FR2964044B1 - Emulsion de metal liquide - Google Patents
Emulsion de metal liquideInfo
- Publication number
- FR2964044B1 FR2964044B1 FR1003453A FR1003453A FR2964044B1 FR 2964044 B1 FR2964044 B1 FR 2964044B1 FR 1003453 A FR1003453 A FR 1003453A FR 1003453 A FR1003453 A FR 1003453A FR 2964044 B1 FR2964044 B1 FR 2964044B1
- Authority
- FR
- France
- Prior art keywords
- liquid metal
- emulsion
- metal emulsion
- alkanethiol
- gallium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000839 emulsion Substances 0.000 title abstract 3
- 229910001338 liquidmetal Inorganic materials 0.000 title abstract 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910052733 gallium Inorganic materials 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Classifications
-
- H01L31/0322—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K23/00—Use of substances as emulsifying, wetting, dispersing, or foam-producing agents
- C09K23/002—Inorganic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K23/00—Use of substances as emulsifying, wetting, dispersing, or foam-producing agents
- C09K23/42—Ethers, e.g. polyglycol ethers of alcohols or phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02568—Chalcogenide semiconducting materials not being oxides, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02614—Transformation of metal, e.g. oxidation, nitridation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
-
- H01L31/18—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Composite Materials (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Photovoltaic Devices (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Colloid Chemistry (AREA)
Abstract
L'invention concerne une émulsion de métal liquide. L'émulsion de l'invention comprend un métal liquide choisi parmi le gallium, l'indium et les alliages de ceux-ci et un solvant qui est un alcanethiol. L'invention trouve application dans le domaine de la fabrication de couches minces, en particulier.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1003453A FR2964044B1 (fr) | 2010-08-26 | 2010-08-26 | Emulsion de metal liquide |
PCT/IB2011/053719 WO2012025893A1 (fr) | 2010-08-26 | 2011-08-24 | Emulsion de metal liquide |
JP2013525405A JP2013538893A (ja) | 2010-08-26 | 2011-08-24 | 液体金属エマルジョン |
CN201180041350.7A CN103068939B (zh) | 2010-08-26 | 2011-08-24 | 液态金属乳液 |
EP11760571.7A EP2609161A1 (fr) | 2010-08-26 | 2011-08-24 | Emulsion de metal liquide |
US13/819,300 US20140147959A1 (en) | 2010-08-26 | 2011-08-24 | Liquid metal emulsion |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1003453A FR2964044B1 (fr) | 2010-08-26 | 2010-08-26 | Emulsion de metal liquide |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2964044A1 FR2964044A1 (fr) | 2012-03-02 |
FR2964044B1 true FR2964044B1 (fr) | 2012-09-14 |
Family
ID=43759746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1003453A Expired - Fee Related FR2964044B1 (fr) | 2010-08-26 | 2010-08-26 | Emulsion de metal liquide |
Country Status (6)
Country | Link |
---|---|
US (1) | US20140147959A1 (fr) |
EP (1) | EP2609161A1 (fr) |
JP (1) | JP2013538893A (fr) |
CN (1) | CN103068939B (fr) |
FR (1) | FR2964044B1 (fr) |
WO (1) | WO2012025893A1 (fr) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2999557A1 (fr) * | 2012-12-14 | 2014-06-20 | Commissariat Energie Atomique | Suspension d'agregats monodisperses de sulfure de metal, son procede de fabrication et ses utilisations |
FR3002234B1 (fr) | 2013-02-20 | 2015-04-03 | Commissariat Energie Atomique | Encre comprenant des particules metalliques munies a leur surface de disulfures de dialkyle et procede de realisation d'une telle encre |
CN103418300B (zh) * | 2013-08-29 | 2016-03-30 | 启东市海信机械有限公司 | 用于锂离子电池制造的搅拌装置的搅拌工艺 |
US9841327B2 (en) * | 2014-08-14 | 2017-12-12 | Purdue Research Foundation | Method of producing conductive patterns of nanoparticles and devices made thereof |
CN105860598B (zh) * | 2016-04-11 | 2019-02-01 | 深圳市博恩实业有限公司 | 具导热功能且可涂覆的液态金属组合物及其制备方法和应用 |
CN108293836A (zh) * | 2016-08-11 | 2018-07-20 | 云南科威液态金属谷研发有限公司 | 一种液态金属土壤及其制备方法 |
US10784011B1 (en) | 2017-05-24 | 2020-09-22 | United States Of America As Represented By The Secretary Of The Air Force | Residue free electrically conductive material |
US11387013B1 (en) | 2017-05-24 | 2022-07-12 | United States Of America As Represented By The Secretary Of The Air Force | Residue free electrically conductive material |
US10428234B2 (en) | 2017-09-25 | 2019-10-01 | United States Of America As Represented By The Secretary Of The Air Force | Liquid metal ink |
CN108421542B (zh) * | 2018-03-22 | 2020-08-07 | 河南科技学院 | 液态金属微球作为致孔剂在制备整体柱中的应用 |
CN110769663B (zh) * | 2018-07-27 | 2021-07-20 | 中国科学院理化技术研究所 | 可回收的电磁屏蔽用液态金属浆料及其制备方法和应用 |
US11102883B2 (en) | 2018-11-02 | 2021-08-24 | United States Of America As Represented By The Secretary Of The Air Force | Substrates comprising a network comprising core shell liquid metal encapsulates comprising multi-functional ligands |
US11100223B2 (en) | 2018-11-02 | 2021-08-24 | United States Of America As Represented By The Secretary Of The Air Force | Core shell liquid metal encapsulates comprising multi-functional ligands and networks comprising same |
US10900848B2 (en) | 2018-11-02 | 2021-01-26 | United States Of America As Represented By The Secretary Of The Air Force | Articles comprising a resistor comprising core shell liquid metal encapsulates and method of detecting an impact |
US11406956B2 (en) | 2018-11-02 | 2022-08-09 | United States Of America As Represented By The Secretary Of The Air Force | Articles comprising core shell liquid metal encapsulate networks and method to control alternating current signals and power |
US11062817B1 (en) | 2019-07-12 | 2021-07-13 | United States Of America As Represented By The Secretary Of The Air Force | Liquid metal encapsulates having non-native shells |
CN110818824B (zh) * | 2019-11-08 | 2021-12-28 | 深圳大学 | 一种液态金属辅助的超声聚合方法 |
CN110779363B (zh) * | 2019-11-19 | 2021-07-13 | 大连理工大学 | 一种液态金属微纳液滴为工质的脉动热管 |
CN111112632A (zh) * | 2019-12-30 | 2020-05-08 | 浙江大学 | 一种低熔点高导电高导热金属纳米颗粒的制备方法 |
WO2022211218A1 (fr) * | 2021-04-02 | 2022-10-06 | 한국과학기술원 | Solution de précurseur métallique liquide, procédé de fabrication de film métallique l'utilisant et dispositif électronique le comprenant |
JP7578740B2 (ja) * | 2023-03-03 | 2024-11-06 | Dowaエレクトロニクス株式会社 | ガリウム粉、混合粉、及び、ガリウム粉分散液の製造方法、ガリウム粉の製造方法、ガリウム粉分散液、並びに導電性ペースト |
CN117316776B (zh) * | 2023-09-27 | 2024-07-02 | 深圳市鸿富诚新材料股份有限公司 | 一种散热器件的制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1428243A4 (fr) * | 2001-04-16 | 2008-05-07 | Bulent M Basol | Procede de formation d'une couche mince de compose semiconducteur destinee a la fabrication d'un dispositif electronique, et couche mince produite par ledit procede |
US7537955B2 (en) * | 2001-04-16 | 2009-05-26 | Basol Bulent M | Low temperature nano particle preparation and deposition for phase-controlled compound film formation |
US7604843B1 (en) * | 2005-03-16 | 2009-10-20 | Nanosolar, Inc. | Metallic dispersion |
US8329501B1 (en) * | 2004-02-19 | 2012-12-11 | Nanosolar, Inc. | High-throughput printing of semiconductor precursor layer from inter-metallic microflake particles |
JP4714859B2 (ja) * | 2005-03-01 | 2011-06-29 | 国立大学法人 名古屋工業大学 | 硫化銅ナノ粒子の合成方法 |
WO2007101138A2 (fr) * | 2006-02-23 | 2007-09-07 | Van Duren Jeroen K J | Impression à haut rendement de couche précurseur semi-conductrice à partir de particules de nanoflocons intermétalliques |
JP4829046B2 (ja) * | 2006-08-30 | 2011-11-30 | 国立大学法人 名古屋工業大学 | 硫化金属ナノ粒子の製造方法及び光電変換素子 |
EP2266145A2 (fr) * | 2008-03-04 | 2010-12-29 | Brent Bollman | Procédés et dispositifs pour le traitement d'une couche de précurseur dans un environnement du groupe via |
CN101234779A (zh) * | 2008-03-06 | 2008-08-06 | 中国科学院化学研究所 | 铜铟硫半导体纳米粒子的制备方法 |
US20090260670A1 (en) * | 2008-04-18 | 2009-10-22 | Xiao-Chang Charles Li | Precursor ink for producing IB-IIIA-VIA semiconductors |
DE112009001284A5 (de) * | 2008-06-27 | 2011-06-30 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG, 70839 | Kompositstruktur |
US8361891B2 (en) * | 2008-12-11 | 2013-01-29 | Xerox Corporation | Processes for forming channels in thin-film transistors |
US8709335B1 (en) * | 2009-10-20 | 2014-04-29 | Hanergy Holding Group Ltd. | Method of making a CIG target by cold spraying |
US8470636B2 (en) * | 2009-11-25 | 2013-06-25 | E I Du Pont De Nemours And Company | Aqueous process for producing crystalline copper chalcogenide nanoparticles, the nanoparticles so-produced, and inks and coated substrates incorporating the nanoparticles |
-
2010
- 2010-08-26 FR FR1003453A patent/FR2964044B1/fr not_active Expired - Fee Related
-
2011
- 2011-08-24 JP JP2013525405A patent/JP2013538893A/ja active Pending
- 2011-08-24 CN CN201180041350.7A patent/CN103068939B/zh not_active Expired - Fee Related
- 2011-08-24 WO PCT/IB2011/053719 patent/WO2012025893A1/fr active Application Filing
- 2011-08-24 EP EP11760571.7A patent/EP2609161A1/fr not_active Withdrawn
- 2011-08-24 US US13/819,300 patent/US20140147959A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN103068939A (zh) | 2013-04-24 |
FR2964044A1 (fr) | 2012-03-02 |
EP2609161A1 (fr) | 2013-07-03 |
CN103068939B (zh) | 2014-11-26 |
JP2013538893A (ja) | 2013-10-17 |
US20140147959A1 (en) | 2014-05-29 |
WO2012025893A1 (fr) | 2012-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 6 |
|
ST | Notification of lapse |
Effective date: 20170428 |