CN101207114A - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
- Publication number
- CN101207114A CN101207114A CNA2007101678464A CN200710167846A CN101207114A CN 101207114 A CN101207114 A CN 101207114A CN A2007101678464 A CNA2007101678464 A CN A2007101678464A CN 200710167846 A CN200710167846 A CN 200710167846A CN 101207114 A CN101207114 A CN 101207114A
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- Prior art keywords
- semiconductor chip
- semiconductor
- distributing board
- semiconductor element
- adhesive
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- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/156—Material
- H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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-
- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2006-343093 | 2006-12-20 | ||
JP2006343093A JP5559452B2 (ja) | 2006-12-20 | 2006-12-20 | 半導体装置及びその製造方法 |
JP2006343093 | 2006-12-20 |
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CN101207114A true CN101207114A (zh) | 2008-06-25 |
CN101207114B CN101207114B (zh) | 2012-09-05 |
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CN2007101678464A Expired - Fee Related CN101207114B (zh) | 2006-12-20 | 2007-10-26 | 半导体器件及其制造方法 |
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US (1) | US7906852B2 (zh) |
JP (1) | JP5559452B2 (zh) |
KR (1) | KR100896301B1 (zh) |
CN (1) | CN101207114B (zh) |
TW (1) | TWI396271B (zh) |
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CN102738133A (zh) * | 2011-03-31 | 2012-10-17 | 株式会社东芝 | 半导体器件及其制造方法 |
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- 2006-12-20 JP JP2006343093A patent/JP5559452B2/ja not_active Expired - Fee Related
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- 2007-10-03 TW TW096137062A patent/TWI396271B/zh not_active IP Right Cessation
- 2007-10-05 US US11/868,036 patent/US7906852B2/en not_active Expired - Fee Related
- 2007-10-19 KR KR1020070105384A patent/KR100896301B1/ko not_active IP Right Cessation
- 2007-10-26 CN CN2007101678464A patent/CN101207114B/zh not_active Expired - Fee Related
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101866862A (zh) * | 2009-04-09 | 2010-10-20 | 瑞萨电子株式会社 | 半导体集成电路器件的制造方法 |
CN102420208A (zh) * | 2010-09-28 | 2012-04-18 | 三星电子株式会社 | 半导体封装件 |
CN102738133A (zh) * | 2011-03-31 | 2012-10-17 | 株式会社东芝 | 半导体器件及其制造方法 |
CN103620772A (zh) * | 2011-04-22 | 2014-03-05 | 泰塞拉公司 | 具有堆叠的面朝下连接的裸片的多芯片模块 |
US9484333B2 (en) | 2011-04-22 | 2016-11-01 | Tessera, Inc. | Multi-chip module with stacked face-down connected dies |
CN102867800B (zh) * | 2011-07-07 | 2016-03-23 | 台湾积体电路制造股份有限公司 | 将功能芯片连接至封装件以形成层叠封装件 |
CN102867800A (zh) * | 2011-07-07 | 2013-01-09 | 台湾积体电路制造股份有限公司 | 将功能芯片连接至封装件以形成层叠封装件 |
CN103165505A (zh) * | 2011-12-09 | 2013-06-19 | 三星电子株式会社 | 制造扇出晶体级封装的方法以及由该方法形成的封装 |
CN103165505B (zh) * | 2011-12-09 | 2017-05-17 | 三星电子株式会社 | 制造扇出晶体级封装的方法以及由该方法形成的封装 |
CN105580135A (zh) * | 2013-09-27 | 2016-05-11 | 高通Mems科技公司 | 具有通孔条的半导体器件 |
CN105580135B (zh) * | 2013-09-27 | 2018-06-05 | 施耐普特拉克股份有限公司 | 具有通孔条的半导体器件 |
CN111052371A (zh) * | 2017-08-24 | 2020-04-21 | 美光科技公司 | 具有横向偏移堆叠的半导体裸片的半导体装置 |
CN112117242A (zh) * | 2019-06-20 | 2020-12-22 | 江苏长电科技股份有限公司 | 芯片封装结构及其制造方法 |
CN112117242B (zh) * | 2019-06-20 | 2023-01-31 | 江苏长电科技股份有限公司 | 芯片封装结构及其制造方法 |
Also Published As
Publication number | Publication date |
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KR100896301B1 (ko) | 2009-05-07 |
JP5559452B2 (ja) | 2014-07-23 |
TWI396271B (zh) | 2013-05-11 |
CN101207114B (zh) | 2012-09-05 |
TW200828559A (en) | 2008-07-01 |
KR20080058162A (ko) | 2008-06-25 |
US20080150157A1 (en) | 2008-06-26 |
US7906852B2 (en) | 2011-03-15 |
JP2008159607A (ja) | 2008-07-10 |
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