CN100403565C - Led器件 - Google Patents

Led器件 Download PDF

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Publication number
CN100403565C
CN100403565C CNB2005800012949A CN200580001294A CN100403565C CN 100403565 C CN100403565 C CN 100403565C CN B2005800012949 A CNB2005800012949 A CN B2005800012949A CN 200580001294 A CN200580001294 A CN 200580001294A CN 100403565 C CN100403565 C CN 100403565C
Authority
CN
China
Prior art keywords
led
hole
depression
reflecting plate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005800012949A
Other languages
English (en)
Chinese (zh)
Other versions
CN1898809A (zh
Inventor
杉浦良治
吉田英树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincstech Circuit Co Ltd
Original Assignee
Hitachi AIC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi AIC Inc filed Critical Hitachi AIC Inc
Publication of CN1898809A publication Critical patent/CN1898809A/zh
Application granted granted Critical
Publication of CN100403565C publication Critical patent/CN100403565C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Led Device Packages (AREA)
CNB2005800012949A 2004-09-16 2005-09-07 Led器件 Expired - Fee Related CN100403565C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP269513/2004 2004-09-16
JP2004269513 2004-09-16

Publications (2)

Publication Number Publication Date
CN1898809A CN1898809A (zh) 2007-01-17
CN100403565C true CN100403565C (zh) 2008-07-16

Family

ID=36059926

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800012949A Expired - Fee Related CN100403565C (zh) 2004-09-16 2005-09-07 Led器件

Country Status (6)

Country Link
US (2) US7626211B2 (enExample)
JP (1) JP4062358B2 (enExample)
KR (1) KR100723618B1 (enExample)
CN (1) CN100403565C (enExample)
TW (1) TW200629596A (enExample)
WO (1) WO2006030671A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102667318A (zh) * 2009-10-15 2012-09-12 科锐公司 灯组件及其制造方法

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DE112005003841B4 (de) * 2004-12-14 2016-03-03 Seoul Viosys Co., Ltd. Licht emittierendes Bauelement mit einer Mehrzahl Licht emittierender Zellen
EP2280430B1 (en) 2005-03-11 2020-01-01 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
EP1897146A2 (en) * 2005-06-27 2008-03-12 Lamina Lighting, Inc. Light emitting diode package and method for making same
JP2007088155A (ja) * 2005-09-21 2007-04-05 Stanley Electric Co Ltd 表面実装型ｌｅｄ基板
JP2007266546A (ja) * 2006-03-30 2007-10-11 Rohm Co Ltd 光通信モジュールおよびその製造方法
JPWO2007126074A1 (ja) * 2006-04-28 2009-09-10 島根県 半導体発光モジュール、装置、およびその製造方法
KR100854328B1 (ko) * 2006-07-07 2008-08-28 엘지전자 주식회사 발광 소자 패키지 및 그 제조방법
JP4533352B2 (ja) * 2006-08-09 2010-09-01 昭和電工株式会社 発光装置、表示装置、およびカバー取付部材
TW200822384A (en) * 2006-11-03 2008-05-16 Coretronic Corp LED package structure
JP5326204B2 (ja) * 2006-11-29 2013-10-30 富士通株式会社 発光部品及びその製造方法及び発光部品組立体及び電子装置
KR100827667B1 (ko) * 2007-01-16 2008-05-07 삼성전자주식회사 기판 내에 반도체 칩을 갖는 반도체 패키지 및 이를제조하는 방법
KR101491138B1 (ko) * 2007-12-12 2015-02-09 엘지이노텍 주식회사 다층 기판 및 이를 구비한 발광 다이오드 모듈
JP2009278012A (ja) * 2008-05-16 2009-11-26 Meio Kasei:Kk Ｌｅｄ装置用パッケージ
US8288845B2 (en) * 2008-11-14 2012-10-16 Triquint Semiconductor, Inc. Package including proximately-positioned lead frame
DE102009008738A1 (de) * 2009-02-12 2010-08-19 Osram Opto Semiconductors Gmbh Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung
KR101006246B1 (ko) * 2009-05-21 2011-01-07 에스브이에스 주식회사 발광다이오드용 적층 세라믹 방열판
KR100986544B1 (ko) * 2009-06-10 2010-10-07 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR101041438B1 (ko) * 2009-12-02 2011-06-15 한국광기술원 이중천공을 구비하는 발광 다이오드 패키지 및 그의 제조방법
WO2011077900A1 (ja) * 2009-12-22 2011-06-30 シャープ株式会社 発光ダイオード素子、光源装置、面光源照明装置、及び液晶表示装置
KR101028195B1 (ko) 2010-01-18 2011-04-11 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
JP2013518415A (ja) * 2010-01-25 2013-05-20 ヴィシャイ スプレイグ，インコーポレイテッド 金属基板電子素子成分パッケージ、およびその製造方法
US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
KR101028329B1 (ko) * 2010-04-28 2011-04-12 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
TWD141522S1 (zh) 2010-06-10 2011-07-11 晶元光電股份有限公司 發光二極體陣列
JP2012023281A (ja) * 2010-07-16 2012-02-02 Nitto Denko Corp 発光装置の製法
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
CN102095091A (zh) * 2010-09-30 2011-06-15 福建省万邦光电科技有限公司 Led光源模组封装结构
CN104254185B (zh) * 2011-01-28 2017-06-09 首尔半导体株式会社 Led发光装置及其驱动方法
JP2012222191A (ja) * 2011-04-11 2012-11-12 Okuno Chem Ind Co Ltd Ｌｅｄ照明ユニット
KR101250372B1 (ko) * 2011-12-09 2013-04-05 엘지이노텍 주식회사 광소자 패키지 및 그 제조 방법
DE102011056654A1 (de) * 2011-12-20 2013-06-20 Vossloh-Schwabe Optoelectronic Gmbh & Co. Kg Leuchtdiodenanordnung
US8766654B2 (en) * 2012-03-27 2014-07-01 Universal Scientific Industrial Co., Ltd. Package structure with conformal shielding and inspection method using the same
JP2013239644A (ja) * 2012-05-16 2013-11-28 Toshiba Corp 半導体発光装置
KR101974349B1 (ko) 2012-10-04 2019-05-02 삼성전자주식회사 발광모듈과 이를 이용한 조명장치
CN103115229B (zh) * 2013-02-27 2015-09-02 利亚德光电股份有限公司 Led显示单元及led显示系统
USD700151S1 (en) * 2013-04-17 2014-02-25 Revolution Display, Inc. LED display housing
JP6244130B2 (ja) * 2013-07-26 2017-12-06 新光電気工業株式会社 発光素子搭載用パッケージ及び発光素子パッケージ
TWD167284S (zh) * 2014-01-14 2015-04-21 隆達電子股份有限公司 導線架料帶之部分
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
JP1613559S (enExample) * 2017-11-07 2018-09-10
CN109192838A (zh) * 2018-08-15 2019-01-11 深圳优卫乐得科技有限公司 一种紫外led光源模组制造方法
WO2020045604A1 (ja) * 2018-08-31 2020-03-05 パナソニックＩｐマネジメント株式会社 半導体素子搭載用パッケージ及び半導体装置
US10810932B2 (en) * 2018-10-02 2020-10-20 Sct Ltd. Molded LED display module and method of making thererof
US11444120B2 (en) * 2020-01-14 2022-09-13 Au Optronics Corporation Display apparatus and method of fabricating the same

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US20020084462A1 (en) * 2000-09-29 2002-07-04 Shingo Tamai Light emission device
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US20030155624A1 (en) * 1995-09-29 2003-08-21 Karlheinz Arndt Optoelectronic semiconductor component
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102667318A (zh) * 2009-10-15 2012-09-12 科锐公司 灯组件及其制造方法
CN102667318B (zh) * 2009-10-15 2015-03-11 科锐公司 灯组件及其制造方法

Also Published As

Publication number Publication date
KR20060085928A (ko) 2006-07-28
US20070063209A1 (en) 2007-03-22
KR100723618B1 (ko) 2007-06-04
JPWO2006030671A1 (ja) 2008-07-31
TWI313937B (enExample) 2009-08-21
WO2006030671A1 (ja) 2006-03-23
CN1898809A (zh) 2007-01-17
US7626211B2 (en) 2009-12-01
JP4062358B2 (ja) 2008-03-19
US20100032693A1 (en) 2010-02-11
TW200629596A (en) 2006-08-16

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Granted publication date: 20080716

Termination date: 20130907