CN102348328B - 芯片埋入方法和芯片埋入式电路板 - Google Patents
芯片埋入方法和芯片埋入式电路板 Download PDFInfo
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- CN102348328B CN102348328B CN201110273683.4A CN201110273683A CN102348328B CN 102348328 B CN102348328 B CN 102348328B CN 201110273683 A CN201110273683 A CN 201110273683A CN 102348328 B CN102348328 B CN 102348328B
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- chip
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
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- 239000010949 copper Substances 0.000 description 23
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- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- -1 allyl compound Chemical class 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110273683.4A CN102348328B (zh) | 2011-09-15 | 2011-09-15 | 芯片埋入方法和芯片埋入式电路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110273683.4A CN102348328B (zh) | 2011-09-15 | 2011-09-15 | 芯片埋入方法和芯片埋入式电路板 |
Publications (2)
Publication Number | Publication Date |
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CN102348328A CN102348328A (zh) | 2012-02-08 |
CN102348328B true CN102348328B (zh) | 2015-05-13 |
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CN201110273683.4A Active CN102348328B (zh) | 2011-09-15 | 2011-09-15 | 芯片埋入方法和芯片埋入式电路板 |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103260351A (zh) * | 2012-02-20 | 2013-08-21 | 联想(北京)有限公司 | 一种电子设备及一种电路板 |
CN102833947A (zh) * | 2012-08-14 | 2012-12-19 | 惠州Tcl移动通信有限公司 | 一种移动通信终端、嵌入式pcb板结构及其加工方法 |
CN105873369B (zh) * | 2016-05-19 | 2019-05-31 | 北京奇虎科技有限公司 | 一种印制电路板的制作方法和印制电路板 |
CN106231790A (zh) * | 2016-07-27 | 2016-12-14 | 上海摩软通讯技术有限公司 | 一种印制电路板及制作方法及移动终端 |
CN107046772A (zh) * | 2017-05-30 | 2017-08-15 | 邹时月 | 一种裸芯片埋入式电路板的制造方法 |
CN110571229A (zh) * | 2018-06-05 | 2019-12-13 | 深南电路股份有限公司 | 一种埋入式光感模组及其制造方法 |
CN111524873B (zh) | 2019-02-01 | 2022-05-13 | 台达电子企业管理(上海)有限公司 | 嵌入式封装模块及其封装方法 |
WO2021217326A1 (zh) * | 2020-04-27 | 2021-11-04 | 宏启胜精密电子(秦皇岛)有限公司 | 内埋电路板及其制造方法 |
CN112367773A (zh) * | 2020-10-28 | 2021-02-12 | 安徽瑞迪微电子有限公司 | Dbc基板与芯片焊接方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1431708A (zh) * | 2002-01-10 | 2003-07-23 | 裕沛科技股份有限公司 | 晶圆型态扩散型封装结构及其制造方法 |
CN1797726A (zh) * | 2004-12-20 | 2006-07-05 | 全懋精密科技股份有限公司 | 半导体构装的芯片埋入基板结构及制法 |
CN101202253A (zh) * | 2006-12-13 | 2008-06-18 | 育霈科技股份有限公司 | 具有良好热膨胀系数效能的圆片级封装及其方法 |
CN101609806A (zh) * | 2008-06-16 | 2009-12-23 | 英特尔公司 | 用于印刷电路板表面安装元件的薄型焊栅阵列技术 |
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2011
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1431708A (zh) * | 2002-01-10 | 2003-07-23 | 裕沛科技股份有限公司 | 晶圆型态扩散型封装结构及其制造方法 |
CN1797726A (zh) * | 2004-12-20 | 2006-07-05 | 全懋精密科技股份有限公司 | 半导体构装的芯片埋入基板结构及制法 |
CN101202253A (zh) * | 2006-12-13 | 2008-06-18 | 育霈科技股份有限公司 | 具有良好热膨胀系数效能的圆片级封装及其方法 |
CN101609806A (zh) * | 2008-06-16 | 2009-12-23 | 英特尔公司 | 用于印刷电路板表面安装元件的薄型焊栅阵列技术 |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Applicant after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Applicant before: SHENNAN CIRCUITS Co.,Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: SHENZHEN SHENNAN CIRCUITS CO., LTD. TO: SHENNAN CIRCUIT CO., LTD. |
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Effective date of registration: 20231012 Address after: Building 101, No. 2 Shennan Circuit, East Zone, Gaoqiao Brand Industrial Park, Gaoqiao Community, Pingdi Street, Longgang District, Shenzhen City, Guangdong Province, 518000 Patentee after: Shenzhen Guangxin Packaging Substrate Co.,Ltd. Address before: 518000 No. 99 Qiaocheng East Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
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