CN100539802C - 印刷电路板和使用其的显示装置 - Google Patents
印刷电路板和使用其的显示装置 Download PDFInfo
- Publication number
- CN100539802C CN100539802C CNB2005100874196A CN200510087419A CN100539802C CN 100539802 C CN100539802 C CN 100539802C CN B2005100874196 A CNB2005100874196 A CN B2005100874196A CN 200510087419 A CN200510087419 A CN 200510087419A CN 100539802 C CN100539802 C CN 100539802C
- Authority
- CN
- China
- Prior art keywords
- pcb
- insulating barrier
- printed circuit
- supporting member
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/114—Pad being close to via, but not surrounding the via
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2072—Anchoring, i.e. one structure gripping into another
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040057669A KR20060008021A (ko) | 2004-07-23 | 2004-07-23 | 인쇄회로기판 및 이를 이용한 평판표시장치 |
KR57669/04 | 2004-07-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1735314A CN1735314A (zh) | 2006-02-15 |
CN100539802C true CN100539802C (zh) | 2009-09-09 |
Family
ID=36077443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100874196A Expired - Fee Related CN100539802C (zh) | 2004-07-23 | 2005-07-22 | 印刷电路板和使用其的显示装置 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7432450B2 (zh) |
JP (1) | JP5014602B2 (zh) |
KR (1) | KR20060008021A (zh) |
CN (1) | CN100539802C (zh) |
TW (1) | TWI386706B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008083584A (ja) * | 2006-09-28 | 2008-04-10 | Nec Lcd Technologies Ltd | 液晶パネルモジュール及び液晶表示装置 |
US7477521B2 (en) * | 2007-05-15 | 2009-01-13 | Acterna Llc | Isolating stress on a printed circuit board |
KR101420825B1 (ko) * | 2007-10-15 | 2014-07-21 | 삼성디스플레이 주식회사 | 인쇄회로기판 및 이를 갖는 표시장치 |
TWI383201B (zh) * | 2008-02-26 | 2013-01-21 | Chimei Innolux Corp | 顯示裝置及背光模組之電路板之固定方法 |
KR101480356B1 (ko) * | 2008-06-09 | 2015-01-09 | 삼성디스플레이 주식회사 | 연성 인쇄 회로 기판 및 이를 포함하는 액정 표시 장치 |
US8294037B2 (en) * | 2009-07-20 | 2012-10-23 | Sony Ericsson Mobile Communications Ab | Method for arranging a component on a circuit board |
JP2012164750A (ja) * | 2011-02-04 | 2012-08-30 | Canon Inc | 電子機器 |
CN102621726A (zh) * | 2012-04-26 | 2012-08-01 | 深圳市华星光电技术有限公司 | 液晶显示模组、液晶显示装置及背板 |
KR102127508B1 (ko) * | 2013-08-23 | 2020-06-30 | 삼성디스플레이 주식회사 | 인쇄 회로 기판 어셈블리 및 그것을 포함하는 표시 장치 |
KR102252077B1 (ko) * | 2014-10-20 | 2021-05-18 | 삼성디스플레이 주식회사 | 표시 장치 |
CN107831609A (zh) * | 2017-10-26 | 2018-03-23 | 惠科股份有限公司 | 信号传输装置的制造方法及显示装置的制造方法 |
CN107831610A (zh) * | 2017-10-26 | 2018-03-23 | 惠科股份有限公司 | 信号传输装置及显示装置 |
KR102657249B1 (ko) * | 2018-08-27 | 2024-04-15 | 삼성디스플레이 주식회사 | 표시 패널, 및 이를 포함하는 표시 장치 |
JP7202202B2 (ja) * | 2019-02-01 | 2023-01-11 | 株式会社ジャパンディスプレイ | 表示装置及びプリント回路基板 |
KR20210145025A (ko) | 2020-05-22 | 2021-12-01 | 삼성디스플레이 주식회사 | 전자 장치 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8403596A (nl) * | 1984-11-27 | 1986-06-16 | Philips Nv | Montagechassis voor onderdelen. |
JPH02237142A (ja) * | 1989-03-10 | 1990-09-19 | Sumitomo Bakelite Co Ltd | 半導体搭載用基板の製造方法 |
JPH06120658A (ja) * | 1992-10-06 | 1994-04-28 | Fujitsu Ltd | 電源供給部を付加したプリント基板の製造方法 |
WO1994018701A1 (en) * | 1993-02-05 | 1994-08-18 | W.L. Gore & Associates, Inc. | Stress-resistant semiconductor chip-circuit board interconnect |
JPH06338670A (ja) * | 1993-05-31 | 1994-12-06 | Matsushita Electric Works Ltd | プリント配線板 |
JPH07221104A (ja) * | 1994-01-28 | 1995-08-18 | Fujitsu Ltd | 半導体装置の製造方法及び半導体装置及び電極ピン形成用マスク及び電極ピン形成用マスクを用いた試験方法 |
JP2570174B2 (ja) | 1994-05-31 | 1997-01-08 | 日本電気株式会社 | 多層プリント配線板 |
JPH0846311A (ja) * | 1994-07-26 | 1996-02-16 | Advantest Corp | 電気信号接続用の電極パッド |
US5597643A (en) * | 1995-03-13 | 1997-01-28 | Hestia Technologies, Inc. | Multi-tier laminate substrate with internal heat spreader |
JP2542493B2 (ja) * | 1995-04-28 | 1996-10-09 | 古河電気工業株式会社 | 複合回路基板 |
JP3250000B2 (ja) | 1995-05-24 | 2002-01-28 | 株式会社アドバンスト・ディスプレイ | 液晶表示パネルの端子接続構造およびその端子接続方法 |
JP2878188B2 (ja) * | 1996-07-01 | 1999-04-05 | 福島日本電気株式会社 | 高周波回路用多層基板 |
KR19980025774A (ko) | 1996-10-04 | 1998-07-15 | 김광호 | 커넥터를 위한 측면 삽입홈이 형성된 다층 인쇄회로기판 |
JPH10190236A (ja) | 1996-12-26 | 1998-07-21 | Nippon Carbide Ind Co Inc | 多層配線板の製造方法 |
JPH1117299A (ja) | 1997-06-20 | 1999-01-22 | Hitachi Ltd | 回路基板およびその製造方法ならびに液晶表示装置 |
JPH1140293A (ja) * | 1997-07-23 | 1999-02-12 | Jsr Corp | 積層型コネクターおよび回路基板検査用アダプター装置 |
KR100505007B1 (ko) | 1997-10-08 | 2005-10-12 | 삼성전자주식회사 | 액정표시장치 모듈용 인쇄회로기판 |
KR100528014B1 (ko) | 1998-02-11 | 2006-03-22 | 삼성전자주식회사 | 커넥터 및 이를 갖는 액정 표시 장치 |
KR100278611B1 (ko) * | 1998-07-29 | 2001-01-15 | 윤종용 | 에프피씨를 이용하는 엘씨디 모듈 |
JP2000056700A (ja) | 1998-08-10 | 2000-02-25 | Alps Electric Co Ltd | 液晶表示装置およびその製造方法 |
KR100304261B1 (ko) * | 1999-04-16 | 2001-09-26 | 윤종용 | 테이프 캐리어 패키지, 그를 포함한 액정표시패널 어셈블리,그를 채용한 액정표시장치 및 이들의 조립 방법 |
JP2001005020A (ja) | 1999-06-25 | 2001-01-12 | Optrex Corp | 液晶表示パネルの電極端子接続構造 |
JP2001111218A (ja) * | 1999-10-13 | 2001-04-20 | Hitachi Ltd | 多層プリント回路基板および電子装置 |
JP2001135746A (ja) | 1999-11-08 | 2001-05-18 | O K Print:Kk | 接続パッドおよびicチップキャリア |
JP2002141667A (ja) * | 2000-11-01 | 2002-05-17 | Matsushita Electric Ind Co Ltd | セラミック複合基板およびその製造方法 |
KR100412106B1 (ko) * | 2001-01-04 | 2003-12-24 | 삼성전자주식회사 | 평면 디스플레이장치 |
JP2002252437A (ja) | 2001-02-26 | 2002-09-06 | Casio Comput Co Ltd | フレキシブル配線基板の接合構造 |
CN1178563C (zh) | 2001-08-28 | 2004-12-01 | 耀华电子股份有限公司 | 利用实心铜柱互连导通的印刷电路板的制作方法 |
KR100813019B1 (ko) | 2001-10-19 | 2008-03-13 | 삼성전자주식회사 | 표시기판 및 이를 갖는 액정표시장치 |
JP2003197676A (ja) * | 2001-12-28 | 2003-07-11 | Optrex Corp | フレキシブル配線基板 |
JP2003198113A (ja) * | 2001-12-28 | 2003-07-11 | Toshiba Corp | プリント配線板、プリント配線板を有する回路モジュールおよび回路モジュールを搭載した電子機器 |
US6747216B2 (en) * | 2002-02-04 | 2004-06-08 | Intel Corporation | Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery |
JP4180846B2 (ja) | 2002-06-14 | 2008-11-12 | 三菱電機株式会社 | 液晶表示装置およびその製造方法 |
KR100840330B1 (ko) * | 2002-08-07 | 2008-06-20 | 삼성전자주식회사 | 액정 표시 장치 및 이에 사용하는 구동 집적 회로 |
US7038917B2 (en) * | 2002-12-27 | 2006-05-02 | Vlt, Inc. | Low loss, high density array interconnection |
-
2004
- 2004-07-23 KR KR1020040057669A patent/KR20060008021A/ko not_active Application Discontinuation
-
2005
- 2005-07-13 TW TW094123722A patent/TWI386706B/zh not_active IP Right Cessation
- 2005-07-14 US US11/181,097 patent/US7432450B2/en active Active
- 2005-07-21 JP JP2005211574A patent/JP5014602B2/ja not_active Expired - Fee Related
- 2005-07-22 CN CNB2005100874196A patent/CN100539802C/zh not_active Expired - Fee Related
-
2008
- 2008-08-25 US US12/197,524 patent/US8144300B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8144300B2 (en) | 2012-03-27 |
US7432450B2 (en) | 2008-10-07 |
KR20060008021A (ko) | 2006-01-26 |
US20080316415A1 (en) | 2008-12-25 |
JP2006041521A (ja) | 2006-02-09 |
TWI386706B (zh) | 2013-02-21 |
US20060016618A1 (en) | 2006-01-26 |
CN1735314A (zh) | 2006-02-15 |
TW200609585A (en) | 2006-03-16 |
JP5014602B2 (ja) | 2012-08-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100539802C (zh) | 印刷电路板和使用其的显示装置 | |
KR101535064B1 (ko) | 표시 장치용 광원 모듈 및 이를 포함하는 표시 장치 | |
KR101412754B1 (ko) | 광원 유닛, 그 제조 방법 및 이를 구비하는 표시 장치 | |
CN101354498A (zh) | 液晶显示装置 | |
CN101162324A (zh) | 背光组件及其形成方法和具有该背光组件的液晶显示器 | |
CN101772255A (zh) | 用于发光二极管背光单元的柔性印刷电路板及其制造方法 | |
JP2009295989A (ja) | フレキシブル印刷回路基板 | |
US20210366881A1 (en) | Array substrate, method of manufacturing the same, and display device | |
US20230326421A1 (en) | Light-emitting assembly | |
US9013096B2 (en) | Light emitting module | |
US20070252940A1 (en) | Display device module | |
US20200400872A1 (en) | Electronic device | |
US11681182B2 (en) | Circuit board for light-emitting diode assembly, backlight unit including the same and image display device including the same | |
KR20080049918A (ko) | 액정 표시 장치 | |
KR20080012511A (ko) | Led 유닛, 이를 이용한 백라이트 유닛 및 이를 구비하는표시 장치 | |
KR20080022683A (ko) | 커넥터 결합 어셈블리 및 이를 포함하는 액정 표시 장치 | |
KR20070033507A (ko) | 가요성 인쇄 회로 필름 및 이를 포함하는 액정 표시 장치 | |
TWI396028B (zh) | 陣列背板、用以測試陣列背板的探針及液晶顯示面板 | |
CN114967253A (zh) | 阵列基板、显示面板及显示装置 | |
KR101593415B1 (ko) | 표시 장치용 광원 모듈 및 이를 포함하는 표시 장치 | |
KR20080079854A (ko) | 연성 인쇄 회로 기판 및 이를 구비하는 액정 표시 장치 | |
KR20070062748A (ko) | 액정표시장치 | |
KR20070121212A (ko) | 인쇄 회로 기판 및 이를 포함하는 액정 표시 장치 | |
KR20210085805A (ko) | 표시장치 | |
KR20070041032A (ko) | 인쇄 회로 기판 및 이를 포함하는 액정 표시 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG ELECTRONICS CO., LTD. Effective date: 20121106 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121106 Address after: Gyeonggi Do, South Korea Patentee after: SAMSUNG DISPLAY Co.,Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung Electronics Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090909 Termination date: 20210722 |
|
CF01 | Termination of patent right due to non-payment of annual fee |