CN101662894B - 封装基板以及封装结构 - Google Patents
封装基板以及封装结构 Download PDFInfo
- Publication number
- CN101662894B CN101662894B CN2008103042496A CN200810304249A CN101662894B CN 101662894 B CN101662894 B CN 101662894B CN 2008103042496 A CN2008103042496 A CN 2008103042496A CN 200810304249 A CN200810304249 A CN 200810304249A CN 101662894 B CN101662894 B CN 101662894B
- Authority
- CN
- China
- Prior art keywords
- base plate
- carbon nano
- packaging
- polymeric matrix
- pipe array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103042496A CN101662894B (zh) | 2008-08-27 | 2008-08-27 | 封装基板以及封装结构 |
US12/468,841 US20100051331A1 (en) | 2008-08-27 | 2009-05-19 | Circuit substrate for mounting electronic component and circuit substrate assembly having same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008103042496A CN101662894B (zh) | 2008-08-27 | 2008-08-27 | 封装基板以及封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101662894A CN101662894A (zh) | 2010-03-03 |
CN101662894B true CN101662894B (zh) | 2011-09-21 |
Family
ID=41723648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008103042496A Expired - Fee Related CN101662894B (zh) | 2008-08-27 | 2008-08-27 | 封装基板以及封装结构 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100051331A1 (zh) |
CN (1) | CN101662894B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201241969A (en) * | 2011-04-08 | 2012-10-16 | Unimicron Technology Corp | Method for fabricating heat dissipation substrate |
US9786850B2 (en) * | 2012-09-07 | 2017-10-10 | President And Fellows Of Harvard College | Methods and systems for scaffolds comprising nanoelectronic components |
US9457128B2 (en) | 2012-09-07 | 2016-10-04 | President And Fellows Of Harvard College | Scaffolds comprising nanoelectronic components for cells, tissues, and other applications |
WO2015161879A1 (en) * | 2014-04-24 | 2015-10-29 | Sht Smart High Tech Ab | Method of manufacturing a flexible substrate with carbon nanotube vias and corresponding flexible substrate |
US9485862B2 (en) * | 2014-08-28 | 2016-11-01 | Apple Inc. | Electronic devices with carbon nanotube printed circuits |
CN106550542B (zh) * | 2015-09-17 | 2021-10-26 | 奥特斯(中国)有限公司 | 插入保护结构并且靠近保护结构具有纯介质层的部件载体 |
US9994741B2 (en) | 2015-12-13 | 2018-06-12 | International Business Machines Corporation | Enhanced adhesive materials and processes for 3D applications |
TWI721077B (zh) | 2015-12-28 | 2021-03-11 | 日商日立造船股份有限公司 | 奈米碳管複合材料及奈米碳管複合材料的製造方法 |
JP2017188519A (ja) * | 2016-04-04 | 2017-10-12 | 東洋紡株式会社 | 金属ベース回路基板およびその製造方法 |
US10854549B2 (en) | 2018-12-31 | 2020-12-01 | Micron Technology, Inc. | Redistribution layers with carbon-based conductive elements, methods of fabrication and related semiconductor device packages and systems |
US11189588B2 (en) * | 2018-12-31 | 2021-11-30 | Micron Technology, Inc. | Anisotropic conductive film with carbon-based conductive regions and related semiconductor assemblies, systems, and methods |
US20200371570A1 (en) * | 2019-05-23 | 2020-11-26 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co. Ltd. | Display screen and electronic device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101095226A (zh) * | 2004-11-04 | 2007-12-26 | 皇家飞利浦电子股份有限公司 | 集成电路纳米管基衬底 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3632558B2 (ja) * | 1999-09-17 | 2005-03-23 | 日立化成工業株式会社 | 封止用エポキシ樹脂組成物及び電子部品装置 |
TW511108B (en) * | 2001-08-13 | 2002-11-21 | Delta Optoelectronics Inc | Carbon nanotube field emission display technology |
AT412265B (de) * | 2002-11-12 | 2004-12-27 | Electrovac | Bauteil zur wärmeableitung |
US20070003472A1 (en) * | 2003-03-24 | 2007-01-04 | Tolt Zhidan L | Electron emitting composite based on regulated nano-structures and a cold electron source using the composite |
US20080292840A1 (en) * | 2004-05-19 | 2008-11-27 | The Regents Of The University Of California | Electrically and thermally conductive carbon nanotube or nanofiber array dry adhesive |
TWI255466B (en) * | 2004-10-08 | 2006-05-21 | Ind Tech Res Inst | Polymer-matrix conductive film and method for fabricating the same |
KR100688857B1 (ko) * | 2004-12-17 | 2007-03-02 | 삼성전기주식회사 | 윈도우를 구비한 볼 그리드 어레이 기판 및 그 제조방법 |
CN100337981C (zh) * | 2005-03-24 | 2007-09-19 | 清华大学 | 热界面材料及其制造方法 |
TWI305131B (en) * | 2005-09-08 | 2009-01-01 | Ind Tech Res Inst | Heat dissipation device and composite material with high thermal conductivity |
US8632879B2 (en) * | 2008-04-25 | 2014-01-21 | The University Of Kentucky Research Foundation | Lightweight thermal management material for enhancement of through-thickness thermal conductivity |
-
2008
- 2008-08-27 CN CN2008103042496A patent/CN101662894B/zh not_active Expired - Fee Related
-
2009
- 2009-05-19 US US12/468,841 patent/US20100051331A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101095226A (zh) * | 2004-11-04 | 2007-12-26 | 皇家飞利浦电子股份有限公司 | 集成电路纳米管基衬底 |
Also Published As
Publication number | Publication date |
---|---|
US20100051331A1 (en) | 2010-03-04 |
CN101662894A (zh) | 2010-03-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhen Ding Technology Co.,Ltd. Patentee after: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Hongsheng Technology Co.,Ltd. Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20161128 Address after: No. 18, Tengfei Road, Qinhuangdao Economic & Technological Development Zone, Hebei, China Patentee after: Qi Ding Technology Qinhuangdao Co.,Ltd. Patentee after: Zhen Ding Technology Co.,Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: FUKU PRECISION COMPONENTS (SHENZHEN) Co.,Ltd. Patentee before: Zhen Ding Technology Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110921 |