TW327654B - Tin-lead alloy plating bath composition - Google Patents

Tin-lead alloy plating bath composition

Info

Publication number
TW327654B
TW327654B TW085107104A TW85107104A TW327654B TW 327654 B TW327654 B TW 327654B TW 085107104 A TW085107104 A TW 085107104A TW 85107104 A TW85107104 A TW 85107104A TW 327654 B TW327654 B TW 327654B
Authority
TW
Taiwan
Prior art keywords
metal
tin
salt
sulphonic acid
lead
Prior art date
Application number
TW085107104A
Other languages
Chinese (zh)
Inventor
Tetsuharu Nishikawa
Itsuki Gentai
Yukihumi Masaki
Original Assignee
Ishihara Chemical Co Ltd
Daiwa Kasei Kenkyusho
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ishihara Chemical Co Ltd, Daiwa Kasei Kenkyusho filed Critical Ishihara Chemical Co Ltd
Application granted granted Critical
Publication of TW327654B publication Critical patent/TW327654B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

A tin-lead alloy plating bath composition characterized in that the bath comprises: (A) soluble metallic salts consisting of a mixture of a stannous salt and a lead salt, in which the total amount of the stannous metal and the lead metal is 0.5~200 g/l, (B) 20~400 g/l of at least one organic sulphonic acid selected from an alkane sulphonic acid and an alkanol sulphonic acid, (C) 0.01~50 g/l of at least one water-soluble nonionic surfactant, and (D) 0.01~10 g/l of at least one compound selected from an alkyl naphthalenesulphonic acid and a salt thereof represented by the formula (I) (I) in which R1 represents a linear or branched C2-5 alkyl group; M represents hydrogen, an alkaline metal, an alkaline earth metal, or ammonium; provided that the substitution positions of R1 and SO3M are not specifically limited; m represents an integer of 1 to 3 and n represents an integer of 1 to 2.
TW085107104A 1995-05-25 1996-06-13 Tin-lead alloy plating bath composition TW327654B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7152635A JP3013150B2 (en) 1995-05-25 1995-05-25 Tin-lead alloy plating bath for stabilizing the composition ratio of electrodeposition film

Publications (1)

Publication Number Publication Date
TW327654B true TW327654B (en) 1998-03-01

Family

ID=15544712

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085107104A TW327654B (en) 1995-05-25 1996-06-13 Tin-lead alloy plating bath composition

Country Status (3)

Country Link
JP (1) JP3013150B2 (en)
KR (1) KR100236430B1 (en)
TW (1) TW327654B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI482247B (en) * 2002-10-08 2015-04-21 Honeywell Int Inc Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4582294B2 (en) * 2004-04-02 2010-11-17 三菱マテリアル株式会社 Lead-tin alloy solder plating solution
JP5574912B2 (en) * 2010-10-22 2014-08-20 ローム・アンド・ハース電子材料株式会社 Tin plating solution

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI482247B (en) * 2002-10-08 2015-04-21 Honeywell Int Inc Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials
US9666547B2 (en) 2002-10-08 2017-05-30 Honeywell International Inc. Method of refining solder materials

Also Published As

Publication number Publication date
KR100236430B1 (en) 1999-12-15
JP3013150B2 (en) 2000-02-28
KR960041428A (en) 1996-12-19
JPH08325783A (en) 1996-12-10

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees