CN101471398B - 光电转换装置的制造方法 - Google Patents
光电转换装置的制造方法 Download PDFInfo
- Publication number
- CN101471398B CN101471398B CN200810189178XA CN200810189178A CN101471398B CN 101471398 B CN101471398 B CN 101471398B CN 200810189178X A CN200810189178X A CN 200810189178XA CN 200810189178 A CN200810189178 A CN 200810189178A CN 101471398 B CN101471398 B CN 101471398B
- Authority
- CN
- China
- Prior art keywords
- single crystal
- silicon layer
- crystal silicon
- layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims description 59
- 239000004065 semiconductor Substances 0.000 title claims description 24
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 462
- 239000000758 substrate Substances 0.000 claims abstract description 378
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 278
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 277
- 239000010703 silicon Substances 0.000 claims abstract description 277
- 239000012535 impurity Substances 0.000 claims abstract description 259
- 238000006243 chemical reaction Methods 0.000 claims abstract description 187
- 239000013078 crystal Substances 0.000 claims abstract description 82
- 230000007547 defect Effects 0.000 claims abstract description 64
- 238000011282 treatment Methods 0.000 claims abstract description 56
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910000077 silane Inorganic materials 0.000 claims abstract description 38
- 230000008439 repair process Effects 0.000 claims abstract description 12
- 239000007789 gas Substances 0.000 claims description 139
- 150000002500 ions Chemical class 0.000 claims description 125
- 239000001257 hydrogen Substances 0.000 claims description 45
- 229910052739 hydrogen Inorganic materials 0.000 claims description 45
- 238000010438 heat treatment Methods 0.000 claims description 42
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 39
- 238000005530 etching Methods 0.000 claims description 20
- 230000001678 irradiating effect Effects 0.000 claims description 20
- 238000013532 laser treatment Methods 0.000 claims description 11
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 claims description 8
- VEDJZFSRVVQBIL-UHFFFAOYSA-N trisilane Chemical compound [SiH3][SiH2][SiH3] VEDJZFSRVVQBIL-UHFFFAOYSA-N 0.000 claims description 6
- 230000003213 activating effect Effects 0.000 claims description 5
- 229910021419 crystalline silicon Inorganic materials 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 728
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 36
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 31
- 239000011241 protective layer Substances 0.000 description 31
- 239000010408 film Substances 0.000 description 27
- 239000002994 raw material Substances 0.000 description 21
- 229910021417 amorphous silicon Inorganic materials 0.000 description 19
- 230000015572 biosynthetic process Effects 0.000 description 19
- 238000000926 separation method Methods 0.000 description 18
- 125000004429 atom Chemical group 0.000 description 16
- 238000010586 diagram Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 13
- 238000005498 polishing Methods 0.000 description 13
- 238000010248 power generation Methods 0.000 description 13
- 230000006798 recombination Effects 0.000 description 13
- 230000002829 reductive effect Effects 0.000 description 13
- 230000003746 surface roughness Effects 0.000 description 13
- 229910052757 nitrogen Inorganic materials 0.000 description 12
- 238000010884 ion-beam technique Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000000969 carrier Substances 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 238000002161 passivation Methods 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 238000005229 chemical vapour deposition Methods 0.000 description 9
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 238000005468 ion implantation Methods 0.000 description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 8
- 229910052796 boron Inorganic materials 0.000 description 8
- 238000000605 extraction Methods 0.000 description 8
- 238000005215 recombination Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- 229910001873 dinitrogen Inorganic materials 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 239000002344 surface layer Substances 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 230000001133 acceleration Effects 0.000 description 6
- 239000002019 doping agent Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
- 238000001039 wet etching Methods 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000001307 helium Substances 0.000 description 5
- 229910052734 helium Inorganic materials 0.000 description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 230000001443 photoexcitation Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 229920001940 conductive polymer Polymers 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 4
- 230000005660 hydrophilic surface Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001678 elastic recoil detection analysis Methods 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 238000002513 implantation Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000008929 regeneration Effects 0.000 description 3
- 238000011069 regeneration method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 244000126211 Hericium coralloides Species 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 230000001172 regenerating effect Effects 0.000 description 2
- 238000005001 rutherford backscattering spectroscopy Methods 0.000 description 2
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 2
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- -1 tungsten nitride Chemical class 0.000 description 2
- 238000000927 vapour-phase epitaxy Methods 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910002656 O–Si–O Inorganic materials 0.000 description 1
- 229910008051 Si-OH Inorganic materials 0.000 description 1
- 229910006358 Si—OH Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000003034 coal gas Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000001739 density measurement Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- JZZIHCLFHIXETF-UHFFFAOYSA-N dimethylsilicon Chemical compound C[Si]C JZZIHCLFHIXETF-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229960001730 nitrous oxide Drugs 0.000 description 1
- 235000013842 nitrous oxide Nutrition 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229910021426 porous silicon Inorganic materials 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052990 silicon hydride Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- OYQCBJZGELKKPM-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O-2].[Zn+2].[O-2].[In+3] OYQCBJZGELKKPM-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/70—Surface textures, e.g. pyramid structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/70—Surface textures, e.g. pyramid structures
- H10F77/703—Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/17—Photovoltaic cells having only PIN junction potential barriers
- H10F10/172—Photovoltaic cells having only PIN junction potential barriers comprising multiple PIN junctions, e.g. tandem cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photovoltaic Devices (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007338578 | 2007-12-28 | ||
| JP2007-338578 | 2007-12-28 | ||
| JP2007338578 | 2007-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101471398A CN101471398A (zh) | 2009-07-01 |
| CN101471398B true CN101471398B (zh) | 2012-11-14 |
Family
ID=40828639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810189178XA Expired - Fee Related CN101471398B (zh) | 2007-12-28 | 2008-12-29 | 光电转换装置的制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8008169B2 (enExample) |
| JP (1) | JP5572307B2 (enExample) |
| CN (1) | CN101471398B (enExample) |
| TW (1) | TWI442590B (enExample) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8017429B2 (en) | 2008-02-19 | 2011-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing photoelectric conversion device |
| JP5654206B2 (ja) * | 2008-03-26 | 2015-01-14 | 株式会社半導体エネルギー研究所 | Soi基板の作製方法及び該soi基板を用いた半導体装置 |
| TWI416757B (zh) * | 2008-10-13 | 2013-11-21 | Advanced Optoelectronic Tech | 多波長發光二極體及其製造方法 |
| US20110041910A1 (en) * | 2009-08-18 | 2011-02-24 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and manufacturing method thereof |
| JP5706670B2 (ja) | 2009-11-24 | 2015-04-22 | 株式会社半導体エネルギー研究所 | Soi基板の作製方法 |
| FR2955702B1 (fr) * | 2010-01-27 | 2012-01-27 | Commissariat Energie Atomique | Cellule photovoltaique comprenant un film mince de passivation en oxyde cristallin de silicium et procede de realisation |
| US8704083B2 (en) * | 2010-02-11 | 2014-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and fabrication method thereof |
| JP5726434B2 (ja) | 2010-04-14 | 2015-06-03 | 浜松ホトニクス株式会社 | 半導体光検出素子 |
| US8614495B2 (en) | 2010-04-23 | 2013-12-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Back side defect reduction for back side illuminated image sensor |
| JP5755931B2 (ja) | 2010-04-28 | 2015-07-29 | 株式会社半導体エネルギー研究所 | 半導体膜の作製方法、電極の作製方法、2次電池の作製方法、および太陽電池の作製方法 |
| JP5554142B2 (ja) * | 2010-05-14 | 2014-07-23 | 株式会社豊田中央研究所 | 半導体膜の気相成長方法 |
| JP5622231B2 (ja) * | 2010-10-06 | 2014-11-12 | 三菱重工業株式会社 | 光電変換装置の製造方法 |
| JP5912404B2 (ja) * | 2010-10-29 | 2016-04-27 | 株式会社半導体エネルギー研究所 | 光電変換装置 |
| SG188730A1 (en) * | 2011-09-07 | 2013-04-30 | Air Prod & Chem | Precursors for photovoltaic passivation |
| KR20130070892A (ko) * | 2011-12-20 | 2013-06-28 | 한국전자통신연구원 | 광 검출기 소자 |
| WO2013152054A1 (en) * | 2012-04-02 | 2013-10-10 | Nusola Inc. | Photovoltaic cell and process of manufacture |
| US9099578B2 (en) | 2012-06-04 | 2015-08-04 | Nusola, Inc. | Structure for creating ohmic contact in semiconductor devices and methods for manufacture |
| US9276164B2 (en) * | 2012-11-26 | 2016-03-01 | Epistar Corporation | Optoelectronic device and method for manufacturing the same |
| CN106158988B (zh) * | 2015-04-07 | 2017-12-12 | 昱晶能源科技股份有限公司 | 太阳能电池及其制造方法 |
| US11651957B2 (en) | 2015-05-28 | 2023-05-16 | SemiNuclear, Inc. | Process and manufacture of low-dimensional materials supporting both self-thermalization and self-localization |
| US9972489B2 (en) | 2015-05-28 | 2018-05-15 | SemiNuclear, Inc. | Composition and method for making picocrystalline artificial borane atoms |
| KR101680036B1 (ko) * | 2015-07-07 | 2016-12-12 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
| US20170012154A1 (en) * | 2015-07-09 | 2017-01-12 | Solaero Technologies Corp. | Method for producing solar cells and solar cell assemblies |
| JP6459948B2 (ja) * | 2015-12-15 | 2019-01-30 | 株式会社Sumco | 半導体エピタキシャルウェーハの製造方法および固体撮像素子の製造方法 |
| US9735267B1 (en) * | 2016-01-28 | 2017-08-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure and formation method of semiconductor device structure |
| JP6259878B1 (ja) * | 2016-08-26 | 2018-01-10 | 株式会社フジクラ | 光電変換素子 |
| IL266967B2 (en) * | 2016-11-29 | 2024-12-01 | Seminuclear Inc | Composition and method for making picocrystalline artificial borane atoms |
| CN107265878A (zh) * | 2017-06-06 | 2017-10-20 | 界首市七曜新能源有限公司 | 高透光率太阳能热水器专用真空管 |
| WO2021066042A1 (ja) * | 2019-09-30 | 2021-04-08 | 京セラ株式会社 | 半導体素子の製造方法 |
| CN111987191A (zh) * | 2020-09-09 | 2020-11-24 | 苏州腾晖光伏技术有限公司 | 一种修复perc电池激光开膜损伤的方法 |
| JP7282961B1 (ja) | 2022-07-28 | 2023-05-29 | 株式会社東芝 | 光電変換素子の検査装置、光電変換素子の製造装置、光電変換素子の製造方法 |
| CN120384269B (zh) * | 2025-04-25 | 2025-11-04 | 山东大学 | 一种(AlxGa1-x)2O3薄膜原位退火装置及方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5705828A (en) * | 1991-08-10 | 1998-01-06 | Sanyo Electric Co., Ltd. | Photovoltaic device |
| US5716480A (en) * | 1995-07-13 | 1998-02-10 | Canon Kabushiki Kaisha | Photovoltaic device and method of manufacturing the same |
| CN1442909A (zh) * | 2002-03-05 | 2003-09-17 | 三洋电机株式会社 | 光电转换装置及其制造方法 |
| CN1445865A (zh) * | 2001-11-29 | 2003-10-01 | 三洋电机株式会社 | 光发电装置及其制造方法 |
| CN1739200A (zh) * | 2003-01-16 | 2006-02-22 | Tdk株式会社 | 光电转换元件、光电转换装置和硅化铁膜 |
Family Cites Families (80)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4180618A (en) | 1977-07-27 | 1979-12-25 | Corning Glass Works | Thin silicon film electronic device |
| US5091334A (en) | 1980-03-03 | 1992-02-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| JPS56122123A (en) | 1980-03-03 | 1981-09-25 | Shunpei Yamazaki | Semiamorphous semiconductor |
| DE3176676D1 (en) | 1980-04-10 | 1988-04-07 | Massachusetts Inst Technology | Methods of producing sheets of crystalline material and devices amde therefrom |
| JPS5771126A (en) | 1980-10-21 | 1982-05-01 | Semiconductor Energy Lab Co Ltd | Semiamorhous semiconductor |
| JPS5972781A (ja) | 1982-10-20 | 1984-04-24 | Semiconductor Energy Lab Co Ltd | 光電変換半導体装置 |
| US4496788A (en) | 1982-12-29 | 1985-01-29 | Osaka Transformer Co., Ltd. | Photovoltaic device |
| US4633034A (en) | 1985-02-08 | 1986-12-30 | Energy Conversion Devices, Inc. | Photovoltaic device and method |
| US5750000A (en) | 1990-08-03 | 1998-05-12 | Canon Kabushiki Kaisha | Semiconductor member, and process for preparing same and semiconductor device formed by use of same |
| KR950014609B1 (ko) | 1990-08-03 | 1995-12-11 | 캐논 가부시끼가이샤 | 반도체부재 및 반도체부재의 제조방법 |
| US5849601A (en) | 1990-12-25 | 1998-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
| US5514879A (en) | 1990-11-20 | 1996-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Gate insulated field effect transistors and method of manufacturing the same |
| US7115902B1 (en) | 1990-11-20 | 2006-10-03 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
| KR950013784B1 (ko) | 1990-11-20 | 1995-11-16 | 가부시키가이샤 한도오따이 에네루기 겐큐쇼 | 반도체 전계효과 트랜지스터 및 그 제조방법과 박막트랜지스터 |
| JP2840699B2 (ja) | 1990-12-12 | 1998-12-24 | 株式会社 半導体エネルギー研究所 | 被膜形成装置及び被膜形成方法 |
| US7576360B2 (en) | 1990-12-25 | 2009-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device which comprises thin film transistors and method for manufacturing the same |
| US7098479B1 (en) | 1990-12-25 | 2006-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and method for manufacturing the same |
| CA2069038C (en) | 1991-05-22 | 1997-08-12 | Kiyofumi Sakaguchi | Method for preparing semiconductor member |
| US5946587A (en) | 1992-08-06 | 1999-08-31 | Canon Kabushiki Kaisha | Continuous forming method for functional deposited films |
| US6835523B1 (en) | 1993-05-09 | 2004-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus for fabricating coating and method of fabricating the coating |
| JP3360919B2 (ja) | 1993-06-11 | 2003-01-07 | 三菱電機株式会社 | 薄膜太陽電池の製造方法,及び薄膜太陽電池 |
| US6183816B1 (en) | 1993-07-20 | 2001-02-06 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating the coating |
| JP3381443B2 (ja) | 1995-02-02 | 2003-02-24 | ソニー株式会社 | 基体から半導体層を分離する方法、半導体素子の製造方法およびsoi基板の製造方法 |
| US5736431A (en) | 1995-02-28 | 1998-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Method for producing thin film solar battery |
| CN1132223C (zh) | 1995-10-06 | 2003-12-24 | 佳能株式会社 | 半导体衬底及其制造方法 |
| JPH09255487A (ja) * | 1996-03-18 | 1997-09-30 | Sony Corp | 薄膜半導体の製造方法 |
| JPH1093122A (ja) * | 1996-09-10 | 1998-04-10 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜太陽電池の製造方法 |
| DE69738307T2 (de) | 1996-12-27 | 2008-10-02 | Canon K.K. | Herstellungsverfahren eines Halbleiter-Bauelements und Herstellungsverfahren einer Solarzelle |
| JPH10335683A (ja) | 1997-05-28 | 1998-12-18 | Ion Kogaku Kenkyusho:Kk | タンデム型太陽電池およびその製造方法 |
| JP4027465B2 (ja) | 1997-07-01 | 2007-12-26 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型表示装置およびその製造方法 |
| US6534380B1 (en) | 1997-07-18 | 2003-03-18 | Denso Corporation | Semiconductor substrate and method of manufacturing the same |
| JPH11103082A (ja) | 1997-09-26 | 1999-04-13 | Canon Inc | 光起電力素子及びその作製方法 |
| JPH11163363A (ja) | 1997-11-22 | 1999-06-18 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| US6331208B1 (en) | 1998-05-15 | 2001-12-18 | Canon Kabushiki Kaisha | Process for producing solar cell, process for producing thin-film semiconductor, process for separating thin-film semiconductor, and process for forming semiconductor |
| JP2000012864A (ja) | 1998-06-22 | 2000-01-14 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP2000124092A (ja) | 1998-10-16 | 2000-04-28 | Shin Etsu Handotai Co Ltd | 水素イオン注入剥離法によってsoiウエーハを製造する方法およびこの方法で製造されたsoiウエーハ |
| JP2000150940A (ja) | 1998-11-18 | 2000-05-30 | Denso Corp | 半導体微粒子集合体及びその製造方法 |
| JP2000349264A (ja) | 1998-12-04 | 2000-12-15 | Canon Inc | 半導体ウエハの製造方法、使用方法および利用方法 |
| JP2000277439A (ja) | 1999-03-25 | 2000-10-06 | Kanegafuchi Chem Ind Co Ltd | 結晶質シリコン系薄膜のプラズマcvd方法およびシリコン系薄膜光電変換装置の製造方法 |
| US6468923B1 (en) * | 1999-03-26 | 2002-10-22 | Canon Kabushiki Kaisha | Method of producing semiconductor member |
| JP2001015721A (ja) | 1999-04-30 | 2001-01-19 | Canon Inc | 複合部材の分離方法及び薄膜の製造方法 |
| TW477009B (en) | 1999-05-26 | 2002-02-21 | Tadahiro Ohmi | Plasma process device |
| US6387829B1 (en) | 1999-06-18 | 2002-05-14 | Silicon Wafer Technologies, Inc. | Separation process for silicon-on-insulator wafer fabrication |
| JP2001089291A (ja) * | 1999-09-20 | 2001-04-03 | Canon Inc | 液相成長法、半導体部材の製造方法、太陽電池の製造方法 |
| JP2001160540A (ja) | 1999-09-22 | 2001-06-12 | Canon Inc | 半導体装置の製造方法、液相成長法及び液相成長装置、太陽電池 |
| JP3513592B2 (ja) | 2000-09-25 | 2004-03-31 | 独立行政法人産業技術総合研究所 | 太陽電池の製造方法 |
| JP3480448B2 (ja) | 2001-03-05 | 2003-12-22 | 森 勇蔵 | エピタキシャルSiの高速成膜方法 |
| JP2002348198A (ja) | 2001-05-28 | 2002-12-04 | Nissin Electric Co Ltd | 半導体素子エピタキシャル成長用基板及びその製造方法 |
| JP2002371357A (ja) | 2001-06-14 | 2002-12-26 | Canon Inc | シリコン系薄膜の形成方法、シリコン系薄膜及び半導体素子並びにシリコン系薄膜の形成装置 |
| TW521540B (en) | 2001-10-03 | 2003-02-21 | Hau-Ran Ni | An ECR plasma reactor system with multiple exciters |
| KR100442105B1 (ko) * | 2001-12-03 | 2004-07-27 | 삼성전자주식회사 | 소이형 기판 형성 방법 |
| JP2004014958A (ja) | 2002-06-11 | 2004-01-15 | Fuji Electric Holdings Co Ltd | 薄膜多結晶太陽電池とその製造方法 |
| US6818529B2 (en) | 2002-09-12 | 2004-11-16 | Applied Materials, Inc. | Apparatus and method for forming a silicon film across the surface of a glass substrate |
| JP4907088B2 (ja) | 2003-02-05 | 2012-03-28 | 株式会社半導体エネルギー研究所 | 表示装置の製造方法 |
| JP4748954B2 (ja) | 2003-07-14 | 2011-08-17 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
| JP4480968B2 (ja) | 2003-07-18 | 2010-06-16 | 株式会社半導体エネルギー研究所 | 表示装置 |
| TWI336921B (en) | 2003-07-18 | 2011-02-01 | Semiconductor Energy Lab | Method for manufacturing semiconductor device |
| US7211454B2 (en) | 2003-07-25 | 2007-05-01 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of a light emitting device including moving the source of the vapor deposition parallel to the substrate |
| JP2005050905A (ja) | 2003-07-30 | 2005-02-24 | Sharp Corp | シリコン薄膜太陽電池の製造方法 |
| US7253391B2 (en) | 2003-09-19 | 2007-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Optical sensor device and electronic apparatus |
| WO2005047968A1 (en) | 2003-11-14 | 2005-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
| JP2005268682A (ja) | 2004-03-22 | 2005-09-29 | Canon Inc | 半導体基材及び太陽電池の製造方法 |
| JP5013393B2 (ja) | 2005-03-30 | 2012-08-29 | 東京エレクトロン株式会社 | プラズマ処理装置と方法 |
| JP2006294422A (ja) | 2005-04-11 | 2006-10-26 | Tokyo Electron Ltd | プラズマ処理装置およびスロットアンテナおよびプラズマ処理方法 |
| TWI408734B (zh) | 2005-04-28 | 2013-09-11 | Semiconductor Energy Lab | 半導體裝置及其製造方法 |
| JP4597792B2 (ja) | 2005-06-27 | 2010-12-15 | 東京エレクトロン株式会社 | 処理ガス供給構造およびプラズマ処理装置 |
| JP4777717B2 (ja) | 2005-08-10 | 2011-09-21 | 東京エレクトロン株式会社 | 成膜方法、プラズマ処理装置および記録媒体 |
| US7301215B2 (en) | 2005-08-22 | 2007-11-27 | Canon Kabushiki Kaisha | Photovoltaic device |
| EP1950813A4 (en) * | 2005-11-17 | 2010-07-21 | Asahi Glass Co Ltd | TRANSPARENT CONDUCTIVE SUBSTRATE FOR SOLAR CELL AND MANUFACTURING METHOD THEREFOR |
| JP5068458B2 (ja) | 2006-01-18 | 2012-11-07 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理方法 |
| JP4978985B2 (ja) | 2006-03-30 | 2012-07-18 | 東京エレクトロン株式会社 | プラズマ処理方法 |
| EP2002484A4 (en) | 2006-04-05 | 2016-06-08 | Silicon Genesis Corp | METHOD AND STRUCTURE FOR MANUFACTURING PHOTOVOLTAIC CELLS USING A LAYER TRANSFER PROCESS |
| JP2008112847A (ja) | 2006-10-30 | 2008-05-15 | Shin Etsu Chem Co Ltd | 単結晶シリコン太陽電池の製造方法及び単結晶シリコン太陽電池 |
| WO2008126706A1 (en) | 2007-04-06 | 2008-10-23 | Semiconductor Energy Laboratory Co., Ltd. | Photovoltaic device and method for manufacturing the same |
| JP5364293B2 (ja) | 2007-06-01 | 2013-12-11 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法およびプラズマcvd装置 |
| US8207010B2 (en) | 2007-06-05 | 2012-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing photoelectric conversion device |
| JP5058084B2 (ja) | 2007-07-27 | 2012-10-24 | 株式会社半導体エネルギー研究所 | 光電変換装置の作製方法及びマイクロ波プラズマcvd装置 |
| JP5216446B2 (ja) | 2007-07-27 | 2013-06-19 | 株式会社半導体エネルギー研究所 | プラズマcvd装置及び表示装置の作製方法 |
| JP5248994B2 (ja) | 2007-11-30 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 光電変換装置の製造方法 |
| JP5248995B2 (ja) | 2007-11-30 | 2013-07-31 | 株式会社半導体エネルギー研究所 | 光電変換装置の製造方法 |
-
2008
- 2008-12-16 JP JP2008319106A patent/JP5572307B2/ja not_active Expired - Fee Related
- 2008-12-22 US US12/341,699 patent/US8008169B2/en not_active Expired - Fee Related
- 2008-12-22 TW TW097150079A patent/TWI442590B/zh not_active IP Right Cessation
- 2008-12-29 CN CN200810189178XA patent/CN101471398B/zh not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5705828A (en) * | 1991-08-10 | 1998-01-06 | Sanyo Electric Co., Ltd. | Photovoltaic device |
| US5716480A (en) * | 1995-07-13 | 1998-02-10 | Canon Kabushiki Kaisha | Photovoltaic device and method of manufacturing the same |
| CN1445865A (zh) * | 2001-11-29 | 2003-10-01 | 三洋电机株式会社 | 光发电装置及其制造方法 |
| CN1442909A (zh) * | 2002-03-05 | 2003-09-17 | 三洋电机株式会社 | 光电转换装置及其制造方法 |
| CN1739200A (zh) * | 2003-01-16 | 2006-02-22 | Tdk株式会社 | 光电转换元件、光电转换装置和硅化铁膜 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5572307B2 (ja) | 2014-08-13 |
| CN101471398A (zh) | 2009-07-01 |
| TW200945613A (en) | 2009-11-01 |
| TWI442590B (zh) | 2014-06-21 |
| US20100047952A1 (en) | 2010-02-25 |
| JP2009177145A (ja) | 2009-08-06 |
| US8008169B2 (en) | 2011-08-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101471398B (zh) | 光电转换装置的制造方法 | |
| CN101447526B (zh) | 光电转换装置的制造方法 | |
| JP5248994B2 (ja) | 光電変換装置の製造方法 | |
| JP5459901B2 (ja) | 光電変換装置モジュールの作製方法 | |
| TWI557928B (zh) | 光電轉換裝置及其製造方法 | |
| KR101503675B1 (ko) | 광기전력 장치 및 그 제조 방법 | |
| JP5352190B2 (ja) | 光電変換装置 | |
| JP5286146B2 (ja) | 光電変換装置の作製方法 | |
| JP5564358B2 (ja) | 光電変換装置及びその作製方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121114 Termination date: 20181229 |