CN101521169A - 半导体装置的制造方法及半导体装置 - Google Patents
半导体装置的制造方法及半导体装置 Download PDFInfo
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- CN101521169A CN101521169A CN200810186571A CN200810186571A CN101521169A CN 101521169 A CN101521169 A CN 101521169A CN 200810186571 A CN200810186571 A CN 200810186571A CN 200810186571 A CN200810186571 A CN 200810186571A CN 101521169 A CN101521169 A CN 101521169A
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- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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Abstract
Description
Claims (22)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008042695A JP5342154B2 (ja) | 2008-02-25 | 2008-02-25 | 半導体装置の製造方法 |
JP2008042695 | 2008-02-25 | ||
JP2008-042695 | 2008-02-25 |
Publications (2)
Publication Number | Publication Date |
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CN101521169A true CN101521169A (zh) | 2009-09-02 |
CN101521169B CN101521169B (zh) | 2013-06-19 |
Family
ID=40997501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2008101865713A Active CN101521169B (zh) | 2008-02-25 | 2008-12-25 | 半导体装置的制造方法及半导体装置 |
Country Status (5)
Country | Link |
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US (2) | US8222082B2 (zh) |
JP (1) | JP5342154B2 (zh) |
KR (1) | KR101566026B1 (zh) |
CN (1) | CN101521169B (zh) |
TW (1) | TWI459483B (zh) |
Cited By (4)
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CN104576605A (zh) * | 2013-10-17 | 2015-04-29 | 辛纳普蒂克斯显像装置株式会社 | 显示装置驱动用半导体集成电路装置 |
CN105720910A (zh) * | 2014-12-01 | 2016-06-29 | 中电电气(上海)太阳能科技有限公司 | 一种太阳能电池组件接线盒 |
CN107405918A (zh) * | 2015-03-17 | 2017-11-28 | 精工爱普生株式会社 | 液体喷射头以及液体喷射头的制造方法 |
CN107431767A (zh) * | 2015-04-17 | 2017-12-01 | 奥林巴斯株式会社 | 摄像装置 |
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JP5609144B2 (ja) * | 2010-02-19 | 2014-10-22 | ソニー株式会社 | 半導体装置および貫通電極のテスト方法 |
JP5355499B2 (ja) * | 2010-06-03 | 2013-11-27 | 株式会社東芝 | 半導体装置 |
DE102011107349B4 (de) * | 2010-06-30 | 2016-05-12 | Micronas Gmbh | Bondkontaktstelle auf einem Halbleitersubstrat |
JP5729126B2 (ja) * | 2011-05-18 | 2015-06-03 | 株式会社デンソー | 半導体装置の製造方法 |
US9064707B2 (en) | 2011-09-14 | 2015-06-23 | Micronas Gmbh | Bonding contact area on a semiconductor substrate |
WO2013069192A1 (ja) * | 2011-11-10 | 2013-05-16 | パナソニック株式会社 | 半導体装置 |
US8953336B2 (en) * | 2012-03-06 | 2015-02-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Surface metal wiring structure for an IC substrate |
JP2013229455A (ja) * | 2012-04-26 | 2013-11-07 | Renesas Electronics Corp | 半導体装置および半導体装置の製造方法 |
TWI483378B (zh) * | 2013-01-04 | 2015-05-01 | Tsai Yu Huang | 三維晶片堆疊結構 |
JP2015109408A (ja) * | 2013-10-22 | 2015-06-11 | マイクロン テクノロジー, インク. | 複合チップ、半導体装置、及び半導体装置の製造方法 |
KR20160056379A (ko) | 2014-11-10 | 2016-05-20 | 삼성전자주식회사 | 트리플 패드 구조를 이용하는 칩 및 그것의 패키징 방법 |
KR102387541B1 (ko) | 2015-03-25 | 2022-04-18 | 삼성전자주식회사 | 반도체 칩, 및 이를 포함하는 플립 칩 패키지와 웨이퍼 레벨 패키지 |
JP2017045900A (ja) * | 2015-08-27 | 2017-03-02 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
JP2017191902A (ja) * | 2016-04-15 | 2017-10-19 | ルネサスエレクトロニクス株式会社 | 電子装置 |
JP2018107370A (ja) * | 2016-12-28 | 2018-07-05 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
CN112566351B (zh) * | 2019-09-10 | 2023-02-17 | 群创光电股份有限公司 | 电子装置 |
US11688686B2 (en) | 2020-07-14 | 2023-06-27 | Samsung Electronics Co., Ltd. | Semiconductor device including an input/output circuit |
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Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3549714B2 (ja) | 1997-09-11 | 2004-08-04 | 沖電気工業株式会社 | 半導体装置 |
JP2000058548A (ja) * | 1998-08-17 | 2000-02-25 | Hitachi Ltd | 半導体装置の配線構造 |
JP2007335888A (ja) * | 2000-12-18 | 2007-12-27 | Renesas Technology Corp | 半導体集積回路装置 |
JP2002359346A (ja) * | 2001-05-30 | 2002-12-13 | Sharp Corp | 半導体装置および半導体チップの積層方法 |
JP3734453B2 (ja) * | 2002-03-15 | 2006-01-11 | 株式会社リコー | 半導体装置の製造方法 |
JP2004079559A (ja) * | 2002-08-09 | 2004-03-11 | Hitachi Maxell Ltd | 半導体チップ |
JP4510370B2 (ja) * | 2002-12-25 | 2010-07-21 | パナソニック株式会社 | 半導体集積回路装置 |
JP3947119B2 (ja) * | 2003-03-06 | 2007-07-18 | 富士通株式会社 | 半導体集積回路 |
JP4242336B2 (ja) * | 2004-02-05 | 2009-03-25 | パナソニック株式会社 | 半導体装置 |
JP2007088329A (ja) * | 2005-09-26 | 2007-04-05 | Toshiba Corp | マルチチップパッケージ型半導体装置 |
JP4995455B2 (ja) * | 2005-11-30 | 2012-08-08 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2007013146A (ja) * | 2006-06-26 | 2007-01-18 | Renesas Technology Corp | 半導体集積回路装置 |
TWI370515B (en) * | 2006-09-29 | 2012-08-11 | Megica Corp | Circuit component |
-
2008
- 2008-02-25 JP JP2008042695A patent/JP5342154B2/ja not_active Expired - Fee Related
- 2008-11-20 TW TW097144917A patent/TWI459483B/zh active
- 2008-12-09 KR KR1020080124766A patent/KR101566026B1/ko active IP Right Grant
- 2008-12-25 CN CN2008101865713A patent/CN101521169B/zh active Active
-
2009
- 2009-02-06 US US12/367,297 patent/US8222082B2/en not_active Expired - Fee Related
-
2011
- 2011-11-29 US US13/306,659 patent/US8384185B2/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104576605A (zh) * | 2013-10-17 | 2015-04-29 | 辛纳普蒂克斯显像装置株式会社 | 显示装置驱动用半导体集成电路装置 |
CN104576605B (zh) * | 2013-10-17 | 2019-06-04 | 辛纳普蒂克斯日本合同会社 | 显示装置驱动用半导体集成电路装置 |
CN105720910A (zh) * | 2014-12-01 | 2016-06-29 | 中电电气(上海)太阳能科技有限公司 | 一种太阳能电池组件接线盒 |
CN107405918A (zh) * | 2015-03-17 | 2017-11-28 | 精工爱普生株式会社 | 液体喷射头以及液体喷射头的制造方法 |
CN107431767A (zh) * | 2015-04-17 | 2017-12-01 | 奥林巴斯株式会社 | 摄像装置 |
US10582098B2 (en) | 2015-04-17 | 2020-03-03 | Olympus Corporation | Image pickup apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP2009200394A (ja) | 2009-09-03 |
US8222082B2 (en) | 2012-07-17 |
US20120074541A1 (en) | 2012-03-29 |
JP5342154B2 (ja) | 2013-11-13 |
KR20090091645A (ko) | 2009-08-28 |
US20090212425A1 (en) | 2009-08-27 |
TWI459483B (zh) | 2014-11-01 |
CN101521169B (zh) | 2013-06-19 |
TW200937545A (en) | 2009-09-01 |
KR101566026B1 (ko) | 2015-11-05 |
US8384185B2 (en) | 2013-02-26 |
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