JP2015096571A - Photocurable resin composition and photocurable resin composition-made sheet obtained by using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photocurable resin composition excellent all in transparency, heat resistance, flexibility, follow up ability to unevenness and releasability without generating bleedout.SOLUTION: There is provided the photocurable resin composition which contains following components (A) to (D), the amount of the component (A) being set in a range of 30 to 70 pts.wt., the amount of the component (B) being set in a range of 10 to 40 pts.wt., the amount of the component (C) being set in a range of 10 to 30 pts.wt. and the amount of the component (D) being set to be 0.5 to 2.0 pts.wt based on 100 pts.wt. of the total amount of the components (A), (B) and (C). (A) a solid epoxy resin having an epoxy equivalent of 7000 to 13000 g/eq. (B) a solid epoxy resin having an epoxy equivalent of 400 to 1000 g/eq. (C) a liquid epoxy resin having a viscosity at 25°C of 12 to 25 Pa s. (D) an optical acid generator.

Description

  INDUSTRIAL APPLICABILITY The present invention is an optical lens and optical-related member that require transparency, and an optical component material that is suitable for use as an optical component material for bonding between optical components and the like. The present invention relates to a curable resin composition and a sheet made of a flexible photocurable resin composition using the same.

  Imaging devices used in recent optical components such as mobile phones and digital cameras are equipped with optical lenses for imaging. Generally, the optical lens materials include optical glass and transparent plastic materials. It is used. In particular, with the spread of mobile phones with imaging functions such as smartphones in recent years, it is necessary to manufacture optical lenses at a lower cost. Plastic resin-based plastic lens materials are the mainstream.

  In the case of using such a plastic lens material, the mounting method of the imaging device on the printed circuit board is because the heat resistance of the optical lens material is low, so the image sensor is first solder-flow mounted on the printed circuit board, and then A retrofitting method such as attaching a lens unit to an image sensor is employed. However, on the other hand, from the viewpoint of cheaper mass production, after attaching the lens unit to the image sensor, a method of reflow mounting them on a printed circuit board as a batch is considered to be superior as a manufacturing process. Of course, when such a method is adopted, an optical lens material having high heat resistance is naturally required.

  In response to such market demands, an imprint manufacturing method using a liquid photocurable resin composition mainly composed of an epoxy resin with high heat resistance as a forming material for optical lenses and the like has been studied and put into practical use. It is being done. This imprint method is a method in which a molding die is pressed against a liquid resin material, and a molded product is formed by following a specific fine pattern or uneven shape formed on the mold surface. There is a fear that the component adheres to the surface of the processing mold as a residue and soils the processing mold, and there is a concern that the number of repeated use of the processing mold is limited. Furthermore, depending on the combination of the material of the processing mold to be used and the photocurable resin composition that is the forming material, the releasability between the resin molded product after photocuring and the processing mold is poor, and the molded product may be missing at the time of mold release. For example, a problem that a desired molded product cannot be obtained occurs, and a decrease in yield due to the problem is a technical problem.

  On the other hand, materials having photo-curing properties have been widely used especially in the field of optics, but there are a plurality of forms such as liquids, dry films, sheets, etc., which are appropriately selected according to the intended use. Yes. In the case of the latter dry film or sheet shape, most of them are acrylic resin and silicone resin, but in recent years, those containing epoxy resin as the main component have also been studied for the above reasons. ing. For example, it contains a resin component having a high molecular weight with a weight average molecular weight of 10,000 or more, an epoxy resin that is solid at room temperature with a weight average molecular weight of less than 10,000, an epoxy resin that is liquid at room temperature, and a photoacid generator and a solvent component. A photosensitive resin varnish has been proposed and used for printed circuit board applications (Patent Document 1). Similarly, to obtain a photocurable epoxy resin film, it contains a phenoxy resin, a bisphenol type epoxy resin that is solid at room temperature, a bisphenol type epoxy resin that is liquid at room temperature, a specific butyral resin, and a photocationic polymerization initiator. A photocurable resin composition has been proposed (Patent Document 2).

JP 2002-62650 A Japanese Patent No. 5028004

  However, although the photosensitive resin varnish disclosed in Patent Document 1 is excellent in terms of transparency, it is not sufficiently satisfactory in terms of flexibility, and is inferior in unevenness followability to a substrate or a processing mold. There is a problem. Moreover, the photocurable resin composition disclosed in Patent Document 2 uses a low-viscosity liquid resin component, and depending on the blending ratio of each component, there is a concern that tack may remain on the film after film formation. When such a resin film is taken, for example, by directly contacting the mold and photocuring, and then releasing the mold, the trace liquid component bleeds out, and the surface of the mold This may cause a residue and cause a mold release failure.

  The present invention has been made in view of such circumstances, and is a photocurable resin composition that is excellent in all of transparency, heat resistance, flexibility, unevenness followability, and releasability without causing bleeding out. An object of the present invention is to provide a sheet made of a photocurable resin composition having good adhesion to a base material, which is obtained using the same.

In order to achieve the above object, the present invention is a photocurable resin composition containing the following components (A) to (D), the sum of (A), (B) and (C) components: With respect to 100 parts by weight, the component (A) is set to 30 to 70 parts by weight, the component (B) is set to 10 to 40 parts by weight, the component (C) is set to 10 to 30 parts by weight, and (D) Let the 1st summary be the photocurable resin composition by which a component is set to 0.5-2.0 weight part.
(A) Solid epoxy resin having an epoxy equivalent of 7000 to 13000 g / eq.
(B) Solid epoxy resin having an epoxy equivalent of 400 to 1000 g / eq.
(C) A liquid epoxy resin having a viscosity of 12 to 25 Pa · s at 25 ° C.
(D) A photoacid generator.

  Moreover, this invention makes a 2nd summary the sheet | seat made from a photocurable resin composition formed by forming the photocurable resin composition of the said 1st summary in a sheet form.

  That is, the present inventor has intensively studied to solve the above problems. In the course of the research, the present inventor recalled using two types of solid epoxy resins having different epoxy equivalents and a liquid epoxy resin as the epoxy resin component having excellent heat resistance, and repeated various experiments. As a result, as described above, by using each component of (A) to (D) at a specific ratio, excellent transparency, heat resistance, and flexibility are achieved without developing tackiness due to the occurrence of bleed out. The present invention has been achieved by finding that all of the properties, the unevenness followability and the releasability can be achieved.

  The following can be considered as one of the factors that can exert such effects. That is, the solid epoxy resin [component (A)] having a specific epoxy equivalent to the composition of the solid epoxy resin [component (B)] having a specific epoxy equivalent and the liquid epoxy resin [component (C)] It plays a role as a reactive binder that imparts flexibility, and it is thus presumed that high flexibility of the uncured layer is achieved while maintaining the reactivity. Moreover, in the photocurable resin composition of this invention, since content of liquid epoxy resin [(C) component] is set to a specific range, handling property is good and it hardens | cures well, without expressing strong tackiness. It will be.

  Thus, the photocurable resin composition of the present invention comprises two types of solid epoxy resins [component (A), component (B)] each having an epoxy equivalent in a specific range and a liquid epoxy resin having a specific viscosity [( C) component] and a photoacid generator [(D) component], and the ratio of each of the above components is set within a specific range. For this reason, if a sheet made of the photocurable resin composition using the photocurable resin composition is used, transparency, heat resistance, flexibility, unevenness follow-up property and release without causing bleeding out. As a result, it becomes possible to provide a sheet that exhibits good followability with respect to a substrate having a minute unevenness or a processing mold, and also has good adhesion to a base material. Therefore, the sheet made of the photocurable resin composition of the present invention can be suitably used as an optical component material that is also used for adhesion between optical lenses, optical related members, optical components, and the like. Furthermore, the sheet | seat made from the photocurable resin composition of this invention has favorable patternability, and can also be used for a lithography use.

  Next, an embodiment for carrying out the present invention will be described.

The photocurable resin composition of the present invention comprises a solid epoxy resin [component (A)] having an epoxy equivalent of 7000 to 13000 g / eq, and a solid epoxy resin [component (B)] having an epoxy equivalent of 400 to 1000 g / eq, The liquid epoxy resin [(C) component] having a viscosity at 25 ° C. of 12 to 25 Pa · s and the photoacid generator [(D) component] can be used. Moreover, in the present invention, (A) to (D) are set to have a specific content with respect to 100 parts by weight of the total amount of the components (A), (B) and (C). Features. In the present invention, “liquid” or “solid” means “liquid” or “solid” state at a temperature of 25 ° C.
Hereinafter, various components will be described in order.

<A: Solid epoxy resin>
As described above, the solid epoxy resin of the component (A) has an epoxy equivalent in the range of 7000 to 13000 g / eq, particularly preferably 7500 to 12500 g / eq. It is preferable to select and use the number of functional groups as appropriate in consideration of desired heat resistance, transparency, and the like. Furthermore, as (A) component, it is preferable to use the thing of a weight average molecular weight (polystyrene conversion) 30000-80000, Especially preferably, it is 45000-60000, For example, a phenoxy resin is mention | raise | lifted as the example. That is, by using the solid epoxy resin having the epoxy equivalent and the high weight average molecular weight, it is possible to form a flexible sheet that does not break even when bent. The phenoxy resin is usually synthesized from a bisphenol A type epoxy resin or a bisphenol F type epoxy resin. From the viewpoint of transparency and heat resistance, a phenoxy resin synthesized from a bisphenol A type epoxy resin may be used. preferable. These can be used alone or in combination of two or more. Moreover, you may use what the solid epoxy resin which has the said characteristic is already solvent-diluted. Specifically, YP-50, YP-50S, YP-70, XZ-1356-2 (all manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), 1256, 4250, 4275, 1256B40 (all manufactured by Mitsubishi Chemical Corporation), etc. are used. It is done.

  The content of the component (A) needs to be set to 30 to 70 parts by weight with respect to 100 parts by weight of the total weight of the components (A) to (C). More preferably, it is 40-70 weight part. That is, if the content of the component (A) is too small, the flexibility will be inferior when molded into a sheet, and if the content is too large, the transparency will be lowered and the desired heat resistance can be obtained. It becomes difficult.

<B: Solid epoxy resin>
As the component (B) used together with the component (A), as described above, those having an epoxy equivalent in the range of 400 to 1000 g / eq are used from the viewpoint of sheet film formability and heat resistance. Particularly preferably, it is 600 to 1000 g / eq. And like the said (A) component, it is preferable to select suitably considering desired transparency, heat resistance, etc. Examples of the component (B) include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, fluorene type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, and adamantane. Type epoxy resin, alicyclic epoxy resin and the like. These can be used alone or in combination of two or more. Among them, it is particularly preferable to use a bisphenol A type epoxy resin. Specifically, YD-012, YD-013, YD-014, YDF-2001, YDF-2004 (all manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), 1001, 1002, 1003, 1055, 1004 (all manufactured by Mitsubishi Chemical Corporation) or the like is used.

  The content of the component (B) needs to be set to be 10 to 40 parts by weight with respect to 100 parts by weight of the total weight of the components (A) to (C). More preferably, it is 15 to 35 parts by weight. That is, when there is too little content of (B) component, the crosslinked density after hardening is small and it becomes difficult to obtain desired heat resistance. Moreover, when there is too much content, it will be inferior to the handleability of the sheet | seat at the time of shape | molding in a sheet form.

<C: Liquid epoxy resin>
As the component (C) used together with the components (A) and (B), as described above, a liquid epoxy resin having a viscosity of 12 to 25 Pa · s at 25 ° C. is used. The viscosity is measured using, for example, a cone plate type (E type) viscometer, and can be appropriately selected and used as long as it has such a specific range of viscosity. For example, bisphenol A type epoxy resin can be used. If the viscosity at 25 ° C. is too low, the tackiness of the sheet after film formation and drying becomes strong, and handling properties are lacking, or bleeding out after curing. Specifically, JER828, JER828XA, JER827, JER152, JER630 (all manufactured by Mitsubishi Chemical Corporation) and the like are used.

  Content of the said (C) component needs to be 10-30 weight part with respect to 100 weight part of total weight of (A)-(C) component. More preferably, it is 10 to 25 parts by weight. That is, when the content of the component (C) is too small, the adhesiveness when the sheet after film formation is affixed to a predetermined substrate is lacking, and when the content is too large, the sheet is formed into a sheet shape. The sheet has a strong tackiness and the cover film may be transferred.

<D: Photoacid generator>
And as a photo-acid generator [(D) component] used with said (A)-(C) component, what generate | occur | produces the acid which can be cationically polymerized by ultraviolet irradiation is used. Examples of such a photoacid generator include anions such as SbF ₆ ⁻ , PF ₆ ⁻ , BF ₄ ⁻ , AsF ₆ ⁻ , (C ₆ F ₅ ) ₄ ⁻ , and PF ₄ (CF ₂ CF ₃ ) ₂ ^−. Examples thereof include onium salts (diazonium salts, sulfonium salts, iodonium salts, selenium salts, pyridinium salts, ferrocenium salts, phosphonium salts, etc.) composed of a component and a cationic component. These may be used alone or in combination of two or more. Specifically, aromatic sulfonium salts, aromatic iodonium salts, aromatic phosphonium salts, aromatic sulfoxonium salts, and the like can be used. Among these, from the viewpoint of photocurability and transparency, a photoacid generator containing hexafluorophosphate or hexafluoroantimonate as an anionic component is preferable.

  The content of the component (D) needs to be set in the range of 0.5 to 2.0 parts by weight with respect to 100 parts by weight of the total weight of the components (A) to (C). More preferably, it is the range of 0.5-1.5 weight part. That is, if the content of the component (D) is too small, the curability may be deteriorated or the heat resistance may be lowered. If the content is too large, the curability is improved while the transparency is impaired. Become.

<Other additives>
Moreover, in addition to each said component, the other additive can be suitably mix | blended with the photocurable resin composition of this invention as needed. For example, for the purpose of enhancing curability, a photosensitizer such as anthracene, an acid proliferating agent, or the like can be blended as necessary. Moreover, in the use which produces hardened | cured material on base materials, such as glass, in order to improve adhesiveness with a base material, you may add coupling agents, such as a silane type or a titanium type. Furthermore, an antioxidant, an antifoaming agent, etc. can be mix | blended suitably. These may be used alone or in combination of two or more. And it is preferable to use these other additives within the range of 5% by weight or less of the entire photocurable resin composition from the viewpoint of not inhibiting the effects of the present invention.

  In the photocurable resin composition of the present invention, for the purpose of preparing as a varnish, a solvent is used as necessary in addition to the above components. Examples of the solvent include esters such as ethyl lactate, methyl acetate and butyl acetate, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, polar solvents such as dimethylformamide and dimethyl sulfoxide, 1,1,1-trichloroethane, Halogen solvents such as chloroform, ethers such as tetrahydrofuran and dioxane, aromatics such as benzene, toluene and xylene, and fluorinated inert liquids such as perfluorooctane and perfluorotri-N-butylamine are used. In addition, the usage-amount in the case of using the said solvent is about 0-200 weight part with respect to 100 weight part of total weights of the said (A)-(C) component, for example.

  In the photocurable resin composition (varnish) of the present invention, for example, the above components (A) to (C), which are resin components, are appropriately mixed with a solvent and heated at room temperature or below the volatilization temperature of a diluting solvent. Then, after each of the above components is completely dissolved, it is cooled, and then the photoacid generator (D) is added and mixed.

  When forming a sheet using the photocurable resin composition of the present invention, for example, the photocurable resin composition is once dissolved in a soluble solvent to prepare a varnish for sheet forming coating. In addition, a general method can be used for the formation of the sheet using the photocurable resin composition. For example, after applying the varnish on the base support film, the sheet is dried to dry the sheet. Complete by forming and covering this with a cover film. At this time, regarding the drying conditions of the coating film at the time of forming the sheet, it is necessary to select the drying conditions so that the amount of residual solvent in the sheet after drying is reduced as much as possible. Examples of the varnish coating method include spin coating and screen printing.

  The thickness of the sheet made of the photocurable resin composition thus obtained is appropriately set according to the application and the like, and examples thereof include a range of 10 to 200 μm. If a desired thickness cannot be obtained with a single sheet, a plurality of sheets can be laminated and used.

  The sheet made of the photocurable resin composition formed by using the photocurable resin composition of the present invention has various characteristics (transparency, heat resistance, flexibility, irregularity followability, It has excellent releasability, exhibits good followability to substrates with minute irregularities and processing molds, and is also useful as an optical lens and optical component as a sheet with good adhesion to the substrate. is there.

When the photocurable resin composition sheet is photocured, light irradiation such as ultraviolet irradiation is usually performed. The light irradiation can be performed using a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a xenon lamp, or the like as a light source, and the irradiation amount is preferably 100 to 10,000 mJ / cm ² . Furthermore, a heat curing step can be added as necessary. As said heating conditions, the conditions for 5 to 60 minutes are mention | raise | lifted in the range of 120-180 degreeC, for example.

  Next, examples will be described together with comparative examples. However, the present invention is not limited to these examples.

  First, prior to Examples and Comparative Examples, the following materials were prepared.

[Component A: Solid epoxy resin]
A-1: Phenoxy resin (weight average molecular weight: 50,000, epoxy equivalent: 12,100 g / eq) (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., YP-70)
A-2: Phenoxy resin (weight average molecular weight: 45,000, epoxy equivalent: 7,800 g / eq) (Mitsubishi Chemical Corporation, 1256B40)
A-3: Phenoxy resin (weight average molecular weight: 60,000, epoxy equivalent: 8,800 g / eq) (Mitsubishi Chemical Corporation, 4275)

[Component B: Solid epoxy resin]
B-1: Bisphenol A type epoxy resin (epoxy equivalent: 650 g / eq) (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., YD-012)
B-2: Bisphenol A type epoxy resin (epoxy equivalent: 1,000 g / eq) (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., YD-014)

[C component: Liquid epoxy resin]
C-1: Liquid bisphenol A type epoxy resin (epoxy equivalent: 185 g / eq, 25 ° C. viscosity: 13 Pa · s) (manufactured by Mitsubishi Chemical Corporation, JER828)
C-2: Liquid bisphenol A type epoxy resin (epoxy equivalent: 215 g / eq, 25 ° C. viscosity: 23 Pa · s) (manufactured by Mitsubishi Chemical Corporation, JER828XA)

[Liquid epoxy resin not applicable to component C]
C′-1: Liquid bisphenol F type epoxy resin (epoxy equivalent: 183 g / eq, 25 ° C. viscosity: 10 Pa · s) (AER250, manufactured by Mitsubishi Chemical Corporation)

[D component: photoacid generator]
D-1: anion component is SbF ₆ ^- and is, cation component represented by the following structural formula (1), 50 wt% triarylsulfonium salts of a propylene carbonate solution based photopolymerization initiator (ADEKA Corporation, SP-170 ).

  Y-1: Silane coupling agent (3-glycidoxypropylmethyldiethoxysilane)

[Examples 1-6, Comparative Examples 1-5]
Each said component was mix | blended in the ratio shown to the postscript Table 1-2, and the photocurable resin composition was produced by melt-mixing. In addition, for the purpose of preparing the produced photocurable resin composition as a varnish, a diluting solvent (methyl ethyl ketone) was appropriately adjusted and used.

  Each characteristic was evaluated according to the following reference | standard regarding each photocurable resin composition which is an Example product and a comparative example product obtained in this way. The results are shown in Tables 1 and 2 below.

[Tackiness]
A film was formed to a thickness of 100 μm using the photocurable resin composition, and dried under predetermined drying conditions (conditions: 70 ° C. × 10 minutes) to form a sheet. And as a result of performing the contact test to the said uncured sheet | seat surface, it evaluated based on the following parameter | index.
X: There was stickiness and the photocurable resin composition adhered.
(Triangle | delta): Although there was stickiness, the photocurable resin composition did not adhere.
○: There was no stickiness and no trace of contact remained.

[Flexibility]
A film was formed to a thickness of 100 μm using the photocurable resin composition, and dried under predetermined drying conditions (conditions: 70 ° C. × 10 minutes) to form a sheet. And as a result of folding the said uncured sheet in two, it evaluated based on the following parameter | index.
X: It broke.
(Triangle | delta): Although it did not crack, a crack generate | occur | produced.
○: Nothing occurred.

[Folding resistance]
A film was formed to a thickness of 100 μm using the photocurable resin composition, and dried under predetermined drying conditions (conditions: 70 ° C. × 10 minutes) to form a sheet. Next, the uncured sheet was photocured by irradiating ultraviolet rays at 6000 mJ / cm ² . Then, as a result of folding in two, evaluation was performed based on the following indices.
X: It broke.
(Triangle | delta): Although it did not crack, a crack generate | occur | produced.
○: Nothing occurred.

[transparency]
A film was formed to a thickness of 100 μm using the photocurable resin composition, and dried under predetermined drying conditions (conditions: 70 ° C. × 10 minutes) to form a sheet. Next, the uncured sheet was photocured by irradiating ultraviolet rays at 6000 mJ / cm ² . Further, post-cure (150 ° C. × 30 minutes) was performed. The light transmittance (wavelength 400 nm) of the sheet thus obtained was measured using an instrument: a spectrophotometer (manufactured by JASCO Corporation). As a result, it evaluated based on the following parameter | index.
○: The light transmittance is 85% or more.
Δ: Light transmittance is 80% or more and less than 85%.
X: Less than 80%.

[Unevenness tracking]
A film was formed to a thickness of 100 μm using the photocurable resin composition, and dried under predetermined drying conditions (conditions: 70 ° C. × 10 minutes) to form a sheet. Next, the uncured sheet was laminated on a substrate having a plurality of irregularities, and visual confirmation was performed from the upper surface of the sheet, and the followability to each irregularity on the substrate was confirmed. As a result, it evaluated based on the following parameter | index.
○: The maximum depth following the irregularities is 200 μm.
(Triangle | delta): The maximum depth which followed the unevenness | corrugation is 100 micrometers.
X: The maximum depth following the irregularities is 50 μm.

[Releasability]
A film was formed to a thickness of 100 μm using the photocurable resin composition, and dried under predetermined drying conditions (conditions: 70 ° C. × 10 minutes) to form a sheet. Next, the uncured sheet was laminated on a concave mold made of silicone resin having a thickness of 200 μm. Then, after photocuring by irradiating ultraviolet rays at 6000 mJ / cm ^{2, the} sheet is released from the mold, and the residue (area ratio) including breakage of the sheet on the mold side is visually confirmed. confirmed. As a result, it evaluated based on the following parameter | index.
○: Residue is 10% or less.
(Triangle | delta): A residue exceeds 10% and is 30% or less.
X: Residue exceeds 30%.

  From the above results, the example products are obtained by forming a sheet using a photocurable resin composition formed by using a specific material and mixed at a blending ratio within a specific range. The later resin properties are also good, it is excellent in various properties (transparency, flexibility, uneven surface followability, release property, etc.), and it exhibits good followability for substrates and molds with minute unevenness. I understand that.

  On the other hand, the product of Comparative Example 1 was obtained by using a liquid epoxy resin having a low viscosity outside the scope of the present invention. The tackiness of the sheet remained, and the sheet was inferior in handling properties. Moreover, since the comparative example 2 product has little content of the solid epoxy resin corresponding to the component (A), the obtained sheet was inferior in flexibility, folding resistance after curing, and releasability. . And since the comparative example 3 product has much content of the liquid epoxy resin equivalent to (C) component, the tackiness after film-forming drying remained strongly, and it was inferior to handling property. Furthermore, the comparative example 4 product has a small amount of solid epoxy resin corresponding to the component (A) and uses a liquid epoxy resin having a low viscosity outside the scope of the present invention. It was insufficient, and was also inferior in unevenness followability, releasability, and folding resistance. Moreover, since the comparative example 5 product has too much solid epoxy resin corresponding to the component (A) and the content of the liquid epoxy resin corresponding to the component (C) is small, the transparency after curing is inferior. When affixing to a base material for uneven | corrugated followable | trackability and mold release evaluation, the adhesiveness was bad compared with the other Example goods, and the lamination of multiple times was required. For this reason, the example product within the scope of the present invention is a sheet formed using a specific material and at a specific blending ratio, and is excellent in sheet film formability and post-curing characteristics. It is clear that the sheet is made of a photocurable resin composition.

  In the photocurable resin composition of the present invention, a sheet made of a photocurable resin composition obtained by using this as a sheet forming material is an optical lens such as an optical lens or an adhesive between optical components that requires transparency. When used as a component material, it is useful because of its good handling property and uneven follow-up property and high heat resistance.

Claims (3)

It is a photocurable resin composition containing the following components (A) to (D), wherein the component (A) is based on 100 parts by weight of the total amount of the components (A), (B) and (C). 30 to 70 parts by weight, (B) component is set to 10 to 40 parts by weight, (C) component is set to a range of 10 to 30 parts by weight, and (D) component is set to 0.5 to 2.0 parts by weight. The photocurable resin composition characterized by the above-mentioned.
(A) Solid epoxy resin having an epoxy equivalent of 7000 to 13000 g / eq.
(B) Solid epoxy resin having an epoxy equivalent of 400 to 1000 g / eq.
(C) A liquid epoxy resin having a viscosity of 12 to 25 Pa · s at 25 ° C.
(D) A photoacid generator.   The photocurable resin composition according to claim 1, wherein the component (A) is a solid epoxy resin having a weight average molecular weight of 30,000 to 80,000.   The sheet | seat made from a photocurable resin composition formed by forming the photocurable resin composition of Claim 1 or 2 in a sheet form.