ITTO910114A1 - Composizioni e procedimento di placcatura - Google Patents

Composizioni e procedimento di placcatura

Info

Publication number
ITTO910114A1
ITTO910114A1 IT000114A ITTO910114A ITTO910114A1 IT TO910114 A1 ITTO910114 A1 IT TO910114A1 IT 000114 A IT000114 A IT 000114A IT TO910114 A ITTO910114 A IT TO910114A IT TO910114 A1 ITTO910114 A1 IT TO910114A1
Authority
IT
Italy
Prior art keywords
compositions
plating procedure
plating
procedure
Prior art date
Application number
IT000114A
Other languages
English (en)
Inventor
Jan M Hendriks
Gerardus A Somers
Der Steen Henrica M H Van
Original Assignee
Enthone Omi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Omi Inc filed Critical Enthone Omi Inc
Publication of ITTO910114A0 publication Critical patent/ITTO910114A0/it
Publication of ITTO910114A1 publication Critical patent/ITTO910114A1/it
Application granted granted Critical
Publication of IT1245514B publication Critical patent/IT1245514B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Other In-Based Heterocyclic Compounds (AREA)
  • Pyridine Compounds (AREA)
ITTO910114A 1990-02-20 1991-02-19 Composizioni e procedimento di placcatura IT1245514B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9003762A GB2242200B (en) 1990-02-20 1990-02-20 Plating compositions and processes

Publications (3)

Publication Number Publication Date
ITTO910114A0 ITTO910114A0 (it) 1991-02-19
ITTO910114A1 true ITTO910114A1 (it) 1992-08-19
IT1245514B IT1245514B (it) 1994-09-29

Family

ID=10671276

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO910114A IT1245514B (it) 1990-02-20 1991-02-19 Composizioni e procedimento di placcatura

Country Status (9)

Country Link
US (1) US5169514A (it)
JP (1) JPH086195B2 (it)
CA (1) CA2036222C (it)
CH (1) CH682823A5 (it)
DE (1) DE4105272A1 (it)
FR (1) FR2658536B1 (it)
GB (1) GB2242200B (it)
IT (1) IT1245514B (it)
SE (1) SE506531C2 (it)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4013349A1 (de) * 1990-04-23 1991-10-24 Schering Ag 1-(2-sulfoaethyl)pyridiniumbetain, verfahren zu dessen herstellung sowie saure nickelbaeder enthaltend diese verbindung
US5576282A (en) * 1995-09-11 1996-11-19 The Procter & Gamble Company Color-safe bleach boosters, compositions and laundry methods employing same
CN1200774A (zh) * 1995-11-03 1998-12-02 恩索恩Omi公司 电镀方法、组合物和沉积物
GB9522591D0 (en) * 1995-11-03 1996-01-03 Enthone Omi Suisse S A Electroplating processes compositions and deposits
US7449098B1 (en) 1999-10-05 2008-11-11 Novellus Systems, Inc. Method for planar electroplating
US7531079B1 (en) 1998-10-26 2009-05-12 Novellus Systems, Inc. Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation
US6312580B1 (en) * 1998-11-02 2001-11-06 Tivian Industries, Ltd. Method for gold plating chromium and other passive metals
US7799200B1 (en) 2002-07-29 2010-09-21 Novellus Systems, Inc. Selective electrochemical accelerator removal
US8158532B2 (en) 2003-10-20 2012-04-17 Novellus Systems, Inc. Topography reduction and control by selective accelerator removal
US8530359B2 (en) 2003-10-20 2013-09-10 Novellus Systems, Inc. Modulated metal removal using localized wet etching
JP4868121B2 (ja) * 2005-12-21 2012-02-01 学校法人早稲田大学 アモルファス金−ニッケル系合金めっき皮膜形成用電気めっき液及び電気めっき方法
CH714243B1 (fr) * 2006-10-03 2019-04-15 Swatch Group Res & Dev Ltd Procédé d'électroformage et pièce ou couche obtenue par ce procédé.
CH710184B1 (fr) 2007-09-21 2016-03-31 Aliprandini Laboratoires G Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux ou métalloïdes toxiques.
KR101502804B1 (ko) * 2008-05-07 2015-03-16 유미코아 갈바노테히닉 게엠베하 Ｐｄ 및 Ｐｄ-Ｎｉ 전해질 욕조
US7534289B1 (en) * 2008-07-02 2009-05-19 Rohm And Haas Electronic Materials Llc Electroless gold plating solution
EP2312021B1 (fr) * 2009-10-15 2020-03-18 The Swatch Group Research and Development Ltd. Procédé d'obtention d'un dépôt d'alliage d'or jaune par galvanoplastie sans utilisation de métaux toxiques
US8168540B1 (en) 2009-12-29 2012-05-01 Novellus Systems, Inc. Methods and apparatus for depositing copper on tungsten
EP2801640A1 (en) * 2013-05-08 2014-11-12 ATOTECH Deutschland GmbH Galvanic nickel or nickel alloy electroplating bath for depositing a semi-bright nickel or nickel alloy
JP6214355B2 (ja) * 2013-11-25 2017-10-18 日本高純度化学株式会社 電解金めっき液及びそれを用いて得られた金皮膜
CN106637307B (zh) * 2017-01-04 2019-01-01 中国地质大学（武汉） 一种用于黄金无氰电铸工艺的添加剂
KR101996915B1 (ko) * 2018-09-20 2019-07-05 (주)엠케이켐앤텍 카보닐 산소를 갖는 퓨린 또는 피리미딘계 화합물을 함유하는 치환형 무전해 금 도금액 및 이를 이용한 치환형 무전해 금 도금 방법
CN111663158B (zh) * 2020-06-19 2021-08-13 深圳市华乐珠宝首饰有限公司 一种耐高温无氰硬金的制备方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6611248A (it) * 1965-12-02 1966-10-25
GB1442325A (en) * 1972-07-26 1976-07-14 Oxy Metal Finishing Corp Electroplating with gold and gold alloys
DE2355581C3 (de) * 1973-11-07 1979-07-12 Deutsche Gold- Und Silber-Scheideanstalt Vormals Roessler, 6000 Frankfurt Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit
GB1578168A (en) * 1976-03-12 1980-11-05 Cilag Chemie Pyridyl alkylsulphonic acid derivatives and their use in electroplating baths
DE3108508C2 (de) * 1981-03-06 1983-06-30 Langbein-Pfanhauser Werke Ag, 4040 Neuss Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung
US4430171A (en) * 1981-08-24 1984-02-07 M&T Chemicals Inc. Electroplating baths for nickel, iron, cobalt and alloys thereof
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
GB8501245D0 (en) * 1985-01-18 1985-02-20 Engelhard Corp Gold electroplating bath
US4615774A (en) * 1985-01-31 1986-10-07 Omi International Corporation Gold alloy plating bath and process
US4670107A (en) * 1986-03-05 1987-06-02 Vanguard Research Associates, Inc. Electrolyte solution and process for high speed gold plating
US4744871A (en) * 1986-09-25 1988-05-17 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
DE3817722A1 (de) * 1988-05-25 1989-12-14 Raschig Ag Verwendung von 2-substituierten ethansulfon-verbindungen als galvanotechnische hilfsstoffe
US5049286A (en) * 1989-12-22 1991-09-17 Omi International Corporation Process for purification of nickel plating baths

Also Published As

Publication number Publication date
CA2036222A1 (en) 1991-08-21
DE4105272A1 (de) 1991-08-22
SE506531C2 (sv) 1997-12-22
ITTO910114A0 (it) 1991-02-19
US5169514A (en) 1992-12-08
GB2242200B (en) 1993-11-17
JPH086195B2 (ja) 1996-01-24
SE9100503D0 (sv) 1991-02-20
JPH06184788A (ja) 1994-07-05
GB2242200A (en) 1991-09-25
FR2658536A1 (fr) 1991-08-23
IT1245514B (it) 1994-09-29
GB9003762D0 (en) 1990-04-18
SE9100503L (sv) 1991-08-21
CH682823A5 (de) 1993-11-30
FR2658536B1 (fr) 1992-12-31
DE4105272C2 (it) 1993-08-05
CA2036222C (en) 2001-08-14

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19980225