CN101243734A - 印刷电路板的制造工艺 - Google Patents
印刷电路板的制造工艺 Download PDFInfo
- Publication number
- CN101243734A CN101243734A CNA2006800296714A CN200680029671A CN101243734A CN 101243734 A CN101243734 A CN 101243734A CN A2006800296714 A CNA2006800296714 A CN A2006800296714A CN 200680029671 A CN200680029671 A CN 200680029671A CN 101243734 A CN101243734 A CN 101243734A
- Authority
- CN
- China
- Prior art keywords
- sheet
- basement membrane
- circuit board
- printed circuit
- enhancing sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000008569 process Effects 0.000 claims abstract description 14
- 230000002708 enhancing effect Effects 0.000 claims description 109
- 210000002469 basement membrane Anatomy 0.000 claims description 93
- 238000009434 installation Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000003475 lamination Methods 0.000 claims description 11
- 238000012545 processing Methods 0.000 abstract description 5
- 238000010923 batch production Methods 0.000 abstract 1
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 38
- 238000005516 engineering process Methods 0.000 description 18
- 239000004033 plastic Substances 0.000 description 11
- 229920003023 plastic Polymers 0.000 description 11
- 238000005728 strengthening Methods 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 230000001360 synchronised effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 235000013569 fruit product Nutrition 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000011900 installation process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005185119 | 2005-06-24 | ||
JP185119/2005 | 2005-06-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101243734A true CN101243734A (zh) | 2008-08-13 |
Family
ID=37595820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2006800296714A Pending CN101243734A (zh) | 2005-06-24 | 2006-06-22 | 印刷电路板的制造工艺 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1894453A2 (fr) |
KR (1) | KR20080015472A (fr) |
CN (1) | CN101243734A (fr) |
TW (1) | TW200731894A (fr) |
WO (1) | WO2007002269A2 (fr) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101790279B (zh) * | 2010-02-02 | 2012-02-29 | 浙江龙威电子科技有限公司 | 复合补强膜及其制造方法 |
CN101772271B (zh) * | 2010-02-02 | 2012-05-23 | 浙江龙威电子科技有限公司 | 挠性印刷电路板单面贴合补强方法 |
CN101637926B (zh) * | 2009-07-28 | 2013-06-19 | 珠海元盛电子科技股份有限公司 | 用于制作粘结层的钢刀模及制作粘结层的方法 |
CN104619132A (zh) * | 2013-11-04 | 2015-05-13 | 深圳崇达多层线路板有限公司 | 挠性印刷电路板的加工方法 |
CN105163484A (zh) * | 2015-09-18 | 2015-12-16 | 刘炜 | 一种具有补强结构的柔性线路板及其加工工艺 |
CN109786269A (zh) * | 2017-11-14 | 2019-05-21 | 蔡宜兴 | 降低封装基板翘曲的方法及半成品结构 |
CN110493972A (zh) * | 2019-08-23 | 2019-11-22 | 江苏上达电子有限公司 | 一种用于cof的补强方法 |
CN111890786A (zh) * | 2020-07-15 | 2020-11-06 | 刘忠卫 | 一种印刷系统 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2100730A1 (fr) | 2008-03-14 | 2009-09-16 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Dispositif de stratification et procédé de stratification |
CN103079351B (zh) * | 2012-12-28 | 2016-01-13 | 大连吉星电子有限公司 | 柔性电路板pet膜线性粘贴补强工艺 |
KR101707844B1 (ko) * | 2015-03-02 | 2017-02-17 | 김태헌 | 연성인쇄회로기판의 보강방법과 연성인쇄회로기판의 보강장치 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003101167A (ja) * | 2001-09-21 | 2003-04-04 | Canon Inc | フレキシブルプリント基板 |
JP3726961B2 (ja) * | 2002-06-26 | 2005-12-14 | 三井金属鉱業株式会社 | Cofフィルムキャリアテープ及びその製造方法 |
JP4139713B2 (ja) * | 2003-03-12 | 2008-08-27 | シャープ株式会社 | 補強板貼り付け装置および貼り付け方法 |
-
2006
- 2006-06-22 CN CNA2006800296714A patent/CN101243734A/zh active Pending
- 2006-06-22 WO PCT/US2006/024275 patent/WO2007002269A2/fr active Application Filing
- 2006-06-22 KR KR1020077030651A patent/KR20080015472A/ko not_active Application Discontinuation
- 2006-06-22 EP EP06785329A patent/EP1894453A2/fr not_active Withdrawn
- 2006-06-23 TW TW095122806A patent/TW200731894A/zh unknown
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101637926B (zh) * | 2009-07-28 | 2013-06-19 | 珠海元盛电子科技股份有限公司 | 用于制作粘结层的钢刀模及制作粘结层的方法 |
CN101790279B (zh) * | 2010-02-02 | 2012-02-29 | 浙江龙威电子科技有限公司 | 复合补强膜及其制造方法 |
CN101772271B (zh) * | 2010-02-02 | 2012-05-23 | 浙江龙威电子科技有限公司 | 挠性印刷电路板单面贴合补强方法 |
CN104619132A (zh) * | 2013-11-04 | 2015-05-13 | 深圳崇达多层线路板有限公司 | 挠性印刷电路板的加工方法 |
CN104619132B (zh) * | 2013-11-04 | 2017-11-07 | 深圳崇达多层线路板有限公司 | 挠性印刷电路板的加工方法 |
CN105163484A (zh) * | 2015-09-18 | 2015-12-16 | 刘炜 | 一种具有补强结构的柔性线路板及其加工工艺 |
CN109786269A (zh) * | 2017-11-14 | 2019-05-21 | 蔡宜兴 | 降低封装基板翘曲的方法及半成品结构 |
CN110493972A (zh) * | 2019-08-23 | 2019-11-22 | 江苏上达电子有限公司 | 一种用于cof的补强方法 |
CN111890786A (zh) * | 2020-07-15 | 2020-11-06 | 刘忠卫 | 一种印刷系统 |
Also Published As
Publication number | Publication date |
---|---|
EP1894453A2 (fr) | 2008-03-05 |
WO2007002269A3 (fr) | 2007-04-26 |
KR20080015472A (ko) | 2008-02-19 |
WO2007002269A2 (fr) | 2007-01-04 |
TW200731894A (en) | 2007-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101243734A (zh) | 印刷电路板的制造工艺 | |
CN103129095B (zh) | 剥离保护膜的装置和方法及制造立体图像显示装置的方法 | |
KR100626898B1 (ko) | 라미네이트 방법 | |
JP2007036198A (ja) | プリント配線板及びその製造方法 | |
CN101443896B (zh) | 粘着性带的粘贴装置 | |
CN101460012B (zh) | 立体电路板的形成装置及形成方法 | |
KR20080026524A (ko) | 주문형 재기록가능 카드를 생산하는 시스템 및 방법 | |
KR20160143971A (ko) | 드라이필름 라미네이팅 모듈 및 이를 이용한 pcb 제조방법 | |
JP4590939B2 (ja) | プリント配線板用絶縁樹脂フィルム及びこれを用いた絶縁層の形成方法 | |
JP2005285960A (ja) | 両面接着剤付きフレキシブル回路基板の製造方法 | |
JP4525180B2 (ja) | 真空積層装置及びこれを用いた絶縁層の形成方法 | |
JP4975500B2 (ja) | 感光性積層体製造装置及び製造方法 | |
JP2011187641A (ja) | フレキシブル基板の製造方法 | |
WO2019151434A1 (fr) | Procédé de liaison d'un élément et bande adhésive | |
JP3413595B2 (ja) | 平角導線の整列治具 | |
JP5041291B2 (ja) | 非接触icカードの製造方法 | |
JP7038695B2 (ja) | 保護フィルムの剥離方法および剥離装置 | |
JP4987656B2 (ja) | 感光性積層体の製造装置及び製造方法 | |
JP3508561B2 (ja) | フィルム片の貼付方法 | |
JP2004211018A (ja) | 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法 | |
JPH04346292A (ja) | ビアフィル形成方法およびビアフィル形成装置 | |
JPS62139554A (ja) | 薄膜剥離方法及びその実施装置 | |
CN118026546A (zh) | 用于弯曲表面的打印装置 | |
JP2000030559A (ja) | 可動接点の装着装置 | |
KR20020041735A (ko) | 반도체 장치용 기판 및 반도체 장치의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20080813 |