TW200717741A - Thermalsetting composition for sealing organic EL element - Google Patents

Thermalsetting composition for sealing organic EL element

Info

Publication number
TW200717741A
TW200717741A TW095124709A TW95124709A TW200717741A TW 200717741 A TW200717741 A TW 200717741A TW 095124709 A TW095124709 A TW 095124709A TW 95124709 A TW95124709 A TW 95124709A TW 200717741 A TW200717741 A TW 200717741A
Authority
TW
Taiwan
Prior art keywords
pts
organic
sealing
composition
molecular
Prior art date
Application number
TW095124709A
Other languages
Chinese (zh)
Other versions
TWI387071B (en
Inventor
Yoshihide Arai
Kenichi Horie
Original Assignee
Three Bond Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Three Bond Co Ltd filed Critical Three Bond Co Ltd
Publication of TW200717741A publication Critical patent/TW200717741A/en
Application granted granted Critical
Publication of TWI387071B publication Critical patent/TWI387071B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Abstract

To provide a thermosetting composition for organic EL device sealing that attains sealing without detriment to the organic EL device so that the occurrence/growth of dark spots is surely inhibited with high transmittance retained to thereby maintain stable emission performance over a prolonged period of time. Sealing of organic EL device is carried out by the use of a composition comprising as main components 100 pts.wt. Of low-molecular-weight epoxy resin of 200 to 2000 molecular weight (A) having at least two glycidyl groups per molecule; 40 to 150 pts.wt. Of high-molecular-weight epoxy resin of 20,000 to 100,000 molecular weight (B) having a bisphenol A or bisphenol F skeleton; per 100 pts.wt. Of the sum of component (A) and component (B), 0.5 to 20 pts.wt. Of latent imidazole compound (C) having a nitrile group; and 0.1 to 10 pts.wt. Of silage coupling agent (D).
TW095124709A 2005-10-24 2006-07-06 Thermalsetting composition for sealing organic el element TWI387071B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005308269A JP5288150B2 (en) 2005-10-24 2005-10-24 Thermosetting composition for sealing organic EL elements

Publications (2)

Publication Number Publication Date
TW200717741A true TW200717741A (en) 2007-05-01
TWI387071B TWI387071B (en) 2013-02-21

Family

ID=37967506

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124709A TWI387071B (en) 2005-10-24 2006-07-06 Thermalsetting composition for sealing organic el element

Country Status (5)

Country Link
JP (1) JP5288150B2 (en)
KR (1) KR101234895B1 (en)
CN (1) CN101243117B (en)
TW (1) TWI387071B (en)
WO (1) WO2007049385A1 (en)

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KR101376818B1 (en) * 2007-06-26 2014-03-21 엘지전자 주식회사 Organic Light Emitting Diode
CN101113229B (en) * 2007-07-04 2010-10-06 深圳典邦科技有限公司 Curing agent intermediate composition and curing agent employing the same
CN101821823B (en) 2007-10-12 2013-03-06 松下电器产业株式会社 Case mold type capacitor and method for manufacturing the same
KR20090076753A (en) 2008-01-08 2009-07-13 주식회사 엘지화학 Transparent resin composition
KR20090076754A (en) 2008-01-08 2009-07-13 주식회사 엘지화학 Optical films, retardation films, protective films, and liquid crystal display comprising the sames
JP5671778B2 (en) * 2008-03-26 2015-02-18 日立化成株式会社 Film-like adhesive for semiconductor sealing, semiconductor device and method for manufacturing the same
JP5881927B2 (en) * 2008-03-26 2016-03-09 日立化成株式会社 Semiconductor sealing adhesive, semiconductor sealing film adhesive, semiconductor device manufacturing method, and semiconductor device
US8613986B2 (en) 2008-04-30 2013-12-24 Lg Chem, Ltd. Optical film and information technology apparatus comprising the same
KR101091534B1 (en) * 2008-04-30 2011-12-13 주식회사 엘지화학 Optical film and information technology apparatus comprising the same
KR101105424B1 (en) * 2008-04-30 2012-01-17 주식회사 엘지화학 Resin compositions and optical films formed by using the same
US8232350B2 (en) 2008-06-02 2012-07-31 3M Innovative Properties Company Adhesive encapsulating composition and electronic devices made therewith
JP2010080087A (en) * 2008-09-24 2010-04-08 Toshiba Corp Method of manufacturing flat panel display device, apparatus for manufacturing flat panel display device, and flat panel display device
JP5201347B2 (en) * 2008-11-28 2013-06-05 株式会社スリーボンド Photocurable resin composition for sealing organic EL elements
JP5696038B2 (en) * 2009-04-17 2015-04-08 三井化学株式会社 Sealing composition and sealing sheet
JP5619383B2 (en) * 2009-07-10 2014-11-05 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 Composition for sealing organic light emitting device and organic light emitting device
KR20120055720A (en) * 2009-09-04 2012-05-31 가부시끼가이샤 쓰리본드 Organic el element sealing member
JP5429054B2 (en) * 2010-06-01 2014-02-26 住友ベークライト株式会社 Resin composition, metal foil with resin, and metal base substrate
US8674502B2 (en) 2010-07-16 2014-03-18 Hitachi Chemical Company, Ltd. Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
JP5651421B2 (en) * 2010-10-07 2015-01-14 三井化学株式会社 Sealing composition and sealing sheet using the same
TWI491638B (en) 2010-11-16 2015-07-11 Ind Tech Res Inst Thermosetting composition
WO2012138030A1 (en) * 2011-04-05 2012-10-11 제일모직 주식회사 Adhesive film for an organic el device, composite included in the adhesive film for an organic el device, and organic el display device including the adhesive film for an organic el device
WO2014007288A1 (en) 2012-07-05 2014-01-09 東レ株式会社 Binder resin composition for preform, binder particle, preform, and fiber-reinforced composite material
KR102055869B1 (en) * 2012-07-05 2019-12-13 쓰리본드 화인 케미칼 가부시키가이샤 Sheet adhesive and organic el panel using same
KR102085332B1 (en) 2012-07-26 2020-03-05 덴카 주식회사 Resin composition
KR20140071552A (en) 2012-11-23 2014-06-12 삼성디스플레이 주식회사 Organic light emitting display apparatus and manufacturing method thereof
KR101549735B1 (en) * 2013-03-26 2015-09-02 제일모직주식회사 Composition for filling agent for encapsulating organic light emitting diode and organic light emitting diode display comprising the same
JP6152319B2 (en) 2013-08-09 2017-06-21 日東電工株式会社 Adhesive composition, adhesive tape or sheet
EP2977406B1 (en) 2013-09-24 2024-01-24 LG Chem, Ltd. Curable composition
JP2015096571A (en) * 2013-11-15 2015-05-21 日東電工株式会社 Photocurable resin composition and photocurable resin composition-made sheet obtained by using the same
JPWO2015087807A1 (en) * 2013-12-11 2017-03-16 積水化学工業株式会社 Curable resin composition for sealing organic electroluminescence display element, curable resin sheet for sealing organic electroluminescence display element, and organic electroluminescence display element
JP6549984B2 (en) * 2014-02-27 2019-07-24 積水化学工業株式会社 Curable resin composition for sealing an organic electroluminescence display device, curable resin sheet for sealing an organic electroluminescence display device, and an organic electroluminescence display device
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JP4816863B2 (en) * 2004-12-22 2011-11-16 株式会社スリーボンド Thermosetting composition for sealing organic EL elements

Also Published As

Publication number Publication date
KR101234895B1 (en) 2013-02-19
JP5288150B2 (en) 2013-09-11
WO2007049385A1 (en) 2007-05-03
JP2007112956A (en) 2007-05-10
CN101243117A (en) 2008-08-13
CN101243117B (en) 2010-11-10
KR20080065582A (en) 2008-07-14
TWI387071B (en) 2013-02-21

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