CN101578009B - 电路板基膜、电路板基板及电路板 - Google Patents

电路板基膜、电路板基板及电路板 Download PDF

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CN101578009B
CN101578009B CN2008103014246A CN200810301424A CN101578009B CN 101578009 B CN101578009 B CN 101578009B CN 2008103014246 A CN2008103014246 A CN 2008103014246A CN 200810301424 A CN200810301424 A CN 200810301424A CN 101578009 B CN101578009 B CN 101578009B
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李文钦
林承贤
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Peng Ding Polytron Technologies Inc
Avary Holding Shenzhen Co Ltd
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Fukui Precision Component Shenzhen Co Ltd
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Abstract

本发明涉及一种电路板基膜，其包括第一半固化树脂层、第二半固化树脂层及夹设于第一半固化树脂层和第二半固化树脂层之间的屏蔽层，所述屏蔽层包括多个碳纳米管膜。所述柔性电路板基膜可屏蔽电路板相邻两导电线路层之间产生的电磁干扰。本发明还涉及包括该柔性电路板基膜的电路板基板及采用该柔性电路板基板制作的电路板。

Description

电路板基膜、电路板基板及电路板
技术领域
本发明涉及印刷电路板领域，尤其涉及一种电路板基膜及包括该电路板基膜的电路板基板和电路板。
背景技术
近年来，为了适应电子设备、通讯设备、计算机等小型化和多功能化的需求，印刷电路板的层数不断增加，体积减小，布线密度提高。印刷电路板上相邻近的线路在工作时产生电磁干扰(Flectromagnetic Interference，EMI)，其会导致在信号的传输过程中会产生杂讯和杂音，严重影响产品的性能。请参见Pong，M.H及Lee，C.M.等人发表于powerElectronics Specialists Conference，1998.PESC 98 Record.29th Annual IEEEVolume2，17-22May 1998Page(s)：1125-1130vol.2EMI due to electric field couplingon PCB。
目前，为了降低和防止印刷电路板产生电磁干扰，在印刷电路板设置屏蔽层。设置的屏蔽层为金属材质，这样就会增加电路板重量，而且在柔性印刷电路板中，屏蔽层的设置会影响柔性电路板的挠折性能，使得柔性电路板的弯曲次数减少，而且会影响电路板小型化的需求。
发明内容
有鉴于此，有必要提供一种电磁屏蔽功能的电路板基膜，用于电路板中电磁屏蔽的作用，提高电路板的性能。
以下将以实施例说明一种电路板基膜和使用该电路板基膜的电路板基板及电路板。
一种电路板基膜，其包括第一半固化树脂层、第二半固化树脂层及夹设于第一半固化树脂层和第二半固化树脂层之间的屏蔽层，所述屏蔽层包括多个碳纳米管膜。
一种电路板基板，其包括电路板基膜和至少一导电层，所述电路板基膜具有相对的两表面，导电层形成于电路板基膜的至少一表面上，所述电路板基膜为上述的电路板基膜。
一种电路板，其包括至少一层上述的电路板基膜以及至少一层形成在所述电路板基膜上的导电线路。
本技术方案电磁屏蔽层采用碳纳米管膜层取代本领域常见金属导体的电磁屏蔽层，碳纳米管具有很高韧性，重量极轻，导电性极强，而且具有良好的导热性能，因此能够得到与金属屏蔽层相同的屏蔽效果，并且可以降低电路板的重量，使得电路板在工作过程中产生的热量可以通过碳纳米管膜层快速散发出去。
附图说明
图1是本技术方案的电路板基膜实施例的结构示意图。
图2是本技术方案的电路板基膜制作方法流程图。
图3是本技术方案的从碳纳米管阵列拉取碳纳米管膜示意图。
图4是本技术方案的屏蔽层的碳纳米管膜披覆示意图。
图5是本技术方案的电路板基板实施例的结构示意图。
图6是本技术方案的电路板基板的实施例另一结构示意图。
图7是本技术方案的电路板的第一实施例结构示意图。
图8是本技术方案的电路板的第一实施例另一结构示意图。
图9是本技术方案的电路板的第二实施例拆分结构示意图。
图10是本技术方案的电路板第二实施例的结构示意图。
具体实施方式
下面将结合多个实施例和附图对本技术方案进行进一步说明。
参见图1，其为本技术方案提供的电路板基膜的实施例示意图。电路板基膜10包括第一半固化树脂层1、第二半固化树脂层3及夹设于第一半固化树脂层1和第二半固化树脂层3之间的屏蔽层2。
所述第一半固化树脂层1具有相对的第一表面11和第二表面12，且第一表面11和第二表面12为平面。第一半固化树脂层1与第二半固化树脂层3由半固化树脂形成，可以为柔性电路板绝缘基膜常用的材料，例如聚酰亚胺、聚乙烯对苯二甲酸乙二醇酯、聚四氟乙烯、聚硫胺、聚甲基丙烯酸甲酯、聚碳酸酯或聚酰亚胺-聚乙烯-对苯二甲酯共聚物。
所述屏蔽层2形成于第一半固化树脂层1的第一表面11上，所述屏蔽层2包括多层碳纳米管膜，且多层碳纳米管膜依次披覆于第一表面11上形成屏蔽层2。本实施例中的碳纳米管膜可由碳纳米管阵列拉出，即组成碳纳米管膜的多个碳纳米管相互平行。
请参阅图2，以下以实施例说明实施例的电路板基膜10的制作方法，该方法包括以下步骤：
第一步，参阅图3，提供碳纳米管阵列20。碳纳米管阵列20可采用化学气相沉积法生长，具体可参阅文献Science，1999，283，512-414和文献J.Am.Chem.Soc，2001，123，11502-11503，此外，中国大陆专利申请公开第02134760.3号也提供了超顺排碳纳米管阵列的生长方法。一般的，碳纳米管阵列生长方法包括：提供一平滑基底，在该基底上沉积一层催化剂层，将沉积有催化剂层的基底在保护气中以300℃至400℃温度下进行退火，时间约为10小时，之后，将沉积有催化剂层的基底加热至500℃至700℃，通入碳源气，碳源气优选为乙炔，反应5至30分钟。通过此种方法生长的碳纳米管阵列20中的碳纳米管呈束状密集排列，直径大小分布比较集中。
第二步，从碳纳米管阵列20中拉取碳纳米管膜21。从所述的纳米阵列20中选定一包括多个碳纳米管束片段，使用拉伸工具，如镊子，沿着拉力方向拉伸该碳纳米管束片段。在拉伸过程中，碳纳米管束片段在拉力的作用下沿拉力方向延伸的同时，碳纳米管束片段两端将由于范德华力的作而首尾相接的连在一起，形成多根碳纳米管线22。如此拉取多次，使拉出的多根碳纳米管线22合并在一起，构成所述的碳纳米管膜21。依照上述方法，可以得到多个碳纳米管膜21。
第三步，将多个碳纳米管膜21依次披覆于第一半固化树脂层1的第一表面11上，从而在第一表面11上形成屏蔽层2。通常情况下，屏蔽层2中的碳纳米管膜21的层数在十层以上，且屏蔽层2的厚度为1微米至50微米。屏蔽层2中的各碳纳米管膜21的延伸方向可以相同也可以不同。例如，请参阅图4，屏蔽层2包括多个第一碳纳米管膜211和多个第二碳纳米管膜212，第一碳纳米管膜211中碳纳米管211a沿直线x延伸，第二碳纳米管膜212中碳纳米管212b沿直线y延伸，且直线x与直线y成一角度α，该角度α大于0°且小于或等于90°。优选地，第一碳纳米管膜211与第二碳纳米管膜212中的碳纳米管的延伸方向所成角度α为60°。
第四步，在屏蔽层2远离第一半固化树脂层1的表面上压合第二半固化树脂层3从而得到所述的电路板基膜10。
作为本技术方案的电路板基膜的实施例的应用，参见图5，本技术方案提供电路板基板30，其包括电路板基膜31和至少一导电层32，所述电路板基膜31与上述电路板基膜10结构相同，电路板基膜31具有第一表面311和与第一表面311相对的第二表面312。导电层32为铜箔，铜箔通过压合或粘合的方式形成于电路板基膜31的一个表面上。参阅图6，电路板基膜31的二相对表面311、312上均形成层电层32从而得到一双面电路板基板40。
请参见图7，本技术方案提供的电路板的第一实施例单面板50，其包括电路板基膜51和至少一导电线路52。所述电路板基膜51与施例中的电路板基膜10结构相同，电路板基膜51具有第一表面511和与第一表面511相对的第二表面512。导电线路52形成于第一表面511。
电路板50可以采用本技术方案提供的电路板基板30按照电路板的制作工艺形成。例如，对电路板基板30的导电层32进行影像转移、蚀刻的步骤可形成导电线路52。可以理解，如果采用电路板基板40制作电路板，则如图8所示，导电层52形成于电路板基膜51的二相对表面511、512上从而得到一双面电路板60。
请参见图9及图10，本技术方案提供第二电路板实施例多层电路板70，其包括第一电路板71、电路板基膜73和第二电路板72。
所述第一电路板71是与本技术方案提供第二电路板实施例双面板60结构相同的双面板，其具有电路板基膜712及形成于电路板基膜二相对表面上的第一导电线路711和第二导电线路713。
所述电路板基膜73是与本技术方案提供电路板基膜10结构相同的电路板基膜，其具有相对的第一表面731和第二表面732。
所述第一电路板72是与本技术方案提供第二电路板实施例双面板60结构相同的双面板，其具有电路板基膜722及形成于电路板基膜二相对表面上的第一导电线路721和第二导电线路723。
所述电路板基膜73的第一表面731与第一电路板的第二导电线路712相接触，电路板基膜73的第二表面732与第二电路板的第一导电层721相接触，按此次序压合第一电路板71、电路板基膜73和第二电路板72压合形成多层电路板70。
可以理解，多层电路板70的相邻两导电线路层之间设置具有电磁屏蔽电路板基膜，这样，多层电路板工作过程中，相邻电路板的线路可以得到电磁屏蔽，从而保证电信号的传输质量。
进一步，多层电路板可以通过至少二个本技术方案提供的电路板第二实施例单面板50压合形成，还可以通过二个本技术方案提供电路板第二实施例双面板60和设置于两双面板60之间本实施例提供的电路板基膜形成多层电路板。
可以理解，应用单面板50、双面板60和电路板基膜10之间的组合，压合在一起，可以形成在二相邻导电线路之间具有屏蔽层的多层电路板。
上述实施例的多层电路板，可以为软性电路板，也可以为硬性电路板，或者为软硬结合的电路板。在上述各类多层电路板的结构中，相邻导电线路层之间可以设置屏蔽层，用以将相邻线路层所可能产生的电磁干扰得以屏蔽。从而保证电信号的传输质量。
进一步，应用碳纳米管膜作为电磁屏蔽的材料，碳纳米管具有很高韧性，重量却极轻，导电性极强，而且具有良好的导热性能，电路板工作过程中产生的热量可以通过碳纳米管膜层传导。
以上实施例对本技术方案进行了详细的描述，但不能理解为对本技术方案的限制。对于本领域的普通技术人员来说，可以根据本技术方案的构思做出其它各种相应的改变与变形，而所有这些改变与变形都应属于本申请权利要求的保护范围。

Claims (10)

1.一种电路板基膜，其包括第一半固化树脂层、第二半固化树脂层及夹设于第一半固化树脂层和第二半固化树脂层之间的屏蔽层，其特征在于，所述屏蔽层包括多层由多个碳纳米管构成的碳纳米管膜。
2.如权利要求1所述的电路板基膜，其特征在于，所述多层碳纳米管膜中，每层碳纳米管膜中的多个碳纳米管相互平行。
3.如权利要求2所述的电路板基膜，其特征在于，所述屏蔽层中各碳纳米管膜中的碳纳米管的延伸方向相同。
4.如权利要求2所述的电路板基膜，其特征在于，所述屏蔽层中相邻碳纳米管膜中的碳纳米管的延伸方向成一角度。
5.如权利要求4所述的电路板基膜，其特征在于，所述屏蔽层包括多层第一碳纳米管膜和多层第二碳纳米管膜，第一碳纳米膜与第二碳纳米膜相互交替地排布，第一碳纳米管膜中的碳纳米管的延伸方向与第二碳纳米管膜中的碳纳米管的延伸方向成一角度α。
6.如权利要求5所述的电路板基膜，其特征在于，所述角度α大于0°且小于或等于90°。
7.如权利要求1所述的电路板基膜，其特征在于，所述屏蔽层的厚度为1微米至50微米。
8.一种电路板基板，其包括电路板基膜和至少一导电层，所述电路板基膜具有相对的两表面，导电层形成于电路板基膜的至少一表面上，其特征在于，所述电路板基膜为权利要求1至7任一项所述的电路板基膜。
9.一种电路板，其包括至少一层如权利要求1至7任一项所述的电路板基膜以及至少一层形成在所述电路板基膜上的导电线路。
10.如权利要求9所述的电路板，其特征在于，所述电路板基膜设置于电路板的二相邻的导电线路层之间。
CN2008103014246A 2008-05-06 2008-05-06 电路板基膜、电路板基板及电路板 Expired - Fee Related CN101578009B (zh)

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