TWI376996B - Printed circuit board and packaging structure having the same - Google Patents

Description

1376996 1101. February 15th, according to the positive α · 1 VI, the invention description: [Technical field of the invention] [0001] The present invention relates to the field of circuit board technology, in particular to a circuit board and a buried circuit board package structure . [Prior Art]

[_In information, communication and consumer electronics products#, circuit boards have essential components that are indispensable for electronic products. With the development of electronic products in the direction of miniaturization and high speed, circuit boards have also evolved from single-sided circuit boards to double-sided circuit boards and multilayer circuit boards. Multilayer boards are widely used due to their large wiring area and high assembly density, see

Takahashi, A. et al., published in IEEE Trans. in 1992 〇

Components, Packaging, and Manufacturing

The high-density multilayer printed circuit board for HITAC M~ 880”. The increase in the wiring area and the refinement of the conductive lines make the line width and line spacing of the circuit board lines smaller and smaller, and the resistance of the lines becomes larger and larger. The enthusiasm generated is also increasing. The density of the package has increased the number of package components such as integrated W' resistors on the board, so that the heat generated by the packaged components is greatly increased. Therefore, the circuit of the prior art The board and the circuit board package structure generate more heat, but can dissipate heat more quickly, especially for the embedded circuit board package structure. [0004] In view of this, a circuit with a higher thermal performance is provided. A board and a circuit board package structure are necessary. [0005] Hereinafter, a circuit board and a circuit board cracking structure 09713517# single number A0101 g 3 pages / total 22 pages 1〇13〇557〇 will be described by way of embodiments. 5~〇1376996 .February 15th, 2010, according to the positive page [0006] A circuit board, which in turn comprises a conductive layer, a composite material layer and an insulating layer, the insulating layer has a And the composite material layer comprises a polymer matrix and at least one bundle of carbon nanotubes disposed in the polymer matrix, one end of the bundle of carbon nanotubes being in contact with the conductive layer and the other end being exposed from the receiving hole of the insulating layer. [0007] A circuit board package structure comprising a package component and a circuit board as described above, the package component being disposed in a receiving hole of the insulating layer and electrically connected to the conductive layer by a bundle of carbon nanotubes. [0008] Compared with the prior art In comparison, the circuit board of the technical solution and the circuit board package structure have a composite material layer, the composite material layer includes a carbon nanotube bundle, and one end of the carbon nanotube bundle is in contact with the conductive layer, and the other end is exposed from the receiving hole of the insulating layer. Therefore, the carbon nanotube bundle in the composite layer can electrically conduct the conductive layer and the package component embedded in the receiving hole of the insulating layer, and can conduct heat of the package component to the conductive layer faster to accelerate the heat dissipation rate. Embodiments [0009] Hereinafter, the circuit board and the circuit board package structure provided by the technical solution are further combined with the accompanying drawings and the plurality of embodiments. DETAILED DESCRIPTION [0010] Referring to FIG. 1, a circuit board 10 according to a first embodiment of the present invention includes a conductive layer 11, a composite material layer 12, and an insulating layer 13. The conductive layer 11 may be made of copper, aluminum, gold, or the like. The conductive layer 11 has a conductive pattern 111, and the conductive pattern 111 includes a conductive line 1111 and a plurality of conductive contacts 1112. The conductive line 1111 is used for transmitting signals, and the plurality of conductive contacts 1112 are used for transmitting signals. Electrically connected to the package component for signal processing. The composite material layer 12 is located at the conductive layer 11 and the insulating layer 13 1013055705-0 09713517 #单号A〇101 Page 4 of 22 pages 1376996 _

[ϊ^ϊ年. On February 15th, the shuttle is replacing the page I with a first surface] 20] and a second surface 1 202. The first surface 1201 is in contact with the conductive layer η, and the second surface 12〇2 is parallel to the first surface 1201 and is in contact with the insulating layer 13. The insulating layer 13 is made of a material for insulating and supporting the conductive layer 11 and the composite layer 12. The insulating layer 13 has a receiving hole 13 收容 for accommodating the embedded package component. The opening position of the receiving hole 130 corresponds to the position of the plurality of conductive contacts 1112 to facilitate electrical connection between the package component and the plurality of conductive contacts 1112. Specifically, the composite material layer 12 includes a polymer matrix 121 and a carbon nanotube bundle 122 disposed in the polymer matrix 121. The polymer matrix 121 can be epoxy (Epoxy), polyfluorene (p〇iyimide, ρι), polyethylene terephthalate (PET), polytetrafluoroethylene (Polytetrafluoroethylene). , PTFE), polyamide, polymethylmethacrylate (PMMA), polycarbonate (Polycarbonate) or polyimine-polyethylene-terephthalate copolymer (Polyamide polyethylene- Terephthalate copolymer) and other insulating resin. The carbon nanotube bundle 122 comprises a carbon nanotube or a plurality of carbon nanotubes arranged in parallel. One end of the carbon nanotube bundle 122 is electrically connected to the conductive layer 11 and the other end is exposed from the receiving hole 13 so as to be in contact with the package member disposed in the receiving hole 130, thereby electrically connecting the conductive layer η to the package member. The number of carbon nanotube bundles 22 can be one, or plural, depending on the structure of the package components. [0012] In this embodiment, the composite material layer 12 includes a plurality of carbon nanotube bundles 122, a plurality of 1013055705-0 09713517# single number Α 0101 5th page / a total of 22 pages 1376996 [0014] [0015] [0016] [0018] [0018] On February 15, 101, the nuclear replacement number of carbon nanotube bundles 122 are embedded in the polymer matrix 121 at an interval from each other in an array. That is, the plurality of carbon nanotube bundles 122 are disposed between the conductive layer 11 and the insulating layer 13 in an insulated manner from each other. The plurality of carbon nanotube bundles 122 are arranged in parallel with each other. Each of the carbon nanotube bundles 122 includes a plurality of carbon nanotubes arranged in parallel, and the axial direction of the plurality of carbon nanotubes, that is, the extending direction of the carbon nanotube bundle 122 and the first surface 1201 is 80 to 100. Between degrees. That is, each of the carbon nanotube bundles 122 is substantially perpendicular to the first surface 1201 and the second surface 1202. Moreover, each of the nanotube bundles 122 has a length that is slightly greater than or substantially equal to the thickness of the composite layer 12 such that one end of each of the nanotube bundles 122 can protrude slightly from the first surface 1201 or just to the first surface 1201. The ends are flush and the other end protrudes slightly from the second surface 1 202 or just flush with the second surface 1202. Therefore, the carbon nanotube bundle 122 can electrically connect the conductive layer 11 to the package component of the insulating layer 13, and can quickly transfer the heat of the package component buried in the insulating layer 13 to the first surface 1201 and the conductive layer 11, Thereby quickly dissipating heat to the outside world. The circuit board 10 provided in the first embodiment of the present technical solution can be prepared by the following steps: First, referring to FIG. 2, a substrate 100 is provided. The substrate 100 may be a metal layer such as a copper layer, an aluminum layer or a nickel layer. The thickness of the substrate 100 can be between 2 and 200 microns. In the second step, referring to FIG. 3, a catalyst layer 200 is formed on the substrate 100. The catalyst layer 200 is a material of a growthable carbon nanotube such as iron, cobalt, nickel or an alloy thereof. Also, the catalyst layer 200 has a predetermined pattern. The predetermined pattern No. A_ Page 6 of 22

1013055705-0 1376996 «» t On February 15, 2011, the shape and distribution of the replacement page are not limited. It is only necessary to make the growing plurality of carbon nanotube bundles have a predetermined arrangement. In this embodiment, the predetermined pattern is an array pattern such that the plurality of carbon nanotube bundles grown are arrayed and spaced apart from each other. The method of forming the predetermined pattern is also not limited. For example, the patterned photoresist may be formed on the surface of the substrate 100, and the catalyst material may be formed on the surface of the substrate 100; or may be formed on the substrate 100 by electroplating, evaporation, sputtering or vapor deposition. The entire layer of the catalyst layer is formed by selectively engraving the catalyst layer.

[0019] In the third step, referring to FIG. 4, a plurality of carbon nanotube bundles 122 are grown on the catalyst layer 200. [0020] Since the catalyst layer 200 has a predetermined pattern, the grown plurality of carbon nanotube bundles 122 are also arranged in an array in a predetermined pattern with a certain interval therebetween to fill the polymer matrix, thereby ensuring a plurality of nanometers. The carbon tube bundles 122 are insulated from each other. [0021] The growth mode of the plurality of carbon nanotube bundles 122 is not limited. For example, when prepared by chemical vapor deposition, the substrate 100 on which the catalyst layer 200 is formed may be placed in a reaction furnace, and a carbon source gas such as acetylene or ethylene may be introduced at 700 to 1 000 degrees Celsius to thereby coat the catalyst layer 200. A plurality of carbon nanotube bundles 122 are grown thereon. The growth height of the plurality of carbon nanotube bundles 122 can be controlled by the growth time, and the growth height is generally 1 to 30 μm. [0022] The plurality of carbon nanotube bundles 122 are arranged in parallel with each other and extend in a direction substantially perpendicular to the catalyst layer 200. Each of the carbon nanotube bundles 122 may include one carbon nanotube or a plurality of carbon nanotubes arranged in parallel, that is, the axial direction of the carbon nanotubes in each of the carbon nanotube bundles 122 and the catalyst layer 200. The angle between the angles is 09713517^^ A0101 Page 7 / Total 22 pages 1013055705-0 1376996 101 years. February 15th revision _ page · To 80-1 00 degrees. [0023] In the fourth step, the composite material layer 12 is formed. [0024] First, referring to FIG. 5, the polymer matrix 121 is applied, sandwiched or otherwise applied between the plurality of carbon nanotube bundles 122 such that the polymer matrix 121 sufficiently fills the voids of the plurality of carbon nanotube bundles 122. And the polymer matrix 121 and the plurality of carbon nanotube bundles 122 are flush with one end of the catalyst layer 200 to form a flat first surface 1201, so that the polymer matrix 121 functions to connect and isolate the plurality of carbon nanotube bundles 122. The function is not to embed the plurality of carbon nanotube bundles 122 away from one end of the catalyst layer 200. [0025] In addition, if the polymer matrix 121 is applied to the plurality of carbon nanotube bundles 122, the polymer matrix 121 embeds the plurality of carbon nanotube bundles 122 away from one end of the catalyst layer 200, so that the plurality of carbon nanotube bundles 122 are entirely embedded in In the polymer matrix 121, a portion of the polymer matrix 121 may be removed by mechanical cutting, laser ablation or other means to form a flat first surface 1201, and the plurality of carbon nanotube bundles 122 are exposed away from one end of the catalyst layer 200. . Next, referring to FIG. 5 and FIG. 6, the substrate 100, the catalyst layer φ 200, and the polymer matrix 121* partially filled between the catalyst layers 200 are removed to form a flat second surface 1202. [0027] The method of removing the substrate 100 and the catalyst layer 200 may be an etching method. For example, when the substrate 100 is copper and the catalyst layer 200 is ferric oxide, the substrate 100 and the catalyst layer 200 may be removed by etching with a three-iron solution. Of course, when other base materials and catalyst layer materials are used, the corresponding etchant, that is, the ruthenium [0028] is used to remove the substrate 100 and the catalyst layer 200, and then the partial filling 1013055705-0 09713517# single number A 〇 101 page 8 / Total 22 pages 1376996, I. » 101. On February 15, the shuttle is replacing the polymer matrix 121 between the catalyst layers 200 to remove the polymer matrix 121 and the plurality of carbon nanotube bundles 122 from the catalyst layer 200. One end is flush and a flat second surface 1 202 is formed from the island. That is, the composite material layer 12 is formed as shown in Fig. 6. [0029] The method of removing the polymer matrix 121 is not limited and may be mechanical cutting, laser ablation, or die blanking. [0030] In the fifth step, the conductive layer 11 is pressed against the first surface 1201 of the composite material layer 12, and the insulating layer 13 is pressed against the second surface 1202, thereby obtaining the circuit board 10, as shown in FIG. [0031] The conductive layer 11 and the insulating layer 13 may be simultaneously pressed against the composite material layer 12, or may be laminated to the composite material layer 12 in sequence. [0032] Before or after the conductive layer 11 is pressed against the first surface 1201, a step of forming the conductive pattern 111 on the conductive layer 11 is further included. The step of forming the conductive layer 11 into the conductive pattern 111 can be realized by an image transfer method and an etching process. [0033] Before or after the insulating layer 13 is pressed against the second surface 1202, the receiving hole 130 may be formed at a predetermined position of the insulating layer 13 by mechanical drilling, laser hole burning or chemical etching. For housing and embedding package components. Therefore, one end of the carbon nanotube bundle 122 can be electrically connected to the conductive layer 11 and the other end can be exposed from the receiving hole 130, and the electrical connection between the package member disposed in the receiving hole 130 and the conductive layer 11 can be conveniently realized. [0034] Please refer to FIG. 7, the technical solution further provides a circuit board package structure 1, which comprises a package component 14, a package resin 15, and a circuit board as shown in FIG. 1 10 097 135 Π 编号 删 第 第 第 第22 pages 1013055705-0 1376996 1101 0Z 15th nuclear replacement 100 [0035] The package component 14 is a device for implementing a specific processing function, which can be an integrated circuit chip * can also be a capacitive inductance component * For memory or other devices. The package component 14 has a plurality of conductive terminals 141 for electrically connecting with other electronic components or circuit boards. [0036] In this embodiment, the package components 14 are buried in the insulation by the encapsulation resin 15. In the receiving hole 130 of the layer 13, the shape and the number of the plurality of conductive terminals 141 correspond to the shape and the number of the conductive contacts 1112. Each of the conductive terminals 141 is electrically connected to a conductive contact |1112 by one or a plurality of carbon nanotube bundles 122. [0037] Since the plurality of carbon nanotube bundles 122 are insulated from each other, the conduction between the plurality of conductive terminals 141 and the plurality of conductive contacts 1112 can be made one-to-one, and the remaining portions of the package component 14 except the plurality of conductive terminals 141 are The protective layer is covered and insulated to ensure proper transmission and processing of signals between the package component 14 and the circuit board 10. [0038] Of course, if the package component 14 has only one conductive terminal 141, the composite material layer 12 only needs to include a carbon nanotube bundle 122 to achieve electrical connection between the conductive terminal 141 and the conductive layer 11. Referring to FIG. 8 , the circuit board package structure 2 provided by the second embodiment of the present invention is substantially the same as the circuit board package structure 1 provided by the first embodiment, and the difference is that the circuit board package structure 2 is further A thermally conductive layer 26 is included. The heat conducting layer 26 is a thin layer of material having good thermal conductivity, which may be a metal material layer, a composite material layer, or other material layers. In this embodiment, the heat conducting layer 26 is of the same structure as the composite material layer 22, 09713517# single number A 〇 101 page 10 / total 22 pages 1013055705-0 1376996 » · year February 15g_giE_g layer 'set in the insulating layer 23 is away from the composite layer 22 and is in contact with the & edge layer 23. Thus, the heat dissipated by the package component 24 can be quickly dissipated to the outside by the plurality of carbon nanotube bundles 262 in the thermally conductive layer 26. Referring to FIG. 9, the circuit board package structure 3 provided by the third embodiment of the present invention is substantially the same as the circuit board package structure 2 provided by the second embodiment. The circuit board package structure 3 further includes - metal substrate Μ. The metal substrate 37 may be made of a material having good thermal conductivity such as copper or aluminum 4 and disposed on the side of the heat conducting layer 36 away from the insulating layer 33 and in contact with the heat conducting layer 36. Thereby, the heat radiated from the package member 34 can be quickly conducted to the metal substrate 37 by the plurality of carbon nanotube bundles 362 in the heat conduction layer 36, and is quickly dissipated to the outside by the metal substrate 37. That is, the metal substrate 37 can further accelerate the heat dissipation rate of the package member 34. [0041] Referring to FIG. 1 , the circuit board package structure 4 provided by the fourth embodiment of the present invention is substantially the same as the circuit board package structure 1 provided by the first embodiment, and the difference is that the circuit board package structure 4 A double-sided circuit board 48 is also included. The double-sided circuit board 48 is disposed on the side of the insulating layer 43 away from the composite material layer 42 and is in contact with the insulating layer 43. The double-sided circuit board 48 includes a first conductive wiring layer 481, a second conductive wiring layer 482, and a resin layer 483 disposed between the first conductive wiring layer 481 and the second conductive wiring layer 482. [0042] The circuit board package structure 4 further has a via hole 401 for electrically conducting the conductive layer 41 and the double-sided circuit board 48. In this embodiment, the via hole 401 is a via hole penetrating through the conductive layer 41, the composite material layer 42, the insulating layer 43, and the double-sided circuit board 48. [0043] Of course, the circuit board package structure 4 includes a double-sided 1013055705-0 09713517# single number A0101 page 11 / a total of 22 pages 1376996 101. February 15th nuclear replacement page as shown in this embodiment The circuit board 48 can also include a single-sided circuit board or a multi-layer circuit board. The heat of the package component 44 can be more effectively dissipated by the composite material layer 42 and the electrical conduction between the package component 44 and the conductive layer 41 can be realized. . [0044] Compared with the prior art, the circuit board and the circuit board package structure of the present technical solution have a composite material layer, the composite material layer includes a carbon nanotube bundle, and one end of the carbon nanotube bundle is in contact with the conductive layer, and the other end Exposed from the receiving hole of the insulating layer, the carbon nanotube bundle in the composite layer can electrically conduct the conductive layer and the package component embedded in the insulating layer receiving hole, and can conduct the heat of the package component to the conductive layer faster. Accelerate the dissipation of heat. [0045] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0046] FIG. 1 is a schematic diagram of a circuit board provided by a first embodiment of the present technical solution. [0047] FIG. 2 is a schematic view of a substrate provided by a first embodiment of the present technical solution. 3 is a schematic view showing the formation of a catalyst layer on a substrate according to a first embodiment of the present technical solution. 4 is a schematic view showing the growth of a plurality of carbon nanotube bundles on a catalyst layer according to a first embodiment of the present technical solution. 5 is a schematic view showing a gap between a polymer matrix filled with a plurality of carbon nanotubes according to a first embodiment of the present technical solution. 1013055705-0 09713517^Single number A〇101 Page 12 of 22 101. February 15th Nuclear replacement page 1376996

*. I

6 is a schematic view showing the removal of a base and a catalyst layer according to a first embodiment of the present technical solution. FIG. 7 is a schematic diagram of a circuit board package structure including the circuit board shown in FIG. 1 according to the first embodiment of the present technical solution. 8 is a schematic diagram of a circuit board package structure according to a second embodiment of the present invention. [0054] FIG. 9 is a schematic diagram of a circuit board package structure according to a third embodiment of the present technology. 10 is a schematic diagram of a circuit board package structure according to a fourth embodiment of the present technology. [Main component symbol description] [0056] Circuit board: 10 [0057] Conductive layer: 11, 41 [0058] Composite material layer: 12, 22, 42 · φ [0059] Insulation layer: 13, 23, 33, 43 [ 0060] Conductive pattern: 111 [0061] Conductive line: 1111 [0062] Conductive contact: 1112 [0063] First surface: 1201 [0064] Second surface: 1202 [0065] Receiving hole: 130 1013055705-0 Single number A 〇101 Page 13 of 22 1376996 February 15, 2011 Nuclear replacement page [0066] Polymer. Substrate: 121 [0067] Nano carbon tube bundle: 122, 262, 362 [0068] Substrate: 100 [0069] Catalyst layer: 200 [0070] Package element. Pieces: 14, 24, 34, 44 [0071] Conductive end point: 141 [0072] Encapsulation resin: 15

Thermal conductive layer: 26, 36 [0074] Metal substrate: 37 [0075] Double-sided circuit board: 48 [0076] First conductive wiring layer: 481 [0077] Second conductive wiring layer: 482 [0078] Resin layer :483 [0079] Guide hole: 401 1013055705-0 Page 14 of 22

Claims (1)

101. February 15th, nuclear replacement page 1376996 ♦ » VII, the scope of application for patents: 1. A circuit board, which in turn comprises a conductive layer, a composite material layer and an insulating layer, the insulating layer has a receiving hole, the composite material The layer comprises a polymer matrix and at least one bundle of carbon nanotubes disposed in the polymer matrix, the bundle of carbon nanotubes comprising a carbon nanotube or a plurality of carbon nanotubes arranged in parallel, the carbon nanotube bundle One end is electrically connected to the conductive layer, and the other end is exposed from the receiving hole of the insulating layer. 2. The circuit board of claim 1, wherein the composite material layer has a first surface opposite to the second surface, the first surface is in contact with the conductive layer, and the second surface is in contact with the insulating layer The angle between the extending direction of the carbon nanotube bundle and the first surface is between 80 and 100 degrees. 3. The circuit board of claim 2, wherein one end of the carbon nanotube bundle protrudes from the first surface or is flush with the first surface, and the other end protrudes from the second surface or the second surface Straight together. 4. The circuit board of claim 1, wherein the composite layer comprises a plurality of carbon nanotube bundles, the plurality of carbon nanotube bundles being arranged in an array in insulation with each other in the matrix. A circuit board package structure comprising a package component and a circuit board as described in claim 1, wherein the package component is disposed in a receiving hole of the insulating layer and electrically connected to the conductive layer by a bundle of carbon nanotubes. 6. The circuit board package structure of claim 5, wherein the conductive layer has a conductive contact, the package component has a conductive end point, and the conductive end point is connected to the conductive contact by a carbon nanotube bundle . 7. The circuit board package structure of claim 5, wherein the circuit board package structure further comprises a heat conducting layer disposed on the insulating layer 09 and 1# single job deletion 1 page 15 / total 22 pages 1013055705-0 1376996 February 15, 2011 Nuclear replacement page > One side away from the composite layer and in contact with the insulation layer. 8. The circuit board package structure of claim 7, wherein the circuit board package structure further comprises a metal substrate disposed on a side of the heat conductive layer away from the insulating layer and in contact with the heat conductive layer. 9. The circuit board package structure of claim 5, wherein the circuit board package structure further comprises a single-sided circuit board, a double-sided circuit board or a multi-layer circuit board, the single-sided circuit board and the double-sided circuit The board or the multi-layer circuit board is disposed on a side of the insulating layer away from the composite material layer, is in contact with the insulating layer, and is electrically connected to the conductive layer through the via hole. 10 . A circuit board comprising a conductive layer, a composite material layer and an insulating layer, the composite material layer having opposite first and second surfaces, the first surface being in contact with the conductive layer, the second surface being In contact with the insulating layer, the composite layer comprises a polymer matrix and a bundle of carbon nanotubes disposed on the polymer matrix, the bundle of carbon nanotubes comprising a carbon nanotube or a plurality of carbon nanotubes arranged in parallel, the naphthalene One end of the carbon tube bundle is flush with the first surface, and the other end is flush with the second surface. 11. A circuit board package structure comprising a package component and a circuit board, the package φ component having conductive terminals, the circuit board comprising a conductive layer, a composite material layer and an insulating layer in sequence, the conductive layer having conductive contacts, The insulating layer is used for embedding a package component, the composite material layer comprising a polymer matrix and a bundle of carbon nanotubes disposed on the polymer matrix, the bundle of carbon nanotubes comprising a carbon nanotube or a plurality of parallel arrays The carbon nanotube tube is used to conduct conductive contacts of the conductive end of the package component and the conductive layer. 0971351?#单号 A〇101 Page 16 of 22 1013055705-0