SE9100503L - Plaeteringskompositioner och -foerfaranden - Google Patents

Plaeteringskompositioner och -foerfaranden

Info

Publication number
SE9100503L
SE9100503L SE9100503A SE9100503A SE9100503L SE 9100503 L SE9100503 L SE 9100503L SE 9100503 A SE9100503 A SE 9100503A SE 9100503 A SE9100503 A SE 9100503A SE 9100503 L SE9100503 L SE 9100503L
Authority
SE
Sweden
Prior art keywords
optionally
gold
ions
plating
phenyl
Prior art date
Application number
SE9100503A
Other languages
Unknown language ( )
English (en)
Other versions
SE506531C2 (sv
SE9100503D0 (sv
Inventor
J J M Hendriks
Original Assignee
Enthone Omi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Omi Inc filed Critical Enthone Omi Inc
Publication of SE9100503D0 publication Critical patent/SE9100503D0/sv
Publication of SE9100503L publication Critical patent/SE9100503L/sv
Publication of SE506531C2 publication Critical patent/SE506531C2/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Other In-Based Heterocyclic Compounds (AREA)
  • Pyridine Compounds (AREA)
SE9100503A 1990-02-20 1991-02-20 Komposition och förfarande för elektroplätering av guld eller guldlegering SE506531C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9003762A GB2242200B (en) 1990-02-20 1990-02-20 Plating compositions and processes

Publications (3)

Publication Number Publication Date
SE9100503D0 SE9100503D0 (sv) 1991-02-20
SE9100503L true SE9100503L (sv) 1991-08-21
SE506531C2 SE506531C2 (sv) 1997-12-22

Family

ID=10671276

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9100503A SE506531C2 (sv) 1990-02-20 1991-02-20 Komposition och förfarande för elektroplätering av guld eller guldlegering

Country Status (9)

Country Link
US (1) US5169514A (sv)
JP (1) JPH086195B2 (sv)
CA (1) CA2036222C (sv)
CH (1) CH682823A5 (sv)
DE (1) DE4105272A1 (sv)
FR (1) FR2658536B1 (sv)
GB (1) GB2242200B (sv)
IT (1) IT1245514B (sv)
SE (1) SE506531C2 (sv)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4013349A1 (de) * 1990-04-23 1991-10-24 Schering Ag 1-(2-sulfoaethyl)pyridiniumbetain, verfahren zu dessen herstellung sowie saure nickelbaeder enthaltend diese verbindung
US5576282A (en) * 1995-09-11 1996-11-19 The Procter & Gamble Company Color-safe bleach boosters, compositions and laundry methods employing same
WO1997017482A1 (en) * 1995-11-03 1997-05-15 Enthone-Omi Inc. Electroplating processes compositions and deposits
GB9522591D0 (en) * 1995-11-03 1996-01-03 Enthone Omi Suisse S A Electroplating processes compositions and deposits
US7449098B1 (en) 1999-10-05 2008-11-11 Novellus Systems, Inc. Method for planar electroplating
US7531079B1 (en) 1998-10-26 2009-05-12 Novellus Systems, Inc. Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation
US6312580B1 (en) * 1998-11-02 2001-11-06 Tivian Industries, Ltd. Method for gold plating chromium and other passive metals
US7799200B1 (en) 2002-07-29 2010-09-21 Novellus Systems, Inc. Selective electrochemical accelerator removal
US8530359B2 (en) 2003-10-20 2013-09-10 Novellus Systems, Inc. Modulated metal removal using localized wet etching
US8158532B2 (en) * 2003-10-20 2012-04-17 Novellus Systems, Inc. Topography reduction and control by selective accelerator removal
JP4868121B2 (ja) * 2005-12-21 2012-02-01 学校法人早稲田大学 アモルファス金−ニッケル系合金めっき皮膜形成用電気めっき液及び電気めっき方法
CH714243B1 (fr) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
CH710184B1 (fr) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
WO2009135505A1 (de) * 2008-05-07 2009-11-12 Umicore Galvanotechnik Gmbh Pd- und pd-ni-elektrolytbäder
US7534289B1 (en) * 2008-07-02 2009-05-19 Rohm And Haas Electronic Materials Llc Electroless gold plating solution
EP2312021B1 (fr) * 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques
US8168540B1 (en) 2009-12-29 2012-05-01 Novellus Systems, Inc. Methods and apparatus for depositing copper on tungsten
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
JP6214355B2 (ja) * 2013-11-25 2017-10-18 日本高純度化学株式会社 電解金めっき液及びそれを用いて得られた金皮膜
CN106637307B (zh) * 2017-01-04 2019-01-01 中国地质大学（武汉） 一种用于黄金无氰电铸工艺的添加剂
KR101996915B1 (ko) * 2018-09-20 2019-07-05 (주)엠케이켐앤텍 카보닐 산소를 갖는 퓨린 또는 피리미딘계 화합물을 함유하는 치환형 무전해 금 도금액 및 이를 이용한 치환형 무전해 금 도금 방법
CN111663158B (zh) * 2020-06-19 2021-08-13 深圳市华乐珠宝首饰有限公司 一种耐高温无氰硬金的制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6611248A (sv) * 1965-12-02 1966-10-25
GB1442325A (en) * 1972-07-26 1976-07-14 Oxy Metal Finishing Corp Electroplating with gold and gold alloys
DE2355581C3 (de) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
GB1578168A (en) * 1976-03-12 1980-11-05 Cilag Chemie Pyridyl alkylsulphonic acid derivatives and their use in electroplating baths
DE3108508C2 (de) * 1981-03-06 1983-06-30 Langbein-Pfanhauser Werke Ag, 4040 Neuss Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung
US4430171A (en) * 1981-08-24 1984-02-07 M&T Chemicals Inc. Electroplating baths for nickel, iron, cobalt and alloys thereof
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
GB8501245D0 (en) * 1985-01-18 1985-02-20 Engelhard Corp Gold electroplating bath
US4615774A (en) * 1985-01-31 1986-10-07 Omi International Corporation Gold alloy plating bath and process
US4670107A (en) * 1986-03-05 1987-06-02 Vanguard Research Associates, Inc. Electrolyte solution and process for high speed gold plating
US4744871A (en) * 1986-09-25 1988-05-17 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
DE3817722A1 (de) * 1988-05-25 1989-12-14 Raschig Ag Verwendung von 2-substituierten ethansulfon-verbindungen als galvanotechnische hilfsstoffe
US5049286A (en) * 1989-12-22 1991-09-17 Omi International Corporation Process for purification of nickel plating baths

Also Published As

Publication number Publication date
JPH086195B2 (ja) 1996-01-24
CH682823A5 (de) 1993-11-30
CA2036222A1 (en) 1991-08-21
FR2658536B1 (fr) 1992-12-31
CA2036222C (en) 2001-08-14
DE4105272A1 (de) 1991-08-22
ITTO910114A1 (it) 1992-08-19
DE4105272C2 (sv) 1993-08-05
SE506531C2 (sv) 1997-12-22
GB2242200B (en) 1993-11-17
GB2242200A (en) 1991-09-25
SE9100503D0 (sv) 1991-02-20
ITTO910114A0 (it) 1991-02-19
FR2658536A1 (fr) 1991-08-23
JPH06184788A (ja) 1994-07-05
IT1245514B (it) 1994-09-29
US5169514A (en) 1992-12-08
GB9003762D0 (en) 1990-04-18

Similar Documents

Publication Publication Date Title
SE9100503L (sv) Plaeteringskompositioner och -foerfaranden
JP3301707B2 (ja) 錫−銀合金酸性電気めっき浴
JP4249292B2 (ja) 錫及び錫合金メッキ浴
JPH1121693A (ja) 錫−銀合金めっき浴及びめっき物
US4885064A (en) Additive composition, plating bath and method for electroplating tin and/or lead
JP3538499B2 (ja) 錫−銀合金電気めっき浴
SG173551A1 (en) Silver-containing alloy plating bath and electrolytic plating method using the same
JP3532046B2 (ja) 非シアン置換銀めっき浴
US3787296A (en) Non-poisonous zinc plating baths
JP3566498B2 (ja) 置換金めっき浴
JPH09302476A (ja) 無電解錫−銀合金めっき浴
US20050077186A1 (en) Electrolysis bath for electrodepositing silver-tin alloys
ES470683A1 (es) Un procedimiento de preparacion de un deposito electrolitico
JP2819180B2 (ja) すず―鉛―ビスマス合金めっき浴
EP0384679B1 (en) Electrolytic deposition of gold-containing alloys
JP2667323B2 (ja) 酸化防止剤、めっき浴用助剤およびこれを用いためっき浴
JPH10168592A (ja) 錫−亜鉛合金めっき浴
JP3292055B2 (ja) 錫−ビスマス合金電気めっき浴及びそれを使用するめっき方法
SE7703113L (sv) Tillsats vid elektropletering
SE8700716L (sv) Polyoxialkykerade polyhydroxiforeningar som tillsatser i zinklegeringselektrolyter
SE7711034L (sv) Elektrolytisk avsettning
JP2926117B2 (ja) スズ、鉛系めっき浴
TW327654B (en) Tin-lead alloy plating bath composition
JP2000328285A (ja) 酸性錫−銅合金めっき浴
JP2709511B2 (ja) 錫，鉛，錫一鉛合金電気めっき浴及び電気めっき方法

Legal Events

Date Code Title Description
NUG Patent has lapsed

Ref document number: 9100503-3

Format of ref document f/p: F