CN100503119C - 焊接复合材料部件的方法 - Google Patents
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Abstract
本发明涉及将两个部件(10,20)硬焊在一起的方法,其特征在于,在被连接在一起的部件的两个表面(S10,S20)之间插入衬垫(30),所述衬垫由难熔纤维组织形成,且至少部分地与硬焊剂(40)接触,进行热处理使硬焊剂(40)液化,以便使熔化的硬焊剂靠毛细管作用分布在被衬垫(30)所覆盖的两个部件(10,20)之间的整个硬焊区域。
Description
发明背景
本发明涉及把热结构复合材料特别是陶瓷基体复合(CMC)材料硬焊在一起的方法。
CMC材料通常由用陶瓷基体硬化而成的多孔基片构成,例如多孔纤维基片。基片纤维可以是碳纤维或陶瓷纤维。基体是难熔的陶瓷制品,例如难熔的碳化物,氮化物,硼化物或氧化物。CMC材料的卓越的力学性能使得它们适合构成结构部件,并能在高温下保持这些性能,例如C/SiC(碳纤维筋和碳化硅基体)复合材料。
当用陶瓷基体复合材料制造结构时,通常把由CMC材料制成的独立元件通过硬焊装配在一起来形成。然而,硬焊陶瓷基体复合材料在技术上是困难的。这些材料表面很粗糙,并且它们包括氧化物相。硬焊结合仅仅使氧化物相除去。为了这个目的,通常的做法是使用硅基的硬焊合金或复合材料,其要求在高于1200℃的温度下进行热处理。然而,在这样的温度及以上,除去存在于材料中的氧化物相会导致气态物质的形成。
图1是具有表面S1和S2的由CMC复合材料制成的两个部件1和2待通过常规的硬焊技术装配在一起的简图,也就是说,通过在待连接的两个部件的表面之间插入固体硬焊剂层3。然后,如图2所示,固体硬焊剂层3被通过热处理熔化以便形成将两个部件的表面S1和S2连接在一起的硬焊结合31。但是,用这种硬焊技术,由释放氧的材料放出的气态物质被捕获在硬焊结合部内,其导致硬焊结合部多孔,在硬焊结合部内局部残存着两表面之间没有硬焊的部分4。如图3所示,其示出了用上述标准硬焊方法所得到的硬焊结合的状态,这种材料的缺少致使两个部件之间的连接存在缺陷,进而降低装配质量。在图3中,可以看到由于在硬焊剂中残存气态物质的穴而使硬焊剂的分布不均匀,因此减弱了由此形成的连接。
那些结果可以被改善,特别是通过仔细地控制温度升高过程中的暂停,以便在达到硬焊温度前完成排出氧的暂停。抗湿剂也可以被用于“迫使”硬焊剂通过结合。图4A和4B(图4A中的IVB部分)示出了在两个CMC部件之间获得的硬焊结合。例如,可以看到结合的质量相比于图3有明显的改善。然而,即使用这种改善了的硬焊控制方法,仍然保留一些导致硬焊结合缺陷的穴。
另外,这些硬焊技术不能控制硬焊结合的厚度。即使对于已被重叠的对接平面(docking plane),由于在热处理过程中硬焊剂不能均匀分布,使得最终的硬焊结合的厚度也可以改变。当对接平面不规则时,硬焊结合厚度的这种变化进一步加剧(图2中的厚度el和e2)。
本发明的目的和概要
本发明的目的是提供一种能通过硬焊使部件被装配在一起而无上述缺陷的方法,特别地是能够排出在热处理过程中产生的气态物质,同时也可以控制硬焊结合的厚度以及所述结合和被硬焊的表面之间的接触。
根据本发明的方法可以实现这个目的,将衬垫插入待被连接在一起的部件的两个表面之间,所述衬垫由难熔的纤维组织构成,且至少部分与硬焊剂接触,并且进行热处理来液化硬焊剂,以便使熔化的硬焊剂通过毛细管作用分布在被衬垫所覆盖的两个部件之间的整个硬焊区域内。
因此,衬垫的纤维组织中的孔隙用于使硬焊剂通过毛细管作用覆盖由衬垫覆盖的整个表面,同时有利于在温度上升过程中排出产生的气态物质。
除此之外,使用这样的衬垫使得硬焊结合的最终厚度可以被控制。通过选择衬垫的厚度,可以以可重复的和精确的方式控制硬焊结合的最终厚度。由于它的适应性,即使用于硬焊在一起的表面不规则,此衬垫也可以控制所述表面的接触。这样硬焊结合和硬焊表面之间连续接触,使得部件之间的连接均匀且质量好。
衬垫可以由包括碳纤维或碳前体(carbon-precursor)纤维或陶瓷纤维的组织构成,其中陶瓷可以是碳化硅(SiC)。
本发明的一方面,在用于硬焊的部件被对接在一起的区域之外,硬焊剂与衬垫的至少一部分接触。在温度上升过程中,为了在被衬垫覆盖的整个区域上硬焊,熔化的硬焊剂在部件的表面之间靠毛细管作用被传送。
衬垫可以被切割成用于硬焊在一起的部件表面的形状和大小。其很容易被控制并能够与用于硬焊在一起的部件的任何形状相匹配。因此,希望形成硬焊结合的区域可以很容易预先被确定为通过衬垫所覆盖的区域。然后可以形成在所有类型的表面上坚固的硬焊结合,并且可以以精确和可重复的方式实现。
附图简述
参考附图,本发明的其它特性和优点从本发明下面的特殊实施方式的描述中可以看出来,特殊实施方式作为非限制性的例子,其中:
图1是采用现有技术将两个陶瓷基体复合材料部件硬焊在一起的简图;
图2是通过把图1中的两个部件硬焊在一起所得到的结果的简图;
图3是采用现有技术所得到的硬焊结合的剖视图;
图4A和4B示出采用现有硬焊方法所得到的硬焊结合;
图5是显示实现本发明方法的连续步骤的流程图;
图6显示根据实现本发明的方法,使用干衬垫实现硬焊操作的图;
图7显示把图6的两个部件硬焊在一起之后所得到的结果图;
图8A和8B显示使用本发明的硬焊方法所得到的硬焊结合;
图9A,9B和9C显示怎样根据本发明的方法通过将两个部件硬焊在一起形成热交换器结构的一部分;和
图10显示将平面部件和蜂巢形部件装配在一起的例子。
实施方式的详细描述
本发明通过硬焊把部件装配在一起的方法适用于由任何热结构陶瓷基体复合(CMC)材料制成的部件,也就是说,任何由难熔的纤维筋(碳纤维或陶瓷纤维)组成的材料,例如C/SiC,SiC/SiC,C/C-SiC材料等等,难熔的纤维筋被也难熔的陶瓷基体硬化。本方法也适用于其它类型的在硬焊过程中容易释放气态物质的材料,例如C/C材料或独石陶瓷(monolithic ceramic)。
参考图5和6,实现根据本发明的方法通过硬焊把由CMC材料制成的两个部件10和20装配在一起,该方法包括下面的步骤。
如图6所示,第一步(步骤S1)在于,在由CMC材料制成的第一个部件10的表面S10和同样由CMC材料制成的第二个部件20的表面S20之间设置由碳纤维或碳前体纤维组织构成的“干”(也就是非浸透的)衬垫30。通常,可以通过采用任何类型的由碳纤维或碳前体纤维或陶瓷纤维,例如SiC纤维,形成的组织来制造本发明的硬焊衬垫,该类组织靠毛细管作用传送硬焊剂,且其具有足够的空隙率以排出产生的气态物质。作为例子,此衬垫可以为垫子(也就是大批的成团纤维)的形式,可以为针扎毡,机织物,毡制品,二维(2D)组织,单向或多向薄片等等。
可选择地(步骤S2),可以在部件的那些不被硬焊的区域(例如,不被衬垫所覆盖的正面和端面)放置抗湿剂,以便控制焊剂使其只弄湿覆盖部件的被硬焊的那些区域的衬垫。例如所使用的抗湿剂可以由以气溶胶的形式封装的氮化硼(BN)组成,通常所说的“阻流”产品例如由供应商Wesgo Metals出售的抗湿剂Stopyt或由供应商Wall Colmonoy Limited配销的Nicrobraz产品。
下一步(步骤S3)在于,使硬焊剂40与衬垫30在两个部件之间超出对接平面的一个(或更多)部分接触。作为例子,硬焊剂可以由硅复合物或硅基复合物组成,例如专利申请EP0806402或US5975407中所述的那些,硅和金属硅化物合金,硅和可选的合金锗或商标名为Cusil-ABA,Ticusil,Incusil或Brasic的已知的金属复合物。特殊情况下,根据与部件材料的兼容性来选择硬焊剂,也就是说,优选不与该材料反应的复合物或以受控的方式与其反应的复合物。
此后,温度升高直到硬焊剂40变成液体,于是其靠毛细管作用吸入衬垫30并分布在被衬垫覆盖的两个部件之间的整个硬焊区域(步骤S4)。在热处理过程中产生的气态物质通过衬垫的孔隙被排出,因此防止气穴在硬焊结合中形成。穿过衬垫的硬焊剂将穿过衬垫的孔隙的气态物质向后推至衬垫的端部,在此被排出。
如图7中所示,由此得到的硬焊结合41连续地与两个部件的表面S10和S20接触。另外,通过使用本发明的衬垫,硬焊结合的最终厚度可以被控制。根据本发明的方法,在部件被硬焊在一起的表面之间插入纤维组织衬垫。继而,所使用的衬垫的厚度确定了这些表面之间的间隙,其中衬垫形成最终硬焊结合的整体部分。因此,硬焊结合的最终厚度可以由所选择使用的衬垫厚度决定。
此外,使用这样的衬垫即使对接平面不规则也可以保证硬焊结合的某一最小厚度。正如图6所看到的,表面S10和S20彼此离开衬垫30所界定的最小距离d。依据表面上存在的不规则的大小,两个表面之间的空间离开这个最小距离一些。因此,依靠衬垫的厚度,也可依靠它的可压缩性,可以独立于待被连接在一起的部件表面的状态,在一开始确定硬焊结合的最小厚度,在硬焊之后可以保持该厚度(图7中的距离d)。
由于它的柔性,衬垫与所述表面粗糙的形状相匹配,因此可以控制与待被硬焊在一起的表面的接触,并在被硬焊在一起的整个表面上形成连续的硬焊结合。
图8A和8B(图8A中的VIIIB截面)显示了由上述方法获得的硬焊结合60,其用来把由CMC材料制成的两个部件61和62连接在一起。所使用的衬垫由碳纤维垫组成。可以看到在结合中没有束缚着残留气穴,同时在结合中存在与硬焊剂和衬垫中的碳之间发生反应形成的SiC颗粒相对应的黑点。硬焊结合60的厚度e在它的整个长度上都是均匀的。
根据本发明使用衬垫的优点是形成硬焊剂的扩散介质,其很容易适应任何形状的部件。衬垫是可变形的,且容易被切掉。因此,可以把它切割成待被硬焊在一起的表面的尺寸和形状,并且它可以适应部件的三维形状(非平面部件)。
图9A,9B和9C显示通过把两个由CMC材料制成的面板110和120(图9A)装配在一起制成一个结构的例子,并且特别形成热交换器结构100(图9C)的一部分,这种热交换器结构用在通过流体流动进行冷却的推力喷管的分叉部分的壁中。
面板110和120中的每一个上有槽或凹进111a,111b,111c,和121a,121b,121c,其形成用于冷却此结构的流体流动槽。凹进111a-111c和121a-121c分别在面板110和120的每一个面板上界定两个独立的硬焊表面(110a和110b在面板110上,120a和120b在面板120上)。
根据本发明,干衬垫130插入面板的待被连接在一起形成流体流路的表面之间。如图9B所示,衬垫130由若干部分130a,130b,130c和130d形成,部分130a,130b,130c和130d被切割成待被连接在一起的面板部分的尺寸和形状。
如图9B所示,两个面板表面被连接在一起,衬垫130的部分130a-130d被插入靠着接触区域,并且每一部分有一端浸没在装有硬焊剂140的坩埚141中。此后,升高温度直到硬焊剂140变成液体,其靠毛细管作用由衬垫130的部分130a-130d吸入,并且遍布在被衬垫覆盖的两个部件之间的整个硬焊区域。
如图9C所示,这制造出具有通过硬焊结合131彼此分开的流体流动槽150的结构100,硬焊结合131仅存在于被衬垫130的部分130a-130d所覆盖的那些区域。
本发明的硬焊方法特别适合于把具有复杂和/或不均一形状的部件装配在一起。如图10所示,例如,很容易把实心部件220和具有蜂巢状或华夫饼形状的部件210装配在一起,而且部件210包括若干单元格211。用标准硬焊方法,硬焊这样的部件特别困难,因为在实心部件220和单元格211的底边之间均匀地放置硬焊剂是困难的,部件210只有该底边部分能够被连接在部件220上。用本发明的方法,通过使用干衬垫230使由硬焊完成的装配操作变得更简单,可以在单元格211的周围和/或内部不精确地放置固体硬焊剂240,然后在温度升高过程中,衬垫230用于在部件210和220之间的所有接触区域上均匀地分布硬焊剂,也就是说,在单元格211侧面的底边和部件220的表面之间。
Claims (10)
1、一种将两个部件(10,20)硬焊在一起的方法,其特征在于,在待被连接在一起的部件的两个表面(S10,S20)之间插入衬垫(30),所述衬垫由难熔纤维组织形成,且至少部分地与硬焊剂(40)接触,进行热处理使硬焊剂(40)熔化,以便使熔化的硬焊剂靠毛细管作用分布在被衬垫(30)所覆盖的两个部件(10,20)之间的整个硬焊区域。
2、根据权利要求1的方法,其特征在于,两个部件(10,20)中的至少一个由陶瓷基体复合材料,或C/C复合材料,或独石陶瓷材料制成。
3、根据权利要求1的方法,其特征在于,所述衬垫(30)由包含碳纤维或碳前体材料纤维或陶瓷纤维的组织形成。
4、根据权利要求1~3之一的方法,其特征在于,硬焊剂(40)与衬垫(30)的至少一部分接触,此部分在待被硬焊在一起的部件的表面(S10,S20)的对接区域之外。
5、根据权利要求4的方法,其特征在于,硬焊剂(140)被置于坩埚(141)中,在热处理过程中,硬焊剂通过位于待被连接在一起的部件(110,120)的表面(110b,120b)之间的衬垫(130)靠毛细管作用传送。
6、根据权利要求1~3之一的方法,其特征在于,根据待形成的硬焊结合的厚度选择衬垫(30;130)的厚度。
7、根据权利要求1~3之一的方法,其特征在于,所述衬垫(30;130)被切割成用于硬焊在一起的部件表面的尺寸和形状。
8、根据权利要求1~3之一的方法,其特征在于,在热处理步骤之前,把抗湿剂涂敷在部件的那些不待被硬焊在一起的部分。
9、根据权利要求1~3之一的方法,其特征在于,用于装配在一起的两个部件(210,220)中的一个呈蜂巢形或华夫饼形。
10、根据权利要求1~3之一的方法,其特征在于,硬焊剂(40;140;240)是硅复合材料或硅基复合材料,或硅合金基复合材料,或金属复合材料。
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FR2748471B1 (fr) * | 1996-05-07 | 1998-06-12 | Commissariat Energie Atomique | Assemblage par brasage de materiaux ceramiques contenant du carbure de silicium |
JPH09314323A (ja) * | 1996-05-28 | 1997-12-09 | Mitsubishi Heavy Ind Ltd | ろう付方法 |
DE19621638C2 (de) * | 1996-05-30 | 2002-06-27 | Fraunhofer Ges Forschung | Offenzellige Schaumkeramik mit hoher Festigkeit und Verfahren zu deren Herstellung |
FR2749787B1 (fr) * | 1996-06-12 | 1998-07-24 | Commissariat Energie Atomique | Procede d'assemblage a l'aide d'un joint epais de pieces en materiaux a base de sic par brasage refractaire et joint refractaire et epais ainsi obtenu |
US5840221A (en) * | 1996-12-02 | 1998-11-24 | Saint-Gobain/Norton Industrial Ceramics Corporation | Process for making silicon carbide reinforced silicon carbide composite |
JPH10277732A (ja) * | 1997-04-07 | 1998-10-20 | Suzuki Motor Corp | 超音波はんだ付方法 |
FR2785664B1 (fr) * | 1998-11-05 | 2001-02-02 | Snecma | Echangeur de chaleur en materiau composite et procede pour sa fabrication |
FR2787737B1 (fr) * | 1998-12-23 | 2001-01-19 | Commissariat Energie Atomique | Composition de brasure, procede d'assemblage de pieces en materiaux a base d'alumine par brasage refractaire avec ladite composition de brasure, assemblage et joint refractaire ainsi obtenus |
JP2000277900A (ja) * | 1999-03-26 | 2000-10-06 | Furukawa Electric Co Ltd:The | 半田コート複合回路基板の製造方法 |
US6524707B1 (en) * | 1999-07-09 | 2003-02-25 | Powerstor Corporation | Carbon-bonded metal structures and methods of fabrication |
JP2001048667A (ja) * | 1999-08-13 | 2001-02-20 | Asahi Glass Co Ltd | セラミックス部品の接合方法 |
FR2806405B1 (fr) * | 2000-03-14 | 2002-10-11 | Commissariat Energie Atomique | Procede d'assemblage de pieces en materiaux a base de sic par brasage refractaire non reactif, composition de brasure, et joint et assemblage refractaires obtenus par ce procede |
JP3980262B2 (ja) * | 2000-10-31 | 2007-09-26 | 日本碍子株式会社 | SiC質熱処理用治具 |
JP2002293654A (ja) * | 2001-03-29 | 2002-10-09 | Taiheiyo Cement Corp | SiC−Si複合材料の接合体およびその製造方法 |
AT5079U1 (de) * | 2001-04-30 | 2002-03-25 | Plansee Ag | Verfahren zum fügen eines hochtemperaturwerkstoff-bauteilverbundes |
US6871395B2 (en) * | 2001-08-06 | 2005-03-29 | Siemens Technology-To-Business Center, Llc. | Methods for manufacturing a tactile sensor using an electrically conductive elastomer |
DE10204860A1 (de) * | 2002-02-06 | 2003-08-14 | Man Technologie Gmbh | Faserverbundkeramik mit hoher Wärmeleitfähigkeit |
US6780028B1 (en) * | 2002-12-06 | 2004-08-24 | Autosplice Systems Inc. | Solder reserve transfer device and process |
FR2850649B1 (fr) | 2003-01-30 | 2005-04-29 | Snecma Propulsion Solide | Procede pour le traitement de surface d'une piece en materiau composite thermostructural et application au brasage de pieces en materiau composite thermostructural |
FR2850741B1 (fr) * | 2003-01-30 | 2005-09-23 | Snecma Propulsion Solide | Procede de fabrication d'un panneau de refroidissement actif en materiau composite thermostructural |
FR2850742B1 (fr) * | 2003-01-30 | 2005-09-23 | Snecma Propulsion Solide | Panneau de refroidissement actif en materiau composite thermostructural et procede pour sa fabrication |
FR2851244B1 (fr) * | 2003-02-17 | 2005-06-17 | Snecma Propulsion Solide | Procede de siliciuration de materiaux composites thermostructuraux et pieces telles qu'obtenues par le procede |
US7011898B2 (en) * | 2003-03-21 | 2006-03-14 | Air Products And Chemicals, Inc. | Method of joining ITM materials using a partially or fully-transient liquid phase |
FR2872072B1 (fr) * | 2004-06-24 | 2006-09-29 | Snecma Propulsion Solide Sa | Procede de brasage de pieces en materiau composite thermostructural siliciure |
US20060213957A1 (en) * | 2005-03-26 | 2006-09-28 | Addington Cary G | Conductive trace formation via wicking action |
-
2004
- 2004-06-24 FR FR0406892A patent/FR2872072B1/fr active Active
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2005
- 2005-05-30 DE DE102005025071.8A patent/DE102005025071B4/de active Active
- 2005-06-02 NO NO20052650A patent/NO340214B1/no unknown
- 2005-06-09 GB GB0511696A patent/GB2415401B/en active Active
- 2005-06-16 AT AT0101805A patent/AT502103B8/de active
- 2005-06-17 KR KR1020050052451A patent/KR101153560B1/ko active IP Right Grant
- 2005-06-21 US US11/157,398 patent/US20060006212A1/en not_active Abandoned
- 2005-06-22 US US11/630,577 patent/US20080190552A1/en not_active Abandoned
- 2005-06-22 EP EP05778794A patent/EP1786586B1/fr active Active
- 2005-06-22 DE DE602005013245T patent/DE602005013245D1/de active Active
- 2005-06-22 WO PCT/FR2005/001566 patent/WO2006010814A1/fr active Application Filing
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- 2005-06-22 CN CNB2005800242546A patent/CN100503119C/zh active Active
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