CN102683220A - 一种制作多层有机液晶聚合物基板结构的方法 - Google Patents
一种制作多层有机液晶聚合物基板结构的方法 Download PDFInfo
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- CN102683220A CN102683220A CN2011100553805A CN201110055380A CN102683220A CN 102683220 A CN102683220 A CN 102683220A CN 2011100553805 A CN2011100553805 A CN 2011100553805A CN 201110055380 A CN201110055380 A CN 201110055380A CN 102683220 A CN102683220 A CN 102683220A
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- liquid crystal
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- 239000000758 substrate Substances 0.000 title claims abstract description 196
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- 239000010949 copper Substances 0.000 claims description 53
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 29
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- 238000001465 metallisation Methods 0.000 claims description 17
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 16
- 238000003475 lamination Methods 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 15
- 238000007747 plating Methods 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
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- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
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- 239000011889 copper foil Substances 0.000 claims description 3
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- 238000001259 photo etching Methods 0.000 claims description 3
- 229940072033 potash Drugs 0.000 claims description 3
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- 235000015320 potassium carbonate Nutrition 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
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- 239000007767 bonding agent Substances 0.000 claims description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103646880A (zh) * | 2013-09-29 | 2014-03-19 | 华进半导体封装先导技术研发中心有限公司 | 一种基于板级功能基板的封装工艺及封装结构 |
CN103811436A (zh) * | 2012-11-09 | 2014-05-21 | 辉达公司 | 改进堆叠式封装结构中的逻辑芯片的热性能 |
CN107305849A (zh) * | 2016-04-22 | 2017-10-31 | 碁鼎科技秦皇岛有限公司 | 封装结构及其制作方法 |
CN108026302A (zh) * | 2015-09-11 | 2018-05-11 | 株式会社村田制作所 | 经处理的液晶聚合物树脂片、其制造方法、树脂多层基板及其制造方法 |
CN109461716A (zh) * | 2018-10-29 | 2019-03-12 | 中国电子科技集团公司第十三研究所 | 混合型多芯片组件及其制备方法 |
CN109801908A (zh) * | 2019-01-29 | 2019-05-24 | 西安微电子技术研究所 | 一种射频模块及其制备方法 |
CN109818150A (zh) * | 2019-03-12 | 2019-05-28 | 信利半导体有限公司 | 一种液晶天线及其制作方法 |
CN111029326A (zh) * | 2018-10-09 | 2020-04-17 | 西安邮电大学 | 基于lcp工艺的凸点互连结构 |
CN111509122A (zh) * | 2020-04-20 | 2020-08-07 | 上海航天电子通讯设备研究所 | 一种内埋置无源阻容元件的lcp封装基板及制作方法 |
CN113297118A (zh) * | 2021-05-17 | 2021-08-24 | 南京航空航天大学 | 一种用于动物机器人的集成式嵌入式系统刺激装置 |
Citations (2)
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---|---|---|---|---|
CN1893078A (zh) * | 2005-07-06 | 2007-01-10 | 精工爱普生株式会社 | 电子基板、电子基板的制造方法、及电子设备 |
US20100201003A1 (en) * | 2005-03-02 | 2010-08-12 | Dane Thompson | Packaging Systems Incorporating Thin Film Liquid Crystal Polymer (LCP) and Methods of Manufacture |
-
2011
- 2011-03-08 CN CN201110055380.5A patent/CN102683220B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100201003A1 (en) * | 2005-03-02 | 2010-08-12 | Dane Thompson | Packaging Systems Incorporating Thin Film Liquid Crystal Polymer (LCP) and Methods of Manufacture |
CN1893078A (zh) * | 2005-07-06 | 2007-01-10 | 精工爱普生株式会社 | 电子基板、电子基板的制造方法、及电子设备 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103811436A (zh) * | 2012-11-09 | 2014-05-21 | 辉达公司 | 改进堆叠式封装结构中的逻辑芯片的热性能 |
CN103646880A (zh) * | 2013-09-29 | 2014-03-19 | 华进半导体封装先导技术研发中心有限公司 | 一种基于板级功能基板的封装工艺及封装结构 |
CN108026302B (zh) * | 2015-09-11 | 2020-12-01 | 株式会社村田制作所 | 经处理的液晶聚合物树脂片、其制造方法、树脂多层基板及其制造方法 |
CN108026302A (zh) * | 2015-09-11 | 2018-05-11 | 株式会社村田制作所 | 经处理的液晶聚合物树脂片、其制造方法、树脂多层基板及其制造方法 |
CN107305849A (zh) * | 2016-04-22 | 2017-10-31 | 碁鼎科技秦皇岛有限公司 | 封装结构及其制作方法 |
CN107305849B (zh) * | 2016-04-22 | 2020-05-19 | 碁鼎科技秦皇岛有限公司 | 封装结构及其制作方法 |
CN111029326A (zh) * | 2018-10-09 | 2020-04-17 | 西安邮电大学 | 基于lcp工艺的凸点互连结构 |
CN111029326B (zh) * | 2018-10-09 | 2022-04-26 | 西安邮电大学 | 基于lcp工艺的凸点互连结构 |
CN109461716A (zh) * | 2018-10-29 | 2019-03-12 | 中国电子科技集团公司第十三研究所 | 混合型多芯片组件及其制备方法 |
CN109801908A (zh) * | 2019-01-29 | 2019-05-24 | 西安微电子技术研究所 | 一种射频模块及其制备方法 |
CN109818150A (zh) * | 2019-03-12 | 2019-05-28 | 信利半导体有限公司 | 一种液晶天线及其制作方法 |
WO2020181558A1 (zh) * | 2019-03-12 | 2020-09-17 | 信利半导体有限公司 | 一种液晶天线及其制作方法 |
CN111509122A (zh) * | 2020-04-20 | 2020-08-07 | 上海航天电子通讯设备研究所 | 一种内埋置无源阻容元件的lcp封装基板及制作方法 |
CN111509122B (zh) * | 2020-04-20 | 2023-09-22 | 上海航天电子通讯设备研究所 | 一种内埋置无源阻容元件的lcp封装基板及制作方法 |
CN113297118A (zh) * | 2021-05-17 | 2021-08-24 | 南京航空航天大学 | 一种用于动物机器人的集成式嵌入式系统刺激装置 |
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