CN101351501B - 环氧树脂组合物 - Google Patents

环氧树脂组合物 Download PDF

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Publication number
CN101351501B
CN101351501B CN2006800494804A CN200680049480A CN101351501B CN 101351501 B CN101351501 B CN 101351501B CN 2006800494804 A CN2006800494804 A CN 2006800494804A CN 200680049480 A CN200680049480 A CN 200680049480A CN 101351501 B CN101351501 B CN 101351501B
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CN
China
Prior art keywords
epoxy resin
weight
parts
composition
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800494804A
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English (en)
Chinese (zh)
Other versions
CN101351501A (zh
Inventor
郑成仑
金道显
李宰源
金永一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KK SDS
Original Assignee
SK Chemicals Co Ltd
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Filing date
Publication date
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Publication of CN101351501A publication Critical patent/CN101351501A/zh
Application granted granted Critical
Publication of CN101351501B publication Critical patent/CN101351501B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN2006800494804A 2005-12-26 2006-12-22 环氧树脂组合物 Expired - Fee Related CN101351501B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020050129793 2005-12-26
KR1020050129793A KR101148051B1 (ko) 2005-12-26 2005-12-26 에폭시 수지 조성물
KR10-2005-0129793 2005-12-26
PCT/KR2006/005676 WO2007075014A1 (en) 2005-12-26 2006-12-22 Epoxy resin composition

Publications (2)

Publication Number Publication Date
CN101351501A CN101351501A (zh) 2009-01-21
CN101351501B true CN101351501B (zh) 2011-05-18

Family

ID=38218210

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800494804A Expired - Fee Related CN101351501B (zh) 2005-12-26 2006-12-22 环氧树脂组合物

Country Status (5)

Country Link
JP (1) JP2009521589A (ja)
KR (1) KR101148051B1 (ja)
CN (1) CN101351501B (ja)
TW (1) TWI453229B (ja)
WO (1) WO2007075014A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100966260B1 (ko) * 2007-11-28 2010-06-28 (주)에버텍엔터프라이즈 저습성 및 고신뢰성을 갖는 다이 접착용 전기 전도성 접착조성물
KR101368986B1 (ko) 2007-12-28 2014-02-28 에스케이케미칼주식회사 엘시디 구동소자용 에폭시 수지 조성물
KR101623670B1 (ko) * 2012-01-18 2016-05-23 미쓰이 가가쿠 가부시키가이샤 조성물, 조성물로 이루어지는 표시 디바이스 단면 시일제, 표시 디바이스 및 그의 제조 방법
CN103554835B (zh) * 2013-10-16 2015-09-09 太原理工大学 一种中低温快速固化增强用环氧树脂材料的制备方法
WO2015141717A1 (ja) * 2014-03-20 2015-09-24 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
JP6283624B2 (ja) * 2015-05-28 2018-02-21 日東電工株式会社 中空型電子デバイス封止用シート、中空型電子デバイスパッケージの製造方法、及び、中空型電子デバイスパッケージ
WO2017110919A1 (ja) 2015-12-25 2017-06-29 東レ株式会社 エポキシ樹脂組成物、繊維強化複合材料、成形品および圧力容器
CN109385047B (zh) * 2018-10-31 2020-11-10 成都市冠宇复合材料制品有限公司 一种树脂组合物及其制备方法
KR102258362B1 (ko) 2020-10-19 2021-06-01 권용문 문경약돌을 먹인 한우의 사골농축액을 이용한 다용도 간장소스 조성물 및 그 제조방법
KR20230157487A (ko) * 2021-07-12 2023-11-16 아사히 가세이 가부시키가이샤 에폭시 수지 조성물, 필름, 필름의 제조 방법, 및 경화물

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1237186A (zh) * 1997-07-24 1999-12-01 洛克泰特公司 用作充填密封材料的热固性树脂组合物
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
CN1282105A (zh) * 2000-08-25 2001-01-31 中国科学院化学研究所 一种半导体封装用的液体环氧组合物及其用途
CN1358798A (zh) * 2000-12-13 2002-07-17 国家淀粉及化学投资控股公司 使用期间放热量低的新型高温欠充模材料

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JPS6456719A (en) * 1987-08-26 1989-03-03 Sanyu Resin Kk Casting resin composition for electronic parts
KR910010026B1 (ko) * 1988-12-19 1991-12-10 주식회사 럭키 액상에폭시 수지 조성물 및 그의 제조방법
JPH0627183B2 (ja) * 1990-03-30 1994-04-13 ソマール株式会社 液状エポキシ樹脂組成物
KR940014615A (ko) * 1992-12-29 1994-07-19 김충세 포커스 팩(focus pack)봉지제용 열경화성 에폭시수지 조성물
JP3141970B2 (ja) * 1993-06-30 2001-03-07 ソマール株式会社 液状エポキシ樹脂組成物
JPH09151303A (ja) * 1995-09-25 1997-06-10 Nissan Chem Ind Ltd エポキシ樹脂組成物
AU740553B2 (en) * 1998-01-16 2001-11-08 Loctite (R&D) Limited Curable epoxy-based compositions
JP2000178411A (ja) * 1998-12-17 2000-06-27 Hitachi Chem Co Ltd 難燃性エポキシ樹脂組成物及びこの組成物を用いた電気部品
KR100372211B1 (ko) * 1999-06-17 2003-02-14 헨켈 록타이트 코오포레이션 조절가능하게 분해가능한 열경화성 수지 조성물, 상기 조성물을 사용하여 반도체 칩과 회로판 사이를 밀봉 언더필링하는 방법, 및 상기 조성물을 사용하여 제조한 전자 장치
TWI229929B (en) * 2001-01-29 2005-03-21 Ube Industries Underfill material for COF mounting and electronic components
JP2003002951A (ja) * 2001-06-25 2003-01-08 New Japan Chem Co Ltd 液状エポキシ樹脂組成物の薄膜硬化物
JP2003026766A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ系反応性希釈剤及び該希釈剤を含む液状エポキシ樹脂組成物
JP4068406B2 (ja) * 2001-07-27 2008-03-26 昭和電工株式会社 重合性化合物、該化合物の製造方法、該化合物を含む重合性組成物、該組成物を硬化してなる硬化物、及び該硬化物の製造方法
JP2003160644A (ja) * 2001-11-27 2003-06-03 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
EP1640396A1 (en) * 2003-06-04 2006-03-29 Sekisui Chemical Co., Ltd. Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device
TW561162B (en) 2003-06-11 2003-11-11 Chang Chun Plastics Co Ltd Epoxy resin composition for encapsulation of optical semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
CN1237186A (zh) * 1997-07-24 1999-12-01 洛克泰特公司 用作充填密封材料的热固性树脂组合物
CN1282105A (zh) * 2000-08-25 2001-01-31 中国科学院化学研究所 一种半导体封装用的液体环氧组合物及其用途
CN1358798A (zh) * 2000-12-13 2002-07-17 国家淀粉及化学投资控股公司 使用期间放热量低的新型高温欠充模材料

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开平6-1830A 1994.01.11

Also Published As

Publication number Publication date
TW200734367A (en) 2007-09-16
CN101351501A (zh) 2009-01-21
KR101148051B1 (ko) 2012-05-25
TWI453229B (zh) 2014-09-21
KR20070068071A (ko) 2007-06-29
JP2009521589A (ja) 2009-06-04
WO2007075014A1 (en) 2007-07-05

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SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SDS K. K.

Free format text: FORMER OWNER: SK CHEMICALS CO., LTD.

Effective date: 20140408

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20140408

Address after: Gyeonggi Do, South Korea

Patentee after: KK SDS

Address before: Gyeonggi Do, South Korea

Patentee before: SK Chemistry Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110518

Termination date: 20151222

EXPY Termination of patent right or utility model