TWI419274B - Packaging substrate and packaging structure - Google Patents

Description

Package substrate and package structure

The present invention relates to circuit board technology, and in particular to a package substrate and a package structure having the package substrate.

In the information, communications and consumer electronics industries, circuit boards are an essential component of all electronic products. With the development of electronic products in the direction of miniaturization and high speed, circuit boards have also evolved from single-sided circuit boards to double-sided circuit boards and multilayer circuit boards. Multilayer boards are widely used due to their large wiring area and high assembly density. Please refer to Takahashi, A. et al., 1992, IEEE Trans.on Components, Packaging, and Manufacturing Technology, "High Density Layer printed". Circuit board for HITAC M~880”.

The increase of the wiring area and the refinement of the conductive lines make the circuit board line width smaller and smaller, the resistance of the line becomes larger and larger, and the heat generated is more and more. The increase in assembly density greatly increases the number of package components such as integrated wafers and resistors on the board, and also greatly increases the amount of heat generated by the package components. That is, the prior art circuit board generates more heat. However, prior art boards do not dissipate heat faster. This is because, on the one hand, the resistance of the conductive lines of the circuit board is getting larger and larger, and the thermal conductivity is getting weaker. On the other hand, the insulation layer of the circuit board has a lower thermal conductivity, which cannot effectively conduct heat, and can not effectively dissipate heat. .

In view of this, it is necessary to provide a package substrate and a package structure having better heat dissipation performance.

A package substrate and a package structure will be described below by way of embodiments.

A package substrate comprising a conductive layer, a composite material layer and a metal substrate in sequence. The conductive layer has a conductive pattern. The composite layer has a first surface that is in contact with the metal substrate and a second surface that is opposite the first surface. The composite material layer comprises a polymer matrix and an array of carbon nanotubes embedded in the polymer matrix, wherein the carbon nanotubes have an axial angle between the anode and the first surface of between 80 and 100 degrees.

A package structure includes a package component and a package substrate as described above, the package component being electrically connected to the conductive pattern.

The package substrate and the package structure of the technical solution have a metal substrate and a composite material layer in contact with the metal substrate, and the composite material layer has a growth direction substantially perpendicular to the first surface carbon nanotube array, so that the composite material layer has excellent properties. The thermal conductivity can quickly transfer the conductive pattern and the heat radiated from the package component to the metal substrate, and the metal substrate is quickly dissipated to the outside.

10, 20, 30‧‧‧ package substrate

11, 31‧‧‧ conductive layer

12, 32‧‧‧ Composite layer

13, 23, 33‧‧‧ metal substrates

111, 211, 311‧‧‧ conductive patterns

1201, 2201, 3201‧‧‧ first surface

1202, 2202, 3202‧‧‧ second surface

121, 221‧‧‧ polymer matrix

122, 222‧‧‧Nano Carbon Tube Array

1221, 2221‧‧‧ first end

1222, 2222‧‧‧ second end

100‧‧‧Base

14‧‧‧ catalyst layer

35‧‧‧Insulation

351‧‧‧through hole

36‧‧‧Package components

37‧‧‧Encapsulation resin

361‧‧‧Metal wire

FIG. 1 is a schematic diagram of a package substrate provided by a first embodiment of the present technical solution.

FIG. 2 is a schematic diagram of a substrate provided by a first embodiment of the present technical solution.

FIG. 3 is a schematic view showing the formation of a catalyst layer on a substrate according to a first embodiment of the present technical solution.

4 is a schematic view of a carbon nanotube array grown on a catalyst layer according to a first embodiment of the present technology.

FIG. 5 is a schematic view showing the second end of the polymer matrix coated carbon nanotube array provided by the first embodiment of the present technical solution.

FIG. 6 is a schematic diagram of a substrate and a catalyst layer removed according to a first embodiment of the present technical solution.

FIG. 7 is a schematic view showing the first end of the polymer matrix coated carbon nanotube array provided by the first embodiment of the present technical solution.

FIG. 8 is a schematic diagram of a package substrate according to a second embodiment of the present technology.

FIG. 9 is a schematic diagram of a package substrate provided by a third embodiment of the present technical solution.

FIG. 10 is a schematic diagram of a package structure including the package substrate shown in FIG. 9 according to the technical solution.

The package substrate and package structure provided by the present technical solution will be further described in detail below with reference to the accompanying drawings and the embodiments.

Referring to FIG. 1 , the package substrate 10 provided by the first embodiment of the present technical solution includes a conductive layer 11 , a composite material layer 12 , and a metal substrate 13 in sequence. The conductive layer 11 has a conductive pattern 111 for electrical connection with the package component for signal transmission and processing. The composite material layer 12 is located between the conductive layer 11 and the metal substrate 13 and has opposite and parallel first surfaces 1201 and second surfaces 1202. The first surface 1201 is in contact with the metal substrate 13, and the second surface 1202 is in contact with the conductive layer 11. The composite material layer 12 is used to conduct heat from the first surface 1201 to the second surface 1202 faster, thereby transferring heat from the conductive pattern 111 and the package component to the metal substrate 13 faster. The metal substrate 13 is made of a metal material having good thermal conductivity such as aluminum or copper, and is used for quickly dissipating the heat conducted by the composite material layer 12 to the outside.

Specifically, the composite layer 12 includes a polymer matrix 121 and a carbon nanotube array 122. The polymer matrix 121 may be an insulating hard resin such as epoxy, fiberglass cloth, or the like, or an insulating flexible resin such as Polyimide (PI) or polyethylene terephthalate. (Polyethylene Terephtalate, PET), Polytetrafluoroethylene (PTFE), Polyamide, Polymethyl-methacrylate, Polycarbonate or Poly Polyamide polyethylene-terephthalate copolymer, and the like. The carbon nanotube array 122 includes a plurality of carbon nanotubes arranged in parallel, and the axial direction of the plurality of carbon nanotubes is between 80 and 100 degrees from the first surface 1201. That is, the growth direction of the carbon nanotube array 122 is substantially perpendicular to the first surface 1201 and the second surface 1202.

The carbon nanotube array 122 has a first end portion 1221 and a second end portion 1222. The distance between the first end portion 1221 and the second end portion 1222 is smaller than the distance between the first surface 1201 and the second surface 1202, that is, The height of the carbon nanotube array 122 is less than the thickness of the composite layer 12. Preferably, the height of the carbon nanotube array is between 2/3 and 4/5 of the thickness of the composite layer.

The carbon nanotube array 122 is embedded in the polymer matrix 121. In this embodiment, the first end portion 1221 and the second end portion 1222 are embedded in the polymer matrix 121. The first end portion 1221 is adjacent to the first surface 1201 and is not in contact with the first surface 1201. The second end portion 1222 is adjacent to the second surface 1202 and is not in contact with the second surface 1202. Moreover, the distance between the first end portion 1221 and the first surface 1201 is equal to the distance between the second end portion 1222 and the second surface 1202. The distance between the first end portion 1221 and the first surface 1201 may be the height of the carbon nanotube array 122. 1/4~1/8.

Since the carbon nanotube array 122 is not in contact with the first surface 1201, the carbon nanotube array 122 is insulated from the conductive pattern 111. That is, the conductive pattern 111 and the metal substrate 13 are not electrically connected. In addition, since the distance between the first end portion 1221 of the carbon nanotube array 122 and the first surface 1201 and the distance between the second end portion 1222 and the second surface 1202 are small, the growth direction of the carbon nanotube array 122 is The axial direction of the plurality of carbon nanotubes has good thermal conductivity. Therefore, the composite layer 12 has good thermal conductivity in the growth direction of the carbon nanotube array 122, and the conductive pattern 111 and the electrically conductive pattern can be electrically connected relatively quickly. The heat of the package component of 111 is conducted to the metal substrate 13, and is further radiated to the outside by the metal substrate 13.

The package substrate 10 provided by the first embodiment of the present technical solution can be prepared by the following steps:

In the first step, referring to Figure 2, a substrate 100 is provided. The substrate 100 may be a metal layer such as a copper layer, an aluminum layer, or a nickel layer. The thickness of the substrate 100 can be between 2 and 200 microns.

In the second step, referring to FIG. 3, a catalyst layer 14 is formed on the substrate 100 by electroplating, evaporation, sputtering or vapor deposition. The catalyst layer 14 is a growthable carbon nanotube such as iron, cobalt, nickel or alloy. The material of the array.

In the third step, referring to FIG. 4, a carbon nanotube array 122 is grown on the catalyst layer 14.

The method of preparing the carbon nanotube array 122 is not limited. When the chemical vapor deposition method is used, the substrate 100 on which the catalyst layer 14 is formed can be placed in a reaction furnace, and a carbon source gas such as acetylene or ethylene is introduced at 700 to 1000 degrees Celsius to grow on the catalyst layer 14. Nano carbon tube array 122. The growth height of the carbon nanotube array 122 can be controlled by growth time, and the growth height is generally 1 to 30 microns. The arrangement of the plurality of carbon nanotubes in the carbon nanotube array 122 is relatively uniform, and is substantially perpendicular to the catalyst layer 14. That is, the angle between the axial direction of the plurality of carbon nanotubes and the catalyst layer 14 is approximately between 80 and 100 degrees.

In the fourth step, a composite material layer 12 is formed.

First, referring to FIG. 5, the polymer matrix 121 is applied to the carbon nanotube array 122 by dip coating, coating, pressing or other means, so that the polymer matrix 121 fully fills the plurality of carbon nanotube arrays 122. The gap between the carbon nanotubes covers the second end 1222 of the carbon nanotube array 122.

Next, referring to FIG. 6, the substrate 100 and the catalyst layer 14 are removed to expose the first end portion 1221 of the nanotube array 122.

The method of removing the substrate 100 and the catalyst layer 14 may be an etching method. For example, when the substrate 100 is copper and the catalyst layer 14 is ferric oxide, the substrate 100 and the catalyst layer 14 may be etched with a ferric chloride solution to expose the first end portion 1221 of the carbon nanotube array 122. Of course, when using other base materials and catalyst layer materials, the corresponding etchant can be used.

Again, referring to FIG. 7, the polymer substrate 121 is coated with the first end portion 1221 of the carbon nanotube array 122 by dip coating, coating, pressing or otherwise, thereby obtaining the carbon nanotube array 122 buried in the polymerization. Composite layer 12 within substrate 121.

In the fifth step, the conductive layer 11 and the metal substrate 13 are respectively pressed against the second surface 1202 of the composite material layer 12 and the first surface 1201, thereby obtaining the package substrate 10, as shown in FIG.

Of course, before or after the conductive layer 11 and the metal substrate 13 are pressed against the composite material layer 12, the conductive layer 11 may be further formed into a conductive pattern 111. The step of forming the conductive layer 11 into the conductive pattern 111 can be realized by an image transfer method and an etching process.

Referring to FIG. 8 , the package substrate 20 provided by the second embodiment of the present invention is substantially the same as the package substrate 10 provided by the first embodiment, except that the first end portion 2221 of the carbon nanotube array 222 is The first surface 2201 is flush and the second end 2222 is embedded in the polymer matrix 221 and spaced from the second surface 2202. Thereby, the conductive pattern 211 is insulated from the metal substrate 23 and has good thermal conductivity.

In addition, the second end portion 2222 of the carbon nanotube array 222 may be flush with the second surface 2202, and the first end portion 2221 is embedded in the polymer base 221 and spaced apart from the first surface 2201. Good insulation and thermal conductivity are obtained.

Referring to FIG. 9 , the package substrate 30 provided by the third embodiment of the present invention is substantially the same as the package substrate 20 provided by the first embodiment, except that the package substrate 30 further includes a conductive layer 31 and a composite material layer. An insulating layer 35 between 32, the first surface 3201 of the composite material layer 32 is in contact with the metal substrate 33, and the second surface 3202 is in contact with the insulating layer 35. The insulating layer 35 has a through hole 351 corresponding to the conductive pattern 311 for placing a package component to package the package component on the package substrate 30.

The technical solution also provides a package structure including the above package substrate.

Referring to FIG. 10, the package structure 4 provided by the technical solution includes a package substrate 30, a package component 36, and a package resin 37 as shown in the third embodiment.

The package component 36 is a device for implementing a specific processing function, and may be an integrated circuit chip, a capacitive inductor component, or a memory or other device.

The method of packaging the package component 36 on the package substrate 30 is not limited. In this embodiment, the package component 36 is fixed in the through hole 351 by the encapsulation resin 37, is in contact with the composite material layer 32, and is electrically connected to the conductive pattern 311 by the metal wire 361, thereby implementing the package component 36 and the package substrate 30. Signal transmission and processing.

When the package component 36 is in operation, the heat generated by the package component 36 and the conductive pattern 311 can be quickly transferred to the metal substrate 33 by the carbon nanotube array in the composite material layer 32, and quickly dissipated to the outside by the metal substrate 33.

Of course, the package structure 4 includes the package substrate 30 as shown in FIG. 9 as shown in FIG. 9 , and may also have a better heat dissipation effect.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧Package substrate

11‧‧‧ Conductive layer

12‧‧‧Composite layer

13‧‧‧Metal substrate

111‧‧‧Electrical graphics

1201‧‧‧ first surface

1202‧‧‧ second surface

121‧‧‧ polymer matrix

122‧‧‧Nano Carbon Tube Array

1221‧‧‧ first end

1222‧‧‧second end

Claims (10)

A package substrate, which in turn comprises a conductive layer, a composite material layer and a metal substrate, the conductive layer having a conductive pattern, the composite material layer having a first surface and a second surface, the first surface being in contact with the metal substrate, the second surface Opposite the first surface, the composite layer comprises a polymer matrix and an array of carbon nanotubes embedded in the polymer matrix, wherein the angle between the axial direction of the carbon nanotubes and the first surface is 80-100 Between degrees. The package substrate according to claim 1, wherein the height of the carbon nanotube array is between 2/3 and 4/5 of the thickness of the composite layer. The package substrate of claim 1, wherein the carbon nanotube array has opposite first and second ends, the first end and the second end being located on the first surface and Between the second surfaces. The package substrate of claim 3, wherein the first end portion and the second end portion are embedded in the polymer matrix, the first end portion is adjacent to the first surface, and the second end portion is adjacent to the first end portion. Two surfaces. The package substrate of claim 3, wherein the first end portion is flush with the first surface, and the second end portion is embedded in the polymer matrix. The package substrate according to claim 3, wherein the second end portion is flush with the second surface, and the first end portion is embedded in the polymer matrix. The package substrate of claim 1, wherein the package substrate further comprises an insulating layer disposed between the conductive layer and the composite layer, the second surface being in contact with the insulating layer. The package substrate of claim 7, wherein the insulating layer has a through hole for placing the package component. A package structure comprising a package component and a package substrate as described in claim 1 , the package component being electrically connected to the conductive pattern. The package structure of claim 9, wherein the package component is fixed to the package substrate by a sealing resin and electrically connected to the conductive pattern by a metal wire.