CN100341629C - 使碳纳米管涂层形成图案的方法和碳纳米管布线 - Google Patents

使碳纳米管涂层形成图案的方法和碳纳米管布线 Download PDF

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CN100341629C
CN100341629C CNB038175029A CN03817502A CN100341629C CN 100341629 C CN100341629 C CN 100341629C CN B038175029 A CNB038175029 A CN B038175029A CN 03817502 A CN03817502 A CN 03817502A CN 100341629 C CN100341629 C CN 100341629C
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D·J·阿瑟
P·J·格拉特考斯基
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Abstract

一种用于制造纳米复合电极或电路图案的方法,包括形成浸渍有粘合剂的连续碳纳米管层以及使用各种印刷或光成像技术使粘合剂树脂形成图案。另一种方法包括使用各种印刷或光成像技术使碳纳米管层形成图案以及随后将连续的粘合剂树脂应用到有图案的碳纳米管层上。从这些有图案的纳米复合涂层制备的制品包括用于平板显示、光电、触摸屏、电致发光灯和EMI屏蔽的透明电极和电路。

Description

使碳纳米管涂层形成图案的方法和碳纳米管布线
相关申请的参考
本发明要求题为NT Mixture的美国临时申请60/381,809以及题为Patterning NT-Based Coatings的美国临时申请60/381,810的优先权,两者的申请日都为2002年5月21日。
技术领域
本发明涉及用于使碳纳米管涂层形成图案的方法以及由该方法制造的碳纳米管布线。
背景技术
包括半导体基装置以及更大型的布线电路的当前电子设备依赖于使用在半导体基材上形成的金属线或高杂质区域的传统布线技术。半导体基装置具有在半导体基材上形成的金属布线层以及在半导体基材表面上形成的相互连接的装置元件。金属层本身经常通过贯穿分隔金属层的绝缘层的通孔而互相连接。此外,掺杂有杂质的半导体基材部分在半导体表面上形成的元件内或这些元件之间的起着布线线路(wiring line)的作用。
虽然这些布线线路采用现代的光刻技术而制造得非常精美,因此半导体基装置都可制成小型的,但是该布线线路的制造需要膜形成以及只可在高真空下操作的处理技术。例如,金属如铝和铜在半导体基材上使用包括溅射和蒸发的物理汽相沉积技术形成。使用离子注入技术将杂质离子如硼和磷注射入半导体基材中以在基材上形成导电部分。无定形硅层通过化学气相沉积技术在基材上形成,然后通过退火转化成多晶硅以形成布线层。如上述形成的许多层和膜必需通过蚀刻工艺如反应性离子蚀刻获得的预定布线图案。真空程度可以取决于方法而不同,例如10-6托(溅射)到几个托(反应性离子蚀刻)。真空程度不管怎样,该仪器的安装和维护都很昂贵。此外,除由无机电极材料如氧化铟锡(ITO)制成的材料外,由上述方法形成的所有布线线路都不能很好传输光。非常薄的金属膜可以为半透明的,但是这些膜的叠加会导致形成实际上阻塞光的层的形成。透明ITO膜可以依靠高度真空的仪器而形成,但是由于是无机特性而没有柔韧性。此外,铟的供给有限。
使用不需要制造仪器的昂贵安装或维护的方法可制备出大型布线电路。印刷电路板通过蚀刻敷铜箔叠层并结合印刷技术制备。当电路板是以环氧/玻璃叠层为基础时这些印刷板是坚硬的,而当它以聚酰亚胺叠层为基础时是柔软的。类似结构通过直接在基材上印刷导电膏剂而形成。膏剂的导电组分通常是金属填充物如银。该导电膏剂使用丝网印刷技术等印刷在基材上。当布线电路的性能要求非常低时,膏剂可以通过刷子施用。
虽然这些制备方法非常廉价,但是依赖于这些方法不可能制备小型装置如半导体装置。此外,由这些方法制造的布线电路是不透明的。光被叠层结构中敷铜箔和应用在基材上的银膏剂阻塞。因此,由这些方法制造的布线结构不能应用到需要透明导电膜精细图案的装置上,如电致发光的显示装置和液晶显示装置上。
人们已经致力于提供透明电极以取代ITO膜。典型实例是在聚合物粘合剂中的ITO颗粒的悬浮液。然而,该填充ITO的系统不能匹配连续ITO膜的电导率。此外,现在已开发出透明导电聚合物材料。这些聚合物通常需要掺杂剂以形成导电性质,并使用丝网印刷术或喷墨应用技术将材料应用到基材上。虽然它们仍然处于开发阶段,还未达到ITO膜的导电水平,但已预见到掺杂剂的加入对控制导电性能具有不利影响,而且它们不可能适合于小型装置。
碳纳米管制备的膜已知具有低致102欧/平方的表面电阻。题为“Methodfor Disentangling Hollow Carbon Microfibers,Electrically ConductiveTransparent Carbon Microfibers Aggregation Film and Coating for FormingSuch Film”的美国专利5,853,877描述了该导电碳纳米管膜的形成,而题为“Processing for Producing Single Wall Nanotubes Using Unsupported MetalCatalysts”的美国专利6,221,330泛泛描述了用于形成导电膜的碳纳米管的生产。然而,在现有技术中还没有报道用于使由碳纳米管制备的膜形成图案的方法。
包括碳纳米管的涂层如含有碳纳米管的膜已经有描述(参见美国专利申请10/105,623,该申请并入此处参考)。例如,该膜具有低致102欧/平方的表面电阻以及高致95%的总透光率。在膜中的碳纳米管的含量可以高达50%。
很惊奇地发现,该材料可以通过两步法形成,这导致形成具有低电阻和高透光率的纳米管膜。首先,碳纳米管的稀水溶液喷雾到基材上,水蒸发而只将固结的碳纳米管留在表面上。然后,树脂应用到固结碳纳米管上并渗入固结碳纳米管的网络中。
发明内容
本发明克服了与当前的金属基和硅基的布线技术有关的问题和缺陷,并提供了使用碳纳米管膜形成布线线路和电极的新布线方法。
本发明的一个具体实施方案涉及一种包括基材和位于基材上并有碳纳米管的有图案布线或电极的碳纳米管布线。
本发明的另外一个具体实施方案涉及一种使碳纳米管涂层形成图案的方法。该方法包括提供一种碳纳米管溶液,将溶液应用到基材上以在基材上形成固结碳纳米管膜,选择性使用粘合剂浸泽碳纳米管,从基材上去除部分没有用粘合剂浸渍的碳纳米管膜。
本发明的另外一个具体实施方案涉及一种使碳纳米管涂层形成图案的方法。该方法包括提供一种碳纳米管溶液,将溶液应用到基材上以在基材上形成固结碳纳米管膜,使用光致抗蚀剂浸渍碳纳米管膜,在采用光致抗蚀剂浸渍的碳纳米管膜上投影一个预定的图案以保护部分碳纳米管膜,再从基材上去除没有被投影保护的碳纳米管膜。
本发明的另外一个具体实施方案涉及一种使碳纳米管涂层形成图案的方法。该方法包括提供一种碳纳米管溶液,将溶液应用到基材上以在基材上形成固结碳纳米管,将碳纳米管膜暴露在穿过掩模(mask)的光源中,以及采用粘合剂浸渍暴露的碳纳米管膜。
本发明的另外一个具体实施方案涉及一种使碳纳米管涂层形成图案的方法。该方法包括提供具有碳纳米管和溶剂的涂敷混合液,并将涂敷混合液应用在基材上以形成一种预定图案,从印在基材上的涂敷混合物中去除溶剂而将固结碳纳米管的有图案膜留在基材上,再使用粘合剂浸渍碳纳米管膜。
本发明的其它具体实施方案和优点在下面的说明书部分中描述,而部分具体实施方案和优点从该描述中是显而易见的或可以从本发明的实施中得悉。
附图说明
图1示出了本发明一个具体实施方案(实施例1)的碳纳米管膜形成图案的方法的工艺步骤。
图2示出了本发明的另外一个具体实施方案(实施例2)的碳纳米管膜形成图案的方法的工艺步骤。
图3示出了本发明的另外一个具体实施方案(实施例3)的碳纳米管膜形成图案的方法的工艺步骤。
图4示出了本发明的另外一个具体实施方案(实施例4)的碳纳米管膜形成图案的方法的工艺步骤。
具体实施方式
正如此处的具体体现和广泛描述的那样,本发明涉及制品和使碳纳米管涂层形成图案的方法,具体地,涉及由这些方法制备的碳纳米管布线。
在本发明中,使用了上述形成碳纳米管膜的方法的独特性质。即,在基材上固结的碳纳米管在没有任何其它组分如粘合剂的情况下仍具有很强与基材表面的粘结力。因此,装置半成品即具有固结碳纳米管的基材与很多现有的装置加工技术相容。然而,粘结力太弱以至被中等强度的干扰而断裂。此外,在基材上固结的碳纳米管具有大量开气孔的网状结构。因此,具有足够低粘度以至渗入开气孔的材料可以应用到基材上,以便固结碳纳米管的开气孔中填入这些材料。
树脂应用之前,的在这些基材上的固结碳纳米管的微观观察表明网络结构是以碳纳米绳的形成为基础并且由这些绳形成网状结构的框架。该结构提供低电阻并同时提供高透光率,这因为这些绳组成的框架可以承担大多数导电,在这些绳之间的相对较大的孔允许所应用到碳纳米管上的树脂穿过。
可以有不同的方法形成依赖于这些特征的有图案碳纳米管膜。例如,碳纳米管膜可以首先在基材的全部表面形成。因为,在基材上的固结碳纳米管可以吸收作为网状结构的一部分的各种材料,用于形成图案的化学试剂可以引入到固结膜的整个部分或所选择的膜部分。例如,根据预定图案,溶解在溶剂中的粘合剂可以应用到固结碳纳米管膜上。粘合剂的应用可以通过包括优选丝网印刷、喷印、照相凹板滚筒印刷的传统方法进行。在溶剂干燥后,粘合剂留在网状结构中,并增强采用粘合剂溶液浸渍的碳纳米管膜部分。通过使用不会溶解粘合剂的水或溶剂冲洗在其上具有碳纳米管的基材,没有被粘合剂增强的碳纳米管的部分容易从基材上洗掉,而碳纳米管膜的增强部分保持完整。基材可以是柔性的或刚性的,可以由透明材料或光阻塞材料构成。对于透明电极的应用,尽管透明的柔性聚合物膜也可以使用,但通常透明无机玻璃板用作基材。当碳纳米管布线用作集成电路的一部分时,基材也可以是硅胶基材。此外,绝缘层可以在作为保护层的碳纳米管布线上形成。其它的碳纳米管布线可以在保护第一碳纳米管布线的绝缘层上形成,从而形成多层布线结构。
除将粘合剂应用到碳纳米管膜的所选择部分外,还可将光致抗蚀剂应用到整个碳纳米管膜上。光致抗蚀剂的应用可以通过包括优选的旋涂的任意传统方法进行。光致抗蚀剂一旦渗入固结碳纳米管的网状结构中,该装置半成品就可以适合于所有的传统光刻处理步骤。例如,将中间掩膜(reticle)的预定图案投影到浸渍有光致抗蚀剂的碳纳米管膜上。取决于所使用光致抗蚀剂的种类,光辐照的碳纳米管膜部分或没有辐照的膜部分在随后的步骤中去除。制品的布线图案转移到碳纳米管膜上。对比粘合剂的形成图案的方法,该方法可以在碳纳米管膜上形成更好的图案,可以与现存的硅基装置的制造方法更加相适合。此处所述的任何基材可以用作该制造方法的基材。绝缘层可以在有图案的碳纳米管膜上形成,也可形成多层碳纳米管布线。
此外,在基材上形成的碳纳米管膜根本没有进行“物理形成图案”。即,碳纳米管膜的电子特性可以在没有从基材物理去除膜的情况下使用。当使用强光源照射时,单壁碳纳米管(SWNTs)进行大的结构改造。尽管SWNTs在强光源辐照下的空气中可以烧坏,但是它们在合适辐照条件下转化成更大电阻的材料。P.M.Ajayan等在“Nanotubes in a Flash-Ignition andReconstruction,”(Science 296,70(2002))中有描述。对于光辐射,传统光刻仪器可以用于在碳纳米管膜上形成预定图案。当形成的布线图案是非常大的,光辐照可以通过在基材上简单放置掩膜而进行。如基材是透明的,优选掩膜可以放置在基材的背部,掩膜也可以直接放置在碳纳米管膜上。导电性的改变善没有预期到对碳纳米管膜以及纳米管绳的网状结构有重大影响。然后,粘合剂应用到整个碳纳米管膜上,并穿入网状结构中以增强结构。绝缘层可以在碳纳米管膜上形成,从而多层碳纳米管布线也可以形成。
有图案碳纳米管膜可以使用包括优选丝网印刷、喷印和照相凹板滚筒印刷的发明的使用方法直接在基材上形成。然而,上述用于形成碳纳米管膜的碳纳米管水溶液对该方法是不适合的,因为溶液的粘度不够高,因而不能与这些方法相符合。因此,需要添加化学试剂到溶液中以增加粘度。另外,碳纳米管和粘合剂的混合物,如在美国系列号10/105,623中所描述的可以用作这些施用方法的油墨。在碳纳米管的预定图案在基材上形成后,用于增加粘性的化学试剂可以去除,以通过在合适气氛中干燥基材或燃烧化学试剂而获得合适的导电率和透光率。该加工步骤将印刷到基材上的碳纳米管转移进入类似于通过将碳纳米管水溶液应用到基材上所获得那样的网状结构中。为保护由此形成的有图案碳纳米管膜,可以在基材的全部表面上应用粘合剂。粘合剂渗入到其上形成有碳纳米管膜的基材部分的网状结构中,直接覆盖碳纳米管布线线路之间的基材上。任何基材都可以用作该生产方法中使用的基材。绝缘层可以在粘合剂层上形成,从而多层碳纳米管布线也可以形成。该方法对于降低所使用碳纳米管的用量很有效,并提供一种平面装置半成品,或者它可以包括在随后加工步骤中形成平面层。
涂敷在基材上的连续碳纳米管膜可以通过放置与碳纳米管膜直接接触的有图案的“粘性的”表面(滚筒或板)而形成图案。如果粘性物质是以预定布线图案的倒像形成图案的,那么在布线中没有使用的膜部分将从膜上转移到转印辊或板上。当涂敷碳纳米管的基材的碳纳米管从转印辊或板上释放时,形成有图案的碳纳米管膜。
此外,碳纳米管的任意两个或多个形成图案的方法可以结合使用以便形成装置的布线结构。例如,电致发光显示装置的开关晶体管的栅极线和相关栅电极可以通过浸渍有碳纳米管的光致抗蚀剂的光刻加工方法形成。另一方面,显示装置的电致发光元件的正极可以通过在装置半成品上丝网印刷高粘度的碳纳米管溶液而形成,所述装置半成品具有在其中形成的栅极线和栅电极。
优选碳纳米管膜的碳纳米管的平均外部直径为3.5nm或更小。在形成上述方法的膜中使用的碳纳米管包括直的和弯曲的多壁纳米管(MWNTs)、直的和弯曲的双壁纳米管(DWNTs)、直的和弯曲的单壁纳米管(SWNTs)以及具有化学修饰以包括其它化合物和功能基团的碳纳米管。优选SWNTs,因为它们自然聚集以形成碳纳米绳。在碳纳米管膜中的碳纳米管体积浓度,即多少空间由碳纳米管填充,优选为5-50%、5-10%、10-15%、15-20%、20-25%、25-30%、30-35%、35-40%、40-45%、45-50%、10-20%、5-25%、5-20%、10-30%或5-30%,但是取决于碳纳米管布线的应用可以超出该范围。碳纳米管的纵横比可以在10~2000之间。
碳纳米管膜的表面电阻和体积阻力可以取决于所使用的碳纳米管的种类和浓度。膜的表面电阻可以为102~1010欧/平方(ohms/square),优选在102~104欧/平方、104~106欧/平方、106~108欧/平方或108~1010欧/平方。膜的体积电阻可以为10-2~1010欧-厘米,优选10-2~100欧-厘米、100~102欧-厘米、102~104欧-厘米、104~106欧-厘米、106~108欧-厘米或者108~1010欧-厘米。优选碳纳米管的透光性为80%或以上(例如,85、90、95、97、99),碳纳米管膜的霾值(haze value)为0.5%(例如0.4、0.3、0.2、0.1、0.01)或更低。但是具有低得多的透光率或高得多的霾值的碳纳米管膜都可以用于形成碳纳米管布线。碳纳米管膜的厚度可以为0.5nm和1μm之间(如0.8、1、2、3、5、10、25、50、100、150、500、750nm),并优选为1~100nm。
为确保碳纳米管膜和绝缘覆盖层的网状结构而使用的粘合剂可以由聚合物材料制成,这可以从宽范围的天然或合成的聚合物树脂中选择。特殊聚合物可以根据强度、结构或需要应用领域的设计要求加以选择,如热塑性塑料、热固性聚合物、弹性体以及它们的组合。更具体而言,它们可以是聚乙烯、聚丙烯、聚氯乙烯、聚苯乙烯、聚氨酯、聚酰亚胺、聚碳酸酯、聚对苯二甲酸乙二醇酯、纤维素、凝胶、壳多糖、多肽、多糖、多核苷酸以及它们的混合物。此外,可以使用陶瓷混合的聚合物、氧化膦和硫属化物。
导电填料可以加入到碳纳米管中。该填料可以是导电有机材料、无机材料或这些材料的组合物或混合物。导电有机材料可以是巴基球(buckeyball)、炭黑、富勒烯以及它们的组合物和混合物。导电无机材料可以是铝、锑、铍、镉、铬、钴、铜、掺杂金属氧化物、铁、金、铅、锰、镁、水银、金属氧化物、镍、铂、银、钢、钛、锌或它们的组合物或混合物。优选的导电材料包括锡-铟混合氧化物、锑-锡混合氧化物、氟掺杂的氧化锡、铝掺杂的氧化锌以及它们的组合物和混合物。
碳纳米管膜在粘合剂注入之前的真空退火还可以降低碳纳米管膜的电阻。这可以通过在碳纳米管绳连接处的碳纳米管的熔合而得到促进。因为纳米管绳自身具有差不多的类金属导电率,而且膜的总导电率可以通过纳米管绳连接处的形态确定,使连接处变厚的任何处理都增加碳纳米管膜的导电率。当金属的纳米大小粒子混入碳纳米管膜时,那些纳米粒子一经退火就迁移进入这些连接处。这也可以导致电阻降低。
更大金属粒子可以大量引入碳纳米管膜中。该复合膜也可以被认为是将碳纳米管加入到大的导电金属粒子的分散体中。当使用金属如银、金、铜、混合物、铝、镁以及它们的合金时,该结合在导电性上获得的提高超过纯碳纳米管膜约6个数量级或更大。然而,该复合膜的金属填料量比仅依赖于金属填料达到逾渗阈所需的量少得多。因此,复合碳纳米管膜可以保持适用于透明电极应用领域的透光率。或者,可以用炭黑粒子代替复合膜中的金属粒子。这种组合不能获得高导电性,但由于在膜中使用的碳纳米管膜的量降低,因而碳纳米管膜的制造成本可以降低。
由这些有图案的纳米复合涂层组成的布线可以用作如透明电极和用于平面显示、光电、接触屏、电致发光灯和EMI屏蔽的电路。
下面的实施例解释了本发明的一些具体实施方案,但这不应该看作是对本发明范围的限制。
实施例
下面参考图1-4分别描述形成碳纳米管布线的四个实施例。下面实施例只是用于解释目的,而不是限制对于上述有图案碳纳米管膜形成的概要性说明。
实施例1
首先,将购买的SWNTs通过包括酸回流、水洗涤、离心和微过滤的处理步骤纯化。然后,纯化的SWNTs混入异丙醇(IPA)和水的溶液中以形成碳纳米管涂层溶液。SWNT固体含量(重量)为10~100ppm的范围。IPA与水的重量比为1∶3~3∶1,取决于涂层所需的干燥速率。一旦获得较好的稳定分散,SWNT分散体的粘度通过加入足够量的聚丙烯酸、粘度调节剂(Acrysol ASE75,Rohm & Hass生产)而增加以形成具有适于照相凹板式涂敷粘度(例如,约1000cP)的涂层组合物。使用有图案的照相凹板辊将该碳纳米管涂层溶液印刷到清澈的塑料膜上(例如,聚醚砜)。然后,通过加热去除IPA/水和粘度调节剂,留下已形成图案的固结碳纳米管膜。然后使用喷雾技术应用电介质粘合剂涂层(例如,溶解在乙酸乙酯中的丙烯酸树脂)。粘合剂涂层渗入到碳纳米管膜中以改善粘附力和机械性质。所得的有图案电极或电路表现出良好的透明性和低的电阻。该方法在图1中示意性示出。
实施例2
首先,购买的SWNTs通过包括酸回流、水洗涤、离心和微过滤的处理步骤纯化。然后,将纯化的SWNTs混入异丙醇(IPA)和水的溶液中以形成碳纳米管涂层溶液。SWNT的固体含量(重量)为10~100ppm的范围。IPA与水的重量比为1∶3~3∶1,这取决于涂层所需的干燥速率。然后使用喷雾技术将SWNT涂层应用到清澈的塑料膜上(例如,聚酯膜如来自DupontTeijin Films的PET或PEN膜)。该基材加热到60℃以提高IPA/水的干燥速率。采用足够厚度的固结碳纳米管以获得所需的电阻(例如500欧/平方)。然后,使用丝网印刷技术印刷粘合剂涂层如溶解在乙酸乙酯中的丙烯酸树脂。粘合剂涂层渗入到碳纳米管膜的所选择区域中以改善粘附力和机械强度。溶剂通过加热去除。然后,通过喷洗技术并使用水和Triton X-100表面活性剂的混合物将未保护碳纳米管膜区域去除。所得的有图案的电极或电路表现出良好的透明性和低的电阻。该方法在图2中示意性示出。
实施例3
首先,购买的SWNTs通过包括酸回流、水洗涤、离心和微过滤的处理步骤纯化。然后,纯化的SWNTs混入异丙醇(IPA)和水的溶液中以形成碳纳米管涂层溶液。SWNT固体含量为10~100ppm的重量范围。IPA与水的重量比为1∶3~3∶1,这取决于涂层所需的干燥速率。然后使用喷雾技术将SWNT涂层应用到玻璃基材上。该基材加热到60℃以提高IPA/水的干燥速率。采用足够厚度的固结碳纳米管以获得所需的电阻(例如500欧/平方)。然后,使用Meyer棒涂敷技术将来自HD Microsystems的可光限定(photodefinable)聚酰亚胺粘合剂如HD-4000系列应用到固结碳纳米管膜上。光致抗蚀剂渗入到碳纳米管膜中。使用普通光刻技术将预定布线图案投影到充满碳纳米管的光致抗蚀剂上。当未固化的聚酰亚胺的区域通过显影剂漂洗时,碳纳米管膜的所选择区域被去除。所得有图案的电极或电路表现出良好的透明性和低的电阻。该方法在图3中示意性示出。
实施例4
使用喷雾技术将如实施例3中制备的涂敷溶液应用到玻璃基材上。该基材加热到60℃以提高IPA/水的干燥速率。采用足够厚度的固结碳纳米管以获得所需的电阻(例如500欧/平方)。高强度的汞灯源穿过掩膜投影到涂敷有碳纳米管的玻璃上。该曝光导致碳纳米管膜的所选择的区域的更高电阻,而且光学透明性没有很大降低。然后使用喷雾技术应用电介质粘合剂涂层(例如,溶解在乙酸乙酯中的丙烯酸树脂)。粘合剂涂层渗入到碳纳米管中以改善粘附力和机械性质。所得的有图案电极或电路表现出良好的透明性和低的电阻。该方法在图3中示意性示出。
在实施例2和3中,碳纳米管膜没有被完全去除。只要邻近的布线元件没有电连接,一定量的纳米管可以残留在基材上。
从此处描述的本发明的说明书和实施考虑,本发明的其它实施方案和用途对于本领域的技术人员将是很明显的。此处所引用的所有的参考文献,包括所有的出版物、美国专利以及包括现有文献的专利申请都逐一并完全地并入此处参考。要指出的是说明书和实施例都只是由下面权利要求所指出的本发明的真正范围和本质的示例而已。

Claims (41)

1.一种碳纳米管布线,包括:
基材;和
位于所述基材上并包含碳纳米管的有图案的布线线路或电极。
2.如权利要求1所述的碳纳米管布线,其中布线线路或电极还包括粘合剂或光致抗蚀剂。
3.如权利要求1所述的碳纳米管布线,其中碳纳米管具有3.5nm或以下的外部直径。
4.如权利要求1所述的碳纳米管布线,其中布线线路或电极还包括金属填料。
5.如权利要求4所述的碳纳米管布线,其中金属填料包括银、金、铜或它们的组合。
6.如权利要求1所述的碳纳米管布线,其中布线线路或电极具有102~104欧/平方的表面电阻。
7.如权利要求1所述的碳纳米管布线,其中布线线路或电极具有10-2~100欧-厘米的体积电阻。
8.如权利要求1所述的碳纳米管布线,其中布线线路或电极具有80%或更高的透过率。
9.如权利要求1所述的碳纳米管布线,其中布线线路或电极具有5~50体积%的碳纳米管浓度。
10.如权利要求1所述的碳纳米管布线,还包括位于布线线路或电极上的绝缘层。
11.如权利要求1所述的碳纳米管布线,其中基材是玻璃基材、聚合物基材、硅片、聚酯胶片或它们的组合物。
12.一种使碳纳米管涂层形成图案的方法,它包括如下步骤:
提供碳纳米管溶液;
将溶液应用到基材上以在基材上形成固结碳纳米管膜;
通过以图案方式沉积粘合剂,用粘合剂浸渍碳纳米管膜;和
从基材上至少去除没有被粘合剂浸渍的部分碳纳米管膜。
13.如权利要求12所述的使碳纳米管涂层形成图案的方法,其中提供碳纳米管溶液的步骤包括纯化所述碳纳米管。
14.如权利要求12所述的使碳纳米管涂层形成图案的方法,其中提供碳纳米管溶液的步骤包括在水和醇的溶液中分散碳纳米管。
15.如权利要求12所述的使碳纳米管涂层形成图案的方法,其中应用溶液的步骤包括采用雾化器喷雾所述溶液。
16.如权利要求12所述的使碳纳米管涂层形成图案的方法,其中浸渍碳纳米管膜的步骤包括在具有预定图案的碳纳米管膜上印刷所述粘合剂。
17.如权利要求12所述的使碳纳米管涂层形成图案的方法,其中浸渍碳纳米管膜的步骤包括喷涂粘合剂。
18.如权利要求12所述的使碳纳米管涂层形成图案的方法,其中去除碳纳米管的步骤包括采用水和表面活性剂的混合物喷洗碳纳米管膜。
19.如权利要求12所述的使碳纳米管涂层形成图案的方法,其中去除碳纳米管的步骤包括将部分碳纳米管膜从基材上转移到粘性表面上。
20.一种使碳纳米管涂层形成图案的方法,它包括如下步骤:
提供碳纳米管溶液;
将溶液应用到基材上以在基材上形成固结碳纳米管膜;
采用光致抗蚀剂浸渍碳纳米管膜;
将预定图案投影到浸渍有光致抗蚀剂的碳纳米管膜上以保护部分碳纳米管膜;和
从基材上去除没有被投影保护的至少部分碳纳米管膜。
21.如权利要求20所述的使碳纳米管涂层形成图案的方法,其中提供碳纳米管溶液的步骤包括纯化碳纳米管。
22.如权利要求20所述的使碳纳米管涂层形成图案的方法,其中提供碳纳米管溶液的步骤包括在水和醇的溶液中分散碳纳米管。
23.如权利要求20所述的使碳纳米管涂层形成图案的方法,其中应用溶液的步骤包括采用雾化器喷雾所述溶液。
24.如权利要求20所述的使碳纳米管涂层形成图案的方法,其中浸渍碳纳米管膜的步骤包括在基材上棒涂敷光致抗蚀剂或在基材上旋涂光致抗蚀剂。
25.如权利要求20所述的使碳纳米管涂层形成图案的方法,其中去除碳纳米管膜的步骤包括采用光致抗蚀剂的显影剂溶液去除碳纳米管膜的未保护部分。
26.一种使碳纳米管涂层形成图案的方法,它包括如下步骤:
提供碳纳米管溶液;
将溶液应用到基材上以在基材上形成固结碳纳米管膜;
将碳纳米管膜在穿过掩膜的光源下曝光;和
使用粘合剂浸渍曝光的碳纳米管膜。
27.如权利要求26所述的使碳纳米管涂层形成图案的方法,其中提供碳纳米管溶液的步骤包括纯化。
28.如权利要求26所述的使碳纳米管涂层形成图案的方法,其中提供碳纳米管溶液的步骤包括在水和醇的溶液中分散所述碳纳米管。
29.如权利要求26所述的使碳纳米管涂层形成图案的方法,其中应用溶液的步骤包括采用雾化器喷雾溶液。
30.如权利要求26所述的使碳纳米管涂层形成图案的方法,其中浸渍碳纳米管膜的步骤包括喷涂所述粘合剂。
31.一种使碳纳米管涂层形成图案的方法,它包括如下步骤:
提供包括碳纳米管和溶剂的涂层混合物;
在基材上应用涂层混合物以形成预定的图案;
从印刷在基材上的涂层混合物中去除溶剂以在基材上留下固结碳纳米管膜;和
采用粘合剂浸渍碳纳米管膜。
32.如权利要求31所述的使碳纳米管涂层形成图案的方法,其中提供涂层混合物的步骤包括纯化。
33.如权利要求31所述的使碳纳米管涂层形成图案的方法,其中提供涂层混合物的步骤包括在水的溶液中分散碳纳米管。
34.如权利要求31所述的使碳纳米管涂层形成图案的方法,其中应用涂层混合物的步骤包括丝网印刷、喷印、照相凹板辊涂印刷。
35.如权利要求31所述的使碳纳米管涂层形成图案的方法,其中去除溶剂的步骤包括加热基材。
36.如权利要求31所述的使碳纳米管涂层形成图案的方法,其中浸渍碳纳米管膜的步骤包括喷涂所述粘合剂。
37.如权利要求31所述的使碳纳米管涂层形成图案的方法,其中提供涂层混合物的步骤包括加入粘度调节剂。
38.一种使碳纳米管涂层形成图案的方法,它包括如下步骤:
提供碳纳米管溶液;
将溶液应用到基材上以在基材上形成固结碳纳米管膜;
从基材上至少去除部分碳纳米管膜;
采用粘合剂浸渍残留在基材上的碳纳米管膜。
39.如权利要求38所述的使碳纳米管涂层形成图案的方法,其中提供碳纳米管溶液的步骤包括纯化所述碳纳米管。
40.如权利要求38所述的使碳纳米管涂层形成图案的方法,其中提供碳纳米管溶液的步骤包括在水和醇的溶液中分散碳纳米管。
41.如权利要求38所述的使碳纳米管涂层形成图案的方法,其中应用溶液的步骤包括使用雾化器喷涂溶液。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10177058B1 (en) 2018-01-26 2019-01-08 Powertech Technology Inc. Encapsulating composition, semiconductor package and manufacturing method thereof

Families Citing this family (292)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8958917B2 (en) * 1998-12-17 2015-02-17 Hach Company Method and system for remote monitoring of fluid quality and treatment
US7454295B2 (en) 1998-12-17 2008-11-18 The Watereye Corporation Anti-terrorism water quality monitoring system
US20110125412A1 (en) * 1998-12-17 2011-05-26 Hach Company Remote monitoring of carbon nanotube sensor
US9056783B2 (en) * 1998-12-17 2015-06-16 Hach Company System for monitoring discharges into a waste water collection system
US7563711B1 (en) * 2001-07-25 2009-07-21 Nantero, Inc. Method of forming a carbon nanotube-based contact to semiconductor
US6835591B2 (en) * 2001-07-25 2004-12-28 Nantero, Inc. Methods of nanotube films and articles
US6706402B2 (en) 2001-07-25 2004-03-16 Nantero, Inc. Nanotube films and articles
US7259410B2 (en) * 2001-07-25 2007-08-21 Nantero, Inc. Devices having horizontally-disposed nanofabric articles and methods of making the same
US6919592B2 (en) * 2001-07-25 2005-07-19 Nantero, Inc. Electromechanical memory array using nanotube ribbons and method for making same
US7285198B2 (en) 2004-02-23 2007-10-23 Mysticmd, Inc. Strip electrode with conductive nano tube printing
KR100571803B1 (ko) * 2002-05-03 2006-04-17 삼성전자주식회사 수소로 기능화된 반도체 탄소나노튜브를 포함하는 전자 소자 및 그 제조방법
DE10226366A1 (de) * 2002-06-13 2004-01-08 Siemens Ag Elektroden für optoelektronische Bauelemente und deren Verwendung
CA2512387A1 (en) * 2003-01-13 2004-08-05 Nantero, Inc. Methods of using thin metal layers to make carbon nanotube films, layers, fabrics, ribbons, elements and articles
US7858185B2 (en) * 2003-09-08 2010-12-28 Nantero, Inc. High purity nanotube fabrics and films
US9574290B2 (en) 2003-01-13 2017-02-21 Nantero Inc. Methods for arranging nanotube elements within nanotube fabrics and films
US8937575B2 (en) 2009-07-31 2015-01-20 Nantero Inc. Microstrip antenna elements and arrays comprising a shaped nanotube fabric layer and integrated two terminal nanotube select devices
US8920619B2 (en) 2003-03-19 2014-12-30 Hach Company Carbon nanotube sensor
US20040198892A1 (en) * 2003-04-01 2004-10-07 Cabot Microelectronics Corporation Electron source and method for making same
EP1631812A4 (en) * 2003-05-14 2010-12-01 Nantero Inc SENSOR PLATFORM HAVING A HORIZONTAL NANOPHONE ELEMENT
JP4036454B2 (ja) * 2003-05-30 2008-01-23 独立行政法人理化学研究所 薄膜トランジスタ。
CA2535634A1 (en) * 2003-08-13 2005-05-26 Nantero, Inc Nanotube-based switching elements with multiple controls and circuits made from same
WO2005017967A2 (en) * 2003-08-13 2005-02-24 Nantero, Inc. Nanotube device structure and methods of fabrication
US7416993B2 (en) * 2003-09-08 2008-08-26 Nantero, Inc. Patterned nanowire articles on a substrate and methods of making the same
US7504051B2 (en) * 2003-09-08 2009-03-17 Nantero, Inc. Applicator liquid for use in electronic manufacturing processes
US7375369B2 (en) * 2003-09-08 2008-05-20 Nantero, Inc. Spin-coatable liquid for formation of high purity nanotube films
KR100570634B1 (ko) * 2003-10-16 2006-04-12 한국전자통신연구원 탄소나노튜브와 금속분말 혼성 복합에 의해 제조된 전자파차폐재
US20050209392A1 (en) * 2003-12-17 2005-09-22 Jiazhong Luo Polymer binders for flexible and transparent conductive coatings containing carbon nanotubes
US20050221016A1 (en) * 2003-12-31 2005-10-06 Glatkowski Paul J Methods for modifying carbon nanotube structures to enhance coating optical and electronic properties of transparent conductive coatings
US20050156318A1 (en) * 2004-01-15 2005-07-21 Douglas Joel S. Security marking and security mark
JP2005277405A (ja) * 2004-02-27 2005-10-06 Takiron Co Ltd 画像表示装置用透光性ノイズ防止成形体
US7956287B2 (en) 2004-04-20 2011-06-07 Takiron Co., Ltd. Transparent conductive formed article for a touch panel and touch panel
US7658869B2 (en) * 2004-06-03 2010-02-09 Nantero, Inc. Applicator liquid containing ethyl lactate for preparation of nanotube films
US7556746B2 (en) 2004-06-03 2009-07-07 Nantero, Inc. Method of making an applicator liquid for electronics fabrication process
US7709880B2 (en) * 2004-06-09 2010-05-04 Nantero, Inc. Field effect devices having a gate controlled via a nanotube switching element
US7288970B2 (en) * 2004-06-18 2007-10-30 Nantero, Inc. Integrated nanotube and field effect switching device
US7161403B2 (en) 2004-06-18 2007-01-09 Nantero, Inc. Storage elements using nanotube switching elements
US7164744B2 (en) 2004-06-18 2007-01-16 Nantero, Inc. Nanotube-based logic driver circuits
DE102004035368B4 (de) 2004-07-21 2007-10-18 Infineon Technologies Ag Substrat mit Leiterbahnen und Herstellung der Leiterbahnen auf Substraten für Halbleiterbauteile
US20060126175A1 (en) * 2004-09-02 2006-06-15 Zhijian Lu Viewing screens including carbon materials and methods of using
TWI399864B (zh) * 2004-09-16 2013-06-21 Nantero Inc 使用奈米管之發光體及其製造方法
WO2006132658A2 (en) * 2004-09-21 2006-12-14 Nantero, Inc. Resistive elements using carbon nanotubes
US8080289B2 (en) * 2004-09-30 2011-12-20 National Cheng Kung University Method for making an aligned carbon nanotube
TWI240312B (en) * 2004-09-30 2005-09-21 Univ Nat Cheng Kung Method for rapidly fabricating aligned carbon nanotube under low temperature
US20100147657A1 (en) * 2004-11-02 2010-06-17 Nantero, Inc. Nanotube esd protective devices and corresponding nonvolatile and volatile nanotube switches
US7567414B2 (en) * 2004-11-02 2009-07-28 Nantero, Inc. Nanotube ESD protective devices and corresponding nonvolatile and volatile nanotube switches
US20060124028A1 (en) * 2004-12-09 2006-06-15 Xueying Huang Inkjet ink compositions comprising carbon nanotubes
EP1825038B1 (en) * 2004-12-16 2012-09-12 Nantero, Inc. Aqueous carbon nanotube applicator liquids and methods for producing applicator liquids thereof
US20060188721A1 (en) * 2005-02-22 2006-08-24 Eastman Kodak Company Adhesive transfer method of carbon nanotube layer
JP4997583B2 (ja) * 2005-03-17 2012-08-08 独立行政法人産業技術総合研究所 センサ
US20060276056A1 (en) * 2005-04-05 2006-12-07 Nantero, Inc. Nanotube articles with adjustable electrical conductivity and methods of making the same
US8941094B2 (en) 2010-09-02 2015-01-27 Nantero Inc. Methods for adjusting the conductivity range of a nanotube fabric layer
US9287356B2 (en) * 2005-05-09 2016-03-15 Nantero Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US20100119789A1 (en) * 2005-04-06 2010-05-13 Grande William J Advanced conductive ink
US8217490B2 (en) * 2005-05-09 2012-07-10 Nantero Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US7479654B2 (en) 2005-05-09 2009-01-20 Nantero, Inc. Memory arrays using nanotube articles with reprogrammable resistance
US9911743B2 (en) 2005-05-09 2018-03-06 Nantero, Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US7781862B2 (en) * 2005-05-09 2010-08-24 Nantero, Inc. Two-terminal nanotube devices and systems and methods of making same
US8183665B2 (en) * 2005-11-15 2012-05-22 Nantero Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US7782650B2 (en) * 2005-05-09 2010-08-24 Nantero, Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US8513768B2 (en) * 2005-05-09 2013-08-20 Nantero Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US7835170B2 (en) 2005-05-09 2010-11-16 Nantero, Inc. Memory elements and cross point switches and arrays of same using nonvolatile nanotube blocks
US8013363B2 (en) * 2005-05-09 2011-09-06 Nantero, Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US9196615B2 (en) * 2005-05-09 2015-11-24 Nantero Inc. Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
US7598127B2 (en) 2005-05-12 2009-10-06 Nantero, Inc. Nanotube fuse structure
TWI264271B (en) * 2005-05-13 2006-10-11 Delta Electronics Inc Heat sink
US7593004B2 (en) 2005-06-02 2009-09-22 Eastman Kodak Company Touchscreen with conductive layer comprising carbon nanotubes
US7645497B2 (en) 2005-06-02 2010-01-12 Eastman Kodak Company Multi-layer conductor with carbon nanotubes
US7535462B2 (en) 2005-06-02 2009-05-19 Eastman Kodak Company Touchscreen with one carbon nanotube conductive layer
US7915122B2 (en) * 2005-06-08 2011-03-29 Nantero, Inc. Self-aligned cell integration scheme
US7538040B2 (en) * 2005-06-30 2009-05-26 Nantero, Inc. Techniques for precision pattern transfer of carbon nanotubes from photo mask to wafers
WO2007004758A1 (en) * 2005-07-05 2007-01-11 Korea Institute Of Machinery And Materials Method for manufacturing transparent electrode and transparent electrode man¬ ufactured thereby
SG183720A1 (en) * 2005-08-12 2012-09-27 Cambrios Technologies Corp Nanowires-based transparent conductors
WO2008054364A2 (en) 2005-09-06 2008-05-08 Nantero, Inc. Carbon nanotubes for the selective transfer of heat from electronics
AU2006287609B2 (en) 2005-09-06 2012-08-02 Nantero, Inc. Method and system of using nanotube fabrics as joule heating elements for memories and other applications
EP1929276B1 (en) * 2005-09-06 2011-07-27 Nantero, Inc. Nanotube sensor system and method of use
EP1941561A2 (en) * 2005-09-21 2008-07-09 University Of Florida Research Foundation, Inc. Low temperature methods for forming patterned electrically conductive thin films and patterned articles therefrom
US7435476B2 (en) * 2005-10-13 2008-10-14 Honda Motor Co., Ltd. Functionalized nanotube material for supercapacitor electrodes
US7821079B2 (en) 2005-11-23 2010-10-26 William Marsh Rice University Preparation of thin film transistors (TFTs) or radio frequency identification (RFID) tags or other printable electronics using ink-jet printer and carbon nanotube inks
CN101356115B (zh) * 2005-11-29 2011-08-10 塞尔吉·尼古拉耶维奇·马克西莫夫斯基 形成纳米尺寸簇群并由此建立有序结构的方法
KR101201318B1 (ko) * 2005-12-08 2012-11-14 엘지디스플레이 주식회사 컬러필터기판 및 그 제조방법
JP2009528238A (ja) * 2005-12-19 2009-08-06 ナンテロ,インク. カーボンナノチューブの生成
US8264137B2 (en) * 2006-01-03 2012-09-11 Samsung Electronics Co., Ltd. Curing binder material for carbon nanotube electron emission cathodes
US9365728B2 (en) * 2006-03-09 2016-06-14 Battelle Memorial Institute Modified carbon nanotubes and methods of forming carbon nanotubes
US7235736B1 (en) 2006-03-18 2007-06-26 Solyndra, Inc. Monolithic integration of cylindrical solar cells
US20070215195A1 (en) 2006-03-18 2007-09-20 Benyamin Buller Elongated photovoltaic cells in tubular casings
US20100132765A1 (en) 2006-05-19 2010-06-03 Cumpston Brian H Hermetically sealed solar cells
US8337979B2 (en) * 2006-05-19 2012-12-25 Massachusetts Institute Of Technology Nanostructure-reinforced composite articles and methods
EP2024283A2 (en) 2006-05-19 2009-02-18 Massachusetts Institute of Technology Continuous process for the production of nanostructures including nanotubes
US7796123B1 (en) 2006-06-20 2010-09-14 Eastman Kodak Company Touchscreen with carbon nanotube conductive layers
US20070290394A1 (en) * 2006-06-20 2007-12-20 International Business Machines Corporation Method and structure for forming self-planarizing wiring layers in multilevel electronic devices
KR100791260B1 (ko) * 2006-06-29 2008-01-04 한국과학기술원 탄소나노튜브 필름을 이용한 투명전극의 제조방법
US8785939B2 (en) 2006-07-17 2014-07-22 Samsung Electronics Co., Ltd. Transparent and conductive nanostructure-film pixel electrode and method of making the same
KR20090040435A (ko) * 2006-07-17 2009-04-24 유니다임 투명하고 전도성이 있는 나노구조-필름 픽셀 전극과 이를 제조하는 방법
TWI328984B (en) * 2006-08-29 2010-08-11 Ind Tech Res Inst Substrate structures and fabrication methods thereof
US20080185936A1 (en) * 2006-09-11 2008-08-07 Balaji Panchapakesan Optically driven carbon nanotube actuators
EP2082436B1 (en) * 2006-10-12 2019-08-28 Cambrios Film Solutions Corporation Nanowire-based transparent conductors and method of making them
US8018568B2 (en) * 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
KR100790216B1 (ko) 2006-10-17 2008-01-02 삼성전자주식회사 전도성 분산제를 이용한 cnt 투명전극 및 그의 제조방법
KR100858090B1 (ko) * 2006-11-17 2008-09-10 삼성전자주식회사 탄소나노튜브 복합체 및 이로부터 제조된 복굴절성 박막
US20120141678A1 (en) 2006-11-27 2012-06-07 Fujifilm Dimatix, Inc. Carbon Nanotube Ink
US20080131705A1 (en) * 2006-12-01 2008-06-05 International Business Machines Corporation Method and system for nanostructure placement using imprint lithography
US20080136861A1 (en) * 2006-12-11 2008-06-12 3M Innovative Properties Company Method and apparatus for printing conductive inks
US20080149371A1 (en) * 2006-12-22 2008-06-26 Angstrom Power Inc. Flexible circuit
JP2008159812A (ja) * 2006-12-22 2008-07-10 Sharp Corp 半導体層形成装置および半導体層形成方法
KR100907512B1 (ko) * 2006-12-29 2009-07-14 (주)탑나노시스 터치패널 및 터치패널의 도전층을 형성하는 방법
KR100883737B1 (ko) * 2007-01-17 2009-02-12 삼성전자주식회사 망상 탄소나노튜브 박막층을 포함하는 탄소나노튜브 투명전극 및 그의 제조방법
US8420978B2 (en) 2007-01-18 2013-04-16 The Board Of Trustees Of The University Of Illinois High throughput, low cost dual-mode patterning method for large area substrates
US20080238882A1 (en) * 2007-02-21 2008-10-02 Ramesh Sivarajan Symmetric touch screen system with carbon nanotube-based transparent conductive electrode pairs
KR20080082811A (ko) * 2007-03-09 2008-09-12 성균관대학교산학협력단 카본나노튜브 함유 투명 전극 및 그의 제조방법
US8110883B2 (en) 2007-03-12 2012-02-07 Nantero Inc. Electromagnetic and thermal sensors using carbon nanotubes and methods of making same
JP5194513B2 (ja) * 2007-03-29 2013-05-08 富士通セミコンダクター株式会社 配線構造及びその形成方法
US8003300B2 (en) * 2007-04-12 2011-08-23 The Board Of Trustees Of The University Of Illinois Methods for fabricating complex micro and nanoscale structures and electronic devices and components made by the same
US8628746B2 (en) * 2007-04-12 2014-01-14 Raytheon Company System and method for dispersing nanostructures in a composite material
US8018563B2 (en) 2007-04-20 2011-09-13 Cambrios Technologies Corporation Composite transparent conductors and methods of forming the same
US8093493B2 (en) 2007-04-30 2012-01-10 Solyndra Llc Volume compensation within a photovoltaic device
WO2009005908A2 (en) * 2007-05-22 2009-01-08 Nantero, Inc. Triodes using nanofabric articles and methods of making the same
US20080292979A1 (en) * 2007-05-22 2008-11-27 Zhe Ding Transparent conductive materials and coatings, methods of production and uses thereof
EP2152788B1 (en) 2007-05-29 2019-08-21 Tpk Holding Co., Ltd Surfaces having particles and related methods
US8652763B2 (en) * 2007-07-16 2014-02-18 The Board Of Trustees Of The University Of Illinois Method for fabricating dual damascene profiles using sub pixel-voting lithography and devices made by same
US8491292B1 (en) 2007-07-31 2013-07-23 Raytheon Company Aligning nanomaterial in a nanomaterial composite
US8636972B1 (en) 2007-07-31 2014-01-28 Raytheon Company Making a nanomaterial composite
US20090035707A1 (en) * 2007-08-01 2009-02-05 Yubing Wang Rheology-controlled conductive materials, methods of production and uses thereof
US8309226B2 (en) * 2007-08-03 2012-11-13 Yazaki Corporation Electrically conductive transparent coatings comprising organized assemblies of carbon and non-carbon compounds
JP2010537392A (ja) * 2007-08-27 2010-12-02 バイエル・マテリアルサイエンス・アクチェンゲゼルシャフト エレクトロルミネッセント効果を有する識別標識およびその製造方法
JP2010538422A (ja) * 2007-08-29 2010-12-09 ノースウェスタン ユニバーシティ 分類されたカーボンナノチューブから調整される透明導電体およびその調整方法
US20090056589A1 (en) * 2007-08-29 2009-03-05 Honeywell International, Inc. Transparent conductors having stretched transparent conductive coatings and methods for fabricating the same
KR101336963B1 (ko) 2007-09-04 2013-12-04 삼성전자주식회사 변형된 기판 구조를 갖는 탄소 나노튜브 막 및 그 제조방법
DE102008010031B4 (de) * 2007-09-27 2016-12-22 Osram Oled Gmbh Strahlungsemittierende Vorrichtung und Verfahren zu deren Herstellung
US20090114890A1 (en) * 2007-10-03 2009-05-07 Raytheon Company Nanocomposite Coating for Reflection Reduction
JP2009094333A (ja) * 2007-10-10 2009-04-30 Nippon Mektron Ltd キャパシタを内蔵したプリント配線板およびその製造方法
US20090104405A1 (en) * 2007-10-17 2009-04-23 Honeywell International Inc. Laminated printed wiring board with controlled spurious rf emission capability/characteristics
CN101458597B (zh) 2007-12-14 2011-06-08 清华大学 触摸屏、触摸屏的制备方法及使用该触摸屏的显示装置
CN101458606B (zh) * 2007-12-12 2012-06-20 清华大学 触摸屏、触摸屏的制备方法及使用该触摸屏的显示装置
CN101458599B (zh) 2007-12-14 2011-06-08 清华大学 触摸屏、触摸屏的制备方法及使用该触摸屏的显示装置
CN101458602B (zh) * 2007-12-12 2011-12-21 清华大学 触摸屏及显示装置
EP2053495A3 (en) 2007-10-23 2011-04-27 Tsinghua University Touch panel, method for making the same, and display device adopting the same
CN101655720B (zh) * 2008-08-22 2012-07-18 清华大学 个人数字助理
CN101458598B (zh) * 2007-12-14 2011-06-08 清华大学 触摸屏及显示装置
CN101458594B (zh) 2007-12-12 2012-07-18 清华大学 触摸屏及显示装置
CN101458593B (zh) 2007-12-12 2012-03-14 清华大学 触摸屏及显示装置
CN101419518B (zh) 2007-10-23 2012-06-20 清华大学 触摸屏
CN101458603B (zh) 2007-12-12 2011-06-08 北京富纳特创新科技有限公司 触摸屏及显示装置
CN101458604B (zh) 2007-12-12 2012-03-28 清华大学 触摸屏及显示装置
CN101458595B (zh) 2007-12-12 2011-06-08 清华大学 触摸屏及显示装置
CN101458609B (zh) * 2007-12-14 2011-11-09 清华大学 触摸屏及显示装置
CN101458600B (zh) 2007-12-14 2011-11-30 清华大学 触摸屏及显示装置
CN101620454A (zh) * 2008-07-04 2010-01-06 清华大学 便携式电脑
CN101458605B (zh) 2007-12-12 2011-03-30 鸿富锦精密工业(深圳)有限公司 触摸屏及显示装置
CN101470559B (zh) * 2007-12-27 2012-11-21 清华大学 触摸屏及显示装置
CN101656769B (zh) * 2008-08-22 2012-10-10 清华大学 移动电话
CN101458608B (zh) * 2007-12-14 2011-09-28 清华大学 触摸屏的制备方法
CN101419519B (zh) * 2007-10-23 2012-06-20 清华大学 触摸屏
CN101676832B (zh) * 2008-09-19 2012-03-28 清华大学 台式电脑
CN101458596B (zh) 2007-12-12 2011-06-08 北京富纳特创新科技有限公司 触摸屏及显示装置
CN101464763B (zh) 2007-12-21 2010-09-29 清华大学 触摸屏的制备方法
CN101470558B (zh) * 2007-12-27 2012-11-21 清华大学 触摸屏及显示装置
CN101470566B (zh) * 2007-12-27 2011-06-08 清华大学 触摸式控制装置
CN101470560B (zh) 2007-12-27 2012-01-25 清华大学 触摸屏及显示装置
CN101458975B (zh) * 2007-12-12 2012-05-16 清华大学 电子元件
CN101458601B (zh) 2007-12-14 2012-03-14 清华大学 触摸屏及显示装置
CN101464757A (zh) * 2007-12-21 2009-06-24 清华大学 触摸屏及显示装置
CN101458607B (zh) 2007-12-14 2010-12-29 清华大学 触摸屏及显示装置
TWI500194B (zh) * 2007-12-21 2015-09-11 Hon Hai Prec Ind Co Ltd 觸摸屏、觸摸屏的製備方法及使用該觸摸屏的顯示裝置
CN101470565B (zh) * 2007-12-27 2011-08-24 清华大学 触摸屏及显示装置
CN101464766B (zh) * 2007-12-21 2011-11-30 清华大学 触摸屏及显示装置
CN101464765B (zh) * 2007-12-21 2011-01-05 鸿富锦精密工业(深圳)有限公司 触摸屏及显示装置
CN101464764B (zh) 2007-12-21 2012-07-18 清华大学 触摸屏及显示装置
US8574393B2 (en) 2007-12-21 2013-11-05 Tsinghua University Method for making touch panel
US7727578B2 (en) * 2007-12-27 2010-06-01 Honeywell International Inc. Transparent conductors and methods for fabricating transparent conductors
US20090179158A1 (en) * 2008-01-16 2009-07-16 Varian Semiconductor Equpiment Associate, Inc. In-vacuum protective liners
US7642463B2 (en) * 2008-01-28 2010-01-05 Honeywell International Inc. Transparent conductors and methods for fabricating transparent conductors
US7960027B2 (en) * 2008-01-28 2011-06-14 Honeywell International Inc. Transparent conductors and methods for fabricating transparent conductors
KR101596372B1 (ko) * 2008-02-15 2016-03-08 삼성디스플레이 주식회사 표시장치용 투명전극, 표시장치 및 표시장치의 제조방법
CN101515091B (zh) * 2008-02-22 2012-07-18 清华大学 液晶显示屏的制备方法
CN102017012B (zh) * 2008-03-14 2014-08-20 Nano-C公司 用于透明导电用途的碳纳米管-透明导电无机纳米颗粒混杂薄膜
US9017808B2 (en) * 2008-03-17 2015-04-28 The Research Foundation For The State University Of New York Composite thermal interface material system and method using nano-scale components
US8546067B2 (en) * 2008-03-21 2013-10-01 The Board Of Trustees Of The University Of Illinois Material assisted laser ablation
KR101685210B1 (ko) * 2008-03-25 2016-12-09 도레이 카부시키가이샤 도전성 복합체 및 그 제조 방법
CN101578009B (zh) * 2008-05-06 2010-12-29 富葵精密组件(深圳)有限公司 电路板基膜、电路板基板及电路板
KR100986000B1 (ko) 2008-06-09 2010-10-06 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR100969437B1 (ko) * 2008-06-13 2010-07-14 삼성전기주식회사 인쇄회로기판 및 그 제조방법
WO2009155359A1 (en) * 2008-06-20 2009-12-23 Nantero, Inc. Nram arrays with nanotube blocks, nanotube traces, and nanotube planes and methods of making same
US8237677B2 (en) * 2008-07-04 2012-08-07 Tsinghua University Liquid crystal display screen
US8183763B2 (en) * 2008-07-08 2012-05-22 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
US8390580B2 (en) * 2008-07-09 2013-03-05 Tsinghua University Touch panel, liquid crystal display screen using the same, and methods for making the touch panel and the liquid crystal display screen
EP2327007A4 (en) * 2008-08-01 2012-12-26 3M Innovative Properties Co TOUCH DEVICES HAVING COMPOSITE ELECTRODES
US8257472B2 (en) * 2008-08-07 2012-09-04 Raytheon Company Fuel removal system for hydrogen implanted in a nanostructure material
JP5289859B2 (ja) * 2008-08-13 2013-09-11 日本写真印刷株式会社 導電性パターン被覆体の製造方法および導電性パターン被覆体
US20100047564A1 (en) * 2008-08-19 2010-02-25 Snu R&Db Foundation Carbon nanotube composites
EP2328731A4 (en) 2008-08-21 2017-11-01 Tpk Holding Co., Ltd Enhanced surfaces, coatings, and related methods
US7915637B2 (en) * 2008-11-19 2011-03-29 Nantero, Inc. Switching materials comprising mixed nanoscopic particles and carbon nanotubes and method of making and using the same
CN101752477A (zh) * 2008-11-28 2010-06-23 清华大学 发光二极管
KR101486750B1 (ko) * 2008-12-01 2015-01-28 삼성전자주식회사 수평의 탄소나노튜브의 형성방법
US8187795B2 (en) * 2008-12-09 2012-05-29 The Board Of Trustees Of The University Of Illinois Patterning methods for stretchable structures
US20110223095A1 (en) * 2008-12-18 2011-09-15 Elizabeth Harvey Carbon nanotube film
DE102008064579B4 (de) * 2008-12-22 2012-03-15 Siemens Aktiengesellschaft Verfahren und Trägerzylinder zur Herstellung einer elektrischen Wicklung
JP5207958B2 (ja) * 2008-12-25 2013-06-12 日本写真印刷株式会社 導電性ナノファイバーシート及びその製造方法
US7875801B2 (en) 2009-01-05 2011-01-25 The Boeing Company Thermoplastic-based, carbon nanotube-enhanced, high-conductivity wire
US8445788B1 (en) * 2009-01-05 2013-05-21 The Boeing Company Carbon nanotube-enhanced, metallic wire
US7875802B2 (en) * 2009-01-05 2011-01-25 The Boeing Company Thermoplastic-based, carbon nanotube-enhanced, high-conductivity layered wire
US7897876B2 (en) * 2009-01-05 2011-03-01 The Boeing Company Carbon-nanotube/graphene-platelet-enhanced, high-conductivity wire
JP5207992B2 (ja) * 2009-01-13 2013-06-12 日本写真印刷株式会社 導電性ナノファイバーシート及びその製造方法
JP5429192B2 (ja) * 2009-01-16 2014-02-26 コニカミノルタ株式会社 パターン電極の製造方法及びパターン電極
KR20110112843A (ko) * 2009-01-23 2011-10-13 쇼킹 테크놀로지스 인코포레이티드 유전체 조성물
US20100224236A1 (en) * 2009-03-03 2010-09-09 Alliance For Sustainable Energy, Llc Nanohole Film Electrodes
KR20170132341A (ko) 2009-04-30 2017-12-01 유니버시티 오브 플로리다 리서치 파운데이션, 인크. 공기 캐소드 기반의 단일 벽 탄소 나노튜브
IT1394220B1 (it) * 2009-05-15 2012-06-01 Univ Padova Procedimento per la produzione di un manufatto di materiale plastico flessibile e trasparente con bassa resistenza elettrica superficiale e manufatto di materiale plastico ottenuto con questo procedimento.
JP5498058B2 (ja) * 2009-05-22 2014-05-21 東京エレクトロン株式会社 導電膜の製造方法及び製造装置並びに導電膜
CN101924816B (zh) 2009-06-12 2013-03-20 清华大学 柔性手机
US8513531B2 (en) * 2009-07-15 2013-08-20 The Board Of Trustees Of The University Of Arkansas Electrodynamic arrays having nanomaterial electrodes
US8574673B2 (en) 2009-07-31 2013-11-05 Nantero Inc. Anisotropic nanotube fabric layers and films and methods of forming same
US8128993B2 (en) * 2009-07-31 2012-03-06 Nantero Inc. Anisotropic nanotube fabric layers and films and methods of forming same
US20110034008A1 (en) * 2009-08-07 2011-02-10 Nantero, Inc. Method for forming a textured surface on a semiconductor substrate using a nanofabric layer
US20110073563A1 (en) * 2009-09-25 2011-03-31 Industrial Technology Research Institute Patterning Method for Carbon-Based Substrate
KR101075481B1 (ko) * 2009-09-29 2011-10-21 경희대학교 산학협력단 용액공정을 이용한 플렉서블 기판의 제조방법
US9099224B2 (en) * 2009-10-01 2015-08-04 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Apparatus and method for nanocomposite sensors
JP5561714B2 (ja) * 2009-10-13 2014-07-30 日本写真印刷株式会社 ディスプレイ電極用透明導電膜
US8351239B2 (en) * 2009-10-23 2013-01-08 Nantero Inc. Dynamic sense current supply circuit and associated method for reading and characterizing a resistive memory array
US8551806B2 (en) * 2009-10-23 2013-10-08 Nantero Inc. Methods for passivating a carbonic nanolayer
US8895950B2 (en) 2009-10-23 2014-11-25 Nantero Inc. Methods for passivating a carbonic nanolayer
KR101636907B1 (ko) * 2009-12-08 2016-07-07 삼성전자주식회사 다공성 나노 구조체 및 그 제조 방법
US8222704B2 (en) * 2009-12-31 2012-07-17 Nantero, Inc. Compact electrical switching devices with nanotube elements, and methods of making same
WO2011100661A1 (en) 2010-02-12 2011-08-18 Nantero, Inc. Methods for controlling density, porosity, and/or gap size within nanotube fabric layers and films
US20110203632A1 (en) * 2010-02-22 2011-08-25 Rahul Sen Photovoltaic devices using semiconducting nanotube layers
SG183399A1 (en) * 2010-02-24 2012-09-27 Cambrios Technologies Corp Nanowire-based transparent conductors and methods of patterning same
US8604332B2 (en) * 2010-03-04 2013-12-10 Guardian Industries Corp. Electronic devices including transparent conductive coatings including carbon nanotubes and nanowire composites, and methods of making the same
US8518472B2 (en) * 2010-03-04 2013-08-27 Guardian Industries Corp. Large-area transparent conductive coatings including doped carbon nanotubes and nanowire composites, and methods of making the same
KR20170026652A (ko) 2010-03-30 2017-03-08 난테로 인크. 네트워크, 직물, 및 필름 내에서의 나노규모 요소의 배열 방법
US10661304B2 (en) 2010-03-30 2020-05-26 Nantero, Inc. Microfluidic control surfaces using ordered nanotube fabrics
KR20110126998A (ko) * 2010-05-18 2011-11-24 삼성전자주식회사 Cnt 조성물, cnt 막구조체, 액정표시장치, cnt 막구조체의 제조방법 및 액정표시장치의 제조방법
EP2579276A4 (en) * 2010-05-28 2014-02-19 Shinetsu Polymer Co TRANSPARENT CONDUCTIVE FILM AND CONDUCTIVE SUBSTRATE USING THE SAME
CN103069369B (zh) * 2010-06-17 2016-05-18 信越聚合物株式会社 输入装置
JP5534437B2 (ja) * 2010-07-28 2014-07-02 信越ポリマー株式会社 入力装置
EP3651212A3 (en) 2010-08-07 2020-06-24 Tpk Holding Co., Ltd Device components with surface-embedded additives and related manufacturing methods
CN103109391B (zh) * 2010-09-24 2016-07-20 加利福尼亚大学董事会 纳米线-聚合物复合材料电极
JP5543889B2 (ja) * 2010-09-30 2014-07-09 株式会社クラレ 配線形成方法、及び配線
US9768460B2 (en) 2010-12-17 2017-09-19 University Of Florida Research Foundation, Inc. Hydrogen oxidation and generation over carbon films
AU2012240367A1 (en) 2011-04-04 2013-11-07 University Of Florida Research Foundation, Inc. Nanotube dispersants and dispersant free nanotube films therefrom
US9278856B2 (en) 2011-04-08 2016-03-08 Covestro Llc Flexible sensing material containing carbon nanotubes
JP5730240B2 (ja) 2011-04-25 2015-06-03 信越ポリマー株式会社 静電容量センサシートの製造方法及び静電容量センサシート
US8569631B2 (en) * 2011-05-05 2013-10-29 Tangitek, Llc Noise dampening energy efficient circuit board and method for constructing and using same
CN102820093B (zh) * 2011-06-09 2014-05-28 天津富纳源创科技有限公司 图案化导电元件的制备方法
TWI447481B (zh) * 2011-06-09 2014-08-01 Shih Hua Technology Ltd 觸摸屏面板的製備方法
TWI447978B (zh) 2011-06-09 2014-08-01 Shih Hua Technology Ltd 觸摸屏面板的製備方法
TWI428667B (zh) 2011-06-09 2014-03-01 Shih Hua Technology Ltd 觸摸屏面板的製備方法
TWI457808B (zh) 2011-06-09 2014-10-21 Shih Hua Technology Ltd 觸摸屏
TWI528388B (zh) 2011-06-09 2016-04-01 識驊科技股份有限公司 圖案化導電元件
TWI441940B (zh) * 2011-06-09 2014-06-21 Shih Hua Technology Ltd 圖案化導電元件的製備方法
TWI512555B (zh) 2011-06-09 2015-12-11 Shih Hua Technology Ltd 觸摸屏面板及其製備方法
TWI425562B (zh) 2011-06-09 2014-02-01 Shih Hua Technology Ltd 觸摸屏面板的製備方法
CN102820073A (zh) * 2011-06-09 2012-12-12 天津富纳源创科技有限公司 图案化导电元件
KR101285414B1 (ko) * 2011-06-23 2013-07-11 (주)탑나노시스 탄소나노튜브필름 제조 방법
EP2725587A4 (en) * 2011-06-24 2015-07-08 Kuraray Co METHOD FOR FORMING CONDUCTIVE FILM, CONDUCTIVE FILM, INSULATION METHOD, AND INSULATING FILM
EP3739598B1 (en) 2011-08-24 2023-12-06 Tpk Holding Co., Ltd Patterned transparent conductors and related manufacturing methods
KR20130033679A (ko) * 2011-09-27 2013-04-04 삼성전기주식회사 터치패널의 제조방법
WO2013049816A1 (en) 2011-09-30 2013-04-04 Sensitronics, LLC Hybrid capacitive force sensors
CN102515558B (zh) * 2011-11-21 2013-12-04 江西理工大学 一种以组合法制备透明导电碳纳米管薄膜的方法
CN103488323B (zh) * 2012-06-13 2016-06-08 东元奈米应材股份有限公司 触控面板及其制造方法
WO2014063009A1 (en) * 2012-10-18 2014-04-24 Texas State University-San Marcos Multi-functional high performance nanocoatings from a facile co-assembly process
CN103838455B (zh) * 2012-11-23 2016-12-21 北京富纳特创新科技有限公司 电阻式触摸屏
JP6373284B2 (ja) 2013-02-28 2018-08-15 エヌ12 テクノロジーズ, インク.N12 Technologies, Inc. ナノ構造フィルムのカートリッジベース払い出し
CN103176650B (zh) * 2013-03-01 2016-09-28 南昌欧菲光科技有限公司 导电玻璃基板及其制作方法
US20140262443A1 (en) * 2013-03-14 2014-09-18 Cambrios Technologies Corporation Hybrid patterned nanostructure transparent conductors
US8978187B2 (en) 2013-03-15 2015-03-17 Lighting Science Group Corporation System for electrostatic removal of debris and associated methods
KR20140118018A (ko) * 2013-03-27 2014-10-08 인텔렉추얼디스커버리 주식회사 전자방출소자 및 그 제조방법
CN103236442B (zh) 2013-04-23 2016-12-28 京东方科技集团股份有限公司 薄膜晶体管及其制造方法、阵列基板、电子装置
US9650732B2 (en) 2013-05-01 2017-05-16 Nantero Inc. Low defect nanotube application solutions and fabrics and methods for making same
WO2015034469A2 (en) * 2013-09-03 2015-03-12 Aneeve Nanotechnologies, Llc A process for cleaning carbon nanotubes and other nanostructured films
US10654718B2 (en) 2013-09-20 2020-05-19 Nantero, Inc. Scalable nanotube fabrics and methods for making same
JP2017504547A (ja) 2013-11-20 2017-02-09 ユニバーシティー オブ フロリダ リサーチ ファウンデーション,インコーポレイテッドUniversity Of Florida Research Foundation,Inc. 炭素含有材料による二酸化炭素の還元
WO2015156894A2 (en) * 2014-01-24 2015-10-15 William Marsh Rice University Carbon nanotube-coated substrates and methods of making the same
DE102014107909A1 (de) * 2014-06-05 2015-12-17 Infineon Technologies Ag Leiterplatten und Verfahren zu deren Herstellung
KR102251775B1 (ko) 2014-07-18 2021-05-12 삼성전자주식회사 전극 구조체 및 이를 사용하는 접촉 감지 센서
US9299430B1 (en) 2015-01-22 2016-03-29 Nantero Inc. Methods for reading and programming 1-R resistive change element arrays
CN104699309B (zh) * 2015-03-31 2017-06-13 合肥京东方光电科技有限公司 一种触摸屏、其制作方法及显示装置
WO2017033461A1 (ja) * 2015-08-24 2017-03-02 日本ゼオン株式会社 熱伝導シート及びその製造方法
WO2017143268A1 (en) 2016-02-17 2017-08-24 Qatar Foundation For Education, Science And Community Development Flexible dust shield
CN109311239A (zh) 2016-05-31 2019-02-05 麻省理工学院 包括非线性细长纳米结构的复合制品以及相关的方法
US9934848B2 (en) 2016-06-07 2018-04-03 Nantero, Inc. Methods for determining the resistive states of resistive change elements
US9941001B2 (en) 2016-06-07 2018-04-10 Nantero, Inc. Circuits for determining the resistive states of resistive change elements
CN108630708A (zh) 2017-03-15 2018-10-09 京东方科技集团股份有限公司 导电基板及其制作方法、显示装置
EP3681942A4 (en) 2017-09-15 2021-05-05 Massachusetts Institute of Technology LOW DEFAULT MANUFACTURING OF COMPOSITE MATERIALS
US11031657B2 (en) 2017-11-28 2021-06-08 Massachusetts Institute Of Technology Separators comprising elongated nanostructures and associated devices and methods, including devices and methods for energy storage and/or use
WO2019147616A1 (en) * 2018-01-24 2019-08-01 Nano-C, Inc. Methods for manufacturing of heterogeneous rigid rod networks
US11626486B2 (en) 2018-01-29 2023-04-11 Massachusetts Institute Of Technology Back-gate field-effect transistors and methods for making the same
US11561195B2 (en) 2018-06-08 2023-01-24 Massachusetts Institute Of Technology Monolithic 3D integrated circuit for gas sensing and method of making and system using
WO2019239408A1 (en) * 2018-06-13 2019-12-19 Tortech Nano Fibers Ltd Carbon nanotube (cnt)-metal composite products and methods of production thereof
CN113544688B (zh) 2018-09-10 2022-08-26 麻省理工学院 用于设计集成电路的系统和方法
CN112840448A (zh) 2018-09-24 2021-05-25 麻省理工学院 通过工程化原子层沉积对碳纳米管的可调掺杂
WO2020113205A1 (en) * 2018-11-30 2020-06-04 Massachusetts Institute Of Technology Rinse - removal of incubated nanotubes through selective exfoliation
CN110098328B (zh) * 2019-03-29 2023-10-31 北京大学深圳研究生院 柔性电子器件及其制造方法
EP4170401A4 (en) * 2020-07-09 2024-02-28 Sumitomo Electric Industries, Ltd. RESIN COMPOSITION, OPTICAL FIBER SECONDARY COATING MATERIAL, OPTICAL FIBER AND OPTICAL FIBER PRODUCTION METHOD

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916642A (en) * 1995-11-22 1999-06-29 Northwestern University Method of encapsulating a material in a carbon nanotube
CN1280382A (zh) * 1999-06-18 2001-01-17 李铁真 使用碳纳米管的白光源及其制造方法
US6278231B1 (en) * 1998-03-27 2001-08-21 Canon Kabushiki Kaisha Nanostructure, electron emitting device, carbon nanotube device, and method of producing the same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07101672B2 (ja) * 1993-02-24 1995-11-01 日本電気株式会社 微細物質の固定ならびに電極形成法
US6221330B1 (en) * 1997-08-04 2001-04-24 Hyperion Catalysis International Inc. Process for producing single wall nanotubes using unsupported metal catalysts
US6630772B1 (en) * 1998-09-21 2003-10-07 Agere Systems Inc. Device comprising carbon nanotube field emitter structure and process for forming device
JP3494583B2 (ja) * 1999-01-13 2004-02-09 松下電器産業株式会社 電子放出素子の製造方法
US6250984B1 (en) * 1999-01-25 2001-06-26 Agere Systems Guardian Corp. Article comprising enhanced nanotube emitter structure and process for fabricating article
KR20010011136A (ko) * 1999-07-26 2001-02-15 정선종 나노구조를 에미터로 사용한 삼극형 전계 방출 에미터의 구조및 그 제조방법
KR100791686B1 (ko) * 1999-10-12 2008-01-03 마쯔시다덴기산교 가부시키가이샤 전자방출소자 및 그것을 이용한 전자원, 전계방출형화상표시장치, 형광등 및 그들의 제조방법
JP3566167B2 (ja) * 2000-02-17 2004-09-15 日本電信電話株式会社 分子導線と金属電極の接続方法および基板
JP4140180B2 (ja) * 2000-08-31 2008-08-27 富士ゼロックス株式会社 トランジスタ
WO2002041348A1 (fr) * 2000-11-20 2002-05-23 Nec Corporation Film cnt et cathode froide a emission de champ comportant ce film
EP1209714A3 (en) * 2000-11-21 2005-09-28 Futaba Corporation Method for manufacturing nano-tube, nano-tube manufactured thereby, apparatus for manufacturing nano-tube, method for patterning nano-tube, nano-tube material patterned thereby, and electron emission source
US6448701B1 (en) * 2001-03-09 2002-09-10 The United States Of America As Represented By The Secretary Of The Navy Self-aligned integrally gated nanofilament field emitter cell and array
US20020160111A1 (en) * 2001-04-25 2002-10-31 Yi Sun Method for fabrication of field emission devices using carbon nanotube film as a cathode
US6918946B2 (en) * 2001-07-02 2005-07-19 Board Of Regents, The University Of Texas System Applications of light-emitting nanoparticles
JP4109952B2 (ja) * 2001-10-04 2008-07-02 キヤノン株式会社 ナノカーボン材料の製造方法
JP2003197131A (ja) * 2001-12-26 2003-07-11 Hitachi Ltd 平面表示装置およびその製造方法
US6811457B2 (en) * 2002-02-09 2004-11-02 Industrial Technology Research Institute Cathode plate of a carbon nano tube field emission display and its fabrication method
KR100449759B1 (ko) * 2002-03-21 2004-09-22 삼성에스디아이 주식회사 전자관용 음극 및 그 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5916642A (en) * 1995-11-22 1999-06-29 Northwestern University Method of encapsulating a material in a carbon nanotube
US6278231B1 (en) * 1998-03-27 2001-08-21 Canon Kabushiki Kaisha Nanostructure, electron emitting device, carbon nanotube device, and method of producing the same
CN1280382A (zh) * 1999-06-18 2001-01-17 李铁真 使用碳纳米管的白光源及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10177058B1 (en) 2018-01-26 2019-01-08 Powertech Technology Inc. Encapsulating composition, semiconductor package and manufacturing method thereof

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