CH652532A5 - Verwendung eines feinstdrahtes fuer die herstellung der aussenanschluesse von halbleiter-bauelementen. - Google Patents

Verwendung eines feinstdrahtes fuer die herstellung der aussenanschluesse von halbleiter-bauelementen. Download PDF

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Publication number
CH652532A5
CH652532A5 CH79/82A CH7982A CH652532A5 CH 652532 A5 CH652532 A5 CH 652532A5 CH 79/82 A CH79/82 A CH 79/82A CH 7982 A CH7982 A CH 7982A CH 652532 A5 CH652532 A5 CH 652532A5
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CH
Switzerland
Prior art keywords
copper
weight
wires
aluminum
connection
Prior art date
Application number
CH79/82A
Other languages
German (de)
English (en)
Inventor
Fritz Dr Aldinger
Albrecht Dr Bischoff
Wolfgang Bonifer
Original Assignee
Heraeus Gmbh W C
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Gmbh W C filed Critical Heraeus Gmbh W C
Publication of CH652532A5 publication Critical patent/CH652532A5/de

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
CH79/82A 1981-02-12 1982-01-07 Verwendung eines feinstdrahtes fuer die herstellung der aussenanschluesse von halbleiter-bauelementen. CH652532A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813104960 DE3104960A1 (de) 1981-02-12 1981-02-12 "feinstdraht"

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CH652532A5 true CH652532A5 (de) 1985-11-15

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CH79/82A CH652532A5 (de) 1981-02-12 1982-01-07 Verwendung eines feinstdrahtes fuer die herstellung der aussenanschluesse von halbleiter-bauelementen.

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JP (1) JPS57149744A (fr)
CH (1) CH652532A5 (fr)
DE (1) DE3104960A1 (fr)
FR (1) FR2499767A1 (fr)
GB (1) GB2093064B (fr)

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US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
GB2175009B (en) * 1985-03-27 1990-02-07 Mitsubishi Metal Corp Wire for bonding a semiconductor device and process for producing the same
US5149917A (en) * 1990-05-10 1992-09-22 Sumitomo Electric Industries, Ltd. Wire conductor for harness
JPH05184788A (ja) * 1991-12-19 1993-07-27 Daiken Trade & Ind Co Ltd 乾燥庫
JPH0716797U (ja) * 1993-08-27 1995-03-20 武盛 豊永 除湿機付高温衣類乾燥機
JP2501303B2 (ja) * 1994-04-11 1996-05-29 株式会社東芝 半導体装置
JP2501305B2 (ja) * 1994-06-06 1996-05-29 株式会社東芝 半導体装置
JP2501306B2 (ja) * 1994-07-08 1996-05-29 株式会社東芝 半導体装置
DE19606116A1 (de) * 1996-02-20 1997-08-21 Berkenhoff Gmbh Elektrische Kontaktelemente
JP3891346B2 (ja) 2002-01-07 2007-03-14 千住金属工業株式会社 微小銅ボールおよび微小銅ボールの製造方法
TWI287282B (en) 2002-03-14 2007-09-21 Fairchild Kr Semiconductor Ltd Semiconductor package having oxidation-free copper wire
KR101019811B1 (ko) 2005-01-05 2011-03-04 신닛테츠 마테리알즈 가부시키가이샤 반도체 장치용 본딩 와이어
WO2017221434A1 (fr) 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 Fil de connexion pour dispositif à semi-conducteurs
DE102018122574B4 (de) * 2018-09-14 2020-11-26 Kme Special Products Gmbh Verwendung einer Kupferlegierung
DE102019113082A1 (de) * 2019-05-17 2020-11-19 Infineon Technologies Ag Halbleiter-gehäuse und verfahren zum bilden eines halbleiter-gehäuses

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DE3023528C2 (de) 1980-06-24 1984-11-29 W.C. Heraeus Gmbh, 6450 Hanau Aluminium enthaltender Feinstdraht

Also Published As

Publication number Publication date
JPS57149744A (en) 1982-09-16
FR2499767B3 (fr) 1984-01-06
DE3104960C2 (fr) 1987-09-24
JPH0237095B2 (fr) 1990-08-22
GB2093064A (en) 1982-08-25
GB2093064B (en) 1984-10-31
FR2499767A1 (fr) 1982-08-13
DE3104960A1 (de) 1982-08-26

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