CN101506990A - 金属分散体和用于光伏器件活性层的化合物膜的形成 - Google Patents
金属分散体和用于光伏器件活性层的化合物膜的形成 Download PDFInfo
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- CN101506990A CN101506990A CNA2006800148591A CN200680014859A CN101506990A CN 101506990 A CN101506990 A CN 101506990A CN A2006800148591 A CNA2006800148591 A CN A2006800148591A CN 200680014859 A CN200680014859 A CN 200680014859A CN 101506990 A CN101506990 A CN 101506990A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/126—Active materials comprising only Group I-III-VI chalcopyrite materials, e.g. CuInSe2, CuGaSe2 or CuInGaSe2 [CIGS]
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1258—Spray pyrolysis
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
- H10F10/167—Photovoltaic cells having only PN heterojunction potential barriers comprising Group I-III-VI materials, e.g. CdS/CuInSe2 [CIS] heterojunction photovoltaic cells
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/16—Material structures, e.g. crystalline structures, film structures or crystal plane orientations
- H10F77/169—Thin semiconductor films on metallic or insulating substrates
- H10F77/1698—Thin semiconductor films on metallic or insulating substrates the metallic or insulating substrates being flexible
- H10F77/1699—Thin semiconductor films on metallic or insulating substrates the metallic or insulating substrates being flexible the films including Group I-III-VI materials, e.g. CIS or CIGS on metal foils or polymer foils
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/778—Nanostructure within specified host or matrix material, e.g. nanocomposite films
- Y10S977/786—Fluidic host/matrix containing nanomaterials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/81—Of specified metal or metal alloy composition
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/081,163 | 2005-03-16 | ||
| US11/081,163 US7604843B1 (en) | 2005-03-16 | 2005-03-16 | Metallic dispersion |
| US11/243,492 | 2005-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101506990A true CN101506990A (zh) | 2009-08-12 |
Family
ID=37009046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006800148591A Pending CN101506990A (zh) | 2005-03-16 | 2006-03-16 | 金属分散体和用于光伏器件活性层的化合物膜的形成 |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US7604843B1 (https=) |
| JP (1) | JP5260275B2 (https=) |
| CN (1) | CN101506990A (https=) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101820024A (zh) * | 2010-02-11 | 2010-09-01 | 昆山正富机械工业有限公司 | 多层铜铟镓硒(硫)光吸收前驱层制造方法 |
| CN103026477A (zh) * | 2010-05-04 | 2013-04-03 | 英特莫里库尔公司 | 用于制造cigs太阳能电池的组合方法 |
| CN103966572A (zh) * | 2013-02-05 | 2014-08-06 | 王东君 | 卷对卷式原子层沉积设备及其使用方法 |
| CN104051569A (zh) * | 2013-03-12 | 2014-09-17 | 台积太阳能股份有限公司 | 薄膜太阳能电池及其制造方法 |
| CN104981890A (zh) * | 2013-02-12 | 2015-10-14 | 日东电工株式会社 | Cigs膜以及使用其的cigs太阳能电池 |
| CN108788124A (zh) * | 2018-05-28 | 2018-11-13 | 北京梦之墨科技有限公司 | 微纳米低熔点金属及其制备方法及导电油墨及印刷方法 |
| CN109638096A (zh) * | 2018-11-09 | 2019-04-16 | 南开大学 | 一种化合物半导体薄膜太阳能电池制备方法 |
| CN110449310A (zh) * | 2019-08-01 | 2019-11-15 | 南通市联缘染业有限公司 | 超声雾化辅助装置及其辅助制备抗静电涤棉纱线的方法 |
| CN112331729A (zh) * | 2020-11-04 | 2021-02-05 | 凯盛光伏材料有限公司 | Cigs薄膜太阳能电池的光吸收层及其形成方法 |
| CN117358069A (zh) * | 2023-12-08 | 2024-01-09 | 万华化学集团股份有限公司 | 一种聚酰胺复合膜及其制备方法和应用 |
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| KR100579007B1 (ko) * | 2003-08-13 | 2006-05-12 | 주식회사 루밴틱스 | 대전 방지 특성을 가진 광섬유 코팅용 광경화형 고분자수지 조성물 |
| US7306823B2 (en) * | 2004-09-18 | 2007-12-11 | Nanosolar, Inc. | Coated nanoparticles and quantum dots for solution-based fabrication of photovoltaic cells |
| US7604843B1 (en) | 2005-03-16 | 2009-10-20 | Nanosolar, Inc. | Metallic dispersion |
| US8372734B2 (en) * | 2004-02-19 | 2013-02-12 | Nanosolar, Inc | High-throughput printing of semiconductor precursor layer from chalcogenide nanoflake particles |
| US8309163B2 (en) | 2004-02-19 | 2012-11-13 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer by use of chalcogen-containing vapor and inter-metallic material |
| US7700464B2 (en) * | 2004-02-19 | 2010-04-20 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from nanoflake particles |
| US8623448B2 (en) * | 2004-02-19 | 2014-01-07 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from chalcogenide microflake particles |
| US8329501B1 (en) | 2004-02-19 | 2012-12-11 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from inter-metallic microflake particles |
| US8642455B2 (en) * | 2004-02-19 | 2014-02-04 | Matthew R. Robinson | High-throughput printing of semiconductor precursor layer from nanoflake particles |
| US7605328B2 (en) | 2004-02-19 | 2009-10-20 | Nanosolar, Inc. | Photovoltaic thin-film cell produced from metallic blend using high-temperature printing |
| US8846141B1 (en) | 2004-02-19 | 2014-09-30 | Aeris Capital Sustainable Ip Ltd. | High-throughput printing of semiconductor precursor layer from microflake particles |
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| CN101820024A (zh) * | 2010-02-11 | 2010-09-01 | 昆山正富机械工业有限公司 | 多层铜铟镓硒(硫)光吸收前驱层制造方法 |
| CN103026477A (zh) * | 2010-05-04 | 2013-04-03 | 英特莫里库尔公司 | 用于制造cigs太阳能电池的组合方法 |
| CN103966572A (zh) * | 2013-02-05 | 2014-08-06 | 王东君 | 卷对卷式原子层沉积设备及其使用方法 |
| CN104981890B (zh) * | 2013-02-12 | 2017-09-15 | 日东电工株式会社 | Cigs膜以及使用其的cigs太阳能电池 |
| CN104981890A (zh) * | 2013-02-12 | 2015-10-14 | 日东电工株式会社 | Cigs膜以及使用其的cigs太阳能电池 |
| US9614111B2 (en) | 2013-02-12 | 2017-04-04 | Nitto Denko Corporation | CIGS film, and CIGS solar cell employing the same |
| CN104051569A (zh) * | 2013-03-12 | 2014-09-17 | 台积太阳能股份有限公司 | 薄膜太阳能电池及其制造方法 |
| CN104051569B (zh) * | 2013-03-12 | 2017-09-26 | 台湾积体电路制造股份有限公司 | 薄膜太阳能电池及其制造方法 |
| CN108788124A (zh) * | 2018-05-28 | 2018-11-13 | 北京梦之墨科技有限公司 | 微纳米低熔点金属及其制备方法及导电油墨及印刷方法 |
| CN109638096A (zh) * | 2018-11-09 | 2019-04-16 | 南开大学 | 一种化合物半导体薄膜太阳能电池制备方法 |
| CN110449310A (zh) * | 2019-08-01 | 2019-11-15 | 南通市联缘染业有限公司 | 超声雾化辅助装置及其辅助制备抗静电涤棉纱线的方法 |
| CN110449310B (zh) * | 2019-08-01 | 2021-07-16 | 南通市联缘染业有限公司 | 超声雾化辅助装置及其辅助制备抗静电涤棉纱线的方法 |
| CN112331729A (zh) * | 2020-11-04 | 2021-02-05 | 凯盛光伏材料有限公司 | Cigs薄膜太阳能电池的光吸收层及其形成方法 |
| CN117358069A (zh) * | 2023-12-08 | 2024-01-09 | 万华化学集团股份有限公司 | 一种聚酰胺复合膜及其制备方法和应用 |
| CN117358069B (zh) * | 2023-12-08 | 2024-02-13 | 万华化学集团股份有限公司 | 一种聚酰胺复合膜及其制备方法和应用 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008537640A (ja) | 2008-09-18 |
| US7604843B1 (en) | 2009-10-20 |
| US20060207644A1 (en) | 2006-09-21 |
| JP5260275B2 (ja) | 2013-08-14 |
| US20100096015A1 (en) | 2010-04-22 |
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