KR960041428A - Tin-lead alloy plating bath - Google Patents

Tin-lead alloy plating bath Download PDF

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Publication number
KR960041428A
KR960041428A KR1019960017890A KR19960017890A KR960041428A KR 960041428 A KR960041428 A KR 960041428A KR 1019960017890 A KR1019960017890 A KR 1019960017890A KR 19960017890 A KR19960017890 A KR 19960017890A KR 960041428 A KR960041428 A KR 960041428A
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KR
South Korea
Prior art keywords
plating bath
tin
lead alloy
alloy plating
sulfonic acid
Prior art date
Application number
KR1019960017890A
Other languages
Korean (ko)
Other versions
KR100236430B1 (en
Inventor
데쯔지 니시가와
다이끼 하라
세이시 마사끼
Original Assignee
아꾸스 도시지
이시하라 야꾸힝 가부시끼가이샤
오꾸하마 요시아끼
가부시끼가이샤 다이와 가세이 겐뀨쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 아꾸스 도시지, 이시하라 야꾸힝 가부시끼가이샤, 오꾸하마 요시아끼, 가부시끼가이샤 다이와 가세이 겐뀨쇼 filed Critical 아꾸스 도시지
Publication of KR960041428A publication Critical patent/KR960041428A/en
Application granted granted Critical
Publication of KR100236430B1 publication Critical patent/KR100236430B1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Abstract

유기 술폰산을 함유하는 주석-납 합금 도금욕에 있어서, 도금욕중의 Sn/Pb 조성비의 납땜 전착 피막을 형성할 수 있고, 더욱이 전류 밀도가 다른 경우에도, 전착 피막의 조성비가 안정한 주석-납 합금도금욕을 제공한다.In the tin-lead alloy plating bath containing the organic sulfonic acid, a solder electrodeposition coating having a Sn / Pb composition ratio in the plating bath can be formed, and even when the current density is different, the composition ratio of the electrodeposition coating is stable. Thereby providing a plating bath.

Description

주석-납 합금 도금욕Tin-lead alloy plating bath

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

Claims (4)

(A) 제1주석염 및 납염의 혼합물로 이루어진 가용성 금속염, (B) 알칸 술폰산 및 알칸올 술폰산 중에서 선택된 1종 이상의 화합물로 이루어진 유기 술폰산, (c) 1종 이상의 비이온계 계면활성제, 및 (D) 아래 일반식 (I)로 표시되는 알킬나프탈렌술폰산 및 그의 염 중에서 선택된 1 종 이상의 화합물을 함유하는 것을 특징으로 하는 주석-납 합금 도금욕(A) an organic sulfonic acid comprising at least one compound selected from alkaline sulfonic acid and alkanol sulfonic acid (B), (c) at least one nonionic surfactant, and D) a tin-lead alloy plating bath characterized by containing at least one compound selected from alkyl naphthalenesulfonic acid represented by the following general formula (I) 상기 식에서 R1은 C1내지 C5의 직쇄 또는 분지쇄 알킬기이고, M은 수소, 알칼리 금속, 알칼리 토금속 암모늄 또는 아민이며, 단, R1, 및 SO3M의 치환 위치는 특별히 한정되지 않으며, m은 1 내지 3의 정수이고, n은 1 또는 2의 정수이다.Wherein R 1 is a C 1 to C 5 linear or branched alkyl group and M is hydrogen, an alkali metal, an alkaline earth metal ammonium or an amine, with the proviso that the substitution positions of R 1 and SO 3 M are not particularly limited, m is an integer of 1 to 3, and n is an integer of 1 or 2. 제1항에 있어서, 평활제를 추가로 함유하는 것을 특징으로 하는 주석-납 합금 도금욕.The tin-lead alloy plating bath according to claim 1, further comprising a smoothing agent. 제1항 또는 2항에 있어서, 광택제를 추가로 함유하는 것을 특징으로 하는 주석 -납 합금 도금욕.The tin-lead alloy plating bath according to claim 1 or 2, further comprising a polishing agent. 제1항 내지 3항 중 어느 한 항에 있어서, 산화 방지제를 추가로 함유하는 것을 특징으로 하는 주석-납 합금 도금욕.The tin-lead alloy plating bath according to any one of claims 1 to 3, further comprising an antioxidant. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960017890A 1995-05-25 1996-05-25 Tin-lead alloy plating bath KR100236430B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-152635 1995-05-25
JP7152635A JP3013150B2 (en) 1995-05-25 1995-05-25 Tin-lead alloy plating bath for stabilizing the composition ratio of electrodeposition film

Publications (2)

Publication Number Publication Date
KR960041428A true KR960041428A (en) 1996-12-19
KR100236430B1 KR100236430B1 (en) 1999-12-15

Family

ID=15544712

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960017890A KR100236430B1 (en) 1995-05-25 1996-05-25 Tin-lead alloy plating bath

Country Status (3)

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JP (1) JP3013150B2 (en)
KR (1) KR100236430B1 (en)
TW (1) TW327654B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004034427A2 (en) 2002-10-08 2004-04-22 Honeywell International Inc. Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials
JP4582294B2 (en) * 2004-04-02 2010-11-17 三菱マテリアル株式会社 Lead-tin alloy solder plating solution
JP5574912B2 (en) * 2010-10-22 2014-08-20 ローム・アンド・ハース電子材料株式会社 Tin plating solution

Also Published As

Publication number Publication date
TW327654B (en) 1998-03-01
JPH08325783A (en) 1996-12-10
JP3013150B2 (en) 2000-02-28
KR100236430B1 (en) 1999-12-15

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