CN101148542B - 热固性硅树脂组合物及使用其的发光二极管元件 - Google Patents

热固性硅树脂组合物及使用其的发光二极管元件 Download PDF

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Publication number
CN101148542B
CN101148542B CN2007101543382A CN200710154338A CN101148542B CN 101148542 B CN101148542 B CN 101148542B CN 2007101543382 A CN2007101543382 A CN 2007101543382A CN 200710154338 A CN200710154338 A CN 200710154338A CN 101148542 B CN101148542 B CN 101148542B
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component
emitting diode
diode element
organopolysiloxane
carbon atoms
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CN101148542A (zh
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小材利之
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Shin-Etsu Chemical Co Ltd
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Shin-Etsu Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
CN2007101543382A 2006-09-22 2007-09-21 热固性硅树脂组合物及使用其的发光二极管元件 Active CN101148542B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006-256581 2006-09-22
JP2006256581A JP4563977B2 (ja) 2006-09-22 2006-09-22 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子
JP2006256581 2006-09-22

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CN101148542A CN101148542A (zh) 2008-03-26
CN101148542B true CN101148542B (zh) 2011-10-05

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Country Link
US (1) US7915362B2 (enExample)
EP (1) EP1921114B1 (enExample)
JP (1) JP4563977B2 (enExample)
KR (1) KR101421292B1 (enExample)
CN (1) CN101148542B (enExample)
DE (1) DE602007003545D1 (enExample)
TW (1) TWI419933B (enExample)

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CN102112118A (zh) * 2008-04-25 2011-06-29 北卡罗来纳-查佩尔山大学 特别用于非湿润模型的颗粒复制的可降解化合物及其使用方法
JP2010027974A (ja) * 2008-07-23 2010-02-04 Sharp Corp 発光装置の製造方法
JP5621211B2 (ja) * 2009-04-20 2014-11-12 横浜ゴム株式会社 光半導体封止用シリコーン樹脂組成物
US8697458B2 (en) 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
MX2011011016A (es) * 2009-04-22 2012-01-25 Shat R Shield Inc Diodo emisor de luz recubierto de silicona.
JP5443940B2 (ja) * 2009-10-21 2014-03-19 東亞合成株式会社 硬化型コーティング剤組成物
JPWO2011135780A1 (ja) * 2010-04-27 2013-07-18 信越化学工業株式会社 発光装置及びその製造方法
EP2616103A1 (en) 2010-09-16 2013-07-24 The University of North Carolina At Chapel Hill Asymmetric bifunctional silyl monomers and particles thereof as prodrugs and delivery vehicles for pharmaceutical, chemical and biological agents
EP2630193B1 (en) * 2010-10-19 2015-04-15 Ablestik (Shanghai) Limited Hybrid silicone composition for light emitting device
JP5921154B2 (ja) 2011-11-09 2016-05-24 日東電工株式会社 光学フィルム、画像表示装置および画像表示装置の製造方法
CA2911523C (en) * 2013-05-10 2018-10-02 Abl Ip Holding Llc Silicone optics
JP6072663B2 (ja) * 2013-10-15 2017-02-01 信越化学工業株式会社 加熱硬化型導電性シリコーン組成物、該組成物からなる導電性接着剤、該組成物からなる導電性ダイボンド材、該ダイボンド材の硬化物を有する光半導体装置。
JP6285346B2 (ja) * 2014-12-08 2018-02-28 信越化学工業株式会社 透明樹脂組成物、該組成物からなる接着剤、該組成物からなるダイボンド材、該組成物を用いた導電接続方法、及び該方法によって得られた光半導体装置
JP6272747B2 (ja) * 2014-12-08 2018-01-31 信越化学工業株式会社 加熱硬化型シリコーン組成物、該組成物からなるダイボンド材及び該ダイボンド材の硬化物を用いた光半導体装置
JP6622171B2 (ja) * 2016-11-08 2019-12-18 信越化学工業株式会社 加熱硬化型シリコーン組成物、ダイボンド材及び光半導体装置
CN110050356B (zh) * 2016-12-09 2023-06-13 莫门蒂夫性能材料韩国株式会社 用于有机电子元件封装物的组合物及采用该组合物形成的封装物
EP3689995B1 (en) * 2017-09-29 2022-03-23 Shin-Etsu Chemical Co., Ltd. Uv curable silicone adhesive composition and cured product thereof
JP6978690B2 (ja) * 2018-05-25 2021-12-08 日亜化学工業株式会社 透光性部材の形成方法および発光装置の製造方法、ならびに、発光装置
JP6962290B2 (ja) * 2018-08-02 2021-11-05 信越化学工業株式会社 光造形用紫外線硬化型シリコーン組成物およびその硬化物
JP7296748B2 (ja) * 2019-03-08 2023-06-23 信越化学工業株式会社 ウェハーレベル光半導体デバイス用樹脂組成物、及び光半導体デバイス
JP7107279B2 (ja) * 2019-05-27 2022-07-27 信越化学工業株式会社 型取り用シリコーンゴム組成物およびシリコーンゴム型

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EP0134678A2 (en) * 1983-07-20 1985-03-20 Loctite Corporation Polymers with graft alpha-alkylarylate functionality
US4525563A (en) * 1983-04-06 1985-06-25 Toyo Contact Lens Co. Oxygen permeable soft contact lens composition
EP0378370A2 (en) * 1989-01-12 1990-07-18 Rohm And Haas Company Process for making silicone-containing polymer particles
EP1045009A1 (en) * 1999-04-16 2000-10-18 Dow Corning Corporation Heat curable silcone acrylate coating compositions
US6906115B2 (en) * 2001-06-27 2005-06-14 Daikin Industries, Ltd. Surface treatment composition and preparation thereof

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JPH0627162B2 (ja) 1988-05-31 1994-04-13 信越化学工業株式会社 光硬化性オルガノポリシロキサン組成物
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JP2927279B2 (ja) 1996-07-29 1999-07-28 日亜化学工業株式会社 発光ダイオード
JPH10228249A (ja) 1996-12-12 1998-08-25 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたｌｅｄ表示装置
JP3344286B2 (ja) 1997-06-12 2002-11-11 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
US5965299A (en) * 1997-06-23 1999-10-12 North Carolina State University Composite electrolyte containing surface modified fumed silica
JP4286935B2 (ja) 1998-10-14 2009-07-01 株式会社朝日ラバー 調色照明装置
JP2001123120A (ja) * 1999-10-26 2001-05-08 Bridgestone Corp 木質仕上材用塗料及び表面塗装木質仕上材
JP2003128920A (ja) * 2001-10-26 2003-05-08 Dow Corning Toray Silicone Co Ltd 硬化性液状シリコーン組成物および半導体装置
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JP2006328164A (ja) 2005-05-25 2006-12-07 Shin Etsu Chem Co Ltd 熱伝導性シリコーン組成物
JP5015571B2 (ja) * 2006-01-12 2012-08-29 信越化学工業株式会社 発光ダイオード素子用紫外線硬化型シリコーン組成物
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US4201808A (en) * 1978-06-12 1980-05-06 Union Carbide Corporation Radiation curable silicone release compositions
US4525563A (en) * 1983-04-06 1985-06-25 Toyo Contact Lens Co. Oxygen permeable soft contact lens composition
EP0134678A2 (en) * 1983-07-20 1985-03-20 Loctite Corporation Polymers with graft alpha-alkylarylate functionality
EP0378370A2 (en) * 1989-01-12 1990-07-18 Rohm And Haas Company Process for making silicone-containing polymer particles
EP1045009A1 (en) * 1999-04-16 2000-10-18 Dow Corning Corporation Heat curable silcone acrylate coating compositions
US6906115B2 (en) * 2001-06-27 2005-06-14 Daikin Industries, Ltd. Surface treatment composition and preparation thereof

Also Published As

Publication number Publication date
TWI419933B (zh) 2013-12-21
TW200823265A (en) 2008-06-01
EP1921114B1 (en) 2009-12-02
JP2008074982A (ja) 2008-04-03
CN101148542A (zh) 2008-03-26
KR20080027205A (ko) 2008-03-26
US7915362B2 (en) 2011-03-29
KR101421292B1 (ko) 2014-07-18
DE602007003545D1 (de) 2010-01-14
US20080076882A1 (en) 2008-03-27
JP4563977B2 (ja) 2010-10-20
EP1921114A1 (en) 2008-05-14

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