CN101415860A - 原子层沉积方法 - Google Patents
原子层沉积方法 Download PDFInfo
- Publication number
- CN101415860A CN101415860A CNA2007800117282A CN200780011728A CN101415860A CN 101415860 A CN101415860 A CN 101415860A CN A2007800117282 A CNA2007800117282 A CN A2007800117282A CN 200780011728 A CN200780011728 A CN 200780011728A CN 101415860 A CN101415860 A CN 101415860A
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- Prior art keywords
- base material
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- gaseous substance
- gaseous
- distributing manifold
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/403—Oxides of aluminium, magnesium or beryllium
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/407—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
- C23C16/45504—Laminar flow
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45519—Inert gas curtains
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
- C23C16/45548—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction
- C23C16/45551—Atomic layer deposition [ALD] characterized by the apparatus having arrangements for gas injection at different locations of the reactor for each ALD half-reaction for relative movement of the substrate and the gas injectors or half-reaction reactor compartments
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45587—Mechanical means for changing the gas flow
- C23C16/45591—Fixed means, e.g. wings, baffles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/392,007 | 2006-03-29 | ||
| US11/392,007 US7413982B2 (en) | 2006-03-29 | 2006-03-29 | Process for atomic layer deposition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101415860A true CN101415860A (zh) | 2009-04-22 |
Family
ID=38233069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007800117282A Pending CN101415860A (zh) | 2006-03-29 | 2007-03-14 | 原子层沉积方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7413982B2 (enExample) |
| EP (1) | EP1999295B1 (enExample) |
| JP (1) | JP5149272B2 (enExample) |
| KR (1) | KR20080109002A (enExample) |
| CN (1) | CN101415860A (enExample) |
| TW (1) | TWI396768B (enExample) |
| WO (1) | WO2007126585A2 (enExample) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102992389A (zh) * | 2012-12-13 | 2013-03-27 | 上海纳米技术及应用国家工程研究中心有限公司 | 一种生长氧化锌纳米线阵列的制备方法 |
| CN103874783A (zh) * | 2011-08-10 | 2014-06-18 | 荷兰应用科学研究组织 | 用于在基板上沉积原子层的方法及装置 |
| CN103959434A (zh) * | 2011-12-05 | 2014-07-30 | 伊斯曼柯达公司 | 通过使用聚合物掩模的选择性沉积 |
| CN106000409A (zh) * | 2016-05-19 | 2016-10-12 | 陕西师范大学 | 用于co2氧化乙苯脱氢制苯乙烯的铁基复合氧化物催化剂 |
| CN107313028A (zh) * | 2017-07-11 | 2017-11-03 | 秦皇岛博硕光电设备股份有限公司 | 原子层沉积装置及具有孔状结构的基材的原子层沉积方法 |
| WO2018210273A1 (zh) * | 2017-05-17 | 2018-11-22 | 李哲峰 | 一种具有同一等离子体源的原子层沉积装置及方法 |
| CN108884567A (zh) * | 2016-04-01 | 2018-11-23 | 3M创新有限公司 | 辊到辊原子层沉积设备和方法 |
| CN109534404A (zh) * | 2018-12-13 | 2019-03-29 | 上海纳米技术及应用国家工程研究中心有限公司 | 表面改性氧化钨纳米材料的制备方法及其产品和应用 |
| CN110382737A (zh) * | 2017-03-14 | 2019-10-25 | 伊斯曼柯达公司 | 带有模块化沉积头的沉积系统 |
| CN113088932A (zh) * | 2021-03-30 | 2021-07-09 | 天津理工大学 | 一种晶圆级层数可控硫化钼及其制备方法 |
| CN117525212A (zh) * | 2024-01-04 | 2024-02-06 | 无锡松煜科技有限公司 | 一种太阳能电池钝化结构及其制备方法 |
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| US20090110892A1 (en) * | 2004-06-30 | 2009-04-30 | General Electric Company | System and method for making a graded barrier coating |
| US8034419B2 (en) | 2004-06-30 | 2011-10-11 | General Electric Company | Method for making a graded barrier coating |
| WO2007075435A2 (en) * | 2005-12-15 | 2007-07-05 | Fluens Corporation | Apparatus for reactive sputtering |
| BRPI0709199A2 (pt) | 2006-03-26 | 2011-06-28 | Lotus Applied Technology Llc | sistema e método para depositar uma pelìcula fina em um substrato flexìvel |
| US20070281089A1 (en) * | 2006-06-05 | 2007-12-06 | General Electric Company | Systems and methods for roll-to-roll atomic layer deposition on continuously fed objects |
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| US8207063B2 (en) * | 2007-01-26 | 2012-06-26 | Eastman Kodak Company | Process for atomic layer deposition |
| JP2008270670A (ja) * | 2007-04-24 | 2008-11-06 | Oki Electric Ind Co Ltd | 薄膜形成装置及び薄膜形成方法 |
| US20080299771A1 (en) * | 2007-06-04 | 2008-12-04 | Irving Lyn M | Methods of making thin film transistors comprising zinc-oxide-based semiconductor materials and transistors made thereby |
| GB0718840D0 (en) * | 2007-09-26 | 2007-11-07 | Eastman Kodak Co | Method of patterning vapour deposition by printing |
| US8398770B2 (en) * | 2007-09-26 | 2013-03-19 | Eastman Kodak Company | Deposition system for thin film formation |
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| US20120222620A1 (en) | 2011-03-01 | 2012-09-06 | Applied Materials, Inc. | Atomic Layer Deposition Carousel with Continuous Rotation and Methods of Use |
| US8697198B2 (en) | 2011-03-31 | 2014-04-15 | Veeco Ald Inc. | Magnetic field assisted deposition |
| DE102011077833A1 (de) * | 2011-06-20 | 2012-12-20 | Gebr. Schmid Gmbh | Verfahren zur Bearbeitung von Substraten und Vorrichtung dazu |
| US9000453B2 (en) | 2011-06-28 | 2015-04-07 | Osram Sylvania Inc. | Electrostatic discharge protection for electrical components, devices including such protection and methods for making the same |
| US20130001596A1 (en) * | 2011-06-28 | 2013-01-03 | Osram Sylvania Inc. | Deposition of esd protection on printed circuit boards |
| EP2743092A4 (en) * | 2011-08-10 | 2015-04-01 | Taiyo Chemical Industry Co Ltd | STRUCTURE WITH A PRIMER THIN FILM AND METHOD FOR THE PRODUCTION THEREOF |
| US8617942B2 (en) | 2011-08-26 | 2013-12-31 | Eastman Kodak Company | Producing transistor including single layer reentrant profile |
| US8592909B2 (en) | 2011-08-26 | 2013-11-26 | Eastman Kodak Company | Transistor including single layer reentrant profile |
| US8637355B2 (en) | 2011-08-26 | 2014-01-28 | Eastman Kodak Company | Actuating transistor including single layer reentrant profile |
| DE102011053229A1 (de) * | 2011-09-02 | 2013-03-07 | Solibro Gmbh | Abscheideverfahren und Abscheidevorrichtung |
| US8623757B2 (en) | 2011-09-29 | 2014-01-07 | Eastmak Kodak Company | Producing a vertical transistor including reentrant profile |
| US8273654B1 (en) | 2011-09-29 | 2012-09-25 | Eastman Kodak Company | Producing a vertical transistor including reentrant profile |
| US8865576B2 (en) | 2011-09-29 | 2014-10-21 | Eastman Kodak Company | Producing vertical transistor having reduced parasitic capacitance |
| US8803227B2 (en) | 2011-09-29 | 2014-08-12 | Eastman Kodak Company | Vertical transistor having reduced parasitic capacitance |
| US8507947B2 (en) * | 2011-12-09 | 2013-08-13 | Power Integrations, Inc. | High quality GaN high-voltage HFETS on silicon |
| US9748125B2 (en) | 2012-01-31 | 2017-08-29 | Applied Materials, Inc. | Continuous substrate processing system |
| US8741772B2 (en) * | 2012-02-16 | 2014-06-03 | Intermolecular, Inc. | In-situ nitride initiation layer for RRAM metal oxide switching material |
| US8633068B2 (en) | 2012-02-22 | 2014-01-21 | Eastman Kodak Company | Vertical transistor actuation |
| US8698230B2 (en) | 2012-02-22 | 2014-04-15 | Eastman Kodak Company | Circuit including vertical transistors with a conductive stack having reentrant profile |
| GB201206096D0 (en) * | 2012-04-05 | 2012-05-16 | Dyson Technology Ltd | Atomic layer deposition |
| KR101503031B1 (ko) * | 2013-04-25 | 2015-03-18 | 한국화학연구원 | 아미노싸이올레이트를 이용한 납 전구체, 이의 제조방법, 및 이를 이용하여 박막을 형성하는 방법 |
| US8927434B2 (en) | 2012-08-31 | 2015-01-06 | Eastman Kodak Company | Patterned thin film dielectric stack formation |
| US8791023B2 (en) | 2012-08-31 | 2014-07-29 | Eastman Kodak Company | Patterned thin film dielectric layer formation |
| US8846545B2 (en) | 2012-08-31 | 2014-09-30 | Eastman Kodak Company | Method of forming patterned thin film dielectric stack |
| US8653516B1 (en) | 2012-08-31 | 2014-02-18 | Eastman Kodak Company | High performance thin film transistor |
| KR102003768B1 (ko) | 2012-11-13 | 2019-07-26 | 삼성디스플레이 주식회사 | 기상 증착 장치 및 유기 발광 표시 장치 제조 방법 |
| DE102012221080A1 (de) * | 2012-11-19 | 2014-03-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Schicht auf einem Oberflächenbereich eines elektronischen Bauelements |
| JP5913079B2 (ja) * | 2012-12-21 | 2016-04-27 | 東京エレクトロン株式会社 | 成膜方法 |
| US9175389B2 (en) * | 2012-12-21 | 2015-11-03 | Intermolecular, Inc. | ALD process window combinatorial screening tool |
| KR102193652B1 (ko) | 2013-03-11 | 2020-12-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 고온 공정 챔버 리드 |
| SMT202200324T1 (it) * | 2013-05-24 | 2022-09-14 | Nanexa Ab | Procedimento per preparare nanoparticelle solide con rivestimento inorganico e loro uso |
| US20140374806A1 (en) | 2013-06-19 | 2014-12-25 | Lee W. Tutt | Four terminal transistor |
| US8946070B2 (en) | 2013-06-19 | 2015-02-03 | Eastman Kodak Company | Four terminal transistor fabrication |
| US8937016B2 (en) | 2013-06-21 | 2015-01-20 | Eastman Kodak Company | Substrate preparation for selective area deposition |
| US8921236B1 (en) | 2013-06-21 | 2014-12-30 | Eastman Kodak Company | Patterning for selective area deposition |
| KR20150029427A (ko) | 2013-09-10 | 2015-03-18 | 삼성디스플레이 주식회사 | 기상 증착 장치, 기상 증착 방법 및 유기 발광 표시 장치 제조 방법 |
| CN104746039A (zh) * | 2013-12-31 | 2015-07-01 | 嘉兴科民电子设备技术有限公司 | 一种铝掺杂氧化锌薄膜的制备方法 |
| KR101463105B1 (ko) * | 2014-01-02 | 2014-12-04 | 연세대학교 산학협력단 | 황화 텅스텐층 형성 방법 및 황화 텅스텐층 형성 장치 |
| US9178029B2 (en) | 2014-03-06 | 2015-11-03 | Eastman Kodak Company | Forming a VTFT gate using printing |
| US9153445B2 (en) | 2014-03-06 | 2015-10-06 | Eastman Kodak Company | Forming a VTFT with aligned gate |
| US9331205B2 (en) | 2014-03-06 | 2016-05-03 | Eastman Kodak Company | VTFT with post, cap, and aligned gate |
| US9236486B2 (en) | 2014-03-06 | 2016-01-12 | Eastman Kodak Company | Offset independently operable VTFT electrodes |
| US9117914B1 (en) | 2014-03-06 | 2015-08-25 | Eastman Kodak Company | VTFT with polymer core |
| US9202898B2 (en) | 2014-03-06 | 2015-12-01 | Eastman Kodak Company | Fabricating VTFT with polymer core |
| US9093470B1 (en) | 2014-03-06 | 2015-07-28 | Eastman Kodak Company | VTFT formation using capillary action |
| US9123815B1 (en) | 2014-03-06 | 2015-09-01 | Eastman Kodak Company | VTFTs including offset electrodes |
| US9147770B1 (en) | 2014-03-06 | 2015-09-29 | Eastman Kodak Company | VTFT with extended electrode |
| US9214560B2 (en) | 2014-03-06 | 2015-12-15 | Eastman Kodak Company | VTFT including overlapping electrodes |
| US9142647B1 (en) | 2014-03-06 | 2015-09-22 | Eastman Kodak Company | VTFT formation using selective area deposition |
| US9153698B2 (en) | 2014-03-06 | 2015-10-06 | Eastman Kodak Company | VTFT with gate aligned to vertical structure |
| US9129993B1 (en) | 2014-03-06 | 2015-09-08 | Eastman Kodak Company | Forming a VTFT using printing |
| US9198283B2 (en) | 2014-03-06 | 2015-11-24 | Eastman Kodak Company | Vertically spaced electrode structure |
| EP3114710A1 (en) | 2014-03-06 | 2017-01-11 | Eastman Kodak Company | Vtft with polymer core |
| KR101574948B1 (ko) * | 2014-04-10 | 2015-12-07 | 주식회사 테스 | 공정가스의 흐름조정장치 |
| US11220737B2 (en) * | 2014-06-25 | 2022-01-11 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
| US11267012B2 (en) | 2014-06-25 | 2022-03-08 | Universal Display Corporation | Spatial control of vapor condensation using convection |
| EP2960059B1 (en) | 2014-06-25 | 2018-10-24 | Universal Display Corporation | Systems and methods of modulating flow during vapor jet deposition of organic materials |
| WO2016011412A1 (en) | 2014-07-17 | 2016-01-21 | Ada Technologies, Inc. | Extreme long life, high energy density batteries and method of making and using the same |
| US9368491B2 (en) | 2014-10-29 | 2016-06-14 | Eastman Kodak Company | Enhancement mode inverter with variable thickness dielectric stack |
| US9443887B1 (en) | 2015-06-12 | 2016-09-13 | Eastman Kodak Company | Vertical and planar TFTS on common substrate |
| US9368490B2 (en) | 2014-10-29 | 2016-06-14 | Eastman Kodak Company | Enhancement-depletion mode inverter with two transistor architectures |
| US9634145B2 (en) | 2014-10-29 | 2017-04-25 | Eastman Kodak Company | TFT substrate with variable dielectric thickness |
| US9620501B1 (en) | 2014-09-16 | 2017-04-11 | Eastman Kodak Company | Enhancement-depletion mode circuit element with differential passivation |
| WO2016209460A2 (en) | 2015-05-21 | 2016-12-29 | Ada Technologies, Inc. | High energy density hybrid pseudocapacitors and method of making and using the same |
| US12401042B2 (en) | 2015-06-01 | 2025-08-26 | Forge Nano Inc. | Nano-engineered coatings for anode active materials, cathode active materials, and solid-state electrolytes and methods of making batteries containing nano-engineered coatings |
| US11996564B2 (en) | 2015-06-01 | 2024-05-28 | Forge Nano Inc. | Nano-engineered coatings for anode active materials, cathode active materials, and solid-state electrolytes and methods of making batteries containing nano-engineered coatings |
| US12027661B2 (en) | 2015-06-01 | 2024-07-02 | Forge Nano Inc. | Nano-engineered coatings for anode active materials, cathode active materials, and solid-state electrolytes and methods of making batteries containing nano-engineered coatings |
| US9401430B1 (en) | 2015-06-12 | 2016-07-26 | Eastman Kodak Company | VTFT with a top-gate structure |
| US9653493B2 (en) | 2015-06-12 | 2017-05-16 | Eastman Kodak Company | Bottom-gate and top-gate VTFTs on common structure |
| US10692659B2 (en) | 2015-07-31 | 2020-06-23 | Ada Technologies, Inc. | High energy and power electrochemical device and method of making and using same |
| KR102420015B1 (ko) * | 2015-08-28 | 2022-07-12 | 삼성전자주식회사 | Cs-ald 장치의 샤워헤드 |
| US10566534B2 (en) | 2015-10-12 | 2020-02-18 | Universal Display Corporation | Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP) |
| TWI650889B (zh) * | 2016-07-22 | 2019-02-11 | 南韓商Ncd股份有限公司 | 在oled上形成無機薄層的方法 |
| US9859308B1 (en) | 2016-07-29 | 2018-01-02 | Eastman Kodak Company | Multiple TFTs on common vertical support element |
| US9799752B1 (en) | 2016-10-31 | 2017-10-24 | Eastman Kodak Company | Method for forming a thin-film transistor |
| US10422038B2 (en) | 2017-03-14 | 2019-09-24 | Eastman Kodak Company | Dual gas bearing substrate positioning system |
| US10400332B2 (en) | 2017-03-14 | 2019-09-03 | Eastman Kodak Company | Deposition system with interlocking deposition heads |
| US10584413B2 (en) | 2017-03-14 | 2020-03-10 | Eastman Kodak Company | Vertical system with vacuum pre-loaded deposition head |
| US10895011B2 (en) | 2017-03-14 | 2021-01-19 | Eastman Kodak Company | Modular thin film deposition system |
| US11248292B2 (en) | 2017-03-14 | 2022-02-15 | Eastman Kodak Company | Deposition system with moveable-position web guides |
| US20180265977A1 (en) | 2017-03-14 | 2018-09-20 | Eastman Kodak Company | Deposition system with vacuum pre-loaded deposition head |
| US10435788B2 (en) | 2017-03-14 | 2019-10-08 | Eastman Kodak | Deposition system with repeating motion profile |
| US10550476B2 (en) | 2017-03-14 | 2020-02-04 | Eastman Kodak Company | Heated gas-bearing backer |
| US11024846B2 (en) | 2017-03-23 | 2021-06-01 | Ada Technologies, Inc. | High energy/power density, long cycle life, safe lithium-ion battery capable of long-term deep discharge/storage near zero volt and method of making and using the same |
| US20190186012A1 (en) * | 2017-12-19 | 2019-06-20 | Eastman Kodak Company | Thin-film optical device with varying layer composition |
| US20190186008A1 (en) * | 2017-12-19 | 2019-06-20 | Eastman Kodak Company | Process for forming compositionally-graded thin films |
| FI128427B (en) | 2018-04-12 | 2020-05-15 | Beneq Oy | Nozzle head and device |
| KR102449895B1 (ko) | 2018-05-18 | 2022-09-30 | 삼성전자주식회사 | 반도체 장치와 그 제조 방법 |
| CN113196455B (zh) * | 2018-11-30 | 2023-06-13 | 株式会社明电舍 | 氧化膜形成装置 |
| GB2585077A (en) | 2019-06-28 | 2020-12-30 | Nanexa Ab | Apparatus |
| JP7713442B2 (ja) | 2019-08-13 | 2025-07-25 | グラフェニクス ディベロップメント,インコーポレイテッド | リチウムベースのエネルギー貯蔵装置用のアノード、その製造方法およびリチウムイオン電池の製造方法 |
| US11489154B2 (en) | 2019-08-20 | 2022-11-01 | Graphenix Development, Inc. | Multilayer anodes for lithium-based energy storage devices |
| EP4018503A4 (en) | 2019-08-20 | 2025-01-08 | Graphenix Development, Inc. | STRUCTURED ANODES FOR LITHIUM-BASED ENERGY STORAGE DEVICES |
| US11495782B2 (en) | 2019-08-26 | 2022-11-08 | Graphenix Development, Inc. | Asymmetric anodes for lithium-based energy storage devices |
| JP6860048B2 (ja) * | 2019-08-30 | 2021-04-14 | 株式会社明電舎 | 原子層堆積方法 |
| JP7098677B2 (ja) | 2020-03-25 | 2022-07-11 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法及びプログラム |
| CA3172496A1 (en) | 2020-04-08 | 2021-10-14 | Graphenix Development, Inc. | Anodes for lithium-based energy storage devices |
| US20220064792A1 (en) * | 2020-08-25 | 2022-03-03 | Innovalens B.V. | Partial coating of intraocular lenses using spatial atomic layer deposition |
| US12255315B2 (en) | 2021-01-14 | 2025-03-18 | Graphenix Development, Inc. | Anode structures having a multiple supplemental layers |
| DE102021206168A1 (de) | 2021-06-16 | 2022-12-22 | Carl Zeiss Smt Gmbh | Verfahren zum Abscheiden einer Deckschicht, reflektives optisches Element für den EUV-Wellenlängenbereich und EUV-Lithographiesystem |
| US11320393B1 (en) | 2021-08-03 | 2022-05-03 | King Abdulaziz University | Gas sensor for detection of toxic gases |
| DE102021214362A1 (de) | 2021-12-15 | 2023-06-15 | Carl Zeiss Smt Gmbh | Verfahren zur Herstellung einer Schutzabdeckung und EUV-Lithographiesystem |
| CN117497633B (zh) * | 2023-04-12 | 2024-06-04 | 天合光能股份有限公司 | 薄膜制备方法、太阳能电池、光伏组件和光伏系统 |
| CN220543924U (zh) | 2023-06-25 | 2024-02-27 | 天合光能股份有限公司 | 太阳能电池、光伏组件和光伏系统 |
| CN117727695B (zh) * | 2024-02-07 | 2024-05-07 | 中国科学院长春光学精密机械与物理研究所 | 一种降低漏电的cmos器件及其制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3850679A (en) * | 1972-12-15 | 1974-11-26 | Ppg Industries Inc | Chemical vapor deposition of coatings |
| FI57975C (fi) | 1979-02-28 | 1980-11-10 | Lohja Ab Oy | Foerfarande och anordning vid uppbyggande av tunna foereningshinnor |
| JPS57130435U (enExample) * | 1981-02-06 | 1982-08-14 | ||
| US4731255A (en) * | 1984-09-26 | 1988-03-15 | Applied Materials Japan, Inc. | Gas-phase growth process and an apparatus for the same |
| JPS6482631A (en) * | 1987-09-25 | 1989-03-28 | Mitsubishi Electric Corp | Atmospheric pressure cvd system |
| FI100409B (fi) * | 1994-11-28 | 1997-11-28 | Asm Int | Menetelmä ja laitteisto ohutkalvojen valmistamiseksi |
| FI118474B (fi) * | 1999-12-28 | 2007-11-30 | Asm Int | Laite ohutkalvojen valmistamiseksi |
| US20030116087A1 (en) * | 2001-12-21 | 2003-06-26 | Nguyen Anh N. | Chamber hardware design for titanium nitride atomic layer deposition |
| US20050084610A1 (en) | 2002-08-13 | 2005-04-21 | Selitser Simon I. | Atmospheric pressure molecular layer CVD |
| US20040065255A1 (en) * | 2002-10-02 | 2004-04-08 | Applied Materials, Inc. | Cyclical layer deposition system |
| US6821563B2 (en) | 2002-10-02 | 2004-11-23 | Applied Materials, Inc. | Gas distribution system for cyclical layer deposition |
-
2006
- 2006-03-29 US US11/392,007 patent/US7413982B2/en active Active
-
2007
- 2007-03-14 WO PCT/US2007/006415 patent/WO2007126585A2/en not_active Ceased
- 2007-03-14 KR KR1020087023813A patent/KR20080109002A/ko not_active Ceased
- 2007-03-14 CN CNA2007800117282A patent/CN101415860A/zh active Pending
- 2007-03-14 EP EP07753067.3A patent/EP1999295B1/en active Active
- 2007-03-14 JP JP2009502830A patent/JP5149272B2/ja not_active Expired - Fee Related
- 2007-03-28 TW TW096110842A patent/TWI396768B/zh active
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Also Published As
| Publication number | Publication date |
|---|---|
| US20070238311A1 (en) | 2007-10-11 |
| EP1999295B1 (en) | 2013-08-07 |
| EP1999295A2 (en) | 2008-12-10 |
| TWI396768B (zh) | 2013-05-21 |
| WO2007126585A3 (en) | 2008-04-24 |
| JP5149272B2 (ja) | 2013-02-20 |
| KR20080109002A (ko) | 2008-12-16 |
| US7413982B2 (en) | 2008-08-19 |
| WO2007126585A2 (en) | 2007-11-08 |
| JP2009531549A (ja) | 2009-09-03 |
| TW200808997A (en) | 2008-02-16 |
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