CH682823A5 - Platierungszusammensetzungen und -verfahren. - Google Patents
Platierungszusammensetzungen und -verfahren. Download PDFInfo
- Publication number
- CH682823A5 CH682823A5 CH519/91A CH51991A CH682823A5 CH 682823 A5 CH682823 A5 CH 682823A5 CH 519/91 A CH519/91 A CH 519/91A CH 51991 A CH51991 A CH 51991A CH 682823 A5 CH682823 A5 CH 682823A5
- Authority
- CH
- Switzerland
- Prior art keywords
- composition according
- gold
- plating
- composition
- ions
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 20
- 239000000203 mixture Substances 0.000 claims description 59
- 239000010931 gold Substances 0.000 claims description 25
- 229910052737 gold Inorganic materials 0.000 claims description 25
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 19
- 229910001020 Au alloy Inorganic materials 0.000 claims description 17
- 238000005275 alloying Methods 0.000 claims description 17
- 239000003353 gold alloy Substances 0.000 claims description 17
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000654 additive Substances 0.000 claims description 12
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 claims description 12
- 150000002500 ions Chemical class 0.000 claims description 12
- -1 gold ion Chemical class 0.000 claims description 11
- 229960003237 betaine Drugs 0.000 claims description 10
- 239000008139 complexing agent Substances 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 6
- REEBJQTUIJTGAL-UHFFFAOYSA-N 3-pyridin-1-ium-1-ylpropane-1-sulfonate Chemical compound [O-]S(=O)(=O)CCC[N+]1=CC=CC=C1 REEBJQTUIJTGAL-UHFFFAOYSA-N 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- 125000003917 carbamoyl group Chemical group [H]N([H])C(*)=O 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- RJPRZHQPROLZRW-UHFFFAOYSA-N 2-hydroxy-3-pyridin-1-ium-1-ylpropane-1-sulfonate Chemical compound [O-]S(=O)(=O)CC(O)C[N+]1=CC=CC=C1 RJPRZHQPROLZRW-UHFFFAOYSA-N 0.000 claims description 3
- WXNLLEDALLWEDJ-UHFFFAOYSA-N 2-pyridin-1-ium-1-ylethanesulfonate Chemical compound [O-]S(=O)(=O)CC[N+]1=CC=CC=C1 WXNLLEDALLWEDJ-UHFFFAOYSA-N 0.000 claims description 3
- SOPYNQPQCZIJCQ-UHFFFAOYSA-N 3-(3-formylpyridin-1-ium-1-yl)propane-1-sulfonate Chemical compound [O-]S(=O)(=O)CCC[N+]1=CC=CC(C=O)=C1 SOPYNQPQCZIJCQ-UHFFFAOYSA-N 0.000 claims description 3
- QHNFACMTBFJLAT-UHFFFAOYSA-N 3-isoquinolin-1-ylpropane-1-sulfonic acid Chemical compound C1=CC=C2C(CCCS(=O)(=O)O)=NC=CC2=C1 QHNFACMTBFJLAT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- XIBSUARVKSGYPL-UHFFFAOYSA-N 3-(3-carbamoylpyridin-1-ium-1-yl)propane-1-sulfonate Chemical compound NC(=O)C1=CC=C[N+](CCCS([O-])(=O)=O)=C1 XIBSUARVKSGYPL-UHFFFAOYSA-N 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical group C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 2
- 239000005977 Ethylene Substances 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 235000006408 oxalic acid Nutrition 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 3
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 229910001453 nickel ion Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 description 65
- 230000000052 comparative effect Effects 0.000 description 15
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 9
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 9
- KPQDSKZQRXHKHY-UHFFFAOYSA-N gold potassium Chemical compound [K].[Au] KPQDSKZQRXHKHY-UHFFFAOYSA-N 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 7
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 description 6
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 6
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- DVECLMOWYVDJRM-UHFFFAOYSA-N pyridine-3-sulfonic acid Chemical class OS(=O)(=O)C1=CC=CN=C1 DVECLMOWYVDJRM-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 235000005985 organic acids Nutrition 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- NARVIWMVBMUEOG-UHFFFAOYSA-N 2-Hydroxy-propylene Natural products CC(O)=C NARVIWMVBMUEOG-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910002065 alloy metal Inorganic materials 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 239000001508 potassium citrate Substances 0.000 description 2
- 229960002635 potassium citrate Drugs 0.000 description 2
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 2
- 235000011082 potassium citrates Nutrition 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- BHJNUCRTLNRSET-UHFFFAOYSA-N 2-hydroxybutanedioic acid;oxalic acid Chemical compound OC(=O)C(O)=O.OC(=O)C(O)CC(O)=O BHJNUCRTLNRSET-UHFFFAOYSA-N 0.000 description 1
- RGIIAYDCZSXHGL-UHFFFAOYSA-N 2-pyridin-4-ylethanesulfonic acid Chemical compound OS(=O)(=O)CCC1=CC=NC=C1 RGIIAYDCZSXHGL-UHFFFAOYSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- KKYNGSVDQZFBIK-UHFFFAOYSA-N N.[Au+3] Chemical compound N.[Au+3] KKYNGSVDQZFBIK-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000013539 acceleration additive Substances 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229940027991 antiseptic and disinfectant quinoline derivative Drugs 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007853 buffer solution Substances 0.000 description 1
- QXDMQSPYEZFLGF-UHFFFAOYSA-L calcium oxalate Chemical compound [Ca+2].[O-]C(=O)C([O-])=O QXDMQSPYEZFLGF-UHFFFAOYSA-L 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical class OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 description 1
- 150000004885 piperazines Chemical class 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- RGOPGRSAYPXWIG-UHFFFAOYSA-N pyridin-2-ylmethanesulfonic acid Chemical class [O-]S(=O)(=O)CC1=CC=CC=[NH+]1 RGOPGRSAYPXWIG-UHFFFAOYSA-N 0.000 description 1
- KZVLNAGYSAKYMG-UHFFFAOYSA-N pyridine-2-sulfonic acid Chemical class OS(=O)(=O)C1=CC=CC=N1 KZVLNAGYSAKYMG-UHFFFAOYSA-N 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- ZKIHLVYBGPFUAD-UHFFFAOYSA-N quinoline-2-sulfonic acid Chemical class C1=CC=CC2=NC(S(=O)(=O)O)=CC=C21 ZKIHLVYBGPFUAD-UHFFFAOYSA-N 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000008234 soft water Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 229940066771 systemic antihistamines piperazine derivative Drugs 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Other In-Based Heterocyclic Compounds (AREA)
- Pyridine Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9003762A GB2242200B (en) | 1990-02-20 | 1990-02-20 | Plating compositions and processes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH682823A5 true CH682823A5 (de) | 1993-11-30 |
Family
ID=10671276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH519/91A CH682823A5 (de) | 1990-02-20 | 1991-02-20 | Platierungszusammensetzungen und -verfahren. |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US5169514A (en, 2012) |
| JP (1) | JPH086195B2 (en, 2012) |
| CA (1) | CA2036222C (en, 2012) |
| CH (1) | CH682823A5 (en, 2012) |
| DE (1) | DE4105272A1 (en, 2012) |
| FR (1) | FR2658536B1 (en, 2012) |
| GB (1) | GB2242200B (en, 2012) |
| IT (1) | IT1245514B (en, 2012) |
| SE (1) | SE506531C2 (en, 2012) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9567684B2 (en) | 2009-10-15 | 2017-02-14 | The Swatch Group Research And Development Ltd | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
| US9683303B2 (en) | 2007-09-21 | 2017-06-20 | The Swatch Group Research And Development Ltd | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4013349A1 (de) * | 1990-04-23 | 1991-10-24 | Schering Ag | 1-(2-sulfoaethyl)pyridiniumbetain, verfahren zu dessen herstellung sowie saure nickelbaeder enthaltend diese verbindung |
| US5576282A (en) * | 1995-09-11 | 1996-11-19 | The Procter & Gamble Company | Color-safe bleach boosters, compositions and laundry methods employing same |
| DE69622431T2 (de) * | 1995-11-03 | 2003-01-30 | Enthone-Omi, Inc. | Elektroplattierungsverfahren, zusammensetzungen und überzügen |
| GB9522591D0 (en) * | 1995-11-03 | 1996-01-03 | Enthone Omi Suisse S A | Electroplating processes compositions and deposits |
| US7531079B1 (en) | 1998-10-26 | 2009-05-12 | Novellus Systems, Inc. | Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation |
| US7449098B1 (en) | 1999-10-05 | 2008-11-11 | Novellus Systems, Inc. | Method for planar electroplating |
| US6312580B1 (en) * | 1998-11-02 | 2001-11-06 | Tivian Industries, Ltd. | Method for gold plating chromium and other passive metals |
| US7799200B1 (en) | 2002-07-29 | 2010-09-21 | Novellus Systems, Inc. | Selective electrochemical accelerator removal |
| US8530359B2 (en) | 2003-10-20 | 2013-09-10 | Novellus Systems, Inc. | Modulated metal removal using localized wet etching |
| US8158532B2 (en) | 2003-10-20 | 2012-04-17 | Novellus Systems, Inc. | Topography reduction and control by selective accelerator removal |
| JP4868121B2 (ja) * | 2005-12-21 | 2012-02-01 | 学校法人早稲田大学 | アモルファス金−ニッケル系合金めっき皮膜形成用電気めっき液及び電気めっき方法 |
| CH714243B1 (fr) * | 2006-10-03 | 2019-04-15 | Swatch Group Res & Dev Ltd | Procédé d'électroformage et pièce ou couche obtenue par ce procédé. |
| KR101502804B1 (ko) * | 2008-05-07 | 2015-03-16 | 유미코아 갈바노테히닉 게엠베하 | Ｐｄ 및 Ｐｄ-Ｎｉ 전해질 욕조 |
| US7534289B1 (en) * | 2008-07-02 | 2009-05-19 | Rohm And Haas Electronic Materials Llc | Electroless gold plating solution |
| US8168540B1 (en) | 2009-12-29 | 2012-05-01 | Novellus Systems, Inc. | Methods and apparatus for depositing copper on tungsten |
| EP2801640A1 (en) * | 2013-05-08 | 2014-11-12 | ATOTECH Deutschland GmbH | Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy |
| JP6214355B2 (ja) * | 2013-11-25 | 2017-10-18 | 日本高純度化学株式会社 | 電解金めっき液及びそれを用いて得られた金皮膜 |
| CN106637307B (zh) * | 2017-01-04 | 2019-01-01 | 中国地质大学（武汉） | 一种用于黄金无氰电铸工艺的添加剂 |
| KR101996915B1 (ko) * | 2018-09-20 | 2019-07-05 | (주)엠케이켐앤텍 | 카보닐 산소를 갖는 퓨린 또는 피리미딘계 화합물을 함유하는 치환형 무전해 금 도금액 및 이를 이용한 치환형 무전해 금 도금 방법 |
| CN111663158B (zh) * | 2020-06-19 | 2021-08-13 | 深圳市华乐珠宝首饰有限公司 | 一种耐高温无氰硬金的制备方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL6611248A (en, 2012) * | 1965-12-02 | 1966-10-25 | ||
| GB1442325A (en) * | 1972-07-26 | 1976-07-14 | Oxy Metal Finishing Corp | Electroplating with gold and gold alloys |
| DE2355581C3 (de) * | 1973-11-07 | 1979-07-12 | Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt | Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit |
| GB1578168A (en) * | 1976-03-12 | 1980-11-05 | Cilag Chemie | Pyridyl alkylsulphonic acid derivatives and their use in electroplating baths |
| DE3108508C2 (de) * | 1981-03-06 | 1983-06-30 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung |
| US4430171A (en) * | 1981-08-24 | 1984-02-07 | M&T Chemicals Inc. | Electroplating baths for nickel, iron, cobalt and alloys thereof |
| GB8334226D0 (en) * | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
| GB8501245D0 (en) * | 1985-01-18 | 1985-02-20 | Engelhard Corp | Gold electroplating bath |
| US4615774A (en) * | 1985-01-31 | 1986-10-07 | Omi International Corporation | Gold alloy plating bath and process |
| US4670107A (en) * | 1986-03-05 | 1987-06-02 | Vanguard Research Associates, Inc. | Electrolyte solution and process for high speed gold plating |
| US4744871A (en) * | 1986-09-25 | 1988-05-17 | Vanguard Research Associates, Inc. | Electrolyte solution and process for gold electroplating |
| DE3817722A1 (de) * | 1988-05-25 | 1989-12-14 | Raschig Ag | Verwendung von 2-substituierten ethansulfon-verbindungen als galvanotechnische hilfsstoffe |
| US5049286A (en) * | 1989-12-22 | 1991-09-17 | Omi International Corporation | Process for purification of nickel plating baths |
-
1990
- 1990-02-20 GB GB9003762A patent/GB2242200B/en not_active Expired - Fee Related
-
1991
- 1991-02-12 CA CA002036222A patent/CA2036222C/en not_active Expired - Fee Related
- 1991-02-19 IT ITTO910114A patent/IT1245514B/it active IP Right Grant
- 1991-02-19 FR FR9101949A patent/FR2658536B1/fr not_active Expired - Lifetime
- 1991-02-19 US US07/656,336 patent/US5169514A/en not_active Expired - Lifetime
- 1991-02-19 JP JP3045340A patent/JPH086195B2/ja not_active Expired - Lifetime
- 1991-02-20 SE SE9100503A patent/SE506531C2/sv not_active IP Right Cessation
- 1991-02-20 DE DE4105272A patent/DE4105272A1/de active Granted
- 1991-02-20 CH CH519/91A patent/CH682823A5/de not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9683303B2 (en) | 2007-09-21 | 2017-06-20 | The Swatch Group Research And Development Ltd | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids |
| US10233555B2 (en) | 2007-09-21 | 2019-03-19 | The Swatch Group Research And Development Ltd. | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids |
| US10619260B2 (en) | 2007-09-21 | 2020-04-14 | The Swatch Group Research And Development Ltd. | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic metals or metalloids |
| US9567684B2 (en) | 2009-10-15 | 2017-02-14 | The Swatch Group Research And Development Ltd | Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials |
Also Published As
| Publication number | Publication date |
|---|---|
| SE9100503D0 (sv) | 1991-02-20 |
| CA2036222A1 (en) | 1991-08-21 |
| IT1245514B (it) | 1994-09-29 |
| GB2242200A (en) | 1991-09-25 |
| SE506531C2 (sv) | 1997-12-22 |
| US5169514A (en) | 1992-12-08 |
| SE9100503L (sv) | 1991-08-21 |
| ITTO910114A0 (it) | 1991-02-19 |
| DE4105272A1 (de) | 1991-08-22 |
| CA2036222C (en) | 2001-08-14 |
| JPH086195B2 (ja) | 1996-01-24 |
| JPH06184788A (ja) | 1994-07-05 |
| FR2658536A1 (fr) | 1991-08-23 |
| ITTO910114A1 (it) | 1992-08-19 |
| FR2658536B1 (fr) | 1992-12-31 |
| DE4105272C2 (en, 2012) | 1993-08-05 |
| GB2242200B (en) | 1993-11-17 |
| GB9003762D0 (en) | 1990-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |