CN100483540C - 具有电荷注入差动读出放大器的电阻性交叉点存储阵列 - Google Patents

具有电荷注入差动读出放大器的电阻性交叉点存储阵列 Download PDF

Info

Publication number
CN100483540C
CN100483540C CNB03124128XA CN03124128A CN100483540C CN 100483540 C CN100483540 C CN 100483540C CN B03124128X A CNB03124128X A CN B03124128XA CN 03124128 A CN03124128 A CN 03124128A CN 100483540 C CN100483540 C CN 100483540C
Authority
CN
China
Prior art keywords
preamplifier
current
read
circuit
memory cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB03124128XA
Other languages
English (en)
Chinese (zh)
Other versions
CN1455412A (zh
Inventor
L·T·特兰
F·A·佩尔纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN1455412A publication Critical patent/CN1455412A/zh
Application granted granted Critical
Publication of CN100483540C publication Critical patent/CN100483540C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/06Sense amplifiers; Associated circuits, e.g. timing or triggering circuits
    • G11C7/067Single-ended amplifiers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1673Reading or sensing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/26Sensing or reading circuits; Data output circuits
    • G11C16/28Sensing or reading circuits; Data output circuits using differential sensing or reference cells, e.g. dummy cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C17/00Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • G11C17/18Auxiliary circuits, e.g. for writing into memory
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/06Sense amplifiers; Associated circuits, e.g. timing or triggering circuits
    • G11C7/062Differential amplifiers of non-latching type, e.g. comparators, long-tailed pairs
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1693Timing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0061Timing circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/004Reading or sensing circuits or methods
    • G11C2013/0054Read is performed on a reference element, e.g. cell, and the reference sensed value is used to compare the sensed value of the selected cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/72Array wherein the access device being a diode
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/77Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/78Array wherein the memory cells of a group share an access device, all the memory cells of the group having a common electrode and the access device being not part of a word line or a bit line driver

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mram Or Spin Memory Techniques (AREA)
  • Semiconductor Memories (AREA)
  • Hall/Mr Elements (AREA)
CNB03124128XA 2002-04-30 2003-04-29 具有电荷注入差动读出放大器的电阻性交叉点存储阵列 Expired - Lifetime CN100483540C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/136782 2002-04-30
US10/136,782 US6597598B1 (en) 2002-04-30 2002-04-30 Resistive cross point memory arrays having a charge injection differential sense amplifier

Publications (2)

Publication Number Publication Date
CN1455412A CN1455412A (zh) 2003-11-12
CN100483540C true CN100483540C (zh) 2009-04-29

Family

ID=22474333

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB03124128XA Expired - Lifetime CN100483540C (zh) 2002-04-30 2003-04-29 具有电荷注入差动读出放大器的电阻性交叉点存储阵列

Country Status (6)

Country Link
US (1) US6597598B1 (enExample)
EP (1) EP1359586A2 (enExample)
JP (1) JP4113033B2 (enExample)
KR (1) KR100939068B1 (enExample)
CN (1) CN100483540C (enExample)
TW (1) TW200305878A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11817159B2 (en) 2020-07-16 2023-11-14 Changxin Memory Technologies, Inc. Circuit for detecting anti-fuse memory cell state and memory
US11817163B2 (en) 2020-07-16 2023-11-14 Changxin Memory Technologies, Inc. Circuit for detecting state of anti-fuse storage unit and memory device thereof
US11854605B2 (en) 2020-07-16 2023-12-26 Changxin Memory Technologies, Inc. State detection circuit for anti-fuse memory cell, and memory
US11854633B2 (en) 2020-07-16 2023-12-26 Changxin Memory Technologies, Inc. Anti-fuse memory cell state detection circuit and memory

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2277717C (en) * 1999-07-12 2006-12-05 Mosaid Technologies Incorporated Circuit and method for multiple match detection in content addressable memories
US6577525B2 (en) * 2001-08-28 2003-06-10 Micron Technology, Inc. Sensing method and apparatus for resistance memory device
EP1321941B1 (en) * 2001-12-21 2005-08-17 Kabushiki Kaisha Toshiba Magnetic random access memory with stacked memory cells
JP2004023062A (ja) * 2002-06-20 2004-01-22 Nec Electronics Corp 半導体装置とその製造方法
US7152800B2 (en) * 2002-08-22 2006-12-26 Texas Instruments Incorporated Preamplifier system having programmable resistance
US7038960B2 (en) * 2002-09-10 2006-05-02 Silicon Storage Technology, Inc. High speed and high precision sensing for digital multilevel non-volatile memory system
US6885600B2 (en) * 2002-09-10 2005-04-26 Silicon Storage Technology, Inc. Differential sense amplifier for multilevel non-volatile memory
US6778420B2 (en) * 2002-09-25 2004-08-17 Ovonyx, Inc. Method of operating programmable resistant element
US6674679B1 (en) * 2002-10-01 2004-01-06 Hewlett-Packard Development Company, L.P. Adjustable current mode differential amplifier for multiple bias point sensing of MRAM having equi-potential isolation
ITMI20030075A1 (it) * 2003-01-20 2004-07-21 Simicroelectronics S R L Amplificatore di rilevamneto parallelo con specchiamento della corrente da misurare su ogni ramo di riferimento.
US6795359B1 (en) * 2003-06-10 2004-09-21 Micron Technology, Inc. Methods and apparatus for measuring current as in sensing a memory cell
FR2871279A1 (fr) * 2004-06-03 2005-12-09 Spintron Sa Memoire magnetique comportant plusieurs modules d'aimantation
FR2871280A1 (fr) * 2004-06-03 2005-12-09 Spintron Sa Memoire magnetique a canal de confinement
JP4118845B2 (ja) 2004-07-30 2008-07-16 株式会社東芝 半導体記憶装置
US7224598B2 (en) * 2004-09-02 2007-05-29 Hewlett-Packard Development Company, L.P. Programming of programmable resistive memory devices
US7130235B2 (en) * 2004-09-03 2006-10-31 Hewlett-Packard Development Company, L.P. Method and apparatus for a sense amplifier
US7212432B2 (en) * 2004-09-30 2007-05-01 Infineon Technologies Ag Resistive memory cell random access memory device and method of fabrication
JP2006127583A (ja) * 2004-10-26 2006-05-18 Elpida Memory Inc 不揮発性半導体記憶装置及び相変化メモリ
JP4783002B2 (ja) 2004-11-10 2011-09-28 株式会社東芝 半導体メモリ素子
US7158431B2 (en) 2005-03-28 2007-01-02 Silicon Storage Technology, Inc. Single transistor sensing and double transistor sensing for flash memory
US7453715B2 (en) * 2005-03-30 2008-11-18 Ovonyx, Inc. Reading a phase change memory
US7447055B2 (en) * 2005-04-22 2008-11-04 Hewlett-Packard Development Company, L.P. Multiplexer interface to a nanoscale-crossbar
US7426131B2 (en) * 2005-11-01 2008-09-16 Adesto Technologies Programmable memory device circuit
US7495971B2 (en) * 2006-04-19 2009-02-24 Infineon Technologies Ag Circuit and a method of determining the resistive state of a resistive memory cell
EP2089887B1 (en) * 2006-11-08 2015-12-23 Nxp B.V. Read enhancement for memory
US7567462B2 (en) * 2006-11-16 2009-07-28 Micron Technology, Inc. Method and system for selectively limiting peak power consumption during programming or erase of non-volatile memory devices
DE102007001859B3 (de) * 2007-01-12 2008-04-24 Qimonda Ag Integrierte Schaltung, Speicherbaustein und Verfahren zum Bestimmen eines Speicherzustands einer resistiven Speicherzelle
US7400521B1 (en) 2007-01-12 2008-07-15 Qimoda Ag Integrated circuit, memory chip and method of evaluating a memory state of a resistive memory cell
US9135962B2 (en) * 2007-06-15 2015-09-15 Micron Technology, Inc. Comparators for delta-sigma modulators
TWI402847B (zh) 2007-06-25 2013-07-21 Higgs Opl Capital Llc 相變化記憶體之感測電路
KR100919565B1 (ko) * 2007-07-24 2009-10-01 주식회사 하이닉스반도체 상 변화 메모리 장치
US7564707B2 (en) * 2007-08-22 2009-07-21 Zerog Wireless, Inc. One-time programmable non-volatile memory
WO2009034687A1 (ja) * 2007-09-10 2009-03-19 Panasonic Corporation 不揮発性記憶装置および不揮発性記憶装置へのデータ書込方法
KR100895387B1 (ko) * 2007-10-16 2009-04-30 주식회사 하이닉스반도체 상 변화 메모리 장치
TWI347607B (en) 2007-11-08 2011-08-21 Ind Tech Res Inst Writing system and method for a phase change memory
US20110226148A1 (en) * 2008-05-16 2011-09-22 Sawka Wayne N Physical destruction of electrical device and methods for triggering same
TWI402845B (zh) 2008-12-30 2013-07-21 Higgs Opl Capital Llc 相變化記憶體陣列之驗證電路及方法
TWI412124B (zh) 2008-12-31 2013-10-11 Higgs Opl Capital Llc 相變化記憶體
US8363450B2 (en) * 2009-07-13 2013-01-29 Seagate Technology Llc Hierarchical cross-point array of non-volatile memory
US8514637B2 (en) * 2009-07-13 2013-08-20 Seagate Technology Llc Systems and methods of cell selection in three-dimensional cross-point array memory devices
JP5284225B2 (ja) * 2009-09-01 2013-09-11 株式会社東芝 不揮発性半導体記憶装置とその読み出し方法
US8570785B2 (en) 2010-05-26 2013-10-29 Hewlett-Packard Development Company Reading a memory element within a crossbar array
WO2013015768A1 (en) * 2011-07-22 2013-01-31 Hewlett-Packard Development Company, L.P. Circuit and method for reading a resistive switching device in an array
US8687398B2 (en) 2012-02-29 2014-04-01 International Business Machines Corporation Sense scheme for phase change material content addressable memory
CN103366804B (zh) 2012-03-30 2017-10-13 硅存储技术公司 具有电流注入读出放大器的非易失性存储装置
US9070424B2 (en) * 2012-06-29 2015-06-30 Samsung Electronics Co., Ltd. Sense amplifier circuitry for resistive type memory
EP2877996A4 (en) * 2012-07-27 2016-03-09 Hewlett Packard Development Co DYNAMIC DETECTION CIRCUIT
JP5839201B2 (ja) 2013-03-06 2016-01-06 ソニー株式会社 半導体装置および情報読出方法
WO2016068992A1 (en) * 2014-10-31 2016-05-06 Hewlett Packard Enterprise Development Lp Reusing sneak current in accessing memory cells
US9489999B2 (en) 2014-11-26 2016-11-08 Qualcomm Incorporated Magnetic tunnel junction resistance comparison based physical unclonable function
US9478308B1 (en) * 2015-05-26 2016-10-25 Intel IP Corporation Programmable memory device sense amplifier
US10340001B2 (en) * 2015-08-27 2019-07-02 King Abdullah University Of Science And Technology Single-readout high-density memristor crossbar
US9852790B1 (en) 2016-10-26 2017-12-26 International Business Machines Corporation Circuit methodology for highly linear and symmetric resistive processing unit
CN108154227B (zh) * 2016-12-06 2020-06-23 上海磁宇信息科技有限公司 一种使用模拟计算的神经网络芯片
US10680105B2 (en) 2017-03-21 2020-06-09 International Business Machines Corporation Mobile ferroelectric single domain wall implementation of a symmetric resistive processing unit
US10261977B2 (en) * 2017-05-04 2019-04-16 University Of Rochester Resistive memory accelerator
KR102244183B1 (ko) 2017-05-27 2021-04-26 유 린 리 구동 시스템
US10290327B2 (en) 2017-10-13 2019-05-14 Nantero, Inc. Devices and methods for accessing resistive change elements in resistive change element arrays
US10403336B2 (en) 2017-12-28 2019-09-03 Micron Technology, Inc. Techniques for precharging a memory cell
CN110446292B (zh) * 2018-05-03 2022-07-08 李玉麟 驱动装置
US11309005B2 (en) * 2018-10-31 2022-04-19 Taiwan Semiconductor Manufacturing Co., Ltd. Current steering in reading magnetic tunnel junction
US11416416B2 (en) * 2019-01-13 2022-08-16 Ememory Technology Inc. Random code generator with non-volatile memory
KR102768650B1 (ko) 2019-06-11 2025-02-13 에스케이하이닉스 주식회사 읽기 동작을 제어하는 제어회로를 포함하는 반도체 메모리 장치
US11217281B2 (en) * 2020-03-12 2022-01-04 Ememory Technology Inc. Differential sensing device with wide sensing margin
WO2024232826A1 (en) * 2023-05-05 2024-11-14 Singapore University Of Technology And Design Method and apparatus for computing operations on a non-volatile memory device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5640343A (en) 1996-03-18 1997-06-17 International Business Machines Corporation Magnetic memory array using magnetic tunnel junction devices in the memory cells
US6259644B1 (en) * 1997-11-20 2001-07-10 Hewlett-Packard Co Equipotential sense methods for resistive cross point memory cell arrays
US6169686B1 (en) 1997-11-20 2001-01-02 Hewlett-Packard Company Solid-state memory with magnetic storage cells
US6292389B1 (en) 1999-07-19 2001-09-18 Motorola, Inc. Magnetic element with improved field response and fabricating method thereof
US6128239A (en) * 1999-10-29 2000-10-03 Hewlett-Packard MRAM device including analog sense amplifiers
US6185143B1 (en) 2000-02-04 2001-02-06 Hewlett-Packard Company Magnetic random access memory (MRAM) device including differential sense amplifiers
US6297983B1 (en) 2000-02-29 2001-10-02 Hewlett-Packard Company Reference layer structure in a magnetic storage cell
US6356477B1 (en) 2001-01-29 2002-03-12 Hewlett Packard Company Cross point memory array including shared devices for blocking sneak path currents

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11817159B2 (en) 2020-07-16 2023-11-14 Changxin Memory Technologies, Inc. Circuit for detecting anti-fuse memory cell state and memory
US11817163B2 (en) 2020-07-16 2023-11-14 Changxin Memory Technologies, Inc. Circuit for detecting state of anti-fuse storage unit and memory device thereof
US11854605B2 (en) 2020-07-16 2023-12-26 Changxin Memory Technologies, Inc. State detection circuit for anti-fuse memory cell, and memory
US11854633B2 (en) 2020-07-16 2023-12-26 Changxin Memory Technologies, Inc. Anti-fuse memory cell state detection circuit and memory

Also Published As

Publication number Publication date
KR20030085503A (ko) 2003-11-05
US6597598B1 (en) 2003-07-22
KR100939068B1 (ko) 2010-01-28
TW200305878A (en) 2003-11-01
JP4113033B2 (ja) 2008-07-02
JP2003323791A (ja) 2003-11-14
EP1359586A2 (en) 2003-11-05
CN1455412A (zh) 2003-11-12

Similar Documents

Publication Publication Date Title
CN100483540C (zh) 具有电荷注入差动读出放大器的电阻性交叉点存储阵列
CN1455414B (zh) 带交叉耦合闩锁读出放大器的电阻交叉点存储单元阵列
US6185143B1 (en) Magnetic random access memory (MRAM) device including differential sense amplifiers
CN100409363C (zh) 数据存储器件及其制造方法
US6456524B1 (en) Hybrid resistive cross point memory cell arrays and methods of making the same
CN100447898C (zh) 高密度存储器读出放大器
JP3812805B2 (ja) トンネル磁気抵抗素子を利用した半導体記憶装置
KR100542159B1 (ko) 고정도로 회로 소자 수가 적은 데이터 판독 구성을 구비한박막 자성체 기억 장치
JP2002008369A (ja) 抵抗性クロスポイントメモリセルアレイのための等電位検知方法
CN100483543C (zh) 磁性随机处理存储器装置
KR20030083557A (ko) 데이터 판독시에 있어서 데이터선의 충전시간을 단축하는박막자성체 기억장치
KR101123925B1 (ko) 판독 동작 수행 방법 및 시스템
WO2007124205A2 (en) Mram array with reference cell row and method of operation
CN100361230C (zh) 设有含磁隧道结的存储单元的薄膜磁性体存储装置
KR101136038B1 (ko) 데이터 저장 디바이스, 메모리 셀 판독 동작 수행 방법 및시스템

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: SAMSUNG ELECTRONICS CO., LTD

Free format text: FORMER OWNER: HEWLETT-PACKARD DEVELOPMENT COMPANY

Effective date: 20071228

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20071228

Address after: Gyeonggi Do, South Korea

Applicant after: SAMSUNG ELECTRONICS Co.,Ltd.

Address before: California, USA

Applicant before: Hewlett-Packard Co.

C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20090429