FR2499767A1 - Application d'un fil metallique extra-fin a la realisation des connexions exterieures de composants a semi-conducteurs - Google Patents

Application d'un fil metallique extra-fin a la realisation des connexions exterieures de composants a semi-conducteurs Download PDF

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Publication number
FR2499767A1
FR2499767A1 FR8202254A FR8202254A FR2499767A1 FR 2499767 A1 FR2499767 A1 FR 2499767A1 FR 8202254 A FR8202254 A FR 8202254A FR 8202254 A FR8202254 A FR 8202254A FR 2499767 A1 FR2499767 A1 FR 2499767A1
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Prior art keywords
copper
extra
wires
semiconductor components
weight
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Granted
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FR8202254A
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English (en)
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FR2499767B3 (fr
Inventor
Fritz Aldinger
Albrecht Bischoff
Wolfgang Bonifer
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WC Heraus GmbH and Co KG
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WC Heraus GmbH and Co KG
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Publication of FR2499767A1 publication Critical patent/FR2499767A1/fr
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    • H—ELECTRICITY
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
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  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

POUR REALISER LES FILS DE CONNEXION ENTRE DES COMPOSANTS A SEMI-CONDUCTEURS ET DES ELEMENTS DE CONNEXION EXTERIEURS, UN SUPPORT DE SYSTEME PAR EXEMPLE, ON UTILISE DES FILS EXTRA-FINS D'UN DIAMETRE DE 0,01 A 0,06MM, DE CUIVRE OU D'UN CUPRO-ALLIAGE CONSTITUE DE 98 A 99,9 EN POIDS DE CUIVRE ET 0,1 A 2 EN POIDS DE BERYLLIUM, ETAIN, ZINC, ARGENT, ZIRCONIUM, CHROME OU FER.

Description

L'invention concerne l'utilisation d'un fil métallique
extra-fin, d'un diamètre de 0,01 a 0,06 mm, pour réaliser les con-
nexions extérieures de composants à semi-conducteurs.
On conna!t l'utilisation de fils extra-fins en or, aluminium ou alliages d'aluminium, tels que AlSil, AlCu4 (demande de brevet allemand soumise à l'Inspection Publique DOS-29 29 623) et AlMgl, pour réaliser les connexions extérieures de composants à semi-conducteurs. La demande de brevet allemand P 30 23 528.0 décrit des fils extra-fins formés d'un noyau de cuivre ou alliage de cuivre (CuSn& en particulier) et d'une enveloppe d'aluminium ou alliage d'aluminium. Alors que les fils extra- fins d'aluminium et alliages d'aluminium sont employés de préférence pour exécuter des soudures
par ultrasons selon le procédé "wedge-wedge", c'est-à-dire avec uti-
lisation d'un coin, les fils à noyau et enveloppe (fils extra-fins de cuivre-aluminium) peuvent être reliés à la fois par soudage, par ultrasons selon le procédé wedge-wedge et par soudage "thermosonique"
selon le procédé de formation des contacts "tête de clou" aux compo-
sanes à semi-conducteurs et aux éléments de connexion auquel. les
fils sont à relier.
La résistance mécanique et. la conductibilité électrique de la liaison entre ces fils à noyau et enveloppe et les composants a semi-conducteurs sont bonnes. Cependant, à l'exécution de la soudure entre le fil et un élément de connexion en cuivre ou cupro-alliage, un support de système par exemple, il risque de se produire des dommages qui - sous les conditions de service - peuvent entraîner
le détachement du fil.
La fiabilité de circuits intégrés dépend dans une
forte mesure des fils de connexion et de la solidité de leurs liai-
sons aux composants a semi-conducteurs et aux éléments de connexion (broches par exemple). Il existe donc un intérêt pour l'amélioration des fils de connexion et pour la mise au point de fils nouveaux, ce
qui devient également nécessaire dans le cadre d'un emploi plus par-
cimonieux de méLaux nobles dans la technologie des semi-conducteurs.
L'invention vise par conséquent à trouver un fil métal-
lique extra-fin, d'un diamètre de 0,01 à 0,06 mm, pour réaliser les connexions extérieures de composants à semi-conducteurs, qui établisse une liaison sGre à la fois avec des composants à semi-conducteurs au silicium revêtus d'une couche d'aluminium et avec des éléments de
connexion en cuivre ou cupro-alliages.
Selon l'invention, on utilise pour l'application indi-
quée un fil extra-fin de cuivre ou d'un cupro-alliage constitué de 98 à 99,9% en poids de cuivre et 0,1 à 2% en poids de béryllium,
étain, zinc, argent, zirconium, chrome ou fer.
Des résultats particulièrement bons ont été obtenus avec des fils extrafins d'alliages de 99,47. en poids de cuivre et 0,6. en poids d'étain et de 99,85% en poids de cuivre et 0,157. en
poids de zirconium.
Des alliages de cuivre de ce genre sont en soi connus.
Par exemple, des alliages de cuivre avec 1% en poids d'étain respec-
tivement avec 0,15% en poids de zirconium sont décrits dans l'ouvrage "Kupfer und Kupferlegierungen in der Technik de Dies, 1967, page 572,
respectivement dans la demande de brevet allemand publiéeDAS-l0 90 437.
Les fils extra-fins de cuivre ou de cupro-alliage selon l'invention sont soudés par ultrasons à l'aide d'un coin aux éléments de connexion constitués de cuivre ou d'alliages de cuivre. Les points de liaison entre les fils extra-fins et le cuivre ou l'alliage de cuivre sont exempts de défauts (fissures, ect.). La résistance à l'arrachage des paires Cu/Cu, CuSnO,6/Cu et CuZrO,15/Cu est plus
grande que celle des paires Cu/Al et Cu/Cu-Al.
La liaison des fils extra-fins aux composants à semi-
conducteurs - au silicium revêtu d'une couche d'aluminium par exemple-
s'effectue par soudage thermosonique selon le procédé de formation des contacts à tête de clou, avec formation d'une microbille au bout du fil par coupure de celui-ci à la flamme dans une atmosphère de
gaz protecteur.
Avec les fils extra-fins employés selon l'invention, le diamètre - de 25 ym - des billes qui se forment à la coupure du fil à la flamme est plus petit qu'avec les fils extra-fins connus (AlSil: 55 ym et CuZrO,15: 50 Pm) . Cette différence de grosseur est encore plus prononcée sur les billes après soudage, comme l'on
montré des prises de vue au microscope électronique à balayage.
Compte tenu de la miniaturisation de plus en plus
poussée des pistes conductives dans les dispositifs à semi-conduc-
teurs, le plus faible diamètre des sphères formées à la coupure à
la flamme se révèle comme un avantage supplémentaire de l'applica-
tion selon l'invention des fils extra-fins de cuivre ou cupro-alliage.
Pendant le soudage thermosonique selon le procédé de formation des contacts à tête de clou, le soudage des fils extra-fins sur l'aire de sortie de la buse servant au guidage du fil et comme sonotrode risque de boucher l'orifice de la buse. Or, à la différence
des fils extra-fins d'aluminium, alliages d'aluminium ou cuivre-alu-
minium, ceux de cuivre et alliage de cuivre n'ont pratiquement pas tendance à se souder à la buse, de sorte que le risque de bouchage
de son orifice est très petit.
Les fils extra-fins de cuivre et cupro-alliages sont en outre remarquables par une conductibilité électrique élevée, une
plus grande résistance à la fatigue que les fils extra-fins d'alumi-
nium, alliages d'aluminium ou cuivre-aluminium et par une résistance à la traction élevée, laquelle ne contribue pas seulement à la bonne tenue à l'arrachage mais aussi à la formation d'une boucle de fil
(loop) stable.
RE V E N D I C A T I 0 N S
1. Application d'un fil métallique extra-fin, d'un dia-
mètre de 0,01 à 0,06 mm, à la réalisation des connexions extérieures
de composants à semi-conducteurs, caractérisée en ce que le fil extra-
fin est un fil de cuivre ou de cupro-alliage constitué de 98 à 99,9% en poids de cuivre et 0,1 à 2% en poids de béryllium, étain, zinc,
argent, zirconium, chrome ou fer.
2. Application selon la revendication 1, caractérisée en ce que le fil extra-fin est constitué de 99,4% en poids de cuivre et
0,6% en poids d'étain.
3. Application selon la revendication 1, caractérisée en ce que le fil extra-fin est constitué de 99,85% en poids de cuivre et
0,15% en poids de zirconium. -
FR8202254A 1981-02-12 1982-02-11 Application d'un fil metallique extra-fin a la realisation des connexions exterieures de composants a semi-conducteurs Granted FR2499767A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813104960 DE3104960A1 (de) 1981-02-12 1981-02-12 "feinstdraht"

Publications (2)

Publication Number Publication Date
FR2499767A1 true FR2499767A1 (fr) 1982-08-13
FR2499767B3 FR2499767B3 (fr) 1984-01-06

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Country Status (5)

Country Link
JP (1) JPS57149744A (fr)
CH (1) CH652532A5 (fr)
DE (1) DE3104960A1 (fr)
FR (1) FR2499767A1 (fr)
GB (1) GB2093064B (fr)

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JPS60223149A (ja) * 1984-04-19 1985-11-07 Hitachi Ltd 半導体装置
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
GB2175009B (en) * 1985-03-27 1990-02-07 Mitsubishi Metal Corp Wire for bonding a semiconductor device and process for producing the same
US5149917A (en) * 1990-05-10 1992-09-22 Sumitomo Electric Industries, Ltd. Wire conductor for harness
JPH05184788A (ja) * 1991-12-19 1993-07-27 Daiken Trade & Ind Co Ltd 乾燥庫
JPH0716797U (ja) * 1993-08-27 1995-03-20 武盛 豊永 除湿機付高温衣類乾燥機
JP2501303B2 (ja) * 1994-04-11 1996-05-29 株式会社東芝 半導体装置
JP2501305B2 (ja) * 1994-06-06 1996-05-29 株式会社東芝 半導体装置
JP2501306B2 (ja) * 1994-07-08 1996-05-29 株式会社東芝 半導体装置
DE19606116A1 (de) * 1996-02-20 1997-08-21 Berkenhoff Gmbh Elektrische Kontaktelemente
JP3891346B2 (ja) 2002-01-07 2007-03-14 千住金属工業株式会社 微小銅ボールおよび微小銅ボールの製造方法
TWI287282B (en) 2002-03-14 2007-09-21 Fairchild Kr Semiconductor Ltd Semiconductor package having oxidation-free copper wire
KR101019811B1 (ko) 2005-01-05 2011-03-04 신닛테츠 마테리알즈 가부시키가이샤 반도체 장치용 본딩 와이어
WO2017221434A1 (fr) 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 Fil de connexion pour dispositif à semi-conducteurs
DE102018122574B4 (de) * 2018-09-14 2020-11-26 Kme Special Products Gmbh Verwendung einer Kupferlegierung
DE102019113082A1 (de) * 2019-05-17 2020-11-19 Infineon Technologies Ag Halbleiter-gehäuse und verfahren zum bilden eines halbleiter-gehäuses

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NL113327C (fr) * 1956-10-31 1900-01-01
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JPS5678357U (fr) * 1979-11-09 1981-06-25
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Also Published As

Publication number Publication date
JPS57149744A (en) 1982-09-16
FR2499767B3 (fr) 1984-01-06
DE3104960C2 (fr) 1987-09-24
JPH0237095B2 (fr) 1990-08-22
CH652532A5 (de) 1985-11-15
GB2093064A (en) 1982-08-25
GB2093064B (en) 1984-10-31
DE3104960A1 (de) 1982-08-26

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