CN102072422A - 大功率led光源模块封装结构 - Google Patents

大功率led光源模块封装结构 Download PDF

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CN102072422A
CN102072422A CN201010299568XA CN201010299568A CN102072422A CN 102072422 A CN102072422 A CN 102072422A CN 201010299568X A CN201010299568X A CN 201010299568XA CN 201010299568 A CN201010299568 A CN 201010299568A CN 102072422 A CN102072422 A CN 102072422A
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reflector
source module
light source
led chip
wiring board
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CN102072422B (zh
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何文铭
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MCOB OPTOELECTRONICS TECHNOLOGY CO., LTD.
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FUJIAN WANBAN OPTOELECTRONIC TECHNOLOGY Co Ltd
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Priority to PCT/CN2010/078626 priority patent/WO2012040959A1/zh
Priority to EP10857722.2A priority patent/EP2657968A1/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本发明提供了一种大功率LED光源模块封装结构，属于照明设备的加工领域，其包括一具有若干反光杯的底座，反光杯底部设有至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部，其特征在于：所述底座的中央嵌设有一线路板，反光杯的侧壁上设有一开口，该线路板延伸至侧壁的开口内，LED芯片通过导线连接至线路板，所述反光杯内的LED芯片和延伸进反光杯开口内的线路板的上方涂敷有一胶水与荧光粉混合层。

Description

大功率LED光源模块封装结构
【技术领域】
本发明涉及一种照明设备，尤其涉及一种大功率LED光源模块。
【背景技术】
LED是一种低电压光源，由于其省电、寿命长，现已被广泛应用于各种低压照明装置，传统的LED光源模块封装结构一般包括一具有反光杯的金属底座，在底座的反光杯底部中央设有若干LED芯片，该LED芯片通过焊接方式或者绝缘胶均匀地粘在反光杯的底部中央，LED芯片之间通过导线相串联或者并联后引出，连接至设置在金属底座上的反光杯外部的线路板，再将LED芯片的上表面涂敷一胶水与荧光粉混合层后使LED芯片被完全覆盖在混合层内部。上述传统的LED光源模块封装结构中，由于LED芯片和线路板之间需要有引线相连接，但LED芯片设置在反光杯内部，而线路板又设置在反光杯之外，因此在生产的过程中，很容易使LED芯片和线路板之间的引线因人为碰断而损坏，大大降低了生产效率，并且生产工序也变得更为复杂，增加生产成本。
【发明内容】
本发明要解决的技术问题，在于提供一种能够简化生产工序，节省生产成本的新型LED光源模块封装结构。
本发明是这样实现的：一种大功率LED光源模块封装结构，包括一具有若干反光杯的底座，反光杯底部设有至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部，其特征在于：所述底座的中央嵌设有一线路板，反光杯的侧壁上设有一开口，该线路板延伸至侧壁的开口内，LED芯片通过导线连接至线路板，所述反光杯内的LED芯片和延伸进反光杯开口内的线路板的上方涂敷有一胶水与荧光粉混合层。
所述线路板由一玻纤板层和一线路层压合在一起组成，线路层上表面还涂覆有一层反光白漆。
所述底座的上表面设有一电镀的反光层。
所述底座和反光杯均为圆形。
所述反光杯为6个，所述线路板呈“王”字型。
本发明具有如下优点：采用上述将LED芯片和延伸进反光杯的开口处的线路板以及它们之间的导线，全部封装在胶水与荧光粉混合层下面的反射杯内部的封装结构，可以在LED芯片封装的工序中就可以直接一步完成，大大提高了生产效率，减少生产过程中导线的损坏，节省了生产成本。
【附图说明】
下面参照附图结合实施例对本发明作进一步的说明。
图1是本发明的整体结构示意图。
图2是本发明底座、线路板和LED芯片之间的结构示意图。
图3是图2的A-A剖视图。
图4是图2的B-B剖视图。
【具体实施方式】
下面结合具体实施例来对本发明进行详细的说明。
请参阅图1至图4所示，是本发明所述的一种大功率LED光源模块封装结构，包括底座11、LED芯片12、绝缘胶13、胶水与荧光粉混合层14、反光杯15、线路板16、开口17、反光层18、导线19。
所述底座11上均匀地设有6个反光杯，本实施例中的底座11和反光杯15均为圆形，所述底座11为铜制一体成型压铸而成，其上表面有一电镀的反光层18，在本实施例中该反光层18为镀银层，反光杯15的底部设有若干LED芯片12，这些LED芯片12通过绝缘胶13粘在反光杯15的底部，其特征在于：所述底座11的中央嵌设有一线路板16，反光杯15的侧壁上设有一开口17，该线路板16延伸至侧壁的开口17内，LED芯片12通过导线19连接至线路板16，所述反光杯15内的LED芯片12和延伸进反光杯15的开口17内的线路板16的上方涂敷有一胶水与荧光粉混合层14。所述线路板16呈“王”字型，并且为多层结构，由一玻纤板层161和一线路层162压合在一起组成，线路层162上表面还涂覆有一层反光白漆163。
上述实施例中，所述底座也不局限于圆形，可以做成方形或者长条形等形状，仍然可以达到前述的发明目的。

Claims (5)

1.一种大功率LED光源模块封装结构，包括一具有若干反光杯的底座，反光杯底部设有至少一个LED芯片，该LED芯片通过绝缘胶粘在反光杯的底部，其特征在于：所述底座的中央嵌设有一线路板，反光杯的侧壁上设有一开口，该线路板延伸至侧壁的开口内，LED芯片通过导线连接至线路板，所述反光杯内的LED芯片和延伸进反光杯开口内的线路板的上方涂敷有一胶水与荧光粉混合层。
2.根据权利要求1所述的大功率LED光源模块封装结构，其特征在于：所述线路板由一玻纤板层和一线路层压合在一起组成，线路层上表面还涂覆有一层反光白漆。
3.根据权利要求1所述的大功率LED光源模块封装结构，其特征在于：所述底座的上表面设有一电镀的反光层。
4.根据权利要求1所述的大功率LED光源模块封装结构，其特征在于：所述底座和反光杯均为圆形。
5.根据权利要求1所述的大功率LED光源模块封装结构，其特征在于：所述反光杯为6个，所述线路板呈“王”字型。
CN201010299568.XA 2010-09-30 2010-09-30 大功率led光源模块封装结构 Expired - Fee Related CN102072422B (zh)

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CN201010299568.XA CN102072422B (zh) 2010-09-30 2010-09-30 大功率led光源模块封装结构
PCT/CN2010/078626 WO2012040959A1 (zh) 2010-09-30 2010-11-11 大功率led光源模块封装结构
EP10857722.2A EP2657968A1 (en) 2010-09-30 2010-11-11 Package structure of high-power led light source module

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Cited By (21)

* Cited by examiner, † Cited by third party
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CN102244074A (zh) * 2011-06-22 2011-11-16 福建省万邦光电科技有限公司 凸杯结构led光源模组封装结构
CN102287661A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 镀陶瓷层基板led筒灯
CN102287658A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 带镂空散热器的镀陶瓷层基板led球泡灯
CN102287664A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 高白度基板led光源多杯模块
CN102287777A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 Led光源多杯模块用底座
CN102287659A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 带镂空散热器的高白度基板led球泡灯
CN102287660A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 带塑料外壳的高白度基板led球泡灯
CN102287672A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 镀陶瓷层基板led光源模组
CN102287671A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 高白度基板led灯条
CN102287776A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 Led光源模组用镀陶瓷层底座
CN102306647A (zh) * 2011-09-09 2012-01-04 福建省万邦光电科技有限公司 镀陶瓷层基板led光源多杯模块
CN102315208A (zh) * 2011-09-09 2012-01-11 福建省万邦光电科技有限公司 带有镶嵌陶瓷板的led光源封装结构
CN102313256A (zh) * 2011-09-09 2012-01-11 福建省万邦光电科技有限公司 Led光源多杯模块用镀陶瓷层底座
CN102322580A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 高白度基板led球泡灯
CN102322618A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 Led光源模组用底座
CN102322582A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 高白度基板led筒灯
CN102322590A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 镀陶瓷层基板led灯条
CN102322579A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 镀陶瓷层基板led球泡灯
CN102322578A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 带塑料外壳的镀陶瓷层基板led球泡灯
CN102593325A (zh) * 2012-03-10 2012-07-18 江苏索尔光电科技有限公司 一种led光源模组封装结构
CN102856311A (zh) * 2012-03-22 2013-01-02 创维液晶器件(深圳)有限公司 Led封装模块及封装方法

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CN102322618A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 Led光源模组用底座
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CN102322590A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 镀陶瓷层基板led灯条
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