TW327654B - Tin-lead alloy plating bath composition - Google Patents
Tin-lead alloy plating bath compositionInfo
- Publication number
- TW327654B TW327654B TW085107104A TW85107104A TW327654B TW 327654 B TW327654 B TW 327654B TW 085107104 A TW085107104 A TW 085107104A TW 85107104 A TW85107104 A TW 85107104A TW 327654 B TW327654 B TW 327654B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- tin
- salt
- sulphonic acid
- lead
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
A tin-lead alloy plating bath composition characterized in that the bath comprises: (A) soluble metallic salts consisting of a mixture of a stannous salt and a lead salt, in which the total amount of the stannous metal and the lead metal is 0.5~200 g/l, (B) 20~400 g/l of at least one organic sulphonic acid selected from an alkane sulphonic acid and an alkanol sulphonic acid, (C) 0.01~50 g/l of at least one water-soluble nonionic surfactant, and (D) 0.01~10 g/l of at least one compound selected from an alkyl naphthalenesulphonic acid and a salt thereof represented by the formula (I) (I) in which R1 represents a linear or branched C2-5 alkyl group; M represents hydrogen, an alkaline metal, an alkaline earth metal, or ammonium; provided that the substitution positions of R1 and SO3M are not specifically limited; m represents an integer of 1 to 3 and n represents an integer of 1 to 2.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7152635A JP3013150B2 (en) | 1995-05-25 | 1995-05-25 | Tin-lead alloy plating bath for stabilizing the composition ratio of electrodeposition film |
Publications (1)
Publication Number | Publication Date |
---|---|
TW327654B true TW327654B (en) | 1998-03-01 |
Family
ID=15544712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085107104A TW327654B (en) | 1995-05-25 | 1996-06-13 | Tin-lead alloy plating bath composition |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3013150B2 (en) |
KR (1) | KR100236430B1 (en) |
TW (1) | TW327654B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI482247B (en) * | 2002-10-08 | 2015-04-21 | Honeywell Int Inc | Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4582294B2 (en) * | 2004-04-02 | 2010-11-17 | 三菱マテリアル株式会社 | Lead-tin alloy solder plating solution |
JP5574912B2 (en) * | 2010-10-22 | 2014-08-20 | ローム・アンド・ハース電子材料株式会社 | Tin plating solution |
-
1995
- 1995-05-25 JP JP7152635A patent/JP3013150B2/en not_active Expired - Fee Related
-
1996
- 1996-05-25 KR KR1019960017890A patent/KR100236430B1/en not_active IP Right Cessation
- 1996-06-13 TW TW085107104A patent/TW327654B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI482247B (en) * | 2002-10-08 | 2015-04-21 | Honeywell Int Inc | Semiconductor packages; lead-containing solders and anodes; and methods of removing alpha-emitters from materials |
US9666547B2 (en) | 2002-10-08 | 2017-05-30 | Honeywell International Inc. | Method of refining solder materials |
Also Published As
Publication number | Publication date |
---|---|
KR960041428A (en) | 1996-12-19 |
JP3013150B2 (en) | 2000-02-28 |
JPH08325783A (en) | 1996-12-10 |
KR100236430B1 (en) | 1999-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |