WO2012006817A1 - Led光源模块封装结构 - Google Patents

Led光源模块封装结构 Download PDF

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Publication number
WO2012006817A1
WO2012006817A1 PCT/CN2010/077507 CN2010077507W WO2012006817A1 WO 2012006817 A1 WO2012006817 A1 WO 2012006817A1 CN 2010077507 W CN2010077507 W CN 2010077507W WO 2012006817 A1 WO2012006817 A1 WO 2012006817A1
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WO
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Prior art keywords
light source
source module
base
led light
reflector
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Application number
PCT/CN2010/077507
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English (en)
French (fr)
Inventor
何文铭
Original Assignee
福建中科万邦光电股份有限公司
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Publication of WO2012006817A1 publication Critical patent/WO2012006817A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the utility model relates to a lighting device, in particular to an LED light source module. Background technique
  • the traditional LED light source module package structure generally includes a metal base with a reflective cup, and a reflective cup at the base.
  • a plurality of LED chips are arranged in the center of the bottom, and the LED chips are uniformly adhered to the center of the bottom of the reflector by soldering or insulating glue.
  • the LED chips are connected in series or in parallel through the wires, and are connected to the reflector disposed on the metal base.
  • the external circuit board is coated with a glue and a phosphor mixed layer on the upper surface of the LED chip to completely cover the inside of the mixed layer.
  • the technical problem to be solved by the utility model is to provide a novel LED light source module package structure capable of tube production process and saving production cost.
  • a novel LED light source module packaging structure comprises a base with a reflector cup, and at least one LED chip is arranged in the center of the bottom of the reflector cup of the base, and the LED chip is adhered to the bottom of the reflector through an insulating glue.
  • the upper surface of the LED chip is coated with a glue and phosphor mixed layer, wherein: a small hole is formed in the bottom or side wall of the reflector of the base, and the LED chip is connected to the wire and protrudes through the small hole. The outside of the base.
  • An insulating sheet is disposed in the small hole of the base, and the LED chips are connected in series or in parallel. Out of the insulating sheet, the insulating sheet is connected to the small hole through the connecting wire.
  • the insulating sheet is provided with a circuit board, the LED chip is connected to the circuit board, and the circuit board on the insulating sheet is connected to the small hole through the connecting wire.
  • the bottom of the reflector cup is provided with a plurality of small reflector cups, and the LED chips are all mounted in a small reflector cup, and the LED chips are connected in series or in parallel by wires.
  • the upper surface of the base is provided with an electroplated reflective layer.
  • the insulating sheet is a glass fiber sheet.
  • the base and the reflector are both circular.
  • the utility model has the following advantages:
  • the package structure in which the LED chip and the circuit board and the wires between them are all encapsulated inside the reflective cup below the glue and phosphor mixed layer can be used in the process of LED chip packaging. Directly completed in one step, greatly improving production efficiency, reducing wire damage during production, and saving production costs.
  • FIG. 1 is a schematic view showing the overall structure of a first embodiment of the present invention.
  • Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1;
  • FIG. 3 is a perspective view showing the structure of a metal base according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic view showing the overall structure of a second embodiment of the present invention.
  • Figure 5 is a cross-sectional view taken along line B-B of Figure 4 .
  • FIG. 6 is a perspective view showing the structure of a metal base according to a second embodiment of the present invention. detailed description
  • FIG. 1 to FIG. 3 is a novel LED light source module package structure according to the first embodiment of the present invention, comprising a base 11 , an LED chip 12 , an insulating glue 13 , a glue and a phosphor mixed layer 14 , Reflector 15, circuit board 16, aperture 17, reflective layer 18.
  • the base 11 is provided with a reflector cup 15 and a small hole 17.
  • the base 11 and the reflector 15 are circular in the embodiment, and the base 11 is integrally formed of copper, and has an upper surface.
  • the reflective layer 18 is a silver-plated layer.
  • the center of the bottom of the reflector 15 is provided with a hole 17 and a plurality of LED chips 12 are disposed around the hole 17.
  • the LED chips 12 are provided.
  • the upper surface of the LED chip 12 is coated with a glue and phosphor mixed layer 14 to cover the LED chip 12 and the small hole 17 , and the small hole 17 is further covered by the insulating paste 13 .
  • the LED chips 12 are connected to the circuit board 16 by wires in series or in parallel to form positive and negative electrodes.
  • FIG. 4 to FIG. 6 is a novel LED light source module package structure according to a second embodiment of the present invention, comprising a base 21 , an LED chip 22 , an insulating glue 23 , a glue and a phosphor mixed layer 24 , Large reflector cup 25, circuit board 26, aperture 27, reflective layer 28, and small reflector cup 29.
  • the base 21 of the base 21 is provided with a reflector cup 25 and a small hole 27.
  • the base 21 and the reflector cup 21 in this embodiment are both circular.
  • the base 21 is integrally formed of copper, and the upper surface thereof is plated with reflective light.
  • the reflective layer is a silver-plated layer, and a small hole 27 is formed in the center of the bottom of the reflector 25.
  • the small hole 27 is provided with a plurality of small reflectors 29, and each of the small reflectors 29 is provided.
  • the LED chips 22 are mounted. The LED chips 22 are adhered to the bottom of the small reflector cup 29 by an insulating glue 23.
  • each LED chip 22 is coated with a glue and phosphor mixed layer 24, and each LED chip 22 is entirely Covered, a position of the circuit board 26 is reserved in the small hole 27, and after the circuit board 26 is installed in the small hole 27, the LED chips 22 are connected in series or parallel through the wires, and then connected to the line.
  • the plate 16 forms a positive and a negative electrode.
  • an insulating sheet may be disposed only in the small hole for the LED chip to be taken out of the connecting line, and the LED chips are connected in series or in parallel and then led out to the insulating sheet by wires, and then the lead wires are led out from the insulating sheet to the circuit board.
  • the board can be placed outside the base.
  • the small hole may be disposed not only in the center of the bottom of the reflector cup or any other position, but also on the side wall of the reflector cup, and then all the LED chips are connected in series and then lead to the small hole on the side wall. It can be used inside, so that it can still achieve the purpose of avoiding the damage of the LED chip wire in the production process.
  • the base is not limited to a circular shape, and may be formed into a square shape or a long strip shape, and the foregoing utility model object can still be achieved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED光源模块封装结构包括具有反光杯（15）的底座（11）。LED芯片（12）通过绝缘胶（13）设置在反光杯的底部中央。LED芯片的上表面涂覆有一胶水与荧光粉的混合层（14）。小孔（17）设置在反光杯的底部或侧壁。导线通过小孔连接LED芯片和底座的外部。

Description

Figure imgf000002_0001
LED光源模块封装结构 技术领域
本实用新型涉及一种照明设备， 尤其涉及一种 LED光源模块。 背景技术
LED是一种低电压光源， 由于其省电、 寿命长， 现已被广泛应用于各 种低压照明装置， 传统的 LED光源模块封装结构一般包括一具有反光杯的 金属底座， 在底座的反光杯底部中央设有若干 LED芯片， 该 LED芯片通过 焊接方式或者绝缘胶均匀地粘在反光杯的底部中央， LED 芯片之间通过导 线相串联或者并联后引出， 连接至设置在金属底座上的反光杯外部的线路 板，再将 LED芯片的上表面涂敷一胶水与荧光粉混合层后使 LED芯片被完 全覆盖在混合层内部。 上述传统的 LED光源模块封装结构中， 由于 LED芯 片和线路板之间需要有引线相连接， 但 LED芯片设置在反光杯内部， 而线 路板又设置在反光杯之外， 因此在生产的过程中， 很容易使 LED芯片和线 路板之间的引线因人为碰断而损坏， 大大降低了生产效率，并且生产工序也 变得更为复杂， 增加生产成本。 实用新型内容
本实用新型要解决的技术问题，在于提供一种能够筒化生产工序， 节省 生产成本的新型 LED光源模块封装结构。
本实用新型是这样实现的： 一种新型 LED光源模块封装结构， 包括一 具有反光杯的底座，底座的反光杯底部中央设有至少一个 LED芯片，该 LED 芯片通过绝缘胶粘在反光杯的底部， 所述 LED芯片的上表面涂敷有一胶水 与荧光粉混合层，其特征在于： 所述底座的反光杯底部或者侧壁上设有一小 孔， LED芯片连接导线后穿过该小孔伸出底座的外部。
所述底座的小孔内设有绝缘片， 所述 LED芯片经串联或并联连接后引 出至绝缘片， 绝缘片上再连接导线穿出该小孔。
所述绝缘片上设有线路板， 所述 LED芯片连接到该线路板上， 绝缘片 上的线路板再连接导线穿出该小孔。
所述反射杯的底部设有若干小反射杯， 所述 LED芯片均安装在小反射 杯内， LED芯片之间用导线串联或者并联。
所述底座的上表面设有一电镀的反光层。
所述绝缘片为玻璃纤维片。
所述底座和反光杯均为圓形。
本实用新型具有如下优点： 采用上述将 LED芯片和线路板以及它们之 间的导线， 全部封装在胶水与荧光粉混合层下面的反射杯内部的封装结构， 可以在 LED芯片封装的工序中就可以直接一步完成，大大提高了生产效率， 减少生产过程中导线的损坏， 节省了生产成本。 附图说明
下面参照附图结合实施例对本实用新型作进一步的说明。
图 1是本实用新型的实施例一的整体结构示意图。
图 2是图 1的 A-A剖视图。
图 3是本实用新型的实施例一的金属底座的立体结构示意图。
图 4是本实用新型的实施例二的整体结构示意图。
图 5是图 4的 B-B剖视图。
图 6是本实用新型的实施例二的金属底座的立体结构示意图。 具体实施方式
下面结合具体实施例来对本实用新型进行详细的说明。
请参阅图 1至图 3所示，是本实用新型的第一个实施例所述的新型 LED 光源模块封装结构， 包括底座 11、 LED芯片 12、 绝缘胶 13、 胶水与荧光粉 混合层 14、 反光杯 15、 线路板 16、 小孔 17、 反光层 18。
所述底座 11的中央设有一反光杯 15和一个小孔 17, 本实施例中的底 座 11和反光杯 15均为圓形， 所述底座 11为铜制一体成型， 其上表面有一 电镀的反光层 18, 在本实施例中该反光层为镀银层， 反光杯 15的底部中央 设有一'』、孔 17, 该小孔 17的周边设有若干 LED芯片 12, 这些 LED芯片 12通过绝缘胶 13粘在反光杯 15的底部， 所述 LED芯片 12的上表面涂敷 有一胶水与荧光粉混合层 14, 将 LED芯片 12和小孔 17全部盖住， 所述 小孔 17内还预留一线路板 16的位置，将线路板 16安装在小孔 17内后，所 述若干 LED芯片 12之间用导线经串联或并联后引出连接至线路板 16, 形 成正负极。
请参阅图 4至图 6所示，是本实用新型的第二个实施例所述的新型 LED 光源模块封装结构， 包括底座 21、 LED芯片 22、 绝缘胶 23、 胶水与荧光粉 混合层 24、 大反光杯 25、 线路板 26、 小孔 27、 反光层 28、 小反光杯 29。
所述底座 21的中央设有一反光杯 25和一个小孔 27, 本实施例中的底 座 21和反光杯 21均为圓形， 所述底座 21为铜制一体成型， 其上表面有一 电镀的反光层 28, 在本实施例中该反光层为镀银层， 反光杯 25的底部中央 设有一小孔 27, 该小孔 27的周边设有若干小反光杯 29, 每个小反光杯 29 内均安装有 LED芯片 22, 这些 LED芯片 22通过绝缘胶 23粘在小反光杯 29的底部，每个 LED芯片 22的上表面均涂敷有一胶水与荧光粉混合层 24, 将每个 LED芯片 22全部盖住， 所述小孔 27内还预留一线路板 26的位置， 将线路板 26安装在小孔 27内后，所述各 LED芯片 22之间用导线经串联或 并联后引出连接至线路板 16, 形成正负极。
上述两个实施例中， 也可以只在小孔内设置一绝缘片供 LED芯片引出 连接线用， 将 LED芯片串联或者并联后用导线引出至绝缘片上， 再从绝缘 片上引出导线至线路板， 则可以将线路板外置在底座之外。 另外， 所述小孔 不仅可以设置在反射杯的底部的中央或者其他任何位置，也可以设置在反射 杯的侧壁上，再将所有 LED芯片串并联后将导线引至侧壁上的小孔内即可， 这样依然可以实现避免在生产过程中 LED芯片的导线容易损坏碰断的实用 新型目的。同时所述底座也不局限于圓形，可以做成方形或者长条形等形状， 仍然可以达到前述的实用新型目的。

Claims

权 利 要 求 书
1、 一种新型 LED光源模块封装结构， 包括一具有反光杯的底座， 底座 的反光杯底部中央设有至少一个 LED芯片，该 LED芯片通过绝缘胶粘在反 光杯的底部， 所述 LED芯片的上表面涂敷有一胶水与荧光粉混合层， 其特 征在于： 所述底座的反光杯底部或者侧壁上设有一小孔， LED芯片连接导 线后穿过该 d、孔伸出底座的外部。
2、 根据权利要求 1所述的新型 LED光源模块封装结构， 其特征在于： 所述底座的小孔内设有绝缘片， 所述 LED芯片经串联或并联连接后引出至 绝缘片， 绝缘片上再连接导线穿出该小孔。
3、 根据权利要求 2所述的新型 LED光源模块封装结构， 其特征在于： 所述绝缘片上设有线路板， 所述 LED芯片连接到该线路板上， 绝缘片上的 线路板再连接导线穿出该小孔。
4、 根据权利要求 2所述的新型 LED光源模块封装结构， 其特征在于： 所述反射杯的底部设有若干小反射杯，所述 LED芯片均安装在小反射杯内， LED芯片之间用导线串联或者并联。
5、 根据权利要求 1所述的新型 LED光源模块封装结构， 其特征在于： 所述底座的上表面设有一电镀的反光层。
6、 根据权利要求 1所述的新型 LED光源模块封装结构， 其特征在于： 所述绝缘片为玻璃纤维片。
7、 根据权利要求 1所述的新型 LED光源模块封装结构， 其特征在于： 所述底座和反光杯均为圓形。
PCT/CN2010/077507 2010-07-16 2010-09-30 Led光源模块封装结构 WO2012006817A1 (zh)

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CN201020261518.8 2010-07-16

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Publication number Priority date Publication date Assignee Title
CN101958388A (zh) * 2010-07-16 2011-01-26 福建中科万邦光电股份有限公司 新型led光源模块封装结构

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CN101677116A (zh) * 2008-09-19 2010-03-24 上海科学院 一种led芯片的封装方法和封装模块

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CN101136445A (zh) * 2006-08-30 2008-03-05 牟小波 一种超大功率照明级发光二极管金属封装结构
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CN101182919A (zh) * 2007-12-17 2008-05-21 杨振行 大功率led灯
CN101677116A (zh) * 2008-09-19 2010-03-24 上海科学院 一种led芯片的封装方法和封装模块

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