WO2007002269A3 - Procede de production de panneau de cablage imprime - Google Patents

Procede de production de panneau de cablage imprime Download PDF

Info

Publication number
WO2007002269A3
WO2007002269A3 PCT/US2006/024275 US2006024275W WO2007002269A3 WO 2007002269 A3 WO2007002269 A3 WO 2007002269A3 US 2006024275 W US2006024275 W US 2006024275W WO 2007002269 A3 WO2007002269 A3 WO 2007002269A3
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
producing printed
steps
bloc
Prior art date
Application number
PCT/US2006/024275
Other languages
English (en)
Other versions
WO2007002269A2 (fr
Inventor
Kazuo Satoh
Hideo Yamazaki
Yukio Nakamori
Original Assignee
3M Innovative Properties Co
Kazuo Satoh
Hideo Yamazaki
Yukio Nakamori
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co, Kazuo Satoh, Hideo Yamazaki, Yukio Nakamori filed Critical 3M Innovative Properties Co
Priority to EP06785329A priority Critical patent/EP1894453A2/fr
Publication of WO2007002269A2 publication Critical patent/WO2007002269A2/fr
Publication of WO2007002269A3 publication Critical patent/WO2007002269A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

La présente invention a trait à un procédé pour fournir un panneau de câblage imprimé équipé d'une feuille de renfort comprenant des étapes de traitement simples et peu nombreuses pouvant donc être effectué facilement, simplement et dans un court laps de temps, tout en permettant la production de grand volume en vrac au lieu de la production par lots.
PCT/US2006/024275 2005-06-24 2006-06-22 Procede de production de panneau de cablage imprime WO2007002269A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06785329A EP1894453A2 (fr) 2005-06-24 2006-06-22 Procede de production de panneau de cablage imprime

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-185119 2005-06-24
JP2005185119 2005-06-24

Publications (2)

Publication Number Publication Date
WO2007002269A2 WO2007002269A2 (fr) 2007-01-04
WO2007002269A3 true WO2007002269A3 (fr) 2007-04-26

Family

ID=37595820

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/024275 WO2007002269A2 (fr) 2005-06-24 2006-06-22 Procede de production de panneau de cablage imprime

Country Status (5)

Country Link
EP (1) EP1894453A2 (fr)
KR (1) KR20080015472A (fr)
CN (1) CN101243734A (fr)
TW (1) TW200731894A (fr)
WO (1) WO2007002269A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2100730A1 (fr) 2008-03-14 2009-09-16 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Dispositif de stratification et procédé de stratification
CN101637926B (zh) * 2009-07-28 2013-06-19 珠海元盛电子科技股份有限公司 用于制作粘结层的钢刀模及制作粘结层的方法
CN101790279B (zh) * 2010-02-02 2012-02-29 浙江龙威电子科技有限公司 复合补强膜及其制造方法
CN101772271B (zh) * 2010-02-02 2012-05-23 浙江龙威电子科技有限公司 挠性印刷电路板单面贴合补强方法
CN103079351B (zh) * 2012-12-28 2016-01-13 大连吉星电子有限公司 柔性电路板pet膜线性粘贴补强工艺
CN104619132B (zh) * 2013-11-04 2017-11-07 深圳崇达多层线路板有限公司 挠性印刷电路板的加工方法
KR101707844B1 (ko) * 2015-03-02 2017-02-17 김태헌 연성인쇄회로기판의 보강방법과 연성인쇄회로기판의 보강장치
CN105163484A (zh) * 2015-09-18 2015-12-16 刘炜 一种具有补强结构的柔性线路板及其加工工艺
TWI638410B (zh) * 2017-11-14 2018-10-11 蔡宜興 降低封裝基板翹曲的方法及半成品結構
CN110493972A (zh) * 2019-08-23 2019-11-22 江苏上达电子有限公司 一种用于cof的补强方法
CN111890786B (zh) * 2020-07-15 2021-12-10 东莞百通包装印刷科技有限公司 一种印刷系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003101167A (ja) * 2001-09-21 2003-04-04 Canon Inc フレキシブルプリント基板
WO2004003992A1 (fr) * 2002-06-26 2004-01-08 Mitsui Mining & Smelting Co.,Ltd. Ruban porteur de film cof et procede de fabrication de ce ruban
US20040177774A1 (en) * 2003-03-12 2004-09-16 Sharp Kabushiki Kaisha Reinforcement combining apparatus and method of combining reinforcement

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003101167A (ja) * 2001-09-21 2003-04-04 Canon Inc フレキシブルプリント基板
WO2004003992A1 (fr) * 2002-06-26 2004-01-08 Mitsui Mining & Smelting Co.,Ltd. Ruban porteur de film cof et procede de fabrication de ce ruban
US20060054349A1 (en) * 2002-06-26 2006-03-16 Mitsui Mining 7 Smelting Co., Ltd. Cof film carrier tape and its manufacturing method
US20040177774A1 (en) * 2003-03-12 2004-09-16 Sharp Kabushiki Kaisha Reinforcement combining apparatus and method of combining reinforcement

Also Published As

Publication number Publication date
EP1894453A2 (fr) 2008-03-05
CN101243734A (zh) 2008-08-13
KR20080015472A (ko) 2008-02-19
WO2007002269A2 (fr) 2007-01-04
TW200731894A (en) 2007-08-16

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