CN201717286U - Led光源模块封装结构 - Google Patents

Led光源模块封装结构 Download PDF

Info

Publication number
CN201717286U
CN201717286U CN2010202447892U CN201020244789U CN201717286U CN 201717286 U CN201717286 U CN 201717286U CN 2010202447892 U CN2010202447892 U CN 2010202447892U CN 201020244789 U CN201020244789 U CN 201020244789U CN 201717286 U CN201717286 U CN 201717286U
Authority
CN
China
Prior art keywords
light source
source module
reflector
led
led light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010202447892U
Other languages
English (en)
Inventor
何文铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujian Wanban optoelectronic Technology Co., Ltd.
Original Assignee
FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd filed Critical FUJIAN ZHONGKEWANBANG PHOTOELECTRIC SHARES Co Ltd
Priority to CN2010202447892U priority Critical patent/CN201717286U/zh
Application granted granted Critical
Publication of CN201717286U publication Critical patent/CN201717286U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本实用新型提供了一种LED光源模块封装结构，属于照明设备的加工领域，其包括一具有反光杯的底座，底座的反光杯底部中央设有若干LED芯片，该LED芯片通过绝缘胶粘在底座的反光杯的底部中央，所述LED芯片的上表面涂敷有一胶水与荧光粉混合层，所述底座上还设有两个小凹槽，凹槽内设有绝缘片，所述若干LED芯片经串联或并联连接后引出至绝缘片上的正负极。

Description

LED光源模块封装结构
【技术领域】
本实用新型涉及一种照明设备，尤其涉及一种LED光源模块封装结构。
【背景技术】
LED是一种低电压光源，由于其省电、寿命长，现已被广泛应用于各种低压照明装置，但由于LED的低电压特性，使其不能安全地使用于各种特殊的照明领域，特别是很多高压照明的领域，如需要使用在高压照明的领域，需要配置变压器等装置，大大增加了使用成本，十分不方便。
【实用新型内容】
本实用新型要解决的技术问题，在于提供一种能够过3KV高压的LED光源模块封装结构。
本实用新型是这样实现的：一种LED光源模块封装结构，包括一具有反光杯的底座，底座的反光杯底部中央设有若干LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部中央，其特征在于：所述LED芯片的上表面涂敷有一胶水与荧光粉混合层。
所述底座上还设有两个小凹槽，凹槽内设有绝缘片，所述若干LED芯片经串联或并联连接后引出至绝缘片上的正负极。
所述底座的上表面设有一镀银层。
所述绝缘片为玻璃纤维片。
所述底座和反光杯均为圆形。
本实用新型具有如下优点：采用上述底座配合LED芯片的封装结构，，能将芯片内部发出的高热量很好传导出来，大大提高了散热性能，因此可以使用在各种高压照明灯具中，并保持良好的使用寿命。
【附图说明】
下面参照附图结合实施例对本实用新型作进一步的说明。
图1是本实用新型LED光源模块封装结构示意图。
图2是图1的A-A剖视图。
【具体实施方式】
请参阅图1至图2所示，本实用新型的LED光源模块封装结构，包括底座1、LED芯片2、绝缘胶3、胶水与荧光粉混合层4、镀银层5、绝缘片6。
所述底座1包括一反光杯11和两个小凹槽12，所述底座1和反光杯11均为圆形，所述底座1为铜制一体成型，其上表面有一镀银层5，反光杯11底部中央设有若干LED芯片2，该LED芯片2通过绝缘胶3粘在反光杯11的底部中央，所述LED芯片2的上表面涂敷有一胶水与荧光粉混合层4，所述底座1上还设有两个小凹槽12，凹槽12内设有由玻璃纤维片制成的绝缘片6，所述若干LED芯片用导线21经串联或并联连接后引出至绝缘片6上的正负极。
采用上述封装方式制成的LED光源模块，由于采用绝缘胶、镀银层和铜底座相结合的散热方式，可以使整个LED模块的散热性能极大地提高，因此可以过3KV高压，方便地使用在各种高压照明设备上，具有较高的经济价值。

Claims (5)

1.一种LED光源模块封装结构，包括一具有反光杯的底座，底座的反光杯底部中央设有若干LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部中央，其特征在于：所述LED芯片的上表面涂敷有一胶水与荧光粉混合层。
2.根据权利要求1所述的LED光源模块封装结构，其特征在于：所述底座上还设有两个小凹槽，凹槽内设有绝缘片，所述若干LED芯片经串联或并联连接后引出至绝缘片上的正负极。
3.根据权利要求1或2所述的LED光源模块封装结构，其特征在于：所述底座的上表面设有一镀银层。
4.根据权利要求2所述的LED光源模块封装结构，其特征在于：所述绝缘片为玻璃纤维片。
5.根据权利要求1所述的LED光源模块封装结构，其特征在于：所述底座和反光杯均为圆形。
CN2010202447892U 2010-07-01 2010-07-01 Led光源模块封装结构 Expired - Fee Related CN201717286U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202447892U CN201717286U (zh) 2010-07-01 2010-07-01 Led光源模块封装结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202447892U CN201717286U (zh) 2010-07-01 2010-07-01 Led光源模块封装结构

Publications (1)

Publication Number Publication Date
CN201717286U true CN201717286U (zh) 2011-01-19

Family

ID=43463292

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202447892U Expired - Fee Related CN201717286U (zh) 2010-07-01 2010-07-01 Led光源模块封装结构

Country Status (1)

Country Link
CN (1) CN201717286U (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102287663A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 高白度基板led光源单杯模块
CN102287662A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 镀陶瓷层基板led光源单杯模块
CN102322619A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 Led光源单杯模块用底座

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102287663A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 高白度基板led光源单杯模块
CN102287662A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 镀陶瓷层基板led光源单杯模块
CN102322619A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 Led光源单杯模块用底座

Similar Documents

Publication Publication Date Title
CN203288644U (zh) 一种分布式高压led模组
CN102102862B (zh) 一种微体积多led集成单元的封装方法
CN101958387A (zh) 新型led光源模组封装结构
CN201717286U (zh) Led光源模块封装结构
CN103413805A (zh) 可调光led灯丝制造工艺
CN203150541U (zh) 一种基于cob封装的led光源
CN203453855U (zh) 可调光led灯丝
CN102738136A (zh) 分布式高压led模组
CN203481270U (zh) Led封装结构
CN201758139U (zh) 新型led光源模组封装结构
CN202633304U (zh) 分布式高压led模组
CN201884982U (zh) 新型led光源模组封装结构
CN102005445A (zh) Led光源模块封装结构
CN201887044U (zh) Led光源模组封装结构
CN203322806U (zh) 一种线性发光的led光源模组
CN202473920U (zh) 一种高压led芯片和驱动电源芯片集成封装结构
CN201681972U (zh) 一种采用透明水晶玻璃封装的发光二极管
CN203118943U (zh) 一种cob灯源板结构
CN201513764U (zh) 一种新型多晶片贴片式大功率led的封装结构
CN201916724U (zh) 一种微体积高亮度的多led集成发光单元
CN201820757U (zh) Led光源模块封装结构
CN201820785U (zh) 高散热led光源模块封装结构
CN203850333U (zh) 一种全角度发光led白光光源
CN202888242U (zh) 一种led发光结构
CN203641936U (zh) 一种led球泡灯

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: FUJIAN WANBAN OPTOELECTRONICS TECHNOLOGY CO., LTD.

Free format text: FORMER OWNER: FUJIAN ZHONGKE WANBAN OPTRONICS CO., LTD.

Effective date: 20110322

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20110322

Address after: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District

Patentee after: Fujian Wanban optoelectronic Technology Co., Ltd.

Address before: Gao Village of Huating town of Putian city in 351100 in Fujian Province, Chengxiang District

Patentee before: Fujian Zhongkewanbang Photoelectric Shares Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110119

Termination date: 20150701

EXPY Termination of patent right or utility model