JP4563977B2 - 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子 - Google Patents

加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子 Download PDF

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Publication number
JP4563977B2
JP4563977B2 JP2006256581A JP2006256581A JP4563977B2 JP 4563977 B2 JP4563977 B2 JP 4563977B2 JP 2006256581 A JP2006256581 A JP 2006256581A JP 2006256581 A JP2006256581 A JP 2006256581A JP 4563977 B2 JP4563977 B2 JP 4563977B2
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group
composition
hydrocarbon group
units
emitting diode
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Japanese (ja)
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JP2008074982A (ja
JP2008074982A5 (enExample
Inventor
利之 小材
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2006256581A priority Critical patent/JP4563977B2/ja
Priority to TW096131344A priority patent/TWI419933B/zh
Priority to EP07253743A priority patent/EP1921114B1/en
Priority to KR1020070096619A priority patent/KR101421292B1/ko
Priority to DE602007003545T priority patent/DE602007003545D1/de
Priority to CN2007101543382A priority patent/CN101148542B/zh
Priority to US11/859,123 priority patent/US7915362B2/en
Publication of JP2008074982A publication Critical patent/JP2008074982A/ja
Publication of JP2008074982A5 publication Critical patent/JP2008074982A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • C09K3/1018—Macromolecular compounds having one or more carbon-to-silicon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
JP2006256581A 2006-09-22 2006-09-22 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子 Active JP4563977B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2006256581A JP4563977B2 (ja) 2006-09-22 2006-09-22 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子
TW096131344A TWI419933B (zh) 2006-09-22 2007-08-24 可熱硬化之聚矽氧組成物及使用其之發光二極體元件
KR1020070096619A KR101421292B1 (ko) 2006-09-22 2007-09-21 열경화형 실리콘 조성물 및 이를 이용한 발광 다이오드소자
DE602007003545T DE602007003545D1 (de) 2006-09-22 2007-09-21 LED-Element
EP07253743A EP1921114B1 (en) 2006-09-22 2007-09-21 Light emitting diode element
CN2007101543382A CN101148542B (zh) 2006-09-22 2007-09-21 热固性硅树脂组合物及使用其的发光二极管元件
US11/859,123 US7915362B2 (en) 2006-09-22 2007-09-21 Heat-curable silicone composition and light emitting diode element using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006256581A JP4563977B2 (ja) 2006-09-22 2006-09-22 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子

Publications (3)

Publication Number Publication Date
JP2008074982A JP2008074982A (ja) 2008-04-03
JP2008074982A5 JP2008074982A5 (enExample) 2008-10-23
JP4563977B2 true JP4563977B2 (ja) 2010-10-20

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JP2006256581A Active JP4563977B2 (ja) 2006-09-22 2006-09-22 加熱硬化型シリコーン組成物及びそれを用いた発光ダイオード素子

Country Status (7)

Country Link
US (1) US7915362B2 (enExample)
EP (1) EP1921114B1 (enExample)
JP (1) JP4563977B2 (enExample)
KR (1) KR101421292B1 (enExample)
CN (1) CN101148542B (enExample)
DE (1) DE602007003545D1 (enExample)
TW (1) TWI419933B (enExample)

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CN102112118A (zh) * 2008-04-25 2011-06-29 北卡罗来纳-查佩尔山大学 特别用于非湿润模型的颗粒复制的可降解化合物及其使用方法
JP2010027974A (ja) * 2008-07-23 2010-02-04 Sharp Corp 発光装置の製造方法
JP5621211B2 (ja) * 2009-04-20 2014-11-12 横浜ゴム株式会社 光半導体封止用シリコーン樹脂組成物
US8697458B2 (en) 2009-04-22 2014-04-15 Shat-R-Shield, Inc. Silicone coated light-emitting diode
CA2759638A1 (en) * 2009-04-22 2010-10-28 Shat-R-Shield, Inc. Silicone coated light-emitting diode
JP5443940B2 (ja) * 2009-10-21 2014-03-19 東亞合成株式会社 硬化型コーティング剤組成物
JPWO2011135780A1 (ja) * 2010-04-27 2013-07-18 信越化学工業株式会社 発光装置及びその製造方法
US20130203675A1 (en) 2010-09-16 2013-08-08 Joseph M. DeSimone Asymmetric biofunctional silyl monomers and particles thereof as prodrugs and delivery vehicles for pharmaceutical, chemical and biological agents
WO2012051749A1 (en) * 2010-10-19 2012-04-26 Ablestik (Shanghai) Ltd. Hybrid silicone composition for light emitting device
JP5921154B2 (ja) 2011-11-09 2016-05-24 日東電工株式会社 光学フィルム、画像表示装置および画像表示装置の製造方法
EP2994290B1 (en) 2013-05-10 2023-10-04 ABL IP Holding LLC Silicone optics
JP6072663B2 (ja) * 2013-10-15 2017-02-01 信越化学工業株式会社 加熱硬化型導電性シリコーン組成物、該組成物からなる導電性接着剤、該組成物からなる導電性ダイボンド材、該ダイボンド材の硬化物を有する光半導体装置。
JP6285346B2 (ja) * 2014-12-08 2018-02-28 信越化学工業株式会社 透明樹脂組成物、該組成物からなる接着剤、該組成物からなるダイボンド材、該組成物を用いた導電接続方法、及び該方法によって得られた光半導体装置
JP6272747B2 (ja) * 2014-12-08 2018-01-31 信越化学工業株式会社 加熱硬化型シリコーン組成物、該組成物からなるダイボンド材及び該ダイボンド材の硬化物を用いた光半導体装置
JP6622171B2 (ja) 2016-11-08 2019-12-18 信越化学工業株式会社 加熱硬化型シリコーン組成物、ダイボンド材及び光半導体装置
JP6864949B2 (ja) * 2016-12-09 2021-04-28 モメンティブ・パフォーマンス・マテリアルズ・コリア・カンパニー・リミテッドＭｏｍｅｎｔｉｖｅ Ｐｅｒｆｏｒｍａｎｃｅ Ｍａｔｅｒｉａｌｓ Ｋｏｒｅａ Ｃｏ．，Ｌｔｄ 有機電子素子封止材用組成物及びこれを用いて形成された封止材
WO2019065398A1 (ja) * 2017-09-29 2019-04-04 信越化学工業株式会社 紫外線硬化型シリコーン粘着剤組成物およびその硬化物
JP6978690B2 (ja) 2018-05-25 2021-12-08 日亜化学工業株式会社 透光性部材の形成方法および発光装置の製造方法、ならびに、発光装置
JP6962290B2 (ja) * 2018-08-02 2021-11-05 信越化学工業株式会社 光造形用紫外線硬化型シリコーン組成物およびその硬化物
JP7296748B2 (ja) * 2019-03-08 2023-06-23 信越化学工業株式会社 ウェハーレベル光半導体デバイス用樹脂組成物、及び光半導体デバイス
JP7107279B2 (ja) * 2019-05-27 2022-07-27 信越化学工業株式会社 型取り用シリコーンゴム組成物およびシリコーンゴム型

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Also Published As

Publication number Publication date
KR20080027205A (ko) 2008-03-26
DE602007003545D1 (de) 2010-01-14
CN101148542B (zh) 2011-10-05
CN101148542A (zh) 2008-03-26
EP1921114A1 (en) 2008-05-14
EP1921114B1 (en) 2009-12-02
JP2008074982A (ja) 2008-04-03
US7915362B2 (en) 2011-03-29
TWI419933B (zh) 2013-12-21
TW200823265A (en) 2008-06-01
US20080076882A1 (en) 2008-03-27
KR101421292B1 (ko) 2014-07-18

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