CN100446201C - 半导体器件 - Google Patents

半导体器件 Download PDF

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Publication number
CN100446201C
CN100446201C CNB2005100986435A CN200510098643A CN100446201C CN 100446201 C CN100446201 C CN 100446201C CN B2005100986435 A CNB2005100986435 A CN B2005100986435A CN 200510098643 A CN200510098643 A CN 200510098643A CN 100446201 C CN100446201 C CN 100446201C
Authority
CN
China
Prior art keywords
lead
bonding
semiconductor chip
wire
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2005100986435A
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English (en)
Chinese (zh)
Other versions
CN1755907A (zh
Inventor
高桥典之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Publication of CN1755907A publication Critical patent/CN1755907A/zh
Application granted granted Critical
Publication of CN100446201C publication Critical patent/CN100446201C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
CNB2005100986435A 2004-09-30 2005-09-05 半导体器件 Expired - Lifetime CN100446201C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP285839/2004 2004-09-30
JP2004285839A JP4525277B2 (ja) 2004-09-30 2004-09-30 半導体装置

Publications (2)

Publication Number Publication Date
CN1755907A CN1755907A (zh) 2006-04-05
CN100446201C true CN100446201C (zh) 2008-12-24

Family

ID=36145875

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100986435A Expired - Lifetime CN100446201C (zh) 2004-09-30 2005-09-05 半导体器件

Country Status (5)

Country Link
US (2) US7323366B2 (https=)
JP (1) JP4525277B2 (https=)
KR (1) KR101160694B1 (https=)
CN (1) CN100446201C (https=)
TW (1) TWI431738B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI467710B (zh) * 2010-08-30 2015-01-01 京濱股份有限公司 電子零件之安裝構造

Families Citing this family (19)

* Cited by examiner, † Cited by third party
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US7001798B2 (en) * 2001-11-14 2006-02-21 Oki Electric Industry Co., Ltd. Method of manufacturing semiconductor device
US8344524B2 (en) * 2006-03-07 2013-01-01 Megica Corporation Wire bonding method for preventing polymer cracking
WO2007148782A1 (ja) * 2006-06-22 2007-12-27 Dai Nippon Printing Co., Ltd. 樹脂封止型半導体装置とその製造方法、半導体装置用基材および積層型樹脂封止型半導体装置
JP5499437B2 (ja) * 2008-01-10 2014-05-21 株式会社デンソー モールドパッケージ
US20090315159A1 (en) * 2008-06-20 2009-12-24 Donald Charles Abbott Leadframes having both enhanced-adhesion and smooth surfaces and methods to form the same
CN101740528B (zh) * 2008-11-12 2011-12-28 力成科技股份有限公司 增进散热的无外引脚式半导体封装构造及其组合
US8080885B2 (en) * 2008-11-19 2011-12-20 Stats Chippac Ltd. Integrated circuit packaging system with multi level contact and method of manufacture thereof
JP5157964B2 (ja) * 2009-02-27 2013-03-06 オムロン株式会社 光伝送モジュール、電子機器、及び光伝送モジュールの製造方法
JP5663214B2 (ja) * 2009-07-03 2015-02-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2011077277A (ja) * 2009-09-30 2011-04-14 Sanyo Electric Co Ltd 半導体装置
CN102263079B (zh) * 2011-07-18 2017-06-09 日月光半导体制造股份有限公司 半导体封装结构
JP5966275B2 (ja) * 2011-08-10 2016-08-10 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
KR101464605B1 (ko) * 2012-12-07 2014-11-24 시그네틱스 주식회사 솔더 접합 능력을 향상하는 큐. 에프. 엔 반도체 패키지 및 그의 제조방법
EP2854162B1 (en) 2013-09-26 2019-11-27 Ampleon Netherlands B.V. Semiconductor device leadframe
EP2854161B1 (en) * 2013-09-26 2019-12-04 Ampleon Netherlands B.V. Semiconductor device leadframe
JP6395045B2 (ja) * 2014-11-18 2018-09-26 日亜化学工業株式会社 複合基板並びに発光装置及びその製造方法
JP6608672B2 (ja) * 2015-10-30 2019-11-20 新光電気工業株式会社 半導体装置及びその製造方法、リードフレーム及びその製造方法
US11742265B2 (en) * 2019-10-22 2023-08-29 Texas Instruments Incorporated Exposed heat-generating devices
CN114226185B (zh) * 2022-02-17 2022-04-29 常州江苏大学工程技术研究院 一种基于物联网线路板的输送系统及其制造方法

Citations (3)

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CN1072393C (zh) * 1997-02-05 2001-10-03 华通电脑股份有限公司 球阵式集成电路封装方法
CN1354526A (zh) * 2000-11-21 2002-06-19 财团法人工业技术研究院 发光元件覆晶组装的方法及其结构
JP2003037219A (ja) * 2001-07-23 2003-02-07 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置およびその製造方法

Family Cites Families (11)

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US6008068A (en) * 1994-06-14 1999-12-28 Dai Nippon Printing Co., Ltd. Process for etching a semiconductor lead frame
JP3405202B2 (ja) * 1998-06-26 2003-05-12 松下電器産業株式会社 リードフレームおよびそれを用いた樹脂封止型半導体装置およびその製造方法
US6198171B1 (en) * 1999-12-30 2001-03-06 Siliconware Precision Industries Co., Ltd. Thermally enhanced quad flat non-lead package of semiconductor
JP4349541B2 (ja) * 2000-05-09 2009-10-21 大日本印刷株式会社 樹脂封止型半導体装置用フレーム
JP2002026198A (ja) * 2000-07-04 2002-01-25 Nec Corp 半導体装置及びその製造方法
JP4523138B2 (ja) * 2000-10-06 2010-08-11 ローム株式会社 半導体装置およびそれに用いるリードフレーム
KR100369393B1 (ko) * 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
US6882048B2 (en) * 2001-03-30 2005-04-19 Dainippon Printing Co., Ltd. Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area
JP2002368176A (ja) * 2001-06-11 2002-12-20 Rohm Co Ltd 半導体電子部品のリードフレーム
KR100445072B1 (ko) * 2001-07-19 2004-08-21 삼성전자주식회사 리드 프레임을 이용한 범프 칩 캐리어 패키지 및 그의제조 방법
EP1318544A1 (en) * 2001-12-06 2003-06-11 STMicroelectronics S.r.l. Method for manufacturing semiconductor device packages

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1072393C (zh) * 1997-02-05 2001-10-03 华通电脑股份有限公司 球阵式集成电路封装方法
CN1354526A (zh) * 2000-11-21 2002-06-19 财团法人工业技术研究院 发光元件覆晶组装的方法及其结构
JP2003037219A (ja) * 2001-07-23 2003-02-07 Matsushita Electric Ind Co Ltd 樹脂封止型半導体装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI467710B (zh) * 2010-08-30 2015-01-01 京濱股份有限公司 電子零件之安裝構造

Also Published As

Publication number Publication date
US7728412B2 (en) 2010-06-01
TWI431738B (zh) 2014-03-21
KR101160694B1 (ko) 2012-06-28
US20060079028A1 (en) 2006-04-13
TW200614474A (en) 2006-05-01
JP2006100636A (ja) 2006-04-13
US20080135992A1 (en) 2008-06-12
KR20060051340A (ko) 2006-05-19
US7323366B2 (en) 2008-01-29
CN1755907A (zh) 2006-04-05
JP4525277B2 (ja) 2010-08-18

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