CN101378630B - 印刷电路板和电子设备的生产方法 - Google Patents

印刷电路板和电子设备的生产方法 Download PDF

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CN101378630B
CN101378630B CN200810213948XA CN200810213948A CN101378630B CN 101378630 B CN101378630 B CN 101378630B CN 200810213948X A CN200810213948X A CN 200810213948XA CN 200810213948 A CN200810213948 A CN 200810213948A CN 101378630 B CN101378630 B CN 101378630B
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plate electrode
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electrode
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平野由和
安陪光纪
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Abstract

本发明提供印刷电路板和电子设备的生产方法，其中印刷电路板设置有板电极，其中各板电极设置有板电极基体，用于通过焊接承载底电极，底电极布置在电子器件的外边缘内侧的底部，板电极布置在该电子器件外边缘内侧，并且设置有从板电极基体向外伸出的突出部分，其宽度比板电极基体窄，并且连接到印刷电路板的导线上。

Description

印刷电路板和电子设备的生产方法 
技术领域
本发明涉及印刷电路板和电子设备的生成方法，尤其涉及通过在印刷电路板上焊接而承载设置有器件底电极的电子器件的印刷电路板和电子设备的生成方法。 
背景技术
以往，集成电路、电阻器、电容器和许多其他电子器件通过回流焊接被表面安装到印刷电路板上。 
通常，对于在印刷电路板上通过回流焊接来表面安装电子器件，首先，将用于印刷焊膏的印刷板放置在印刷电路板的板电极上，并且在印刷板上涂覆奶油状的焊膏，从而给板电极涂覆焊膏。然后，去掉印刷板，电子器件被放置在印刷电路板上，然后焊料由热风加热或红外线加热所熔化，称作“回流”，用于连接该电子器件电极和板电极。 
通过以回流焊接的这种方式生产的带有电子器件的印刷电路板经过外观检验或连接板电极和器件电极的电器测试的检查，然后用于生产电子设备。然而，如果回流所熔化的焊料没有停留在电子器件电极和板电极之间，而且漏到电子器件的外侧，那么有时在回流时电子器件和印刷电路板的翘曲将导致诸如焊接失效等以及电子设备产量下降的问题。 
利用图1中的A-C，将说明焊接印刷电路板上的板电极和电子器件上的器件底电极的实例。图1中的A是侧视图，示出了布置在电子器件20a的底部的器件电极(即，器件底电极22a)、印刷电路板10a的板电极12a、和焊点24a，图1中的B是俯视图，示出了器件底电极22a和板电极12a的位置关系，而图1中的C示出了把电子器件20b安装到印刷电路板10b上的一种方式。 
如图1中的A所示，在电子器件电极22a和板电极12a之间的焊点24a上，回流时熔化的焊料没有停留在电极之间，而且漏到电子器件的外侧。电极之间焊料较少，而且电极间焊料高度低。 
如图1中的A所示，如果如图1中的C所示电极间焊料数量少，当电子器件20b和印刷电路板10b由于回流时热应力而发生翘曲，除非熔化的焊料足够高以允许该变形，否则器件底电极22b和板电极12b将最终无法接合。 
日本早期公开的专利申请No.2005-228959提出了这样一种方法，即利用器件侧面上的电极并在器件侧面上与电极紧密接合，从而避免回流时电极间的这类接合失效现象。 
所提出的方法需要把电子器件电极做成器件侧电极。然而，随着电子设备密度越来越高，电子器件在尺寸上被制造得越来越小。因此在电子器件的外边缘形成侧电极是很困难的。此外，器件侧电极被布置覆盖电子器件的外边缘。板电极沿电子器件外边缘的方向延伸，而且在印刷电路板上电子器件所占据的面积增大，所以这种方法存在阻碍电子设备密度增大的问题。 
发明内容
本发明的一个目的是提供一种印刷电路板和/或一种电子设备的制造方法，该电子设备通过在印刷电路板上焊接，承载设置有器件底电极的电子器件，从而防止电子器件和印刷电路板之间的接合失效。 
根据本发明的一个方面，提供了一种一种印刷电路板，设置有板电极，其中每个板电极设置有：板电极基体，用于通过焊接承载电子器件的底电极，所述板电极基体放置在所述电子器件外边缘的内侧，和从所述板电极基体向外伸出的突出部分，其宽度比所述板电极基体窄，并且连接到所述印刷电路板的互连结构上。 
优选的，所述板电极基体比所述底电极大。在一个实施例中，所述板电极的周围可以用阻焊剂处理。 
根据本发明的另一个方面，提供一种电子设备的生产方法，包括：在印刷电路板上形成板电极以及形成板电极基体，所述板电极中的每一个包括所述板电极基体，所述板电极基体通过焊接承载电子器件的底电极，并且所述板电极基体放置在所述电子器件外缘的内侧，并且形成从所述板电 极基体向外伸出的突出部分，所述突出部分的宽度比所述板电极基体窄，并且所述突出部分连接到所述印刷电路板的导线上；在所述板电极上放置具有图案的印刷板，所述板电极通过所述图案暴露；将所述印刷板上涂覆有焊膏，以用所述焊膏涂覆暴露的板电极；去掉印刷板，并将所述底电极放置在涂覆有焊膏的所述板电极的所述板电极基体上，以承载所述电子器件；然后把所述板电极基体和所述底电极焊接在一起。 
优选的，所述印刷板的所述图案是矩形、圆形、椭圆形、半圆形、或扇形，所述板电极从所述图案暴露。在一个实施例中，所述板电极的周围可以用阻焊剂处理。 
根据本发明，在板电极上提供了突出部分，所以熔化的焊料保持在电极之间，电极间熔化焊料的高度升高，并且在回流时熔化的焊料吸收了电子器件和印刷电路板的翘曲，所以可以防止具有器件底电极的电子器件和印刷电路板之间的接合失效，并且可以防止电子设备的产量下降，该电子设备表面安装具有器件底电极的电子器件。 
进而，根据本发明，可以防止印刷电路板上的器件底电极的接合失效，器件底电极在印刷电路板上占据面积比器件侧电极所占据的面积小，因此可以提供更高密度的电子设备。 
附图说明
通过参考附图对下述优选实施例的描述，将更清楚的理解本发明，其中： 
图1中的A是侧视图，示出了器件底电极、板的板电极和焊点；图1中的B是俯视图，示出了器件底电极和板电极之间的位置关系；而图1中的C是侧视图，示出了器件底电极和板电极无法接合的情形。 
图2中的A是侧视图，示出了回流前用焊膏涂覆板电极的情形；图2中的B是侧视图，示出了回流时涂覆在板电极上的焊膏的形状；图2中的C是俯视图，示出了器件底电极和板电极的位置关系；而图2中的D是侧视图，示出了器件底电极和板电极接合起来的情形。 
图3中的A是印刷板的俯视图；图3中的B是印刷电路板的俯视图， 该印刷电路板具有放置在其顶面并涂覆有焊膏的印刷板；图3中的C是回流前状态下印刷电路板的俯视图，从印刷电路板上去掉印刷板，而且用焊膏涂覆其板电极；图3中的D是印刷电路板的俯视图，回流后其上熔化的焊料流动到板电极上；并且 
图4中的A是圆形印刷板开口的俯视图，图4中的B是椭圆形印刷板开口的俯视图，图4中的C是半圆形印刷板开口的俯视图，而图4中的D是扇形印刷板开口俯视图。 
具体实施方式
下面，将参照附图对本发明的实施例进行说明。 
利用图2中的A-D，在一种电子设备中，将说明设置在印刷电路板上的板电极、设置在电子器件上的器件底电极和焊点的实例。 
图2中的A是侧视图，示出了回流前用焊膏涂覆板电极12c的情形；图2中的B是侧视图，示出了回流时涂覆在板电极12c上的焊膏的形状；图2中的C是俯视图，示出了器件底电极22c和板电极12c的位置关系，板电极12c具有板电极基体14c和突出部分13c；而图2中的D是侧视图，示出了电子设备1中电子器件20c的器件底电极12c和印刷电路板10c的板电极22c通过焊点24c接合起来的情形。 
如图2中的C所示的板电极12c具有板电极基体14c和突出部分13c。突出部分13c面积减小了，因此可以防止熔化焊料流动到电子器件外侧，熔化的焊料保持在电极之间，然后形成了如图2中的D所示内圆角形焊点24c。通过形成这样的板电极并将其放置于印刷电路板上，在回流焊接中形成了内圆角形焊点24c，并且电极间熔化焊料的高度变高，所以可以在回流时吸收电子器件20c和印刷电路板10c的翘曲，并且可以避免接合失效现象。 
需要注意的是，突出部分13c被连接到未示出的印刷电路板导线上，从而把电子器件20c电器连接到印刷电路板上的其他电子器件等。 
此外，如图2中的C所示，板电极12c的板电极基体14c的纵向尺寸L2比器件底电极12c的纵向尺寸L1长，而且比从板电极基体14c上的电 子器件内侧端到电子器件20c的外周边的尺寸L3短。此外，突出部分13c的宽度尺寸L7比使熔化焊料移动的板电极基体14c的宽度尺寸L6短。 
因此，板电极基体14c被放置在电子器件20c外周边内侧，所以防止了板电极沿电子器件外边缘的方向延伸，同时具有器件底电极的电子器件在印刷电路板上所占据的面积减小了。 
图2中的A是侧视图，示出了回流前用焊膏24c-1涂覆板电极12c的情形。因为是在回流前，所以该情形示出了，焊膏刚好以未示出的印刷板的开口的厚度涂覆在印刷电路板上的状态。 
图2中的B是侧视图，示出了回流时涂覆在板电极12c上的熔化的焊料24c-2。这显示出回流加热导致焊膏熔化以及作用在器件底电极22c和板电极12c之间的熔化焊料的表面张力使焊料流动到器件底电极22c一侧的状态。因此，如图2中的A所示焊膏24c-1熔化，然后，如图2中的B所示，熔化焊料24c-2在底电极22c和板电极14c之间流动，由此熔化焊料的高度变高。 
利用图3中的A-D，将说明将电子器件回流焊接到印刷电路板上的方法的实例。 
图3中的A是印刷板32的俯视图，其设置有开口34，用来把焊膏涂覆在板电极上；图3中的B是印刷电路板10d的俯视图，其上放置有印刷板32，并且其上涂覆有焊膏36；图3中的C是印刷电路板10c的俯视图，从其上去掉印刷板32，并且在回流前状态下，在印刷电路板上的板电极13d、14d上涂覆焊膏36；而图3中的D是印刷电路板10d的俯视图，其处于回流焊熔化的焊料38移动到板电极13d、14d上的情形。 
需要注意的是在图3中的A-D中，为了解释的需要，说明了单一板电极的回流焊接，但是实际的印刷电路板设置有很多板电极。 
如图3中的A所示，印刷板32具有开口34，用于把焊膏涂覆在印刷电路板10d的板电极13d、14d上。 
图3中的B示出了其顶面上放置有印刷板32的印刷电路板10d以及涂覆在印刷电路板10d上的焊膏36。通过把焊膏涂覆在印刷板32上，焊膏36从开口34进入，并焊膏36被涂覆在由板电极基体14d和突出部分 13d组成的板电极上。需要注意的是，印刷电路板10d的表面除了板电极外的其他部分要做处理，使其对熔化焊料的沉积有抵抗性，即，提供阻焊剂33。 
需要注意的是，开口34是矩形形状，没有任何同板电极突出部分13d的形状相匹配的突出形状，其面积比由板电极基体14d和突出部分13d组成的板电极大，并且覆盖了板电极。开口34之所以制成这样的矩形形状，是因为如果开口34具有与突出部分13d相配的突出形状，那么印刷板32的突出形状将妨碍用来涂覆焊膏的刮板等。因此，可以避免印刷板32突出形状的弯曲。 
图3中的C示出了从如图3中的B所示的涂覆有焊膏36的印刷电路板10d上去掉印刷板32的情形。如图所示，根据印刷板32的开口34的矩形形状，焊膏36被涂覆在板电极基体14d和突出部分13d上。 
图3中的D示出了这样的情形，如图3中的C所示涂覆有焊膏的印刷电路板10d被回流焊，以使得焊膏34熔化，并且熔化的焊料38流动到板电极13d、14d上。印刷电路板10d的表面用阻焊剂33处理，如箭头所示，由于回流引起的熔化焊料38的表面张力，熔化的焊料从突出部分13d流动到板电极基体14d上。 
在上述说明中需要注意的是，印刷板的开口被制成矩形形状，但是开口并非只限于这种形状。只要其形状不妨碍用来涂覆焊膏的刮板并能覆盖板电极，这就可以了。 
利用图4中的A-D，将说明设置有非矩形形状的印刷板开口的实例。 
图4中的A是俯视图，示出了圆形印刷板开口34a，图4中的B示出了椭圆形印刷板开口34b，图4中的C示出了半圆形印刷板开口34c，而图4中的D示出了扇形印刷板开口34d。 
图示的具有圆形、椭圆形、半圆形、扇形、和其他形状的开口都没有突出形状并且不会妨碍用来涂覆焊膏的刮板等。在涂覆焊料时，可以避免印刷板部分32的弯曲。此外，示出了涂覆有焊膏的印刷电路板10d通过回流焊使得焊膏34熔化，并且熔化的焊料38在板电极上流动的状态。印刷电路板10d用阻焊剂33对表面进行处理，因而由于熔化焊料38的表面 张力，熔化的焊料从突出部分13d上流动到板电极基体14d上。 
因此，根据本发明的电子设备制造方法中，设置有矩形、圆形、椭圆形、半圆形、或扇形的开口被用于回流焊接，同时避免形成焊料球而导致印刷电路板上电子器件电极间的短路事故等。 
在不脱离本发明的范围的情况下，可以构造本发明的很多不同的实施例，而且应该理解的是，除了在所附权利要求中所规定的，本发明不限制于本说明书所描述的特定实施例。

Claims (4)

1.一种印刷电路板，设置有板电极，其中每个板电极设置有：
板电极基体，用于通过焊接承载电子器件的底电极，所述板电极基体放置在所述电子器件外边缘的内侧，和
从所述板电极基体向外伸出的突出部分，其宽度比所述板电极基体窄，并且连接到所述印刷电路板的互连结构上；
其中所述板电极的周围用阻焊剂处理。
2.根据权利要求1所述的印刷电路板，其中所述板电极基体比所述底电极大。
3.一种电子设备的生产方法，包括：
在印刷电路板上形成板电极以及形成板电极基体，所述板电极中的每一个包括所述板电极基体，所述板电极基体通过焊接承载电子器件的底电极，并且所述板电极基体放置在所述电子器件外缘的内侧，并且形成从所述板电极基体向外伸出的突出部分，所述突出部分的宽度比所述板电极基体窄，并且所述突出部分连接到所述印刷电路板的导线上，其中所述板电极的周围用阻焊剂处理；
在所述板电极上放置具有图案的印刷板，所述板电极通过所述图案暴露；
将所述印刷板上涂覆有焊膏，以用所述焊膏涂覆暴露的板电极；
去掉印刷板，并将所述底电极放置在涂覆有焊膏的所述板电极的所述板电极基体上，以承载所述电子器件；然后
把所述板电极基体和所述底电极焊接在一起。
4.如权利要求3所述的电子设备生产方法，其中所述印刷板的所述图案是矩形、圆形、椭圆形、半圆形、或扇形，所述板电极从所述图案暴露。 
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