WO2012040959A1 - 大功率led光源模块封装结构 - Google Patents

大功率led光源模块封装结构 Download PDF

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Publication number
WO2012040959A1
WO2012040959A1 PCT/CN2010/078626 CN2010078626W WO2012040959A1 WO 2012040959 A1 WO2012040959 A1 WO 2012040959A1 CN 2010078626 W CN2010078626 W CN 2010078626W WO 2012040959 A1 WO2012040959 A1 WO 2012040959A1
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Prior art keywords
circuit board
light source
reflector
source module
package structure
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Application number
PCT/CN2010/078626
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English (en)
French (fr)
Inventor
何文铭
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福建中科万邦光电股份有限公司
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Priority to EP10857722.2A priority Critical patent/EP2657968A1/en
Publication of WO2012040959A1 publication Critical patent/WO2012040959A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Definitions

  • the invention relates to a lighting device, in particular to a high power LED light source module. Background technique
  • the traditional LED light source module package structure generally includes a metal base with a reflective cup, and a reflective cup at the base. There are a plurality of LED chips in the center of the bottom. The LED chips are uniformly adhered to the center of the bottom of the reflector by soldering or insulating glue. The LED chips are connected in series or in parallel through the wires, and connected to the reflector disposed on the metal base.
  • the external circuit board is coated with a glue and a phosphor mixed layer on the upper surface of the LED chip to completely cover the inside of the mixed layer.
  • the technical problem to be solved by the present invention is to provide a novel LED light source module package structure which can simplify the production process and save production cost.
  • a high-power LED light source module package structure includes a base having a plurality of reflector cups, and at least one LED chip is disposed at the bottom of the reflector cup, and the LED chip is adhered to the bottom of the reflector through an insulating glue, wherein a circuit board is embedded in the center of the base, and an opening is formed in the side wall of the reflector, the circuit board extends into the opening of the side wall, and the LED chip is connected to the circuit board through a wire, and the LED chip in the reflective cup A glue and phosphor mixed layer is applied over the circuit board extending into the opening of the reflector.
  • the circuit board is composed of a fiberglass board layer and a line laminated together, and the circuit layer is on the upper surface The surface is also coated with a layer of reflective white paint.
  • the upper surface of the base is provided with an electroplated reflective layer.
  • the base and the reflector are both circular.
  • the invention has the following advantages: the above-mentioned LED chip and the circuit board extending into the opening of the reflector cup and the wires between them are all encapsulated in the inside of the reflector cup under the glue and phosphor mixed layer, and can be in the LED
  • the chip packaging process can be completed in one step, greatly improving production efficiency, reducing wire damage during production, and saving production costs.
  • Figure 2 is a schematic view showing the structure between the base, the wiring board and the LED chip of the present invention.
  • Figure 3 is a cross-sectional view taken along line A-A of Figure 2;
  • Fig. 4 is a cross-sectional view taken along line BB of Fig. 2;
  • a high-power LED light source module package structure includes a base 11, an LED chip 12, an insulating glue 13, a glue and phosphor mixed layer 14, a reflector cup 15, The circuit board 16, the opening 17, the light reflecting layer 18, and the wire 19.
  • the base 11 is provided with six reflectors, and the base 11 and the reflector 15 are circular in the embodiment.
  • the base 11 is integrally formed by die-casting of copper, and the upper surface thereof is plated.
  • the light reflecting layer 18 is a silver plating layer.
  • the bottom of the reflector cup 15 is provided with a plurality of LED chips 12, and the LED chips 12 are adhered to the bottom of the reflector cup 15 by an insulating glue 13, and are characterized by:
  • a circuit board 16 is embedded in the center of the base 11.
  • the side wall of the reflector 15 is provided with an opening 17 extending into the opening 17 of the side wall.
  • the LED chip 12 is connected to the circuit board 16 through the wire 19.
  • the LED chip 12 in the reflector 15 and the circuit board 16 extending into the opening 17 of the reflector 15 are coated with a glue.
  • the circuit board 16 has a "king" shape and is a multi-layer structure, which is composed of a fiberglass board layer 161 and a circuit layer 162.
  • the upper surface of the circuit layer 162 is also coated with a layer of reflective white paint 163. .

Description

Figure imgf000003_0001
大功率 LED光源模块封装结构 技术领域
本发明涉及一种照明设备， 尤其涉及一种大功率 LED光源模块。 背景技术
LED是一种低电压光源， 由于其省电、 寿命长， 现已被广泛应用于 各种低压照明装置，传统的 LED光源模块封装结构一般包括一具有反光 杯的金属底座， 在底座的反光杯底部中央设有若干 LED芯片， 该 LED 芯片通过焊接方式或者绝缘胶均匀地粘在反光杯的底部中央， LED芯片 之间通过导线相串联或者并联后引出， 连接至设置在金属底座上的反光 杯外部的线路板，再将 LED芯片的上表面涂敷一胶水与荧光粉混合层后 使 LED芯片被完全覆盖在混合层内部。 上述传统的 LED光源模块封装 结构中， 由于 LED芯片和线路板之间需要有引线相连接， 但 LED芯片 设置在反光杯内部， 而线路板又设置在反光杯之外， 因此在生产的过程 中，很容易使 LED芯片和线路板之间的引线因人为碰断而损坏， 大大降 低了生产效率， 并且生产工序也变得更为复杂， 增加生产成本。 发明内容
本发明要解决的技术问题， 在于提供一种能够简化生产工序， 节省 生产成本的新型 LED光源模块封装结构。
本发明是这样实现的： 一种大功率 LED光源模块封装结构， 包括一 具有若干反光杯的底座， 反光杯底部设有至少一个 LED芯片， 该 LED 芯片通过绝缘胶粘在反光杯的底部， 其中： 所述底座的中央嵌设有一线 路板，反光杯的侧壁上设有一开口，该线路板延伸至侧壁的开口内， LED 芯片通过导线连接至线路板，所述反光杯内的 LED芯片和延伸进反光杯 开口内的线路板的上方涂敷有一胶水与荧光粉混合层。
所述线路板由一玻纤板层和一线路层压合在一起组成， 线路层上表 面还涂覆有一层反光白漆。
所述底座的上表面设有一电镀的反光层。
所述底座和反光杯均为圓形。
所述反光杯为 6个， 所述线路板呈 "王" 字型。
本发明具有如下优点：采用上述将 LED芯片和延伸进反光杯的开口 处的线路板以及它们之间的导线， 全部封装在胶水与荧光粉混合层下面 的反射杯内部的封装结构，可以在 LED芯片封装的工序中就可以直接一 步完成， 大大提高了生产效率， 减少生产过程中导线的损坏， 节省了生 产成本。 附图说明
下面参照附图结合实施例对本发明作进一步的说明。
图 1是本发明的整体结构示意图。
图 2是本发明底座、 线路板和 LED芯片之间的结构示意图。
图 3是图 2的 A-A剖视图。
图 4是图 2的 B-B剖视图。
Figure imgf000004_0001
请参阅图 1至图 4所示，是本发明所述的一种大功率 LED光源模块 封装结构， 包括底座 11、 LED芯片 12、 绝缘胶 13、 胶水与荧光粉混合 层 14、 反光杯 15、 线路板 16、 开口 17、 反光层 18、 导线 19。
所述底座 11上均勾地设有 6个反光杯， 本实施例中的底座 11和反 光杯 15均为圓形， 所述底座 11为铜制一体成型压铸而成， 其上表面有 一电镀的反光层 18, 在本实施例中该反光层 18为镀银层， 反光杯 15的 底部设有若干 LED芯片 12, 这些 LED芯片 12通过绝缘胶 13粘在反光 杯 15的底部， 其特征在于： 所述底座 11的中央嵌设有一线路板 16, 反光杯 15的侧壁上设有一开口 17, 该线路板 16延伸至侧壁的开口 17 内， LED芯片 12通过导线 19连接至线路板 16,所述反光杯 15内的 LED 芯片 12和延伸进反光杯 15的开口 17内的线路板 16的上方涂敷有一胶 水与荧光粉混合层 14。 所述线路板 16呈 "王" 字型， 并且为多层结构， 由一玻纤板层 161和一线路层 162压合在一起组成， 线路层 162上表面 还涂覆有一层反光白漆 163。
上述实施例中， 所述底座也不局限于圓形， 可以做成方形或者长条 形等形状， 仍然可以达到前述的发明目的。

Claims

权 利 要 求 书
1、 一种大功率 LED光源模块封装结构， 包括一具有若干反光杯的 底座， 反光杯底部设有至少一个 LED芯片， 该 LED芯片通过绝缘胶粘 在反光杯的底部， 其特征在于： 所述底座的中央嵌设有一线路板， 反光 杯的侧壁上设有一开口， 该线路板延伸至侧壁的开口内， LED芯片通过 导线连接至线路板，所述反光杯内的 LED芯片和延伸进反光杯开口内的 线路板的上方涂敷有一胶水与荧光粉混合层。
2、 根据权利要求 1所述的大功率 LED光源模块封装结构， 其特征 在于： 所述线路板由一玻纤板层和一线路层压合在一起组成， 线路层上 表面还涂覆有一层反光白漆。
3、 根据权利要求 1所述的大功率 LED光源模块封装结构， 其特征 在于： 所述底座的上表面设有一电镀的反光层。
4、 根据权利要求 1所述的大功率 LED光源模块封装结构， 其特征 在于： 所述底座和反光杯均为圓形。
5、 根据权利要求 1所述的大功率 LED光源模块封装结构， 其特征 在于： 所述反光杯为 6个， 所述线路板呈 "王" 字型。
PCT/CN2010/078626 2010-09-30 2010-11-11 大功率led光源模块封装结构 WO2012040959A1 (zh)

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Application Number Priority Date Filing Date Title
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CN201010299568.X 2010-09-30
CN201010299568.XA CN102072422B (zh) 2010-09-30 2010-09-30 大功率led光源模块封装结构

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CN102322582A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 高白度基板led筒灯
CN102306647A (zh) * 2011-09-09 2012-01-04 福建省万邦光电科技有限公司 镀陶瓷层基板led光源多杯模块
CN102287664A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 高白度基板led光源多杯模块
CN102287672A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 镀陶瓷层基板led光源模组
CN102287777A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 Led光源多杯模块用底座
CN102313256A (zh) * 2011-09-09 2012-01-11 福建省万邦光电科技有限公司 Led光源多杯模块用镀陶瓷层底座
CN102322618A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 Led光源模组用底座
CN102322590A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 镀陶瓷层基板led灯条
CN102322580A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 高白度基板led球泡灯
CN102287776A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 Led光源模组用镀陶瓷层底座
CN102287658A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 带镂空散热器的镀陶瓷层基板led球泡灯
CN102322579A (zh) * 2011-09-09 2012-01-18 福建省万邦光电科技有限公司 镀陶瓷层基板led球泡灯
CN102287661A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 镀陶瓷层基板led筒灯
CN102287659A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 带镂空散热器的高白度基板led球泡灯
CN102287660A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 带塑料外壳的高白度基板led球泡灯
CN102315208A (zh) * 2011-09-09 2012-01-11 福建省万邦光电科技有限公司 带有镶嵌陶瓷板的led光源封装结构
CN102287671A (zh) * 2011-09-09 2011-12-21 福建省万邦光电科技有限公司 高白度基板led灯条
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CN102856311B (zh) * 2012-03-22 2015-09-30 创维液晶器件(深圳)有限公司 Led封装模块及封装方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2613048Y (zh) * 2003-04-07 2004-04-21 熊麒 点矩阵发光二极管的组合结构
JP2004241509A (ja) * 2003-02-04 2004-08-26 Matsushita Electric Ind Co Ltd Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
CN1734762A (zh) * 2005-08-08 2006-02-15 佰鸿工业股份有限公司 矩阵式发光二极体及其制造方法
CN200969350Y (zh) * 2006-06-20 2007-10-31 常州东村电子有限公司 集成式功率型发光二极管封装结构
CN101728366A (zh) * 2008-10-22 2010-06-09 先进开发光电股份有限公司 光电元件封装模块及其制造方法
CN201535483U (zh) * 2009-07-13 2010-07-28 福建中科万邦光电股份有限公司 一种新型串、并联的led封装底座

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332412A (ja) * 2005-05-27 2006-12-07 Rohm Co Ltd 受光装置
CN201039523Y (zh) * 2007-04-27 2008-03-19 宁波升谱光电半导体有限公司 一种高显色指数的大功率白光led器件
CN101608747A (zh) * 2008-06-16 2009-12-23 台湾应解股份有限公司 发光二极管灯具模块
CN101684933B (zh) * 2008-09-28 2013-08-28 红蝶科技(深圳)有限公司 一种白光发光二极管封装结构及其封装方法
CN201293291Y (zh) * 2008-11-26 2009-08-19 吴述强 Led微波感应灯
CN201318636Y (zh) * 2008-11-26 2009-09-30 广州硅芯电子科技有限公司 一种led-ic封装灯
CN101539254B (zh) * 2009-05-08 2010-07-21 罗本杰 一种高功率led光源的反光、散热基座
CN101807658B (zh) * 2010-03-25 2012-11-21 福建中科万邦光电股份有限公司 一种大功率led封装方法
CN201887045U (zh) * 2010-09-30 2011-06-29 福建省万邦光电科技有限公司 大功率led光源模块封装结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241509A (ja) * 2003-02-04 2004-08-26 Matsushita Electric Ind Co Ltd Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
CN2613048Y (zh) * 2003-04-07 2004-04-21 熊麒 点矩阵发光二极管的组合结构
CN1734762A (zh) * 2005-08-08 2006-02-15 佰鸿工业股份有限公司 矩阵式发光二极体及其制造方法
CN200969350Y (zh) * 2006-06-20 2007-10-31 常州东村电子有限公司 集成式功率型发光二极管封装结构
CN101728366A (zh) * 2008-10-22 2010-06-09 先进开发光电股份有限公司 光电元件封装模块及其制造方法
CN201535483U (zh) * 2009-07-13 2010-07-28 福建中科万邦光电股份有限公司 一种新型串、并联的led封装底座

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