CN102095091A - Led光源模组封装结构 - Google Patents

Led光源模组封装结构 Download PDF

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Publication number
CN102095091A
CN102095091A CN2010102995938A CN201010299593A CN102095091A CN 102095091 A CN102095091 A CN 102095091A CN 2010102995938 A CN2010102995938 A CN 2010102995938A CN 201010299593 A CN201010299593 A CN 201010299593A CN 102095091 A CN102095091 A CN 102095091A
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Prior art keywords
metal substrate
led chip
reflector
light source
source module
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CN2010102995938A
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何文铭
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FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
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FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
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Priority to CN2010102995938A priority Critical patent/CN102095091A/zh
Priority to PCT/CN2010/078621 priority patent/WO2012040957A1/zh
Priority to EP10857720.6A priority patent/EP2650603A1/en
Publication of CN102095091A publication Critical patent/CN102095091A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

本发明提供了一种LED光源模组封装结构，属于照明设备的加工领域，包括金属基板、线路板、反光杯和LED芯片，所述线路板嵌设在金属基板的下表面，金属基板的上表面固定设有至少一个反光杯，反光杯的底部设有一可通向线路板的上表面的小孔，每个反光杯内安装至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部除小孔以外位置的金属基板上，所述LED芯片的上表面涂敷有一胶水与荧光粉混合层，LED芯片通过导线穿过小孔后连接至线路板上。

Description

LED光源模组封装结构
【技术领域】
本发明涉及一种照明设备，尤其涉及一种LED光源模块。
【背景技术】
LED是一种低电压光源，由于其省电、寿命长，现已被广泛应用于各种低压照明装置，传统的大功率LED芯片或者集成程度较高的多芯片LED光源模组的封装结构一般采用金属基板来实现，具体结构一般采用在具有反光杯的高导热金属(如铜、铝等)作为基板，再将绝缘层和电路连接层复合在基层上，形成整个的复合基板，在反光杯中央安装LED芯片，LED芯片连接至电路连接层，再将LED芯片的上表面涂敷一胶水与荧光粉混合层完成封装。上述传统的LED光源模块封装结构中，由于LED芯片和电路连接层之间需要有引线相连接，但LED芯片设置在反光杯内部，而线路板又设置在反光杯之外，因此在生产的过程中，很容易使LED芯片和线路板之间的引线因人为碰断而损坏，大大降低了生产效率，并且生产工序也变得更为复杂，增加生产成本，并且由于传统的金属基板需要采用大面积的绝缘层，导致整个封装结构的散热性能较差，不利于产品的寿命。
【发明内容】
本发明要解决的技术问题，在于提供一种散热性能更好，并且可以节省生产成本的新型LED光源模组封装结构。
本发明是这样实现的：一种新型LED光源模组封装结构，包括金属基板、线路板、反光杯和LED芯片，其特征在于：所述线路板设置在金属基板的下表面，金属基板的上表面固定设有至少一个反光杯，反光杯的底部设有一可通向线路板的上表面的小孔，每个反光杯内安装至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部除小孔以外位置的金属基板上，所述LED芯片的上表面涂敷有一胶水与荧光粉混合层，LED芯片通过导线穿过小孔后连接至线路板上。
所述金属基板的下表面设置有一长形槽，所述线路板嵌设在该长形槽内。
所述金属基板的上表面设有一电镀的反光层。
所述反光杯为环状，通过注塑或者点塑方式制成，或者通过在金属基板上直接压铸成型。
所述金属基板的一端设有至少一个卡扣，另一端的相对应位置设有与之适配的卡槽。
本发明具有如下优点：采用上述的封装方式，可以使LED芯片和线路板以及它们之间的导线，全部封装在胶水与荧光粉混合层下面，可以在LED芯片封装的工序中就可以直接一步完成，大大提高了生产效率，减少生产过程中导线的损坏，节省了生产成本；由于将线路板嵌入安装在金属基板的背面的预制槽内，既大大简化了生产工序，又可以牢固地进行固定；同时由于LED芯片可以直接安装固定在金属基板上，可以大大地提高散热性能，提高产品的寿命。
【附图说明】
下面参照附图结合实施例对本发明作进一步的说明。
图1是本发明的LED光源模组封装结构的正面结构示意图。
图2是本发明的LED光源模组封装结构的背面结构示意图。
图3是本发明的LED光源模组封装结构的前侧面结构示意图。
图4是本发明的LED光源模组封装结构的右侧面结构示意图。
图5是本发明的LED光源模组封装结构的金属基板、线路板和LED芯片之间的连接结构示意图。
图6是图1的A-A剖视图。
【具体实施方式】
下面结合具体实施例来对本发明进行详细的说明。
请参阅图1至图6所示，是本发明所述的LED光源模组封装结构，包括金属基板1、线路板2、反光杯3和LED芯片4，在所述金属基板1的下表面中间位置设有一长条形的凹槽11，凹槽11内嵌设有线路板2，线路板2上设有预先制好的连接电路，线路板2的两端分别引出至金属基板1的两端形成正负极，所述反光杯3是在金属基板1上直接压铸成型的，反光杯3的底部设有一可通向线路板2的上表面的小孔12，每个反光杯3内安装若干LED芯片4，LED芯片4通过绝缘胶粘在反光杯3的底部除小孔12以外位置的金属基板1上，所述LED芯片4的上表面涂敷有一胶水与荧光粉混合层5，LED芯片4通过导线6穿过小孔12后连接至线路板上。所述金属基板1的上表面设有一电镀的反光层7，本实施例中该反光层采用镀银层，所述反光杯3为环状，本实施例中采用的是圆形反光杯，该反光杯3也通过注塑或者点塑方式制成后固定在金属基板1上，本专利中，所述金属基板1的下表面也可以不设有凹槽，只需将线路板2直接固定设置在金属基板1的下表面也可以实现发明目的。同时本发明中也可以采用方形的反光杯来实现。所述金属基板1的一端设有一个外宽内窄的卡扣8，另一端的相对应位置设有与之形状相同的卡槽9，也可以在两端设置多个这样的卡扣和卡槽结构，这样就可以很方便地将多个同样的模组扣接在一起，如使用在长条型灯条的用途上。

Claims (5)

1.一种LED光源模组封装结构，包括金属基板、线路板、反光杯和LED芯片，其特征在于：所述线路板设置在金属基板的下表面，金属基板的上表面固定设有至少一个反光杯，反光杯的底部设有一可通向线路板的上表面的小孔，每个反光杯内安装至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部除小孔以外位置的金属基板上，所述LED芯片的上表面涂敷有一胶水与荧光粉混合层，LED芯片通过导线穿过小孔后连接至线路板上。
2.根据权利要求1所述的LED光源模组封装结构，其特征在于：所述金属基板的下表面设置有一长形槽，所述线路板嵌设在该长形槽内。
3.根据权利要求1所述的LED光源模组封装结构，其特征在于：所述金属基板的上表面设有一电镀的反光层。
4.根据权利要求1所述的LED光源模组封装结构，其特征在于：所述反光杯为环状，通过注塑或者点塑方式制成，或者通过在金属基板上直接压铸成型。
5.根据权利要求1所述的LED光源模组封装结构，其特征在于：所述金属基板的一端设有至少一个卡扣，另一端的相对应位置设有与之适配的卡槽。
CN2010102995938A 2010-09-30 2010-09-30 Led光源模组封装结构 Pending CN102095091A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2010102995938A CN102095091A (zh) 2010-09-30 2010-09-30 Led光源模组封装结构
PCT/CN2010/078621 WO2012040957A1 (zh) 2010-09-30 2010-11-11 Led光源模组封装结构
EP10857720.6A EP2650603A1 (en) 2010-09-30 2010-11-11 Package structure of led light source module

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CN2010102995938A CN102095091A (zh) 2010-09-30 2010-09-30 Led光源模组封装结构

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6921183B2 (en) * 2003-02-13 2005-07-26 Pi Fu Yang Concave cup printed circuit board for light emitting diode and method for producing the same
CN1898809A (zh) * 2004-09-16 2007-01-17 日立Aic株式会社 Led反射板及led器件
CN101064260A (zh) * 2006-04-26 2007-10-31 碁成科技股份有限公司 功率芯片的封装制程
CN201190979Y (zh) * 2008-03-19 2009-02-04 和谐光电科技（泉州）有限公司 高散热性的led发光装置
CN101364622A (zh) * 2007-08-08 2009-02-11 高侨自动化科技股份有限公司 高功率led封装结构
US20090059583A1 (en) * 2007-08-28 2009-03-05 Chi-Yuan Hsu Package Structure for a High-Luminance Light Source

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6921183B2 (en) * 2003-02-13 2005-07-26 Pi Fu Yang Concave cup printed circuit board for light emitting diode and method for producing the same
CN1898809A (zh) * 2004-09-16 2007-01-17 日立Aic株式会社 Led反射板及led器件
CN101064260A (zh) * 2006-04-26 2007-10-31 碁成科技股份有限公司 功率芯片的封装制程
CN101364622A (zh) * 2007-08-08 2009-02-11 高侨自动化科技股份有限公司 高功率led封装结构
US20090059583A1 (en) * 2007-08-28 2009-03-05 Chi-Yuan Hsu Package Structure for a High-Luminance Light Source
CN201190979Y (zh) * 2008-03-19 2009-02-04 和谐光电科技（泉州）有限公司 高散热性的led发光装置

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WO2012040957A1 (zh) 2012-04-05

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Application publication date: 20110615