TW200734367A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
TW200734367A
TW200734367A TW095148201A TW95148201A TW200734367A TW 200734367 A TW200734367 A TW 200734367A TW 095148201 A TW095148201 A TW 095148201A TW 95148201 A TW95148201 A TW 95148201A TW 200734367 A TW200734367 A TW 200734367A
Authority
TW
Taiwan
Prior art keywords
parts
epoxy resin
weight
resin composition
reactive diluent
Prior art date
Application number
TW095148201A
Other languages
Chinese (zh)
Other versions
TWI453229B (en
Inventor
Seong-Roon Jeong
Do-Hyun Kim
Jae-Won Lee
Young-Il Kim
Original Assignee
Sk Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sk Chemicals Co Ltd filed Critical Sk Chemicals Co Ltd
Publication of TW200734367A publication Critical patent/TW200734367A/en
Application granted granted Critical
Publication of TWI453229B publication Critical patent/TWI453229B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The present invention relates to an epoxy resin composition, in particular, to an epoxy resin composition suitable for use as an encapsulation agent for electrical parts such as drive-ICs mounted on a circuit board. The epoxy composition is a liquid phase at room temperature and includes 100 parts by weight of an epoxy resin having 2 or more glycidyl groups in the molecure, 10-50 parts by weight of a reactive diluent having one or more glycidyl groups in the molecure, 50-200 parts by weight of an anhydrous curing agent which is a liquid phase at room temperature with respect to 100 parts by weight of the epoxy resin and the reactive diluent, and 1-20 parts by weight of a latent curing accelerator with respect to 100 parts by weight of the epoxy resin, the reactive diluent, and the anhydrous curing agent, and whose viscosity at 25 DEG C is 250-500 cps, gelation time at 150 DEG C is below 120 seconds.
TW095148201A 2005-12-26 2006-12-21 Epoxy resin composition TWI453229B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050129793A KR101148051B1 (en) 2005-12-26 2005-12-26 Epoxy resin composition

Publications (2)

Publication Number Publication Date
TW200734367A true TW200734367A (en) 2007-09-16
TWI453229B TWI453229B (en) 2014-09-21

Family

ID=38218210

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148201A TWI453229B (en) 2005-12-26 2006-12-21 Epoxy resin composition

Country Status (5)

Country Link
JP (1) JP2009521589A (en)
KR (1) KR101148051B1 (en)
CN (1) CN101351501B (en)
TW (1) TWI453229B (en)
WO (1) WO2007075014A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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KR100966260B1 (en) * 2007-11-28 2010-06-28 (주)에버텍엔터프라이즈 Electrically Conductive Adhesive Compositions for Die Adhesion Having Enhanced Moisture Resistance and Reliability
KR101368986B1 (en) 2007-12-28 2014-02-28 에스케이케미칼주식회사 Epoxy Resin Composition for LCD driving element
WO2013108629A1 (en) * 2012-01-18 2013-07-25 三井化学株式会社 Composition, composition for display device end-face sealing agent comprising composition, and display device and method for manufacturing same
CN103554835B (en) * 2013-10-16 2015-09-09 太原理工大学 The preparation method of low-temperature fast-curing enhancing epoxide resin material in a kind of
WO2015141717A1 (en) * 2014-03-20 2015-09-24 日本ゼオン株式会社 Radiation-sensitive resin composition and electronic component
JP6283624B2 (en) * 2015-05-28 2018-02-21 日東電工株式会社 Hollow electronic device sealing sheet, hollow electronic device package manufacturing method, and hollow electronic device package
EP3395851B1 (en) 2015-12-25 2021-03-10 Toray Industries, Inc. Epoxy resin composition, fiber-reinforced composite material, molded article, and pressure vessel
CN109385047B (en) * 2018-10-31 2020-11-10 成都市冠宇复合材料制品有限公司 Resin composition and preparation method thereof
KR102258362B1 (en) 2020-10-19 2021-06-01 권용문 Multipurpose soy sauce composition and manufacturing method therof
KR20230157487A (en) * 2021-07-12 2023-11-16 아사히 가세이 가부시키가이샤 Epoxy resin composition, film, method for producing film, and cured product

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6456719A (en) * 1987-08-26 1989-03-03 Sanyu Resin Kk Casting resin composition for electronic parts
KR910010026B1 (en) * 1988-12-19 1991-12-10 주식회사 럭키 Liquid epoxy resin composition and preparation thereof
JPH0627183B2 (en) * 1990-03-30 1994-04-13 ソマール株式会社 Liquid epoxy resin composition
KR940014615A (en) * 1992-12-29 1994-07-19 김충세 Thermosetting epoxy resin composition for FOCUS PACK encapsulant
JP3141970B2 (en) * 1993-06-30 2001-03-07 ソマール株式会社 Liquid epoxy resin composition
JPH09151303A (en) * 1995-09-25 1997-06-10 Nissan Chem Ind Ltd Epoxy resin composition
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
WO1999005196A1 (en) * 1997-07-24 1999-02-04 Loctite Corporation Thermosetting resin compositions useful as underfill sealants
KR100573326B1 (en) * 1998-01-16 2006-04-24 록타이트(알 앤 디) 리미티드 Curable epoxy-based compositions
JP2000178411A (en) * 1998-12-17 2000-06-27 Hitachi Chem Co Ltd Flame retardant epoxy resin composition and electrical part using the composition
CN1178287C (en) * 1999-06-17 2004-12-01 洛克泰特公司 Reworkable thermosetting resin composition
CN1125488C (en) * 2000-08-25 2003-10-22 中国科学院化学研究所 Liquid epoxy composite for packaging semiconductor and its application
US6548575B2 (en) * 2000-12-13 2003-04-15 National Starch And Chemical Investment Holding Corporation High temperature underfilling material with low exotherm during use
KR100928124B1 (en) * 2001-01-29 2009-11-24 우베 고산 가부시키가이샤 COF mounting underfill and electronic parts
JP2003002951A (en) * 2001-06-25 2003-01-08 New Japan Chem Co Ltd Cured thin-film of liquid epoxy resin composition
JP2003026766A (en) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd Epoxy-based reactive diluent and liquid epoxy resin composition containing the same
JP4068406B2 (en) * 2001-07-27 2008-03-26 昭和電工株式会社 Polymerizable compound, method for producing the compound, polymerizable composition containing the compound, cured product obtained by curing the composition, and method for producing the cured product
JP2003160644A (en) * 2001-11-27 2003-06-03 Matsushita Electric Works Ltd Semiconductor sealing epoxy resin composition and semiconductor device
TW200508314A (en) * 2003-06-04 2005-03-01 Sekisui Chemical Co Ltd A liquid crystal display device and curing resin composition, sealing material for the same
TW561162B (en) 2003-06-11 2003-11-11 Chang Chun Plastics Co Ltd Epoxy resin composition for encapsulation of optical semiconductor device

Also Published As

Publication number Publication date
TWI453229B (en) 2014-09-21
CN101351501A (en) 2009-01-21
KR101148051B1 (en) 2012-05-25
CN101351501B (en) 2011-05-18
KR20070068071A (en) 2007-06-29
JP2009521589A (en) 2009-06-04
WO2007075014A1 (en) 2007-07-05

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