CN101736316A - 处理室的高效uv清洁 - Google Patents
处理室的高效uv清洁 Download PDFInfo
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Abstract
本发明用于处理室的高效UV清洁,其提供一种紫外(UV)固化室,其能够对布置在衬底上的介质材料进行固化并对其进行原位清洁。串列处理室设有两个单独并相邻的处理区域,这些处理区域由盖子所覆盖的主体限定,盖子分别位于各个处理区域上方并具有对准的窗口。每个由耦合到盖子的壳体所覆盖的处理区域有一个或多个UV灯泡发射UV光,UV光被经过窗口导向位于处理区域内的衬底上。UV灯泡可以是发光二极管阵列或采用例如微波或射频源的灯泡。可以在固化处理期间以脉冲方式产生UV光。使用远程产生的氧基/臭氧和/或原位实现了室的清洁。使用灯阵列、衬底与灯头的相对运动以及灯反射器形状和/或位置的实时改变可以增强衬底照明的均匀性。
Description
本申请是2006年4月18日申请的中国专利申请200680014799.3的分案申请。
技术领域
本发明的实施例一般涉及紫外(UV)固化室。更具体地说,本发明的实施例涉及串列UV室,所述UV室用于对衬底上的介质膜执行固化处理并对串列室内的表面执行清洁处理。
背景技术
氧化硅(SiO)、碳化硅(SiC)和掺碳氧化硅(SiOC)在半导体器件制造中得到了非常广泛的使用。在半导体衬底上形成含硅膜的一种途径是通过室内的化学气相沉积(CVD)。在含硅膜的CVD过程中经常采用供应有机硅的材料。由于这种有机硅供应材料中存在碳,室壁上和衬底上可能形成含碳膜。
水常常是有机硅化合物的CVD反应副产品,并会被通过物理方式以潮气的形式吸收到膜中。衬底加工设备内空气里的潮气提供了未固化膜中潮气的另一来源。在为后续制造处理排队的时候,膜对吸收水的抵抗能力对于限定稳定的膜而言很重要。潮气不是稳定膜的一部分,并可能在以后造成器件工作过程中介质材料的失效。
因此,优选地从所沉积的含碳膜中除去不需要的化学成分和化合物(例如水)。更重要的是,需要除去牺牲材料的热不稳定有机碎片(由CVD过程中提高多孔性所用的成孔剂(porogen)造成)。已有建议采用紫外辐射来对CVD氧化硅膜的后处理提供帮助。例如,授权给AppliedMaterials,Inc.的美国专利No.6,566,278和No.6,614,181描述了使用UV光对CVD碳掺杂氧化硅膜进行后处理,这些专利的全部内容结合于本申请中。
因此,现有技术中需要一种UV固化室,所述室可以对沉积在衬底上的膜进行有效的固化。还需要一种UV固化室,这种室可以提高生产率、消耗最少的能量并适于对室自身内表面进行原位清洁处理。
发明内容
本发明的实施例一般涉及紫外(UV)固化室,所述固化室用于对位于衬底上的介质材料进行固化。在一种实施例中,串列处理室提供了两个单独并相邻的处理区域,这些处理区域由盖子覆盖的主体限定,盖子分别位于各个处理区域上方并具有对准的灯泡隔离窗。灯泡隔离窗是通过下述方式之一实现的:由串列处理室每侧一个窗口将一个或多个灯泡与一个大的共用体积中的衬底隔开;或者将灯泡阵列的每个灯泡包在其各自的UV透明包封物中,然后所述包封物与衬底处理环境直接接触。每个处理区域的一个或多个UV灯泡由耦合到盖子的壳体覆盖并发射UV光,所述UV光被穿过窗口导向位于处理区域内的衬底上。
UV灯泡可以是发光二极管阵列或灯泡,其采用现有技术的任何UV照明源,包括但不限于微波弧光、射频灯丝(电容耦合的等离子体)以及感应耦合等离子体(ICP)灯。另外,可以在固化处理期间以脉冲方式产生UV光。用于增强衬底照明均匀性的各种想法包括:使用灯阵列,所述灯阵列还可以用来改变入射光的波长分布;衬底与灯头之间的相对运动,包括旋转和周期性平移(扫描);以及实时改变灯反射器的形状和/或位置。
固化处理期间形成的残余物是有机物/有机硅,并被使用基于氧基和臭氧的清洁来除去。产生所需的氧基可以通过远程方式实现并将氧基传输到固化室,也可以原位产生,还可以通过这两种方案同时运转来实现。由于远程产生的氧基会非常迅速地复合成氧分子(O2),所以基于远程氧的清洁方式关键是以远程方式产生臭氧并将这种臭氧传输到固化室中,然后,在臭氧与固化室内的受热表面接触时,允许臭氧在该处分解成氧基和氧分子。因此,臭氧主要是将氧基传输到固化室中所用的媒介物。在远程臭氧清洁的辅助性优点中,固化室中未分解的臭氧也可以攻击某些有机残余物,从而增强氧基清洁。以远程方式产生臭氧的方法可以通过使用任何现有的臭氧产生技术来实现,这些技术包括但不限于介质阻挡放电/电晕放电(例如Applied Materials Ozonator)或UV活化反应器。根据一种实施例,使用固化介质材料所用的UV灯泡和/或另外的(一个或多个)UV灯泡来产生臭氧,所述UV灯泡的位置可以在远程。
附图说明
为了可以更详细地理解本发明的上述特征,通过参考实施例可以对上文简要概括的本发明有更具体的说明,附图中图示了这些实施例中的一些。但是应当明白,附图只是图示了本发明的典型实施例,因此不应认为对其范围的限制,因为本发明可以采用其他等效实施方式。
图1是半导体处理系统的俯视图,本发明的实施例可以结合在该系统中。
图2是被构造用于UV固化的半导体处理系统的串列处理室示意图。
图3是串列处理室的局部剖视图,该处理室具有盖子组件,盖子组件具有分别位于两个处理区域上方的两个UV灯泡。
图4是在处理区域上方带有UV灯泡的盖子组件的局部剖视图,UV灯泡具有垂直定向的长轴。
图5是采用了UV灯阵列的盖子组件的底面局部示意图。
图6是处理室的示意图,该处理室具有为固化选用的第一UV灯阵列和为使清洁气体活化而选用的第UV灯阵列。
图7是盖子组件的立体图,盖子组件用于布置在串列处理室上并带有由UV灯组成的示例性阵列,UV灯设置成向室的两个处理区域提供UV光。
具体实施方式
图1示出了半导体处理系统100的俯视图,本发明的实施例可以结合在该系统中。系统100图示了可以从Santa Clara,California的AppliedMaterials,Inc.买到的Producer TM处理系统的一种实施例。处理系统100是一种自备式(self-contained)系统,它具有支撑在主机结构101上的必备处理设备。处理系统100大体上包括前端台架区域102、传送室111、一系列串列处理室106、以及后端138,其中,衬底盒109支撑在前端台架区域102上,衬底向/从装载锁定(loadlock)室112装入和卸载,传送室111容纳了衬底操作装置113,串列处理室106安装在传送室111上,后端138容纳了系统100工作所需的辅助设备(例如气体面板103和配电板105)。
每个串列处理室106包括两个用于处理衬底的处理区域(参见图3)。这两个处理区域分享共同的气体供应、共同的压力控制和共同的处理气体排放/泵送系统。系统的模块化设计使得可以从任何一种构造迅速转换成另外的任何一种。室的布置和组合可以更改以执行具体的处理步骤。串列处理室106中任一个可以包括盖,根据下述本发明的方面,此盖包括一个或多个紫外(UV)灯,用于衬底上低K材料的固化处理和/或室清洁处理。在一种实施例中,所有三个串列处理室106都有UV灯并设置成UV固化室,以便并行运转以使产量最大化。
在一种可替换实施例中,并非全部串列处理室106都被构造成UV固化室,系统100可以被改造成,一个或多个串列处理室具有已知的辅助室部件,以适应各种其他已知处理,如化学气相沉积(CVD)、物理气相沉积(PVD)、刻蚀等。例如,系统100可以构造成使串列处理室106之一作为CVD室,以在衬底上沉积材料,如低介电常数(K)膜。这样的构造可以使研发制造中的利用率最大化,并且在必要时可以避免已沉积的膜暴露于大气中。
图2图示了半导体处理系统100的串列处理室106中设置成用于UV固化的一个室。串列处理室106包括主体200和可以被铰接到主体200的盖子202。两个壳体204耦合到盖子202,每个壳体耦合到入口206和出口208,用于使冷却空气通过壳体204的内部。冷却空气可以处于室温下,即大约22摄氏度。中央增压空气源210向入口206提供足够流速的空气,以确保与串列处理室106有关的任何UV灯泡和/或用于灯泡的电源214正常工作。出口208接收从壳体204排出的空气,所述排出空气由共用的排气系统212收集,排气系统212可以包括气体洗涤器,以除去取决于灯泡选择而可能由UV灯泡产生的臭氧。可以通过用不含氧的冷却气体(例如氮气、氩或氦)对灯进行冷却来避免臭氧管理问题。
图3示出了串列处理室106的局部剖视图,处理室106带有盖子202、壳体204和电源214。每个壳体204覆盖了两个UV灯泡302中对应的一个,两个UV灯泡203分别布置在主体200内限定的两个处理区域300上方。每个处理区域300包括加热底座306,底座306用于在处理区域300内支撑衬底308。底座306可以由陶瓷或金属(例如铝)制成。优选地,底座306耦合到杆310,杆310穿过主体200的底部延伸,并由驱动系统312来操作,以使处理区域300中的底座306朝向/背离UV灯泡302运动。在固化期间,驱动系统312还可以使底座306旋转和/或平移,以进一步增强衬底照射的均匀性。除了可能根据光发送系统设计的考虑因素(例如焦距)的性质对衬底308上入射的UV辐射水平进行微调之外,底座306的可调定位还使得能够对挥发性固化副产品、吹扫和清洁气流模式和停留时间进行控制。
大体上,本发明的实施例可使用任何UV源,例如微波汞弧灯、脉冲氙闪光灯或高效UV发光二极管阵列。UV灯泡302是密封的等离子灯泡,并被填充有由电源214激发的一种或多种气体,例如氙(Xe)或汞(Hg)。优选地,电源214是微波发生器,它可以包括一个或多个磁控管(未示出)以及对磁控管的灯丝供电的一个或多个变压器(未示出)。在一种具有千瓦级微波(MW)电源的实施例中,每个壳体204包括与电源214邻近的孔径215,用于从电源214接收高达约6000W的微波功率,以便随后从每个灯泡302产生高达约100W的UV光。在另一种实施例中,UV灯泡302可以在其中包括电极或灯丝,这样,电源214代表了到电极的电路和/或电流供应,例如直流(DC)或脉冲DC。
用于某些实施例的电源214可以包括射频(RF)能量源,这些能量源能够激发UV灯泡302内的气体。灯泡中RF激发的构造可以是电容式或电感式。可以用感应耦合等离子体(ICP)灯泡通过产生比电容耦合放电更密集的等离子体来有效地增大灯泡辉度。另外,ICP灯避免了由于电极变差而造成的UV输出变差,从而使灯泡寿命更长以增强系统生产率。以RF能量源作为电源214的优点包括效率的提高。
优选地,灯泡302发生的光横跨从170nm至400nm的宽带波长。灯泡302内选用的气体可以决定所发射的波长。由于在存在氧气时,较短的波长容易产生臭氧,所以可以将灯泡302发射的UV光调谐到主要产生大于200nm的宽带UV光,以免在固化处理中产生臭氧。
UV灯泡302发射的UV光经过布置在盖子202的孔径中的窗口314而进入处理区域300。窗口314优选地由不含OH的合成石英玻璃制造,并具有足够的厚度以保持真空而不发生破裂。此外,窗口314优选为熔融石英,它可以使低至约150nm的UV光透射。由于盖子202密封到主体200,而窗口314密封到盖子202,所以处理区域300提供的体积能够维持从约1Torr至约650Torr的压力。处理气体或清洁气体经过两个入口通道316中对应的一个进入处理区域300。然后,处理气体或清洁气体经过共用的出口端口318离开处理区域300。另外,向壳体204内部供应的冷却气体经过灯泡302循环,但是由窗口314与处理区域300隔离开。
在一种实施例中,每个壳体204包括内部抛物面,所述内部抛物面由涂有双色膜的浇铸的石英衬里304限定。石英衬里304反射从UV灯泡302发射的UV光,并成形为根据由石英衬里304将UV光导向处理区域300内的方式而既适于固化处理又适于室清洁处理。对于某些实施例,石英衬里304通过使内部抛物面的形状发生运动和改变而进行调节,以更好地适应各种处理或任务。另外,石英衬里304优选地通过双色膜来透射红外光并反射灯泡302发射的紫外光。双色膜通常包括由多种介质材料组成的周期性多层膜,这些介质材料交替地具有高折射率和低折射率。由于涂层是非金属性的,所以从电源214向下入射到浇铸石英衬里304的背侧上的微波辐射不会与调制层发生显著的相互作用或被其吸收,并容易被透射以使灯泡302中的气体电离。
在另一种实施例中,在固化和/或清洁过程中,以旋转或其他方式周期性地使石英衬里304运动,从而增强衬底平面中照明的均匀性。在再一种实施例中,整个壳体204在衬底308上方旋转或周期性地平移,而石英衬里304相对于灯泡302静止。在另一种实施例中,衬底308通过底座306进行旋转或周期性平移,在衬底308与灯泡302之间提供相对运动,以增强照明和固化的均匀性。
对于含碳膜的固化处理,底座306在1-10Torr下被加热至350℃与500℃之间,优选为400℃。处理区域300内的压力优选为不低于约0.5Torr,以增强从底座306至衬底的热传递。沉积膜的收缩率随着压力减小而增大的事实证明,通过在低压下执行固化处理以加速的成孔剂的消除,衬底产量增加。此外,当固化处理发生于低压下时,所得介电常数在暴露于加工设备环境大气中的潮气时的稳定性也改善。例如,在相同条件下,75Torr下的固化处理产生了介电常数κ为2.6的膜,而3.5Torr下的固化处理产生了κ为2.41的膜。在完成标准加速稳定性测试之后,75Torr下固化的膜的介电常数增大到2.73,而3.5Torr下固化的膜的介电常数只增大了它的一半,增大到2.47。因此,较低压力下固化产生的较低介电常数膜对环境湿度的敏感度约为其一半。
示例1
一种对掺碳氧化硅膜的固化处理包括:对于串列处理室106在8Torr的压力下,经过各个入口通道316引入每分钟14标准升(slm)的氦(He)(二者每侧7slm)。对于某些实施例,固化处理使用氮气(N2)或氩(Ar)代替He或与He混合,因为主要考虑是不含氧,除非需要其他成分进行反应性UV表面处理。吹扫气体主要执行两种主要功能,即去除固化副产品以及促进整个衬底上的均匀热传递。这些非反应性的吹扫气体使处理区域300内的表面上堆积的残余物减至最少。
另外,可以加入氢以有利地从衬底300上的膜中除去一些甲基并清除(scavenge)氧,所述氧在固化过程中释放、并可能除去过多的甲基。氢可以对基于氧/臭氧的清洁之后室中剩余的残留氧进行吸气(getter)并在固化过程中从膜中除去氧气。这些氧来源中任一者都可能通过氧基(oxygen radical)的光感应反应和/或与甲基结合形成挥发性副产品而潜在地破坏固化中的膜,所述氧基是由固化中可能用到的短波长UV形成的,所述挥发性副产品会使最终的膜缺少甲基,从而造成介电常数稳定性不良和/或膜应力过高。必须注意固化处理中引入的氢量,因为对于波长小于约275nm的UV辐射,氢可能形成氢基,它会攻击膜中的碳-碳键,也会以CH4的形式除去甲基。
根据本发明一些方面的固化处理采用脉冲UV单元,所述单元可以用脉冲氙闪光灯作为灯泡302。在衬底308处于处理区域300内从约10milliTorr至约700Torr的真空下的同时,衬底308暴露于来自灯泡302的UV光脉冲。对于各种应用,脉冲UV单元可以对UV光的输出频率进行调谐。
对于清洁处理,可以将底座306的温度升高到约100℃至约600℃之间,优选为约400℃。通过将清洁气体经过入口通道316引入处理区域300中,处理区域300的UV压力升高,这种较高的压力便于热传递并增强了清洁处理。另外,可以将使用例如介质阻挡放电/电晕放电或UV活化的方法以远程方式所产生的臭氧引入处理区域300。臭氧在与受热的底座306接触时分离成O-和O2。在清洁处理中,原子氧(elemental oxygen)与处理区域300表面上存在的碳氢化合物和碳物质发生反应,形成可以经过出口端口318泵出或排出的一氧化碳和二氧化碳。在控制底座间距、清洁气体流速和压力的同时对底座306进行加热可以增强原子氧与污染物之间的反应速率。将所得的挥发性反应物和污染物泵出处理区域300来完成清洁处理。
清洁气体(例如氧)可以被暴露于选定波长的UV辐射以产生原位臭氧。可以打开电源214,使得从灯泡302将期望波长的UV光直接发射到或通过石英衬里304的聚焦而间接发射到待清洁表面上,在清洁气体为氧时,所述期望波长优选为约184.9nm至约253.7nm。例如,184.9nm和253.7nm的UV辐射波长使以氧为清洁气体的清洁最佳,因为氧吸收184.9nm波长并产生臭氧和原子氧,而臭氧吸收253.7nm波长并转化成氧气和原子氧。
示例2
对于一种实施例,清洁处理包括将5slm的臭氧和氧(臭氧在氧中占13wt%)引入串列室中,在每个处理区域300内均匀分配以产生足够的氧基来从处理区域300内的表面清洁沉积物。O3分子还可以攻击各种有机残余物。剩余的O2分子不会除去处理区域300内表面上的碳氢化合物沉积物。在对6对衬底进行固化之后,在8Torr的压力下,通过20分钟的清洁处理可以产生足够的清洁。
图4图示了在处理区域400上方具有UV灯泡的盖子组件402的局部剖视图,UV灯泡具有垂直定向的长轴403。本实施例中反射器的形状与其他任何实施例中都不同。换句话说,必须优化反射器的几何形状,从而对于单一灯或多个灯中每种灯的形状、方向和组合,都确保对衬底平面的照明强度和均匀度最大化。只示出了串列处理室406的一半。除了灯泡403的方向之外,图4所示串列处理室406与图2和图3所示串列处理室106类似。因此,串列处理室406可以包括上述任何方面。
图5示出了盖子组件的底面500的局部图,该组件采用了UV灯502的阵列。UV灯502的阵列可以布置在串连处理室上方的壳体内而不是像图2-4所示实施例中图示的单一灯泡。尽管示出了许多单独的灯泡。不过UV灯502的阵列可以包括由单一电源或分开的电源供电的至少两个灯泡。例如,在一种实施例中,UV灯502的阵列包括用于发射第一波长分布的第一灯泡和用于发射第二波长分布的第二灯泡。这样,除了调节气体的流动、成分、压力和衬底温度之外,还可以通过对给定固化室内各个灯的照明顺序进行限定来控制固化处理。除了多固化室系统外,还可以通过限定每个串列固化室中的处理顺序来使固化处理更加精确,其中,每个串列固化室在各自所用的具体固化部分的参数(例如灯的光谱、衬底温度、环境气体成分、以及压力)方面受到独立控制。
UV灯502的阵列可以被设计为满足具体的UV光谱分布需求,以通过在UV灯502的阵列内选择和布置一种、两种或更多种不同类型的单独灯泡来执行固化处理和清洁处理。例如,可以从低压Hg、中压Hg和高压Hg中选择灯泡。可以把来自具有特别适于清洁的波长分布的灯泡的UV光导向整个处理区域,而把来自具有特别适于固化的波长分布的灯泡的UV光专门导向衬底。另外,可以独立于UV灯502阵列内的其他灯泡而对UV灯502阵列内被专门导向衬底的灯泡选择性地供电,从而为清洁处理或固化处理打开选择的灯泡。
UV灯502的阵列可以使用高效灯泡,例如UV发光二极管。由微波或脉冲电源进行供电的UV光源与UV灯502的阵列中可能的低功率灯泡(例如10W-100W)相比具有5%的转换效率,以提供约20%的转换效率。通过微波电源,总能量的95%被转换成热量,而只有5%的能量被转换成UV发射,热量浪费了能量并且还有额外的冷却需求。低功率灯泡的低冷却需求可以使UV灯502的阵列置于离衬底更近处(例如1到6英寸之间)以减少反射的UV光和能量损失。
此外,盖子组件的底面500可以包括与UV灯502的阵列交错的多个气体出口504。因此,可以从上方将固化气体和清洁气体引入室内的处理区域中(参见图6和图7)。
图6示意性图示了处理室600,处理室600具有第一UV灯阵列602和第二UV灯阵列604,第一阵列602被选用来固化,第二阵列604位于远处并选用来使清洁气体活化。第一UV灯阵列602被划分成具有第一波长分布的第一组灯泡601以及具有第二波长分布的第二组灯泡603。在固化处理期间,第一UV灯阵列602内这两组灯泡601和603都将UV光(由图案605表示)聚焦到衬底606上。随后,通过入口610将清洁气体(由箭头608表示)引入,清洁气体受到来自第二UV灯阵列605的UV辐射以优选地产生臭氧。随后,臭氧进入处理区域612,在经过出口614被排出之前,由臭氧的活化造成的氧自由基在该处对清洁区域612进行清洁。
图7示出了盖子组件702的立体图,盖子组件702用于布置在串列处理室(未示出)上并带有由分别隔开的UV灯762组成的示例性阵列,UV灯762设置成向室的两个处理区域提供UV光。与图2和图3所示实施例类似,盖子组件702包括壳体704,壳体704耦合到入口(不可见)以及壳体704上位置相反的相应出口708,用于使冷却空气经壳体704覆盖的UV灯泡732通过。在本实施例中,通过分别隔开的UV灯阵列762,冷却空气被导入并通过环,所述环限定在各个灯泡732与分别围绕各个灯泡732的窗口或UV透射保护管之间。壳体704的内部顶壁706可以提供反射器和阻挡器,反射器用于将UV光导向衬底,阻挡器使气体入口716供应到壳体顶部中的气体便于扩散。
可以将这里所述的任何实施例进行组合或更改以包括其他实施例的各个方面。尽管上文针对的是本发明的实施例,但是在不脱离其基本范围的情况下也可以得到本发明的其他和更多实施例,本发明的范围由权利要求来确定。
Claims (20)
1.一种用于将设置在衬底上的介质材料固化的紫外(UV)固化室,包括:
主体,限定彼此分离并相邻的第一和第二处理区域;
盖,耦合到所述主体的顶部,以覆盖所述第一和第二处理区域,其中所述盖包括分别位于所述第一和第二处理区域上方对准的第一和第二石英窗口;
第一和第二UV源,分别设置在所述第一和第二石英窗口上方;
第一和第二壳体,耦合到所述盖并且分别覆盖所述第一和第二UV源;以及
第一和第二反射器,分别设置在所述第一和第二壳体中,并且所述第一和第二反射器中每一个可移动,以调节由所述反射器引导到所述处理区域的UV光的图案。
2.根据权利要求1所述的UV固化室,其中,到所述第一和第二处理区域的气体入口适于将臭氧共用到所述处理区域中用于清洁处理。
3.根据权利要求1所述的UV固化室,还包括与所述第一壳体的内部和所述第二壳体的内部流体连通以冷却设置在其中的所述第一和第二UV源的中央空气源。
4.根据权利要求3所述的UV固化室,还包括与所述第一壳体的内部和所述第二壳体的内部流体连通以收集其中加热的空气并从空气中去除臭氧的共用排气系统。
5.根据权利要求1所述的UV固化室,还包括分别设置在所述第一和第二处理区域中用于支撑所述衬底的第一和第二加热并且可移动的底座。
6.根据权利要求1所述的UV固化室,还包括用于激发所述第一和第二UV源的至少一个电源,所述至少一个电源中的每一个为至少一个微波发生器。
7.根据权利要求1所述的UV固化室,还包括用于激发所述第一和第二UV源的至少一个电源,所述至少一个电源中的每一个为至少一个射频发生器。
8.根据权利要求1所述的UV固化室,其中,所述第一和第二UV源中的每一个包括一个或多个UV灯泡。
9.根据权利要求8所述的UV固化室,其中,所述一个或多个UV灯泡中的每一个具有相对于分别定位在所述第一和第二处理区域中的第一和第二衬底沿竖直方向取向的长轴。
10.根据权利要求8所述的UV固化室,其中,所述UV固化室安装传送室上。
11.根据权利要求1所述的UV固化室,其中,所述第一和第二壳体分别具有涂覆有双色膜的第一和第二石英衬里。
12.根据权利要求8所述的UV固化室,其中,所述第一和第二UV源中的每一个包括第一UV灯泡和第二UV灯泡。
13.根据权利要求12所述的UV固化室,其中,所述第一UV灯泡发射第一波长分布,所述第二UV灯泡发射第二波长分布,所述第一波长分布与所述第二波长分布不同。
14.根据权利要求12所述的UV固化室,其中,所述第一UV灯泡能够独立于所述第二UV灯泡被打开。
15.一种用于将设置在衬底上的介质材料固化的紫外(UV)固化室,包括:
主体,限定彼此分离并相邻的第一和第二处理区域;
盖,耦合到所述主体的顶部,以覆盖所述第一和第二处理区域,其中所述盖包括分别位于所述第一和第二处理区域上方对准的第一和第二石英窗口;
第一和第二UV源,分别设置在所述第一和第二石英窗口上方;
第一和第二壳体,耦合到所述盖并且分别覆盖所述第一和第二UV源,所述第一和第二壳体具有分别涂覆有双色膜的第一和第二石英衬里。
16.根据权利要求15所述的UV固化室,其中,所述双色膜包括由多种非金属的介质材料组成的周期性多层膜,所述多层膜交替地具有高折射率和低折射率。
17.根据权利要求15所述UV固化室,还包括分别设置在所述第一和第二处理区域中用于支撑所述衬底的第一和第二加热并且可移动的底座
18.根据权利要求15所述的UV固化室,还包括用于激发所述第一和第二UV源的至少一个电源,每个所述电源为至少一个微波发生器或至少一个射频发生器。
19.根据权利要求15所述的UV固化室,其中,所述第一和第二UV源中的每一个包括一个或多个UV灯泡,所述UV灯泡具有相对于分别定位在所述第一和第二处理区域中的第一和第二衬底沿竖直方向取向的长轴。
20.根据权利要求15所述的UV固化室,其中,所述UV固化室安装传送室上。
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CN102121607A (zh) * | 2011-01-11 | 2011-07-13 | 安徽师范大学 | 一种紫外led平面固化装置的设计方案 |
CN102121607B (zh) * | 2011-01-11 | 2012-10-24 | 安徽师范大学 | 一种紫外led平面固化装置的设计方案 |
CN103681404A (zh) * | 2012-08-31 | 2014-03-26 | 乐金显示有限公司 | 固化设备 |
TWI698933B (zh) * | 2015-01-07 | 2020-07-11 | 日商思可林集團股份有限公司 | 熱處理方法及熱處理裝置 |
CN113412166A (zh) * | 2019-02-12 | 2021-09-17 | 应用材料公司 | 用于清洁真空系统的方法、用于真空处理基板的方法以及用于真空处理基板的设备 |
CN113412166B (zh) * | 2019-02-12 | 2024-02-20 | 应用材料公司 | 用于清洁真空腔室的方法、用于真空处理基板的方法以及用于真空处理基板的设备 |
CN111613551A (zh) * | 2019-02-22 | 2020-09-01 | Asm Ip私人控股有限公司 | 衬底处理设备和用于处理衬底的方法 |
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Also Published As
Publication number | Publication date |
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WO2006121585A1 (en) | 2006-11-16 |
KR101168821B1 (ko) | 2012-07-25 |
KR101018965B1 (ko) | 2011-03-03 |
KR20100033431A (ko) | 2010-03-29 |
KR20070118270A (ko) | 2007-12-14 |
CN101736316B (zh) | 2013-03-20 |
US20060249175A1 (en) | 2006-11-09 |
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