JP2008270670A - 薄膜形成装置及び薄膜形成方法 - Google Patents
薄膜形成装置及び薄膜形成方法 Download PDFInfo
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- JP2008270670A JP2008270670A JP2007114632A JP2007114632A JP2008270670A JP 2008270670 A JP2008270670 A JP 2008270670A JP 2007114632 A JP2007114632 A JP 2007114632A JP 2007114632 A JP2007114632 A JP 2007114632A JP 2008270670 A JP2008270670 A JP 2008270670A
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- Prior art keywords
- film forming
- thin film
- gas
- exhaust
- wafer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45595—Atmospheric CVD gas inlets with no enclosed reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Formation Of Insulating Films (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
【解決手段】成膜ガスのガス流をよぎる方向の搬送路に沿ってウエハを搬送しつつ、前記搬送路の両側方から前記ガス流を吸い込むこと。
【選択図】図2
Description
20 薄膜形成装置
24 搬送装置
26 ディスパージョンヘッド
27 排気ヘッド
28 供給ライン
29a〜29d 成膜原料ガス源
31 排気ライン
32 排気装置
41 排気口
42 供給口
Claims (9)
- 成膜ガスをウエハ上に当てて薄膜を形成する薄膜形成装置であって、
前記成膜ガスのガス流を供給口を介して供給するガス供給部と、
前記ガス流をよぎる搬送路に沿って前記ウエハを搬送する搬送部と、
前記ガス流を排気する排気部と、を含み、
前記排気部は、前記搬送路の両側方に配置されて前記ガス流を吸い込む少なくとも2つの排気口を含むことを特徴とする薄膜形成装置。 - 前記ガス供給部は、前記供給口がその端面において開口した供給ヘッドを有し、
前記排気部は、前記排気口がその端面において開口した排気ヘッドを有し、
前記供給ヘッドと前記排気ヘッドとが一体となっていることを特徴とする請求項1記載の薄膜形成装置。 - 前記薄膜形成装置は、前記供給口の近傍に配置されて前記ウエハを加熱する加熱部を有し、該加熱部は、前記搬送路を挟んで前記成膜ガスの供給口の反対側に配置されていることを特徴とする請求項1又は2記載の薄膜形成装置。
- 前記成膜ガスはO3及びTEOSからなることを特徴とする請求項1乃至3のいずれか1に記載の薄膜形成装置。
- 前記成膜ガスはO3、TEOS、TMOP及びTEBからなることを特徴とする請求項1乃至3のいずれか1に記載の薄膜形成装置。
- ウエハを成膜ガスの流れをよぎる搬送路に沿って前記ウエハを搬送して前記ウエハ上に薄膜を形成するする薄膜形成方法であって、
前記搬送路の両側方の各々に設けられた少なくとも2つの排気口によって前記成膜ガスのガス流を吸い込むことを特徴とする薄膜形成方法。 - 前記ウエハを、前記搬送路を挟んで前記成膜ガスの供給口の反対側から加熱することを特徴とする請求項6記載の薄膜形成方法。
- 前記成膜ガスはO3及びTEOSからなることを特徴とする請求項6又は7記載の薄膜形成方法。
- 前記成膜ガスはO3、TEOS、TMOP及びTEBからなることを特徴とする請求項6又は7記載の薄膜形成方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007114632A JP2008270670A (ja) | 2007-04-24 | 2007-04-24 | 薄膜形成装置及び薄膜形成方法 |
US12/081,094 US20080268153A1 (en) | 2007-04-24 | 2008-04-10 | Thin-film forming apparatus and thin-film forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007114632A JP2008270670A (ja) | 2007-04-24 | 2007-04-24 | 薄膜形成装置及び薄膜形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008270670A true JP2008270670A (ja) | 2008-11-06 |
Family
ID=39887311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007114632A Withdrawn JP2008270670A (ja) | 2007-04-24 | 2007-04-24 | 薄膜形成装置及び薄膜形成方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080268153A1 (ja) |
JP (1) | JP2008270670A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8859042B2 (en) * | 2008-05-30 | 2014-10-14 | Alta Devices, Inc. | Methods for heating with lamps |
JP2012521094A (ja) * | 2009-03-16 | 2012-09-10 | アルタ デバイセズ,インコーポレイテッド | ウエハキャリアトラック |
DE102011080202A1 (de) * | 2011-08-01 | 2013-02-07 | Gebr. Schmid Gmbh | Vorrichtung und Verfahren zur Herstellung von dünnen Schichten |
US10932323B2 (en) | 2015-08-03 | 2021-02-23 | Alta Devices, Inc. | Reflector and susceptor assembly for chemical vapor deposition reactor |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5938851A (en) * | 1997-04-14 | 1999-08-17 | Wj Semiconductor Equipment Group, Inc. | Exhaust vent assembly for chemical vapor deposition systems |
US7413982B2 (en) * | 2006-03-29 | 2008-08-19 | Eastman Kodak Company | Process for atomic layer deposition |
-
2007
- 2007-04-24 JP JP2007114632A patent/JP2008270670A/ja not_active Withdrawn
-
2008
- 2008-04-10 US US12/081,094 patent/US20080268153A1/en not_active Abandoned
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US20080268153A1 (en) | 2008-10-30 |
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