CN101223393A - 流体控制装置 - Google Patents

流体控制装置 Download PDF

Info

Publication number
CN101223393A
CN101223393A CNA2006800263161A CN200680026316A CN101223393A CN 101223393 A CN101223393 A CN 101223393A CN A2006800263161 A CNA2006800263161 A CN A2006800263161A CN 200680026316 A CN200680026316 A CN 200680026316A CN 101223393 A CN101223393 A CN 101223393A
Authority
CN
China
Prior art keywords
heater
fluid control
plate
support unit
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800263161A
Other languages
English (en)
Inventor
四方出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikin Inc
Original Assignee
Fujikin Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikin Inc filed Critical Fujikin Inc
Publication of CN101223393A publication Critical patent/CN101223393A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K49/00Means in or on valves for heating or cooling
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00Construction of housing; Use of materials therefor
    • F16K27/003Housing formed from a plurality of the same valve elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00Construction of housing; Use of materials therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16LPIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L41/00Branching pipes; Joining pipes to walls
    • F16L41/02Branch units, e.g. made in one piece, welded, riveted
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/6416With heating or cooling of the system

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Details Of Valves (AREA)
  • Valve Housings (AREA)
  • Resistance Heating (AREA)
  • Supply Devices, Intensifiers, Converters, And Telemotors (AREA)

Abstract

本发明提供一种流体控制装置,即使使用棒形的管式加热器,也不需要与其长度相应的替换空间,只要存在与其宽度相应的替换空间即可对其进行维护,能够抑制设置面积的增加。在支承部件(2)上设有在侧方开口的凹部(2a)。加热器部件(3)以能够从侧方安装或拆卸的方式被插入支承部件(2)的凹部(2a)中并固定。支承部件(2)由两片板状部件(21)、(22)重叠而形成,其横截面为コ字形。加热器部件(3)插入在由两片板状部件(21)、(22)所形成的凹部(2a)中并由内六角螺栓(26)固定。

Description

流体控制装置
技术领域
本发明涉及半导体制造装置等所使用的流体控制装置,特别是涉及带加热装置的流体控制装置。
背景技术
专利文献1中公开了一种加热装置,用于对流体控制装置进行加热,在流体控制装置的底座上固定有按前后顺序呈串联状配置的多个流体控制仪器,加热装置包括:配置在流体控制装置左右两侧的至少单侧上的作为加热器部件的带式加热器;由底壁和侧壁构成,底壁被螺纹部件固定于底座,侧壁使带式加热器抵接于各流体控制仪器的多个支架。
另一方面,作为加热流体控制装置的加热器部件,具有管式加热器,管式加热器能够应对高输出,适用于高温处理或带式加热器不适用的位置的加热。
专利文献1:日本特开平10-246356号公报
发明内容
在专利文献1的加热装置中,由于在底座上需要设置用于安装支架底壁的部分,所以存在必须增加流体控制装置的设置面积的问题。出于集成化方面的考虑,不希望增加这样的设置面积,但在用带式加热器从侧面进行加热时,即使不使用支架,也会增加与带式加热器的厚度相应的设置面积。
因此,为了解决上述带式加热器的问题,虽然考虑到使用管式加热器并使其夹在多个流体控制仪器和底座之间,但由于管式加热器为棒形,在加热器断线时的替换等维护时,需要有与其长度相应的替换空间,因此,使用管式加热器时,存在着必须要考虑到维护时如何确保替换空间而进行设计的问题。
本发明的目的在于提供一种流体控制装置,即使使用棒形的管式加热器,也不需要有与其长度相应的替换空间,只要具有与宽度相应的替换空间即可进行维护,与此同时能够抑制设置面积的增加。
本发明的技术方案1的流体控制装置中,串联状配置的多个流体控制仪器被支承部件支承,其中,在支承部件上设有在侧方开口的凹部,加热器部件以能够从侧方安装或拆卸的方式插入该凹部。
作为流体控制装置例如以在入口侧和出口侧分别设有开关阀的质量流量控制器为基本结构,根据需要再增加过滤器、调整器等各种流体控制仪器而构成。也有的流体控制仪器是分别设于入口和出口的带管连接部的块状接头部件、使相邻流体控制仪器相互连通的多个带V字形通路的块状连接部件等。
支承部件由不锈钢等的金属制成,在支承部件的上表面上,以规定的间距设有用于安装流体控制仪器的多个螺纹孔。支承部件可以由截面为コ字形的一个部件形成,也可以由两个部件构成。支承部件被制成为,其长度比多个流体控制仪器在配置方向上的全长更长,在该支承部件的两端部设有通孔,供将支承部件安装至底座的螺纹部件插入。
作为加热器部件,可以是在金属制成的管中设置电热线的管式加热器,也可以是将电热线织入玻璃纤维材料的带式加热器,另外,也可以使用封装加热器、微型加热器、板式加热器等各种类型的加热器。
由于加热器部件能够相对侧方向设于支承部件的凹部安装拆卸,所以只要具有用于在宽度方向上将加热器部件取出的宽度相应的空间,就能够替换加热器部件。
技术方案2的流体控制装置在技术方案1的装置的基础上,通过两片板状部件相重叠,支承部件被形成为横截面为コ字形,加热器部件被插入由两片板状部件所形成的凹部中,并通过螺纹部件被固定。
作为支承部件,可以通过以两片平坦的板状部件夹着垫片重叠而形成为横截面为コ字形,也可以通过至少其中一个板状部件上形成有厚壁部的两片板状部件重叠,而形成为横截面为コ字形。
技术方案3的流体控制装置在技术方案2的装置的基础上,其中一片板状部件是平坦的板,另一板状部件是带阶梯的板,所述带阶梯的板由与平坦的板重叠并结合的厚壁部、以及与平坦的板隔开间隔正对的薄壁部构成。
带阶梯的板的厚壁部设置在长度方向的全长范围内,由此,支承部件的整个横截面形成为コ字形。加热器部件、平坦的板、以及带阶梯的板被制成相同长度。平坦的板与带阶梯的板的结合优选通过螺纹部件实现,在这种情况下,在两板的重叠部设有供螺纹部件插入的通孔,通过使插入该通孔的螺钉与设于底座的螺纹孔的旋合,同时实现板相互的结合、和将支承部件安装至底座。同样地,关于加热器部件的固定,设有将平坦的板、加热器部件、以及带阶梯的板全部贯穿的通孔,通过使插入该通孔的螺钉与设于底座的螺纹孔的旋合,同时实现加热器的固定、以及将加热器部件和支承部件安装至底座。若在流体控制装置的周围存在空间,则在长度方向上和宽度方向上都能够将加热器部件取出。
技术方案4的流体控制装置在技术方案3的装置的基础上,加热器部件包括:棒形加热器主体;导热板,其具有棒形加热器主体以能够安装或拆卸的方式插入其中的加热器插入孔,带阶梯的板的薄壁部的宽度比板整个宽度的一半大,设置加热器插入孔,使得棒形加热器主体位于支承部件的宽度方向中央。
棒形加热器主体例如被制成管式加热器。管式加热器具有:一端部封闭另一端部开口的金属制成的管;设在管内部的镍铬合金线等的电热线、以及镁粉等的填充材料;与电热线相连接的引出线。管式加热器的输出功率大,能够进行高温加热。管式加热器例如由温度控制器对电压进行开或关的控制而达到控制温度。用于控制温度的传感器例如使用白金薄膜温度传感器、封装型k型热电偶等。
导热板由热传递性好的材质例如铝制成,通过使棒形加热器主体被紧密地插入加热器插入孔,来自棒形加热器主体的热量经由导热板被效率良好地传递至支承部件。棒形加热器主体通常是截面为圆形的杆状,与此相应,加热器插入孔也被制成截面为圆形。被插入加热器插入孔的棒形加热器主体,例如通过从导热板的侧面拧入的螺钉而被固定,由此,棒形加热器主体与加热器插入孔的周面紧密接触并以能够自由安装或拆卸的方式支承于导热板。而且,通过使带阶梯的板的薄壁部的宽度比板的整个宽度的一半大,能够使棒形加热器主体正好位于支承部件的宽度方向中央,由此,能够在宽度方向上实现均匀加热。
在利用带式加热器进行加热时,由于带式加热器易变形因而若不以夹子等将其压在流体控制仪器上,则会在带式加热器与流体控制仪器之间产生空气层从而成为绝热层,通过以上述的结构使用棒形加热器,能够改善加热器与流体控制仪器的紧密接触性,能够防止演变为绝热层的空气层的产生。
本发明的流体控制装置,通常是由一个装置(集成化流体控制装置)构成一条管线,多个管线是分别以规定的间隔(管线间距尺寸)并列地配置在底座上的。集成化流体控制装置由于是与其他装置组合而作为半导体制造用的气体供给装置使用的,因而在底座的设置面积上存在着制约,难以在底座的周围确保充分的空间。用带式加热器从流体控制仪器的侧面加热时,就需要增大各管线的间距尺寸,而通过在被制成一条管线所需的宽度的支承部件上如技术方案1所述那样内置加热器部件,则能够减小管线的间距尺寸。而且,通过制成技术方案2的结构,在替换加热器部件时,能够在保持流体控制装置的设置状态的状态下将加热器部件在宽度方向上取出。由此,即使是在集成化流体控制装置的底座的周围、尤其是长度方向上无法确保充分空间的情况下,也能够将加热器部件从宽度方向上取出,能够使加热器部件移动至不受空间制约的位置而进行替换。
(发明的效果)
根据技术方案1的流体控制装置,由于串联状配置的多个流体控制仪器被支承部件支承,在支承部件上设有在侧方开口的凹部,加热器部件以能够从侧方安装或拆卸的方式插入该凹部,所以在替换加热器部件时,有与加热器部件的宽度相应的替换空间便足够了,因而能够抑制设置面积的增加,实现紧凑化。
根据技术方案2的流体控制装置,通过将固定加热器部件的螺纹部件取下,就能够将加热器部件从支承部件上拆下进行维护,能够使替换更加容易。
根据技术方案3的流体控制装置,能够使两片板状部件的形状为简单的形状,能够降低制造成本。
根据技术方案4的流体控制装置,使棒形加热器主体在长度方向上均匀地发热,并且使该加热器主体位于支承部件的宽度方向中央,由此,能够在宽度方向上均匀地进行加热,能够以一定温度对流体控制装置均匀地加热。
附图说明
图1是本发明的流体控制装置的立体图。
图2是本发明的流体控制装置的立体图,表示将加热器部件取下的状态。
图3是表示本发明的流体控制装置的主要部分的分解图。
图4是表示本发明的流体控制装置的主要部分的组装图。
(符号说明)
1   流体控制装置(管线)
2   支承部件
2a  凹部
3   加热器部件
11  手动阀(流体控制仪器)
12  过滤器(流体控制仪器)
13      调整器(流体控制仪器)
14      压力计(流体控制仪器)
15      入口阻断开放器(流体控制仪器)
16      质量流量控制器(流体控制仪器)
17      出口阻断开放器(流体控制仪器)
21      平坦的板(板状部件)
22      带阶梯的的板(板状部件)
22c     薄壁部
22d     厚壁部
23、26  内六角螺栓(螺纹部件)
31      导热板
31a     加热器插入孔
32      棒形加热器主体
具体实施方式
以下参照附图对本发明的实施方式进行说明。在以下的说明中,将图中的上下称为“上下”,将图中的右称为“前”、左称为“后”,“左右”定义  朝向后方。该“前后”、“上下”、“左右”是为了方便而采用的说法,有时也会将前后反过来,或将上下称为左右来使用。
如图1及图2所示,本发明的流体控制装置1具有:呈串联状配置的多个流体控制仪器11、12、13、14、15、16、17;具有开口于右方(侧方)的凹部2a并支承多个流体控制仪器11、12、13、14、15、16、17的支承部件2;以能够从右方安装或拆卸的方式插入支承部件2的凹部2a的加热部件3。
多个流体控制仪器11、12、13、14、15、16、17在上层4和下层5上分开配置,上层4包括:质量流量控制器16;设在质量流量控制器16的后侧(入口侧)的手动阀11、过滤器12、调整器13、压力计14以及入口侧阻断开放器15;设在质量流量控制器16的前侧(出口侧)的出口侧阻断开放器17;下层5包括:分别设在入口和出口的带管连接部的块状接头部件51、53;使相邻的上层构成元件之间连通的多个带V字形通路的块状接头部件52。入口侧阻断开放器15具有:块状主体41a、41b;安装于该块状主体41a、41b上的两个开关阀促动器15a、15b。出口侧阻断开放器17具有:块状主体42a、42b;安装于该块状主体42a、42b上的两个开关阀促动器17a、17b。
支承部件2上以规定间隔固定有作为下层构成元件的接头部件(流体控制仪器),横跨着前后相邻的接头部件51、52、53配置有作为上层构成元件的流体控制仪器11、12、13、14、15、16、17,并被螺纹部件固定在接头部件51、52、53上。
而且,在底座6上并列地配置多个支承有流体控制仪器11、12、13、14、15、16、17的支承部件2,由此形成了具有多个由配置为串联状的多个流体控制仪器11、12、13、14、15、16、17形成的流体控制装置(管线)1的装置(例如,半导体制造用气体供给装置)。
如图3和图4所示,支承部件2具有:不锈钢制成的平坦的板21;重叠在平坦的板21的下表面上的、不锈钢制成的带阶梯的板22。
在平坦的板21的上表面上,以规定间距设有用于安装流体控制仪器11、12、13、14、15、16、17的多个螺纹孔21c。
带阶梯的板22由厚壁部22d和薄壁部22c构成,厚壁部22d重叠于平坦的板21,薄壁部22c隔开间隔与平坦的板21相对。薄壁部22c设在长度方向的全长范围内,其宽度大于板整个宽度的一半。通过两板21、22的重叠,支承部件2形成为横截面为コ字形,在两板21、22之间形成有用于容纳加热器部件3的凹部2a。
两板21、22被制成比多个流体控制仪器11、12、13、14、15、16、17在配置排列方向上的全长更长的长度,在两板21、22的前后两端部的左右,设有用于贯穿将支承部件2安装于底座6的螺纹部件23、26的通孔21a、21b、22a、22b。
加热器部件3由作为发热部的棒形加热器主体32和导热板31构成,其中,导热板31具有棒形加热器主体32以能够安装或拆卸的方式插入其中的加热器插入孔31a。
棒形加热器主体32使用管式加热器。棒形加热器主体32是截面为圆形的棒形,与此相应地,加热器插入孔31a也被制成截面为圆形。加热器插入孔31a比导热板31的宽度方向中央稍向左错开设置。这一错开量设定成,在将加热部件3安装至支承部件2上时,棒形加热器主体32能位于支承部件2的宽度方向中央。插入加热器插入孔31a中的棒形加热器主体32借助从导热板31的右侧面拧入的螺钉33而被固定。由此,棒形加热器主体32与加热器插入孔31a的周面紧密接触并被以能够自由安装或拆卸的方式支承于导热板31,棒形加热器主体32所产生的热量经由导热板31被高效率地传递至底座6。而且,由于棒形加热器主体32位于支承部件2的宽度方向中央,所以能够在宽度方向上实现均匀的加热。
加热部件3、平坦的板21以及带阶梯的板22被制成同一长度。
支承部件2和底座6由内六角螺栓23、26,套管24、27、以及弹簧垫圈25、28结合。
将支承部件2安装至底座6的内六角螺栓23、26中左侧的两个螺栓23兼用于支承部件2的平坦的板21与带阶梯的板22的结合,螺栓23插入设在两板21、22的重叠部的通孔21b、22b,通过该螺栓23与设于底座6的螺纹孔6b的旋合,同时实现两板21、22的结合、以及将支承部件2安装至底座6的功能。
将支承部件2安装至底座6的内六角螺栓23、26中右侧的两个螺栓26兼用于将加热器部件3固定于支承部件2。在加热器部件3上,设有与平坦的板21以及带阶梯的板22的右侧通孔21a、22a对应的通孔31b,螺栓26插入于设置在平坦的板21、加热器部件3、以及带阶梯的板22的通孔21a、31b、22a,通过该螺栓26与设于底座6的螺纹孔6a的旋合,同时实现加热器部件3的固定、以及将加热器部件3和支承部件2安装至底座6的功能。
各内六角螺栓23、26在插入于套管24、27中的状态下被使用,弹簧垫圈25、28配置在套管24、27的上下两侧。因此,通过拧紧内六角螺栓23、26,弹簧垫圈25、28弹性变形,平坦的板21和带阶梯的板22被向着加热器部件3推压,由此,加热器部件3和支承部件2实现了紧密接触。只要在流体控制装置1的周围有空间,从长度方向和宽度方向就都可以将加热器部件3取出。
本发明的流体控制装置1,是由一个装置(集成化流体控制装置)构成一条管线,多个管线1分别以规定的间隔(管线间距尺寸)并列地配置在底座6上。由于集成化流体控制装置还要与其他装置组合而作为半导体制造用的气体供给装置使用,所以底座6的面积大小是有限制的,难以在底座6的周围确保充分的空间。根据本发明的流体控制装置1,通过在被制成一条管线1所必需的宽度的支承部件2上如上述那样内置加热器部件3,能够缩小管线的间距尺寸。而且,由于加热器部件3能够相对于设在支承部件2上的凹部2a从侧方安装或拆卸,所以在替换加热器部件3时,使用于支承部件2固定的内六角螺栓23保持拧紧的状态,将用于固定加热器部件的内六角螺栓26取下,能够在保持流体控制仪器11、12、13、14、15、16、17的设置状态的状态下(确保各仪器11、12、13、14、15、16、17之间的密封性能的状态下)在宽度方向上将加热器部件3取出。由此,即使在集成化流体控制装置1的底座6的周围、特别是长度方向上无法确保充分空间的情况下,也能够在宽度方向上将加热器部件3取出,能够使加热器部件3移动到不受空间制约的位置而进行替换。
另外,上述实施方式中,由厚壁部22d和薄壁部22c构成的带阶梯的板22与平坦的板21重叠,从而支承部件2被形成为横截面为コ字形;也可以是由厚壁部和薄壁部构成的相同形状的带阶梯的板相互重叠,从而支承部被形成为横截面为コ字形,或者,还可以在两片平坦的板之间夹设垫片而使其重叠,从而支承部被形成为横截面为コ字形。
(工业实用性)
在本发明的流体控制装置中,由于在串联状配置的多个流体控制装置被支承部件支承的流体控制装置中,设有在支承部件侧方开口的凹部,加热器部件以能够从侧方安装或拆卸的方式被插入该凹部,所以在替换加热器部件时,与加热器部件的宽度相应的替换空间便足够了,从而能够抑制设置面积的增加,实现紧凑化。

Claims (7)

1.一种流体控制装置,在支承部件上支承有呈串联状配置的多个流体控制仪器,其特征在于,
在支承部件上设有向侧方开口的凹部,加热器部件以能够从侧方安装或拆卸的方式插入并固定于该凹部。
2.如权利要求1所述的流体控制装置,其特征在于,
支承部件被制成为,其长度大于多个流体控制仪器在配置方向上的全长,在该支承部件的两端部设有通孔,用于插入将支承部件安装至底座的螺纹部件。
3.如权利要求1所述的流体控制装置,其特征在于,
支承部件由两片板状部件相重叠而成,其横截面为コ字形,
加热器部件被插入由两片板状部件所形成的凹部中,并通过螺纹部件被固定。
4.如权利要求3所述的流体控制装置,其特征在于,
其中一片板状部件是平坦的板,
另一板状部件是带阶梯的板,所述带阶梯的板由与平坦的板重叠并相结合的厚壁部、以及隔着间隔与平坦的板互相对置的薄壁部构成。
5.如权利要求4所述的流体控制装置,其特征在于,
设有将平坦的板、加热器部件、以及带阶梯的板全部贯穿的通孔,通过将插入该通孔的螺钉拧入设在底座上的螺纹孔,同时实现加热器部件的固定、以及将加热器部件和支承部件安装至底座上的功能。
6.如权利要求4所述的流体控制装置,其特征在于,
加热器部件包括:棒形加热器主体;导热板,其具有加热器插入孔,供棒形加热器主体以能够安装或拆卸的方式插入其中,
带阶梯的板其薄壁部的宽度比板整个宽度的一半大,
加热器插入孔设置在可使得棒形加热器主体位于支承部件的宽度方向中央的位置。
7.如权利要求6所述的流体控制装置,其特征在于,
被插入加热器插入孔中的棒形加热器主体通过从导热板的侧面被拧入的螺钉被固定,由此,棒形加热器主体与加热器插入孔的周面紧密接触并被以能够安装拆卸的方式支承在导热板上。
CNA2006800263161A 2005-06-17 2006-04-26 流体控制装置 Pending CN101223393A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005177162A JP4753173B2 (ja) 2005-06-17 2005-06-17 流体制御装置
JP177162/2005 2005-06-17

Publications (1)

Publication Number Publication Date
CN101223393A true CN101223393A (zh) 2008-07-16

Family

ID=37532094

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800263161A Pending CN101223393A (zh) 2005-06-17 2006-04-26 流体控制装置

Country Status (7)

Country Link
US (1) US20090277510A1 (zh)
EP (1) EP1892447A1 (zh)
JP (1) JP4753173B2 (zh)
KR (1) KR20080025722A (zh)
CN (1) CN101223393A (zh)
TW (1) TW200704892A (zh)
WO (1) WO2006134727A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104822979A (zh) * 2012-11-29 2015-08-05 株式会社富士金 流体控制装置
TWI742729B (zh) * 2019-06-28 2021-10-11 日商富士金股份有限公司 流體控制裝置

Families Citing this family (371)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8986456B2 (en) 2006-10-10 2015-03-24 Asm America, Inc. Precursor delivery system
US10378106B2 (en) 2008-11-14 2019-08-13 Asm Ip Holding B.V. Method of forming insulation film by modified PEALD
US9394608B2 (en) 2009-04-06 2016-07-19 Asm America, Inc. Semiconductor processing reactor and components thereof
US8877655B2 (en) 2010-05-07 2014-11-04 Asm America, Inc. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
US8883270B2 (en) 2009-08-14 2014-11-11 Asm America, Inc. Systems and methods for thin-film deposition of metal oxides using excited nitrogen—oxygen species
US8802201B2 (en) 2009-08-14 2014-08-12 Asm America, Inc. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
US9312155B2 (en) 2011-06-06 2016-04-12 Asm Japan K.K. High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
US9793148B2 (en) 2011-06-22 2017-10-17 Asm Japan K.K. Method for positioning wafers in multiple wafer transport
US10364496B2 (en) 2011-06-27 2019-07-30 Asm Ip Holding B.V. Dual section module having shared and unshared mass flow controllers
US10854498B2 (en) 2011-07-15 2020-12-01 Asm Ip Holding B.V. Wafer-supporting device and method for producing same
US20130023129A1 (en) 2011-07-20 2013-01-24 Asm America, Inc. Pressure transmitter for a semiconductor processing environment
JP5890984B2 (ja) * 2011-08-30 2016-03-22 株式会社フジキン 流体制御装置
US9096931B2 (en) * 2011-10-27 2015-08-04 Asm America, Inc Deposition valve assembly and method of heating the same
US9341296B2 (en) 2011-10-27 2016-05-17 Asm America, Inc. Heater jacket for a fluid line
US9017481B1 (en) 2011-10-28 2015-04-28 Asm America, Inc. Process feed management for semiconductor substrate processing
US9167625B2 (en) 2011-11-23 2015-10-20 Asm Ip Holding B.V. Radiation shielding for a substrate holder
US9005539B2 (en) 2011-11-23 2015-04-14 Asm Ip Holding B.V. Chamber sealing member
US9202727B2 (en) 2012-03-02 2015-12-01 ASM IP Holding Susceptor heater shim
US8946830B2 (en) 2012-04-04 2015-02-03 Asm Ip Holdings B.V. Metal oxide protective layer for a semiconductor device
TWI622664B (zh) 2012-05-02 2018-05-01 Asm智慧財產控股公司 相穩定薄膜,包括該薄膜之結構及裝置,及其形成方法
US8728832B2 (en) 2012-05-07 2014-05-20 Asm Ip Holdings B.V. Semiconductor device dielectric interface layer
US8933375B2 (en) 2012-06-27 2015-01-13 Asm Ip Holding B.V. Susceptor heater and method of heating a substrate
US9558931B2 (en) 2012-07-27 2017-01-31 Asm Ip Holding B.V. System and method for gas-phase sulfur passivation of a semiconductor surface
US9117866B2 (en) 2012-07-31 2015-08-25 Asm Ip Holding B.V. Apparatus and method for calculating a wafer position in a processing chamber under process conditions
US9659799B2 (en) 2012-08-28 2017-05-23 Asm Ip Holding B.V. Systems and methods for dynamic semiconductor process scheduling
US9169975B2 (en) 2012-08-28 2015-10-27 Asm Ip Holding B.V. Systems and methods for mass flow controller verification
US9021985B2 (en) 2012-09-12 2015-05-05 Asm Ip Holdings B.V. Process gas management for an inductively-coupled plasma deposition reactor
US9324811B2 (en) 2012-09-26 2016-04-26 Asm Ip Holding B.V. Structures and devices including a tensile-stressed silicon arsenic layer and methods of forming same
US10714315B2 (en) 2012-10-12 2020-07-14 Asm Ip Holdings B.V. Semiconductor reaction chamber showerhead
US9640416B2 (en) 2012-12-26 2017-05-02 Asm Ip Holding B.V. Single-and dual-chamber module-attachable wafer-handling chamber
US20160376700A1 (en) 2013-02-01 2016-12-29 Asm Ip Holding B.V. System for treatment of deposition reactor
US8894870B2 (en) 2013-02-01 2014-11-25 Asm Ip Holding B.V. Multi-step method and apparatus for etching compounds containing a metal
US9696727B2 (en) 2013-03-08 2017-07-04 Fujikin Incorporated Fluid control apparatus and thermal sensor installation structure with respect to fluid control apparatus
US9589770B2 (en) 2013-03-08 2017-03-07 Asm Ip Holding B.V. Method and systems for in-situ formation of intermediate reactive species
US9484191B2 (en) 2013-03-08 2016-11-01 Asm Ip Holding B.V. Pulsed remote plasma method and system
US8993054B2 (en) 2013-07-12 2015-03-31 Asm Ip Holding B.V. Method and system to reduce outgassing in a reaction chamber
US9018111B2 (en) 2013-07-22 2015-04-28 Asm Ip Holding B.V. Semiconductor reaction chamber with plasma capabilities
US9793115B2 (en) 2013-08-14 2017-10-17 Asm Ip Holding B.V. Structures and devices including germanium-tin films and methods of forming same
US9396934B2 (en) 2013-08-14 2016-07-19 Asm Ip Holding B.V. Methods of forming films including germanium tin and structures and devices including the films
US9240412B2 (en) 2013-09-27 2016-01-19 Asm Ip Holding B.V. Semiconductor structure and device and methods of forming same using selective epitaxial process
US9556516B2 (en) 2013-10-09 2017-01-31 ASM IP Holding B.V Method for forming Ti-containing film by PEALD using TDMAT or TDEAT
US9605343B2 (en) 2013-11-13 2017-03-28 Asm Ip Holding B.V. Method for forming conformal carbon films, structures conformal carbon film, and system of forming same
US10179947B2 (en) 2013-11-26 2019-01-15 Asm Ip Holding B.V. Method for forming conformal nitrided, oxidized, or carbonized dielectric film by atomic layer deposition
US10683571B2 (en) 2014-02-25 2020-06-16 Asm Ip Holding B.V. Gas supply manifold and method of supplying gases to chamber using same
US9447498B2 (en) 2014-03-18 2016-09-20 Asm Ip Holding B.V. Method for performing uniform processing in gas system-sharing multiple reaction chambers
US10167557B2 (en) 2014-03-18 2019-01-01 Asm Ip Holding B.V. Gas distribution system, reactor including the system, and methods of using the same
US11015245B2 (en) 2014-03-19 2021-05-25 Asm Ip Holding B.V. Gas-phase reactor and system having exhaust plenum and components thereof
US9404587B2 (en) 2014-04-24 2016-08-02 ASM IP Holding B.V Lockout tagout for semiconductor vacuum valve
US10858737B2 (en) 2014-07-28 2020-12-08 Asm Ip Holding B.V. Showerhead assembly and components thereof
US9543180B2 (en) 2014-08-01 2017-01-10 Asm Ip Holding B.V. Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum
US9890456B2 (en) 2014-08-21 2018-02-13 Asm Ip Holding B.V. Method and system for in situ formation of gas-phase compounds
US9657845B2 (en) 2014-10-07 2017-05-23 Asm Ip Holding B.V. Variable conductance gas distribution apparatus and method
US10941490B2 (en) 2014-10-07 2021-03-09 Asm Ip Holding B.V. Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
JP6475950B2 (ja) * 2014-10-29 2019-02-27 株式会社フジキン 流体制御器用加熱装置および流体制御装置
KR102300403B1 (ko) 2014-11-19 2021-09-09 에이에스엠 아이피 홀딩 비.브이. 박막 증착 방법
KR102263121B1 (ko) 2014-12-22 2021-06-09 에이에스엠 아이피 홀딩 비.브이. 반도체 소자 및 그 제조 방법
US9478415B2 (en) 2015-02-13 2016-10-25 Asm Ip Holding B.V. Method for forming film having low resistance and shallow junction depth
US10529542B2 (en) 2015-03-11 2020-01-07 Asm Ip Holdings B.V. Cross-flow reactor and method
US10276355B2 (en) 2015-03-12 2019-04-30 Asm Ip Holding B.V. Multi-zone reactor, system including the reactor, and method of using the same
US10458018B2 (en) 2015-06-26 2019-10-29 Asm Ip Holding B.V. Structures including metal carbide material, devices including the structures, and methods of forming same
US10600673B2 (en) 2015-07-07 2020-03-24 Asm Ip Holding B.V. Magnetic susceptor to baseplate seal
US9899291B2 (en) 2015-07-13 2018-02-20 Asm Ip Holding B.V. Method for protecting layer by forming hydrocarbon-based extremely thin film
US10043661B2 (en) 2015-07-13 2018-08-07 Asm Ip Holding B.V. Method for protecting layer by forming hydrocarbon-based extremely thin film
US10083836B2 (en) 2015-07-24 2018-09-25 Asm Ip Holding B.V. Formation of boron-doped titanium metal films with high work function
US10087525B2 (en) 2015-08-04 2018-10-02 Asm Ip Holding B.V. Variable gap hard stop design
US9647114B2 (en) 2015-08-14 2017-05-09 Asm Ip Holding B.V. Methods of forming highly p-type doped germanium tin films and structures and devices including the films
US9711345B2 (en) 2015-08-25 2017-07-18 Asm Ip Holding B.V. Method for forming aluminum nitride-based film by PEALD
US9960072B2 (en) 2015-09-29 2018-05-01 Asm Ip Holding B.V. Variable adjustment for precise matching of multiple chamber cavity housings
US9909214B2 (en) 2015-10-15 2018-03-06 Asm Ip Holding B.V. Method for depositing dielectric film in trenches by PEALD
US10211308B2 (en) 2015-10-21 2019-02-19 Asm Ip Holding B.V. NbMC layers
US10322384B2 (en) 2015-11-09 2019-06-18 Asm Ip Holding B.V. Counter flow mixer for process chamber
US9455138B1 (en) 2015-11-10 2016-09-27 Asm Ip Holding B.V. Method for forming dielectric film in trenches by PEALD using H-containing gas
US9905420B2 (en) 2015-12-01 2018-02-27 Asm Ip Holding B.V. Methods of forming silicon germanium tin films and structures and devices including the films
US9607837B1 (en) 2015-12-21 2017-03-28 Asm Ip Holding B.V. Method for forming silicon oxide cap layer for solid state diffusion process
US9735024B2 (en) 2015-12-28 2017-08-15 Asm Ip Holding B.V. Method of atomic layer etching using functional group-containing fluorocarbon
US9627221B1 (en) 2015-12-28 2017-04-18 Asm Ip Holding B.V. Continuous process incorporating atomic layer etching
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
US9754779B1 (en) 2016-02-19 2017-09-05 Asm Ip Holding B.V. Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
US10529554B2 (en) 2016-02-19 2020-01-07 Asm Ip Holding B.V. Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
US10468251B2 (en) 2016-02-19 2019-11-05 Asm Ip Holding B.V. Method for forming spacers using silicon nitride film for spacer-defined multiple patterning
US10501866B2 (en) 2016-03-09 2019-12-10 Asm Ip Holding B.V. Gas distribution apparatus for improved film uniformity in an epitaxial system
US10343920B2 (en) 2016-03-18 2019-07-09 Asm Ip Holding B.V. Aligned carbon nanotubes
US9892913B2 (en) 2016-03-24 2018-02-13 Asm Ip Holding B.V. Radial and thickness control via biased multi-port injection settings
US10865475B2 (en) 2016-04-21 2020-12-15 Asm Ip Holding B.V. Deposition of metal borides and silicides
US10087522B2 (en) 2016-04-21 2018-10-02 Asm Ip Holding B.V. Deposition of metal borides
US10190213B2 (en) 2016-04-21 2019-01-29 Asm Ip Holding B.V. Deposition of metal borides
US10367080B2 (en) 2016-05-02 2019-07-30 Asm Ip Holding B.V. Method of forming a germanium oxynitride film
US10032628B2 (en) 2016-05-02 2018-07-24 Asm Ip Holding B.V. Source/drain performance through conformal solid state doping
KR102592471B1 (ko) 2016-05-17 2023-10-20 에이에스엠 아이피 홀딩 비.브이. 금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법
US11453943B2 (en) 2016-05-25 2022-09-27 Asm Ip Holding B.V. Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
US10388509B2 (en) 2016-06-28 2019-08-20 Asm Ip Holding B.V. Formation of epitaxial layers via dislocation filtering
US9859151B1 (en) 2016-07-08 2018-01-02 Asm Ip Holding B.V. Selective film deposition method to form air gaps
US10612137B2 (en) 2016-07-08 2020-04-07 Asm Ip Holdings B.V. Organic reactants for atomic layer deposition
US9793135B1 (en) 2016-07-14 2017-10-17 ASM IP Holding B.V Method of cyclic dry etching using etchant film
US10714385B2 (en) 2016-07-19 2020-07-14 Asm Ip Holding B.V. Selective deposition of tungsten
KR102354490B1 (ko) 2016-07-27 2022-01-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법
US10177025B2 (en) 2016-07-28 2019-01-08 Asm Ip Holding B.V. Method and apparatus for filling a gap
US10395919B2 (en) 2016-07-28 2019-08-27 Asm Ip Holding B.V. Method and apparatus for filling a gap
US9812320B1 (en) 2016-07-28 2017-11-07 Asm Ip Holding B.V. Method and apparatus for filling a gap
US9887082B1 (en) 2016-07-28 2018-02-06 Asm Ip Holding B.V. Method and apparatus for filling a gap
KR102532607B1 (ko) 2016-07-28 2023-05-15 에이에스엠 아이피 홀딩 비.브이. 기판 가공 장치 및 그 동작 방법
US10090316B2 (en) 2016-09-01 2018-10-02 Asm Ip Holding B.V. 3D stacked multilayer semiconductor memory using doped select transistor channel
US10410943B2 (en) 2016-10-13 2019-09-10 Asm Ip Holding B.V. Method for passivating a surface of a semiconductor and related systems
US10643826B2 (en) 2016-10-26 2020-05-05 Asm Ip Holdings B.V. Methods for thermally calibrating reaction chambers
US11532757B2 (en) 2016-10-27 2022-12-20 Asm Ip Holding B.V. Deposition of charge trapping layers
US10714350B2 (en) 2016-11-01 2020-07-14 ASM IP Holdings, B.V. Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10643904B2 (en) 2016-11-01 2020-05-05 Asm Ip Holdings B.V. Methods for forming a semiconductor device and related semiconductor device structures
US10435790B2 (en) 2016-11-01 2019-10-08 Asm Ip Holding B.V. Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap
US10229833B2 (en) 2016-11-01 2019-03-12 Asm Ip Holding B.V. Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10134757B2 (en) 2016-11-07 2018-11-20 Asm Ip Holding B.V. Method of processing a substrate and a device manufactured by using the method
KR102546317B1 (ko) 2016-11-15 2023-06-21 에이에스엠 아이피 홀딩 비.브이. 기체 공급 유닛 및 이를 포함하는 기판 처리 장치
US10340135B2 (en) 2016-11-28 2019-07-02 Asm Ip Holding B.V. Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride
KR20180068582A (ko) 2016-12-14 2018-06-22 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US9916980B1 (en) 2016-12-15 2018-03-13 Asm Ip Holding B.V. Method of forming a structure on a substrate
US11581186B2 (en) 2016-12-15 2023-02-14 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus
US11447861B2 (en) 2016-12-15 2022-09-20 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus and a method of forming a patterned structure
KR102700194B1 (ko) 2016-12-19 2024-08-28 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US10269558B2 (en) 2016-12-22 2019-04-23 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10867788B2 (en) 2016-12-28 2020-12-15 Asm Ip Holding B.V. Method of forming a structure on a substrate
US11390950B2 (en) 2017-01-10 2022-07-19 Asm Ip Holding B.V. Reactor system and method to reduce residue buildup during a film deposition process
US10655221B2 (en) 2017-02-09 2020-05-19 Asm Ip Holding B.V. Method for depositing oxide film by thermal ALD and PEALD
US10468261B2 (en) 2017-02-15 2019-11-05 Asm Ip Holding B.V. Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
US10529563B2 (en) 2017-03-29 2020-01-07 Asm Ip Holdings B.V. Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
US10283353B2 (en) 2017-03-29 2019-05-07 Asm Ip Holding B.V. Method of reforming insulating film deposited on substrate with recess pattern
US10103040B1 (en) 2017-03-31 2018-10-16 Asm Ip Holding B.V. Apparatus and method for manufacturing a semiconductor device
USD830981S1 (en) 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
KR102457289B1 (ko) 2017-04-25 2022-10-21 에이에스엠 아이피 홀딩 비.브이. 박막 증착 방법 및 반도체 장치의 제조 방법
US10892156B2 (en) 2017-05-08 2021-01-12 Asm Ip Holding B.V. Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
US10446393B2 (en) 2017-05-08 2019-10-15 Asm Ip Holding B.V. Methods for forming silicon-containing epitaxial layers and related semiconductor device structures
US10770286B2 (en) 2017-05-08 2020-09-08 Asm Ip Holdings B.V. Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
US10504742B2 (en) 2017-05-31 2019-12-10 Asm Ip Holding B.V. Method of atomic layer etching using hydrogen plasma
US10886123B2 (en) 2017-06-02 2021-01-05 Asm Ip Holding B.V. Methods for forming low temperature semiconductor layers and related semiconductor device structures
US12040200B2 (en) 2017-06-20 2024-07-16 Asm Ip Holding B.V. Semiconductor processing apparatus and methods for calibrating a semiconductor processing apparatus
US11306395B2 (en) 2017-06-28 2022-04-19 Asm Ip Holding B.V. Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
US10685834B2 (en) 2017-07-05 2020-06-16 Asm Ip Holdings B.V. Methods for forming a silicon germanium tin layer and related semiconductor device structures
KR20190009245A (ko) 2017-07-18 2019-01-28 에이에스엠 아이피 홀딩 비.브이. 반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물
US10541333B2 (en) 2017-07-19 2020-01-21 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US11374112B2 (en) 2017-07-19 2022-06-28 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US11018002B2 (en) 2017-07-19 2021-05-25 Asm Ip Holding B.V. Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
US10312055B2 (en) 2017-07-26 2019-06-04 Asm Ip Holding B.V. Method of depositing film by PEALD using negative bias
US10590535B2 (en) 2017-07-26 2020-03-17 Asm Ip Holdings B.V. Chemical treatment, deposition and/or infiltration apparatus and method for using the same
US10605530B2 (en) 2017-07-26 2020-03-31 Asm Ip Holding B.V. Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace
US10770336B2 (en) 2017-08-08 2020-09-08 Asm Ip Holding B.V. Substrate lift mechanism and reactor including same
US10692741B2 (en) 2017-08-08 2020-06-23 Asm Ip Holdings B.V. Radiation shield
US11139191B2 (en) 2017-08-09 2021-10-05 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US10249524B2 (en) 2017-08-09 2019-04-02 Asm Ip Holding B.V. Cassette holder assembly for a substrate cassette and holding member for use in such assembly
US11769682B2 (en) 2017-08-09 2023-09-26 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US10236177B1 (en) 2017-08-22 2019-03-19 ASM IP Holding B.V.. Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures
USD900036S1 (en) 2017-08-24 2020-10-27 Asm Ip Holding B.V. Heater electrical connector and adapter
US11830730B2 (en) 2017-08-29 2023-11-28 Asm Ip Holding B.V. Layer forming method and apparatus
KR102491945B1 (ko) 2017-08-30 2023-01-26 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US11295980B2 (en) 2017-08-30 2022-04-05 Asm Ip Holding B.V. Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
US11056344B2 (en) 2017-08-30 2021-07-06 Asm Ip Holding B.V. Layer forming method
KR102401446B1 (ko) 2017-08-31 2022-05-24 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US10607895B2 (en) 2017-09-18 2020-03-31 Asm Ip Holdings B.V. Method for forming a semiconductor device structure comprising a gate fill metal
KR102630301B1 (ko) 2017-09-21 2024-01-29 에이에스엠 아이피 홀딩 비.브이. 침투성 재료의 순차 침투 합성 방법 처리 및 이를 이용하여 형성된 구조물 및 장치
US10844484B2 (en) 2017-09-22 2020-11-24 Asm Ip Holding B.V. Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US10658205B2 (en) 2017-09-28 2020-05-19 Asm Ip Holdings B.V. Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
US10403504B2 (en) 2017-10-05 2019-09-03 Asm Ip Holding B.V. Method for selectively depositing a metallic film on a substrate
US10319588B2 (en) 2017-10-10 2019-06-11 Asm Ip Holding B.V. Method for depositing a metal chalcogenide on a substrate by cyclical deposition
US10923344B2 (en) 2017-10-30 2021-02-16 Asm Ip Holding B.V. Methods for forming a semiconductor structure and related semiconductor structures
KR102443047B1 (ko) 2017-11-16 2022-09-14 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치 방법 및 그에 의해 제조된 장치
US10910262B2 (en) 2017-11-16 2021-02-02 Asm Ip Holding B.V. Method of selectively depositing a capping layer structure on a semiconductor device structure
US11022879B2 (en) 2017-11-24 2021-06-01 Asm Ip Holding B.V. Method of forming an enhanced unexposed photoresist layer
JP7214724B2 (ja) 2017-11-27 2023-01-30 エーエスエム アイピー ホールディング ビー.ブイ. バッチ炉で利用されるウェハカセットを収納するための収納装置
WO2019103610A1 (en) 2017-11-27 2019-05-31 Asm Ip Holding B.V. Apparatus including a clean mini environment
US10290508B1 (en) 2017-12-05 2019-05-14 Asm Ip Holding B.V. Method for forming vertical spacers for spacer-defined patterning
US10872771B2 (en) 2018-01-16 2020-12-22 Asm Ip Holding B. V. Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
CN111630203A (zh) 2018-01-19 2020-09-04 Asm Ip私人控股有限公司 通过等离子体辅助沉积来沉积间隙填充层的方法
TWI799494B (zh) 2018-01-19 2023-04-21 荷蘭商Asm 智慧財產控股公司 沈積方法
USD903477S1 (en) 2018-01-24 2020-12-01 Asm Ip Holdings B.V. Metal clamp
US11018047B2 (en) 2018-01-25 2021-05-25 Asm Ip Holding B.V. Hybrid lift pin
US10535516B2 (en) 2018-02-01 2020-01-14 Asm Ip Holdings B.V. Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures
USD880437S1 (en) 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
US11081345B2 (en) 2018-02-06 2021-08-03 Asm Ip Holding B.V. Method of post-deposition treatment for silicon oxide film
US10896820B2 (en) 2018-02-14 2021-01-19 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
JP7124098B2 (ja) 2018-02-14 2022-08-23 エーエスエム・アイピー・ホールディング・ベー・フェー 周期的堆積プロセスにより基材上にルテニウム含有膜を堆積させる方法
US10731249B2 (en) 2018-02-15 2020-08-04 Asm Ip Holding B.V. Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
US10658181B2 (en) 2018-02-20 2020-05-19 Asm Ip Holding B.V. Method of spacer-defined direct patterning in semiconductor fabrication
KR102636427B1 (ko) 2018-02-20 2024-02-13 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법 및 장치
US10975470B2 (en) 2018-02-23 2021-04-13 Asm Ip Holding B.V. Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
US11473195B2 (en) 2018-03-01 2022-10-18 Asm Ip Holding B.V. Semiconductor processing apparatus and a method for processing a substrate
US11629406B2 (en) 2018-03-09 2023-04-18 Asm Ip Holding B.V. Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
US11114283B2 (en) 2018-03-16 2021-09-07 Asm Ip Holding B.V. Reactor, system including the reactor, and methods of manufacturing and using same
KR102646467B1 (ko) 2018-03-27 2024-03-11 에이에스엠 아이피 홀딩 비.브이. 기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조
US11088002B2 (en) 2018-03-29 2021-08-10 Asm Ip Holding B.V. Substrate rack and a substrate processing system and method
US10510536B2 (en) 2018-03-29 2019-12-17 Asm Ip Holding B.V. Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber
US11230766B2 (en) 2018-03-29 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
KR102501472B1 (ko) 2018-03-30 2023-02-20 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법
TWI843623B (zh) 2018-05-08 2024-05-21 荷蘭商Asm Ip私人控股有限公司 藉由循環沉積製程於基板上沉積氧化物膜之方法及相關裝置結構
US12025484B2 (en) 2018-05-08 2024-07-02 Asm Ip Holding B.V. Thin film forming method
KR20190129718A (ko) 2018-05-11 2019-11-20 에이에스엠 아이피 홀딩 비.브이. 기판 상에 피도핑 금속 탄화물 막을 형성하는 방법 및 관련 반도체 소자 구조
KR102596988B1 (ko) 2018-05-28 2023-10-31 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법 및 그에 의해 제조된 장치
TWI840362B (zh) 2018-06-04 2024-05-01 荷蘭商Asm Ip私人控股有限公司 水氣降低的晶圓處置腔室
US11718913B2 (en) 2018-06-04 2023-08-08 Asm Ip Holding B.V. Gas distribution system and reactor system including same
US11286562B2 (en) 2018-06-08 2022-03-29 Asm Ip Holding B.V. Gas-phase chemical reactor and method of using same
KR102568797B1 (ko) 2018-06-21 2023-08-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 시스템
US10797133B2 (en) 2018-06-21 2020-10-06 Asm Ip Holding B.V. Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
WO2020003000A1 (en) 2018-06-27 2020-01-02 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
TW202409324A (zh) 2018-06-27 2024-03-01 荷蘭商Asm Ip私人控股有限公司 用於形成含金屬材料之循環沉積製程
KR102686758B1 (ko) 2018-06-29 2024-07-18 에이에스엠 아이피 홀딩 비.브이. 박막 증착 방법 및 반도체 장치의 제조 방법
US10612136B2 (en) 2018-06-29 2020-04-07 ASM IP Holding, B.V. Temperature-controlled flange and reactor system including same
US10388513B1 (en) 2018-07-03 2019-08-20 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10755922B2 (en) 2018-07-03 2020-08-25 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10767789B2 (en) 2018-07-16 2020-09-08 Asm Ip Holding B.V. Diaphragm valves, valve components, and methods for forming valve components
US10483099B1 (en) 2018-07-26 2019-11-19 Asm Ip Holding B.V. Method for forming thermally stable organosilicon polymer film
US11053591B2 (en) 2018-08-06 2021-07-06 Asm Ip Holding B.V. Multi-port gas injection system and reactor system including same
US10883175B2 (en) 2018-08-09 2021-01-05 Asm Ip Holding B.V. Vertical furnace for processing substrates and a liner for use therein
US10829852B2 (en) 2018-08-16 2020-11-10 Asm Ip Holding B.V. Gas distribution device for a wafer processing apparatus
US11430674B2 (en) 2018-08-22 2022-08-30 Asm Ip Holding B.V. Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
KR102707956B1 (ko) 2018-09-11 2024-09-19 에이에스엠 아이피 홀딩 비.브이. 박막 증착 방법
US11024523B2 (en) 2018-09-11 2021-06-01 Asm Ip Holding B.V. Substrate processing apparatus and method
US11049751B2 (en) 2018-09-14 2021-06-29 Asm Ip Holding B.V. Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
TWI844567B (zh) 2018-10-01 2024-06-11 荷蘭商Asm Ip私人控股有限公司 基材保持裝置、含有此裝置之系統及其使用之方法
US11232963B2 (en) 2018-10-03 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
KR102592699B1 (ko) 2018-10-08 2023-10-23 에이에스엠 아이피 홀딩 비.브이. 기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치
US10847365B2 (en) 2018-10-11 2020-11-24 Asm Ip Holding B.V. Method of forming conformal silicon carbide film by cyclic CVD
US10811256B2 (en) 2018-10-16 2020-10-20 Asm Ip Holding B.V. Method for etching a carbon-containing feature
KR102546322B1 (ko) 2018-10-19 2023-06-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치 및 기판 처리 방법
KR102605121B1 (ko) 2018-10-19 2023-11-23 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치 및 기판 처리 방법
USD948463S1 (en) 2018-10-24 2022-04-12 Asm Ip Holding B.V. Susceptor for semiconductor substrate supporting apparatus
US10381219B1 (en) 2018-10-25 2019-08-13 Asm Ip Holding B.V. Methods for forming a silicon nitride film
US11087997B2 (en) 2018-10-31 2021-08-10 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
KR20200051105A (ko) 2018-11-02 2020-05-13 에이에스엠 아이피 홀딩 비.브이. 기판 지지 유닛 및 이를 포함하는 기판 처리 장치
US11572620B2 (en) 2018-11-06 2023-02-07 Asm Ip Holding B.V. Methods for selectively depositing an amorphous silicon film on a substrate
US11031242B2 (en) 2018-11-07 2021-06-08 Asm Ip Holding B.V. Methods for depositing a boron doped silicon germanium film
US10847366B2 (en) 2018-11-16 2020-11-24 Asm Ip Holding B.V. Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
US10818758B2 (en) 2018-11-16 2020-10-27 Asm Ip Holding B.V. Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
US10559458B1 (en) 2018-11-26 2020-02-11 Asm Ip Holding B.V. Method of forming oxynitride film
US12040199B2 (en) 2018-11-28 2024-07-16 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
US11217444B2 (en) 2018-11-30 2022-01-04 Asm Ip Holding B.V. Method for forming an ultraviolet radiation responsive metal oxide-containing film
KR102636428B1 (ko) 2018-12-04 2024-02-13 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치를 세정하는 방법
US11158513B2 (en) 2018-12-13 2021-10-26 Asm Ip Holding B.V. Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
JP7504584B2 (ja) 2018-12-14 2024-06-24 エーエスエム・アイピー・ホールディング・ベー・フェー 窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム
TWI819180B (zh) 2019-01-17 2023-10-21 荷蘭商Asm 智慧財產控股公司 藉由循環沈積製程於基板上形成含過渡金屬膜之方法
KR20200091543A (ko) 2019-01-22 2020-07-31 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
CN111524788B (zh) 2019-02-01 2023-11-24 Asm Ip私人控股有限公司 氧化硅的拓扑选择性膜形成的方法
KR20200102357A (ko) 2019-02-20 2020-08-31 에이에스엠 아이피 홀딩 비.브이. 3-d nand 응용의 플러그 충진체 증착용 장치 및 방법
TWI845607B (zh) 2019-02-20 2024-06-21 荷蘭商Asm Ip私人控股有限公司 用來填充形成於基材表面內之凹部的循環沉積方法及設備
KR102626263B1 (ko) 2019-02-20 2024-01-16 에이에스엠 아이피 홀딩 비.브이. 처리 단계를 포함하는 주기적 증착 방법 및 이를 위한 장치
JP2020136678A (ja) 2019-02-20 2020-08-31 エーエスエム・アイピー・ホールディング・ベー・フェー 基材表面内に形成された凹部を充填するための方法および装置
TWI842826B (zh) 2019-02-22 2024-05-21 荷蘭商Asm Ip私人控股有限公司 基材處理設備及處理基材之方法
US11742198B2 (en) 2019-03-08 2023-08-29 Asm Ip Holding B.V. Structure including SiOCN layer and method of forming same
KR20200108242A (ko) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. 실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체
KR20200108243A (ko) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. SiOC 층을 포함한 구조체 및 이의 형성 방법
KR20200116033A (ko) 2019-03-28 2020-10-08 에이에스엠 아이피 홀딩 비.브이. 도어 개방기 및 이를 구비한 기판 처리 장치
KR20200116855A (ko) 2019-04-01 2020-10-13 에이에스엠 아이피 홀딩 비.브이. 반도체 소자를 제조하는 방법
KR20200123380A (ko) 2019-04-19 2020-10-29 에이에스엠 아이피 홀딩 비.브이. 층 형성 방법 및 장치
KR20200125453A (ko) 2019-04-24 2020-11-04 에이에스엠 아이피 홀딩 비.브이. 기상 반응기 시스템 및 이를 사용하는 방법
KR20200130118A (ko) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. 비정질 탄소 중합체 막을 개질하는 방법
KR20200130121A (ko) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. 딥 튜브가 있는 화학물질 공급원 용기
KR20200130652A (ko) 2019-05-10 2020-11-19 에이에스엠 아이피 홀딩 비.브이. 표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조
JP2020188255A (ja) 2019-05-16 2020-11-19 エーエスエム アイピー ホールディング ビー.ブイ. ウェハボートハンドリング装置、縦型バッチ炉および方法
JP2020188254A (ja) 2019-05-16 2020-11-19 エーエスエム アイピー ホールディング ビー.ブイ. ウェハボートハンドリング装置、縦型バッチ炉および方法
USD947913S1 (en) 2019-05-17 2022-04-05 Asm Ip Holding B.V. Susceptor shaft
USD975665S1 (en) 2019-05-17 2023-01-17 Asm Ip Holding B.V. Susceptor shaft
USD935572S1 (en) 2019-05-24 2021-11-09 Asm Ip Holding B.V. Gas channel plate
USD922229S1 (en) 2019-06-05 2021-06-15 Asm Ip Holding B.V. Device for controlling a temperature of a gas supply unit
KR20200141003A (ko) 2019-06-06 2020-12-17 에이에스엠 아이피 홀딩 비.브이. 가스 감지기를 포함하는 기상 반응기 시스템
KR20200143254A (ko) 2019-06-11 2020-12-23 에이에스엠 아이피 홀딩 비.브이. 개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조
USD944946S1 (en) 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
JP7333944B2 (ja) * 2019-06-27 2023-08-28 株式会社フジキン 流体制御装置
USD931978S1 (en) 2019-06-27 2021-09-28 Asm Ip Holding B.V. Showerhead vacuum transport
KR20210005515A (ko) 2019-07-03 2021-01-14 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법
JP7499079B2 (ja) 2019-07-09 2024-06-13 エーエスエム・アイピー・ホールディング・ベー・フェー 同軸導波管を用いたプラズマ装置、基板処理方法
CN112216646A (zh) 2019-07-10 2021-01-12 Asm Ip私人控股有限公司 基板支撑组件及包括其的基板处理装置
KR20210010307A (ko) 2019-07-16 2021-01-27 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
KR20210010816A (ko) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. 라디칼 보조 점화 플라즈마 시스템 및 방법
KR20210010820A (ko) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. 실리콘 게르마늄 구조를 형성하는 방법
US11643724B2 (en) 2019-07-18 2023-05-09 Asm Ip Holding B.V. Method of forming structures using a neutral beam
TWI839544B (zh) 2019-07-19 2024-04-21 荷蘭商Asm Ip私人控股有限公司 形成形貌受控的非晶碳聚合物膜之方法
KR20210010817A (ko) 2019-07-19 2021-01-28 에이에스엠 아이피 홀딩 비.브이. 토폴로지-제어된 비정질 탄소 중합체 막을 형성하는 방법
CN112309843A (zh) 2019-07-29 2021-02-02 Asm Ip私人控股有限公司 实现高掺杂剂掺入的选择性沉积方法
CN112309899A (zh) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 基板处理设备
CN112309900A (zh) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 基板处理设备
US11227782B2 (en) 2019-07-31 2022-01-18 Asm Ip Holding B.V. Vertical batch furnace assembly
US11587815B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11587814B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
CN118422165A (zh) 2019-08-05 2024-08-02 Asm Ip私人控股有限公司 用于化学源容器的液位传感器
USD965044S1 (en) 2019-08-19 2022-09-27 Asm Ip Holding B.V. Susceptor shaft
USD965524S1 (en) 2019-08-19 2022-10-04 Asm Ip Holding B.V. Susceptor support
JP2021031769A (ja) 2019-08-21 2021-03-01 エーエスエム アイピー ホールディング ビー.ブイ. 成膜原料混合ガス生成装置及び成膜装置
USD930782S1 (en) 2019-08-22 2021-09-14 Asm Ip Holding B.V. Gas distributor
USD949319S1 (en) 2019-08-22 2022-04-19 Asm Ip Holding B.V. Exhaust duct
USD940837S1 (en) 2019-08-22 2022-01-11 Asm Ip Holding B.V. Electrode
USD979506S1 (en) 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
KR20210024423A (ko) 2019-08-22 2021-03-05 에이에스엠 아이피 홀딩 비.브이. 홀을 구비한 구조체를 형성하기 위한 방법
KR20210024420A (ko) 2019-08-23 2021-03-05 에이에스엠 아이피 홀딩 비.브이. 비스(디에틸아미노)실란을 사용하여 peald에 의해 개선된 품질을 갖는 실리콘 산화물 막을 증착하기 위한 방법
US11286558B2 (en) 2019-08-23 2022-03-29 Asm Ip Holding B.V. Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
KR20210029090A (ko) 2019-09-04 2021-03-15 에이에스엠 아이피 홀딩 비.브이. 희생 캡핑 층을 이용한 선택적 증착 방법
KR20210029663A (ko) 2019-09-05 2021-03-16 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US11562901B2 (en) 2019-09-25 2023-01-24 Asm Ip Holding B.V. Substrate processing method
CN112593212B (zh) 2019-10-02 2023-12-22 Asm Ip私人控股有限公司 通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法
KR20210042810A (ko) 2019-10-08 2021-04-20 에이에스엠 아이피 홀딩 비.브이. 활성 종을 이용하기 위한 가스 분배 어셈블리를 포함한 반응기 시스템 및 이를 사용하는 방법
TWI846953B (zh) 2019-10-08 2024-07-01 荷蘭商Asm Ip私人控股有限公司 基板處理裝置
KR20210043460A (ko) 2019-10-10 2021-04-21 에이에스엠 아이피 홀딩 비.브이. 포토레지스트 하부층을 형성하기 위한 방법 및 이를 포함한 구조체
US12009241B2 (en) 2019-10-14 2024-06-11 Asm Ip Holding B.V. Vertical batch furnace assembly with detector to detect cassette
TWI834919B (zh) 2019-10-16 2024-03-11 荷蘭商Asm Ip私人控股有限公司 氧化矽之拓撲選擇性膜形成之方法
US11637014B2 (en) 2019-10-17 2023-04-25 Asm Ip Holding B.V. Methods for selective deposition of doped semiconductor material
KR20210047808A (ko) 2019-10-21 2021-04-30 에이에스엠 아이피 홀딩 비.브이. 막을 선택적으로 에칭하기 위한 장치 및 방법
KR20210050453A (ko) 2019-10-25 2021-05-07 에이에스엠 아이피 홀딩 비.브이. 기판 표면 상의 갭 피처를 충진하는 방법 및 이와 관련된 반도체 소자 구조
US11646205B2 (en) 2019-10-29 2023-05-09 Asm Ip Holding B.V. Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
KR20210054983A (ko) 2019-11-05 2021-05-14 에이에스엠 아이피 홀딩 비.브이. 도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템
US11501968B2 (en) 2019-11-15 2022-11-15 Asm Ip Holding B.V. Method for providing a semiconductor device with silicon filled gaps
KR20210062561A (ko) 2019-11-20 2021-05-31 에이에스엠 아이피 홀딩 비.브이. 기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템
KR20210065848A (ko) 2019-11-26 2021-06-04 에이에스엠 아이피 홀딩 비.브이. 제1 유전체 표면과 제2 금속성 표면을 포함한 기판 상에 타겟 막을 선택적으로 형성하기 위한 방법
CN112951697A (zh) 2019-11-26 2021-06-11 Asm Ip私人控股有限公司 基板处理设备
CN112885692A (zh) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 基板处理设备
CN112885693A (zh) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 基板处理设备
JP7527928B2 (ja) 2019-12-02 2024-08-05 エーエスエム・アイピー・ホールディング・ベー・フェー 基板処理装置、基板処理方法
KR20210070898A (ko) 2019-12-04 2021-06-15 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
TW202125596A (zh) 2019-12-17 2021-07-01 荷蘭商Asm Ip私人控股有限公司 形成氮化釩層之方法以及包括該氮化釩層之結構
US11527403B2 (en) 2019-12-19 2022-12-13 Asm Ip Holding B.V. Methods for filling a gap feature on a substrate surface and related semiconductor structures
KR20210089079A (ko) 2020-01-06 2021-07-15 에이에스엠 아이피 홀딩 비.브이. 채널형 리프트 핀
TW202140135A (zh) 2020-01-06 2021-11-01 荷蘭商Asm Ip私人控股有限公司 氣體供應總成以及閥板總成
US11993847B2 (en) 2020-01-08 2024-05-28 Asm Ip Holding B.V. Injector
KR102675856B1 (ko) 2020-01-20 2024-06-17 에이에스엠 아이피 홀딩 비.브이. 박막 형성 방법 및 박막 표면 개질 방법
TW202130846A (zh) 2020-02-03 2021-08-16 荷蘭商Asm Ip私人控股有限公司 形成包括釩或銦層的結構之方法
TW202146882A (zh) 2020-02-04 2021-12-16 荷蘭商Asm Ip私人控股有限公司 驗證一物品之方法、用於驗證一物品之設備、及用於驗證一反應室之系統
US11776846B2 (en) 2020-02-07 2023-10-03 Asm Ip Holding B.V. Methods for depositing gap filling fluids and related systems and devices
US11781243B2 (en) 2020-02-17 2023-10-10 Asm Ip Holding B.V. Method for depositing low temperature phosphorous-doped silicon
TW202203344A (zh) 2020-02-28 2022-01-16 荷蘭商Asm Ip控股公司 專用於零件清潔的系統
KR20210116249A (ko) 2020-03-11 2021-09-27 에이에스엠 아이피 홀딩 비.브이. 록아웃 태그아웃 어셈블리 및 시스템 그리고 이의 사용 방법
KR20210116240A (ko) 2020-03-11 2021-09-27 에이에스엠 아이피 홀딩 비.브이. 조절성 접합부를 갖는 기판 핸들링 장치
CN113394086A (zh) 2020-03-12 2021-09-14 Asm Ip私人控股有限公司 用于制造具有目标拓扑轮廓的层结构的方法
KR20210124042A (ko) 2020-04-02 2021-10-14 에이에스엠 아이피 홀딩 비.브이. 박막 형성 방법
TW202146689A (zh) 2020-04-03 2021-12-16 荷蘭商Asm Ip控股公司 阻障層形成方法及半導體裝置的製造方法
TW202145344A (zh) 2020-04-08 2021-12-01 荷蘭商Asm Ip私人控股有限公司 用於選擇性蝕刻氧化矽膜之設備及方法
KR20210128343A (ko) 2020-04-15 2021-10-26 에이에스엠 아이피 홀딩 비.브이. 크롬 나이트라이드 층을 형성하는 방법 및 크롬 나이트라이드 층을 포함하는 구조
US11821078B2 (en) 2020-04-15 2023-11-21 Asm Ip Holding B.V. Method for forming precoat film and method for forming silicon-containing film
US11996289B2 (en) 2020-04-16 2024-05-28 Asm Ip Holding B.V. Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods
JP2021172884A (ja) 2020-04-24 2021-11-01 エーエスエム・アイピー・ホールディング・ベー・フェー 窒化バナジウム含有層を形成する方法および窒化バナジウム含有層を含む構造体
KR20210132600A (ko) 2020-04-24 2021-11-04 에이에스엠 아이피 홀딩 비.브이. 바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템
TW202146831A (zh) 2020-04-24 2021-12-16 荷蘭商Asm Ip私人控股有限公司 垂直批式熔爐總成、及用於冷卻垂直批式熔爐之方法
KR20210134226A (ko) 2020-04-29 2021-11-09 에이에스엠 아이피 홀딩 비.브이. 고체 소스 전구체 용기
KR20210134869A (ko) 2020-05-01 2021-11-11 에이에스엠 아이피 홀딩 비.브이. Foup 핸들러를 이용한 foup의 빠른 교환
TW202147543A (zh) 2020-05-04 2021-12-16 荷蘭商Asm Ip私人控股有限公司 半導體處理系統
KR20210141379A (ko) 2020-05-13 2021-11-23 에이에스엠 아이피 홀딩 비.브이. 반응기 시스템용 레이저 정렬 고정구
TW202146699A (zh) 2020-05-15 2021-12-16 荷蘭商Asm Ip私人控股有限公司 形成矽鍺層之方法、半導體結構、半導體裝置、形成沉積層之方法、及沉積系統
KR20210143653A (ko) 2020-05-19 2021-11-29 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
KR20210145078A (ko) 2020-05-21 2021-12-01 에이에스엠 아이피 홀딩 비.브이. 다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법
KR102702526B1 (ko) 2020-05-22 2024-09-03 에이에스엠 아이피 홀딩 비.브이. 과산화수소를 사용하여 박막을 증착하기 위한 장치
TW202201602A (zh) 2020-05-29 2022-01-01 荷蘭商Asm Ip私人控股有限公司 基板處理方法
TW202212620A (zh) 2020-06-02 2022-04-01 荷蘭商Asm Ip私人控股有限公司 處理基板之設備、形成膜之方法、及控制用於處理基板之設備之方法
TW202218133A (zh) 2020-06-24 2022-05-01 荷蘭商Asm Ip私人控股有限公司 形成含矽層之方法
TW202217953A (zh) 2020-06-30 2022-05-01 荷蘭商Asm Ip私人控股有限公司 基板處理方法
KR102707957B1 (ko) 2020-07-08 2024-09-19 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법
TW202219628A (zh) 2020-07-17 2022-05-16 荷蘭商Asm Ip私人控股有限公司 用於光微影之結構與方法
TW202204662A (zh) 2020-07-20 2022-02-01 荷蘭商Asm Ip私人控股有限公司 用於沉積鉬層之方法及系統
US12040177B2 (en) 2020-08-18 2024-07-16 Asm Ip Holding B.V. Methods for forming a laminate film by cyclical plasma-enhanced deposition processes
KR20220027026A (ko) 2020-08-26 2022-03-07 에이에스엠 아이피 홀딩 비.브이. 금속 실리콘 산화물 및 금속 실리콘 산질화물 층을 형성하기 위한 방법 및 시스템
TW202229601A (zh) 2020-08-27 2022-08-01 荷蘭商Asm Ip私人控股有限公司 形成圖案化結構的方法、操控機械特性的方法、裝置結構、及基板處理系統
USD990534S1 (en) 2020-09-11 2023-06-27 Asm Ip Holding B.V. Weighted lift pin
USD1012873S1 (en) 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
US12009224B2 (en) 2020-09-29 2024-06-11 Asm Ip Holding B.V. Apparatus and method for etching metal nitrides
KR20220045900A (ko) 2020-10-06 2022-04-13 에이에스엠 아이피 홀딩 비.브이. 실리콘 함유 재료를 증착하기 위한 증착 방법 및 장치
CN114293174A (zh) 2020-10-07 2022-04-08 Asm Ip私人控股有限公司 气体供应单元和包括气体供应单元的衬底处理设备
TW202229613A (zh) 2020-10-14 2022-08-01 荷蘭商Asm Ip私人控股有限公司 於階梯式結構上沉積材料的方法
KR20220053482A (ko) 2020-10-22 2022-04-29 에이에스엠 아이피 홀딩 비.브이. 바나듐 금속을 증착하는 방법, 구조체, 소자 및 증착 어셈블리
TW202223136A (zh) 2020-10-28 2022-06-16 荷蘭商Asm Ip私人控股有限公司 用於在基板上形成層之方法、及半導體處理系統
TW202235649A (zh) 2020-11-24 2022-09-16 荷蘭商Asm Ip私人控股有限公司 填充間隙之方法與相關之系統及裝置
TW202235675A (zh) 2020-11-30 2022-09-16 荷蘭商Asm Ip私人控股有限公司 注入器、及基板處理設備
US11946137B2 (en) 2020-12-16 2024-04-02 Asm Ip Holding B.V. Runout and wobble measurement fixtures
TW202231903A (zh) 2020-12-22 2022-08-16 荷蘭商Asm Ip私人控股有限公司 過渡金屬沉積方法、過渡金屬層、用於沉積過渡金屬於基板上的沉積總成
USD980814S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD1023959S1 (en) 2021-05-11 2024-04-23 Asm Ip Holding B.V. Electrode for substrate processing apparatus
USD980813S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD981973S1 (en) 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus
USD990441S1 (en) 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate
CN118414690A (zh) * 2021-12-22 2024-07-30 株式会社博迈立铖 气化器
WO2023220595A1 (en) * 2022-05-09 2023-11-16 Watlow Electric Manufacturing Company Heater system for gas processing components

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3733459A (en) * 1971-02-09 1973-05-15 C Lengstorf Internal heating device for air valves
US4597412A (en) * 1982-09-29 1986-07-01 Stark Anton W Valve for sequential chemical operations
JP2695745B2 (ja) * 1993-09-02 1998-01-14 シーケーディ株式会社 ガス供給装置
JP2690269B2 (ja) * 1994-04-18 1997-12-10 シーケーディ株式会社 ガス供給装置
JP3785516B2 (ja) * 1997-03-07 2006-06-14 株式会社フジキン 流体制御装置
JPH112384A (ja) * 1997-06-12 1999-01-06 Sony Corp 配管システム
US7036528B2 (en) * 1998-05-18 2006-05-02 Swagelok Company Modular surface mount manifold assemblies
JP2000230670A (ja) * 1999-02-10 2000-08-22 Hitachi Metals Ltd ヒータ付き集積流体制御装置
US6499631B2 (en) * 2001-01-26 2002-12-31 Illinois Tool Works Inc. Hot melt adhesive applicator
JP4487135B2 (ja) * 2001-03-05 2010-06-23 東京エレクトロン株式会社 流体制御装置
JP4653358B2 (ja) * 2001-08-28 2011-03-16 シーケーディ株式会社 集積弁
JP4567370B2 (ja) * 2004-05-10 2010-10-20 シーケーディ株式会社 ガス供給集積ユニット

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104822979A (zh) * 2012-11-29 2015-08-05 株式会社富士金 流体控制装置
CN104822979B (zh) * 2012-11-29 2016-12-28 株式会社富士金 流体控制装置
TWI742729B (zh) * 2019-06-28 2021-10-11 日商富士金股份有限公司 流體控制裝置

Also Published As

Publication number Publication date
EP1892447A1 (en) 2008-02-27
JP4753173B2 (ja) 2011-08-24
TW200704892A (en) 2007-02-01
JP2006349075A (ja) 2006-12-28
US20090277510A1 (en) 2009-11-12
KR20080025722A (ko) 2008-03-21
WO2006134727A1 (ja) 2006-12-21

Similar Documents

Publication Publication Date Title
CN101223393A (zh) 流体控制装置
EP0877185B1 (en) Device for heating fluid controller
KR101775257B1 (ko) 유체 제어 장치 및 유체 제어 장치에의 서멀 센서 설치 구조
JP2012515974A (ja) 温度制御圧力調節器
US20090212039A1 (en) Fluid Controlling Apparatus
WO2004094883A1 (ja) バルブ装着用ヒータユニット
KR102375472B1 (ko) 기화기
WO2014084014A1 (ja) 流体制御装置
TWI672459B (zh) 流體控制裝置
US10697815B2 (en) System and methods for mitigating condensation in a sensor module
JP4567370B2 (ja) ガス供給集積ユニット
JP7365662B2 (ja) ヒータ固定具および流体制御装置
JP2001280595A (ja) 集積型ガス供給ユニット用モジュールブロック
JP4528592B2 (ja) ガス供給集積ユニット
WO2021192643A1 (ja) 気化システム
JP2006242222A (ja) 集積化ガス制御装置と集積化ガス制御方法
JP2000230670A (ja) ヒータ付き集積流体制御装置
JP2020153513A (ja) 流体制御装置
WO2023120402A1 (ja) 気化器
CN116336393A (zh) 用于基板处理装置的集成气体系统
CN110088616B (zh) 分析单元
WO2019138686A1 (ja) 流体加熱モジュール
RU2001127645A (ru) Воздухонагреватель
KR20080059970A (ko) 온수기의 열교환기 바이패스 파이프 접속장치

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication