CN101138091A - 用于生长平坦半极性氮化镓的技术 - Google Patents
用于生长平坦半极性氮化镓的技术 Download PDFInfo
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- CN101138091A CN101138091A CNA2006800076945A CN200680007694A CN101138091A CN 101138091 A CN101138091 A CN 101138091A CN A2006800076945 A CNA2006800076945 A CN A2006800076945A CN 200680007694 A CN200680007694 A CN 200680007694A CN 101138091 A CN101138091 A CN 101138091A
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- growth
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- 238000000034 method Methods 0.000 title claims abstract description 46
- 229910002601 GaN Inorganic materials 0.000 title claims description 81
- 230000012010 growth Effects 0.000 title claims description 76
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims description 60
- 150000004767 nitrides Chemical class 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 9
- 239000010980 sapphire Substances 0.000 claims abstract description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 22
- 238000005520 cutting process Methods 0.000 claims description 15
- 229910021529 ammonia Inorganic materials 0.000 claims description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 229910002704 AlGaN Inorganic materials 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims description 4
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000005915 ammonolysis reaction Methods 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 229910052596 spinel Inorganic materials 0.000 abstract description 4
- 239000011029 spinel Substances 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 41
- 230000010287 polarization Effects 0.000 description 21
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 15
- 239000013078 crystal Substances 0.000 description 10
- 229910052738 indium Inorganic materials 0.000 description 9
- 230000008901 benefit Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000014509 gene expression Effects 0.000 description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000002269 spontaneous effect Effects 0.000 description 6
- 229910052725 zinc Inorganic materials 0.000 description 6
- 239000011701 zinc Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000001451 molecular beam epitaxy Methods 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000399 optical microscopy Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000001534 heteroepitaxy Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000005701 quantum confined stark effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VLCQZHSMCYCDJL-UHFFFAOYSA-N tribenuron methyl Chemical compound COC(=O)C1=CC=CC=C1S(=O)(=O)NC(=O)N(C)C1=NC(C)=NC(OC)=N1 VLCQZHSMCYCDJL-UHFFFAOYSA-N 0.000 description 2
- 101150067361 Aars1 gene Proteins 0.000 description 1
- 229910020068 MgAl Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/938—Lattice strain control or utilization
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- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Led Devices (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66028305P | 2005-03-10 | 2005-03-10 | |
US60/660,283 | 2005-03-10 | ||
PCT/US2006/008595 WO2006099138A2 (en) | 2005-03-10 | 2006-03-10 | Technique for the growth of planar semi-polar gallium nitride |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201010111379A Division CN101845670A (zh) | 2005-03-10 | 2006-03-10 | 用于生长平坦半极性氮化镓的技术 |
Publications (2)
Publication Number | Publication Date |
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CN101138091A true CN101138091A (zh) | 2008-03-05 |
CN101138091B CN101138091B (zh) | 2010-05-19 |
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Application Number | Title | Priority Date | Filing Date |
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CN2006800076945A Active CN101138091B (zh) | 2005-03-10 | 2006-03-10 | 用于生长平坦半极性氮化镓的技术 |
CN201010111379A Pending CN101845670A (zh) | 2005-03-10 | 2006-03-10 | 用于生长平坦半极性氮化镓的技术 |
Family Applications After (1)
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CN201010111379A Pending CN101845670A (zh) | 2005-03-10 | 2006-03-10 | 用于生长平坦半极性氮化镓的技术 |
Country Status (8)
Country | Link |
---|---|
US (4) | US7220324B2 (zh) |
EP (2) | EP1869707B1 (zh) |
JP (2) | JP5706601B2 (zh) |
KR (2) | KR101145753B1 (zh) |
CN (2) | CN101138091B (zh) |
HK (1) | HK1112109A1 (zh) |
TW (2) | TW201443990A (zh) |
WO (1) | WO2006099138A2 (zh) |
Cited By (12)
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CN102119243A (zh) * | 2008-07-16 | 2011-07-06 | 奥斯坦多科技公司 | 利用氢化物气相外延(HVPE)生长平面非极性的{1-100}m面和半极性的{11-22}氮化镓 |
CN102422391A (zh) * | 2009-11-12 | 2012-04-18 | 松下电器产业株式会社 | 氮化物半导体元件的制造方法 |
CN102449737A (zh) * | 2009-03-02 | 2012-05-09 | 加利福尼亚大学董事会 | 生长于非极性或半极性(Ga,Al,In,B)N衬底上的装置 |
CN102549778A (zh) * | 2009-08-27 | 2012-07-04 | 首尔Opto仪器股份有限公司 | 倾斜基底上的高质量非极性/半极性半导体器件及其制造方法 |
US8629065B2 (en) | 2009-11-06 | 2014-01-14 | Ostendo Technologies, Inc. | Growth of planar non-polar {10-10} M-plane gallium nitride with hydride vapor phase epitaxy (HVPE) |
US8759814B2 (en) | 2012-08-10 | 2014-06-24 | National Taiwan University | Semiconductor light-emitting device and manufacturing method thereof |
CN105702562A (zh) * | 2010-11-08 | 2016-06-22 | 韩国光技术院 | 使用化学剥离方法的iii族氮化物基板的制备方法 |
CN105824179A (zh) * | 2009-05-29 | 2016-08-03 | 天空激光二极管有限公司 | 一种投影系统 |
CN104112803B (zh) * | 2014-04-14 | 2016-08-17 | 中国科学院半导体研究所 | 半极性面氮化镓基发光二极管及其制备方法 |
US11594862B2 (en) | 2018-12-21 | 2023-02-28 | Kyocera Sld Laser, Inc. | Fiber delivered laser induced white light system |
US11788699B2 (en) | 2018-12-21 | 2023-10-17 | Kyocera Sld Laser, Inc. | Fiber-delivered laser-induced dynamic light system |
US12000552B2 (en) | 2019-01-18 | 2024-06-04 | Kyocera Sld Laser, Inc. | Laser-based fiber-coupled white light system for a vehicle |
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US7504274B2 (en) | 2004-05-10 | 2009-03-17 | The Regents Of The University Of California | Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition |
US9011598B2 (en) * | 2004-06-03 | 2015-04-21 | Soitec | Method for making a composite substrate and composite substrate according to the method |
CN101138091B (zh) * | 2005-03-10 | 2010-05-19 | 加利福尼亚大学董事会 | 用于生长平坦半极性氮化镓的技术 |
WO2006130696A2 (en) | 2005-06-01 | 2006-12-07 | The Regents Of The University Of California | Technique for the growth and fabrication of semipolar (ga,al,in,b)n thin films, heterostructures, and devices |
US8278128B2 (en) | 2008-02-01 | 2012-10-02 | The Regents Of The University Of California | Enhancement of optical polarization of nitride light-emitting diodes by wafer off-axis cut |
US8148713B2 (en) * | 2008-04-04 | 2012-04-03 | The Regents Of The University Of California | Method for fabrication of semipolar (Al, In, Ga, B)N based light emitting diodes |
KR20080040709A (ko) * | 2005-07-13 | 2008-05-08 | 더 리전츠 오브 더 유니버시티 오브 캘리포니아 | 반극성 질화물 박막들의 결함 감소를 위한 측방향 성장방법 |
WO2007030709A2 (en) * | 2005-09-09 | 2007-03-15 | The Regents Of The University Of California | METHOD FOR ENHANCING GROWTH OF SEMI-POLAR (Al, In,Ga,B)N VIA METALORGANIC CHEMICAL VAPOR DEPOSITION |
KR20080098039A (ko) * | 2006-01-20 | 2008-11-06 | 더 리전츠 오브 더 유니버시티 오브 캘리포니아 | 금속유기 화학 기상 증착을 통한 준극성 (Al,In,Ga,B)N의 성장을 향상시키기 위한 방법 |
JP5896442B2 (ja) | 2006-01-20 | 2016-03-30 | 国立研究開発法人科学技術振興機構 | Iii族窒化物膜の成長方法 |
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JP2009527898A (ja) * | 2006-02-17 | 2009-07-30 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 半極性(Al、In、Ga、B)Nの光電子素子の成長方法 |
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JP2010512660A (ja) * | 2006-12-11 | 2010-04-22 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 無極性および半極性の発光デバイス |
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Also Published As
Publication number | Publication date |
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HK1112109A1 (en) | 2008-08-22 |
WO2006099138A3 (en) | 2006-11-23 |
CN101138091B (zh) | 2010-05-19 |
JP5706601B2 (ja) | 2015-04-22 |
CN101845670A (zh) | 2010-09-29 |
KR20110044332A (ko) | 2011-04-28 |
EP1869707A2 (en) | 2007-12-26 |
US7220324B2 (en) | 2007-05-22 |
JP2014222780A (ja) | 2014-11-27 |
KR101145755B1 (ko) | 2012-05-16 |
US20100133663A1 (en) | 2010-06-03 |
TW200735203A (en) | 2007-09-16 |
US20120119222A1 (en) | 2012-05-17 |
EP2315253A1 (en) | 2011-04-27 |
US7704331B2 (en) | 2010-04-27 |
TWI453813B (zh) | 2014-09-21 |
EP1869707A4 (en) | 2009-02-25 |
KR20070120982A (ko) | 2007-12-26 |
US20060205199A1 (en) | 2006-09-14 |
US8524012B2 (en) | 2013-09-03 |
US20070111531A1 (en) | 2007-05-17 |
JP2008533723A (ja) | 2008-08-21 |
WO2006099138A2 (en) | 2006-09-21 |
TW201443990A (zh) | 2014-11-16 |
EP1869707B1 (en) | 2012-06-13 |
US8128756B2 (en) | 2012-03-06 |
KR101145753B1 (ko) | 2012-05-16 |
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