CH652532A5 - Verwendung eines feinstdrahtes fuer die herstellung der aussenanschluesse von halbleiter-bauelementen. - Google Patents
Verwendung eines feinstdrahtes fuer die herstellung der aussenanschluesse von halbleiter-bauelementen. Download PDFInfo
- Publication number
- CH652532A5 CH652532A5 CH79/82A CH7982A CH652532A5 CH 652532 A5 CH652532 A5 CH 652532A5 CH 79/82 A CH79/82 A CH 79/82A CH 7982 A CH7982 A CH 7982A CH 652532 A5 CH652532 A5 CH 652532A5
- Authority
- CH
- Switzerland
- Prior art keywords
- copper
- weight
- wires
- aluminum
- connection
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Wire Bonding (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19813104960 DE3104960A1 (de) | 1981-02-12 | 1981-02-12 | "feinstdraht" |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH652532A5 true CH652532A5 (de) | 1985-11-15 |
Family
ID=6124622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH79/82A CH652532A5 (de) | 1981-02-12 | 1982-01-07 | Verwendung eines feinstdrahtes fuer die herstellung der aussenanschluesse von halbleiter-bauelementen. |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS57149744A (enExample) |
| CH (1) | CH652532A5 (enExample) |
| DE (1) | DE3104960A1 (enExample) |
| FR (1) | FR2499767A1 (enExample) |
| GB (1) | GB2093064B (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60223149A (ja) * | 1984-04-19 | 1985-11-07 | Hitachi Ltd | 半導体装置 |
| US4705204A (en) * | 1985-03-01 | 1987-11-10 | Mitsubishi Denki Kabushiki Kaisha | Method of ball forming for wire bonding |
| GB2175009B (en) * | 1985-03-27 | 1990-02-07 | Mitsubishi Metal Corp | Wire for bonding a semiconductor device and process for producing the same |
| US5149917A (en) * | 1990-05-10 | 1992-09-22 | Sumitomo Electric Industries, Ltd. | Wire conductor for harness |
| JPH05184788A (ja) * | 1991-12-19 | 1993-07-27 | Daiken Trade & Ind Co Ltd | 乾燥庫 |
| JPH0716797U (ja) * | 1993-08-27 | 1995-03-20 | 武盛 豊永 | 除湿機付高温衣類乾燥機 |
| JP2501303B2 (ja) * | 1994-04-11 | 1996-05-29 | 株式会社東芝 | 半導体装置 |
| JP2501305B2 (ja) * | 1994-06-06 | 1996-05-29 | 株式会社東芝 | 半導体装置 |
| JP2501306B2 (ja) * | 1994-07-08 | 1996-05-29 | 株式会社東芝 | 半導体装置 |
| DE19606116A1 (de) * | 1996-02-20 | 1997-08-21 | Berkenhoff Gmbh | Elektrische Kontaktelemente |
| JP3891346B2 (ja) * | 2002-01-07 | 2007-03-14 | 千住金属工業株式会社 | 微小銅ボールおよび微小銅ボールの製造方法 |
| TWI287282B (en) | 2002-03-14 | 2007-09-21 | Fairchild Kr Semiconductor Ltd | Semiconductor package having oxidation-free copper wire |
| WO2006073206A1 (ja) | 2005-01-05 | 2006-07-13 | Nippon Steel Materials Co., Ltd. | 半導体装置用ボンディングワイヤ |
| SG10201600329SA (en) * | 2016-01-15 | 2017-08-30 | Heraeus Materials Singapore Pte Ltd | Coated wire |
| WO2017221434A1 (ja) | 2016-06-20 | 2017-12-28 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
| DE102018122574B4 (de) | 2018-09-14 | 2020-11-26 | Kme Special Products Gmbh | Verwendung einer Kupferlegierung |
| DE102019113082A1 (de) | 2019-05-17 | 2020-11-19 | Infineon Technologies Ag | Halbleiter-gehäuse und verfahren zum bilden eines halbleiter-gehäuses |
| US20230119577A1 (en) * | 2021-10-15 | 2023-04-20 | Lincoln Global, Inc. | High alloy welding wire with copper based coating |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1090437B (de) * | 1956-08-14 | 1960-10-06 | Nippert Electric Products Comp | Verfahren zum Verbessern der elektrischen und mechanischen Eigenschaften von Kupfer-Zirkon-Legierungen |
| NL219101A (enExample) * | 1956-10-31 | 1900-01-01 | ||
| DE2929623C2 (de) * | 1979-07-21 | 1981-11-26 | W.C. Heraeus Gmbh, 6450 Hanau | Feinstdraht aus einer Aluminiumlegierung |
| JPS5678357U (enExample) * | 1979-11-09 | 1981-06-25 | ||
| DE3011661C2 (de) * | 1980-03-26 | 1982-08-26 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Halbleiteranordnung mit Kontaktierungsdrähten |
| DE3023528C2 (de) | 1980-06-24 | 1984-11-29 | W.C. Heraeus Gmbh, 6450 Hanau | Aluminium enthaltender Feinstdraht |
-
1981
- 1981-02-12 DE DE19813104960 patent/DE3104960A1/de active Granted
- 1981-11-26 GB GB8135741A patent/GB2093064B/en not_active Expired
-
1982
- 1982-01-07 CH CH79/82A patent/CH652532A5/de not_active IP Right Cessation
- 1982-02-11 FR FR8202254A patent/FR2499767A1/fr active Granted
- 1982-02-12 JP JP57019859A patent/JPS57149744A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57149744A (en) | 1982-09-16 |
| JPH0237095B2 (enExample) | 1990-08-22 |
| DE3104960A1 (de) | 1982-08-26 |
| DE3104960C2 (enExample) | 1987-09-24 |
| FR2499767A1 (fr) | 1982-08-13 |
| GB2093064A (en) | 1982-08-25 |
| FR2499767B3 (enExample) | 1984-01-06 |
| GB2093064B (en) | 1984-10-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased | ||
| PL | Patent ceased |