JPS57149744A - Extrafine wire - Google Patents

Extrafine wire

Info

Publication number
JPS57149744A
JPS57149744A JP57019859A JP1985982A JPS57149744A JP S57149744 A JPS57149744 A JP S57149744A JP 57019859 A JP57019859 A JP 57019859A JP 1985982 A JP1985982 A JP 1985982A JP S57149744 A JPS57149744 A JP S57149744A
Authority
JP
Japan
Prior art keywords
copper
weight
extrafine
wire
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57019859A
Other languages
Japanese (ja)
Other versions
JPH0237095B2 (en
Inventor
Arudeingaa Furitsutsu
Bishiyotsufu Arupuretsuhito
Poonifuaa Buorufugangu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Publication of JPS57149744A publication Critical patent/JPS57149744A/en
Publication of JPH0237095B2 publication Critical patent/JPH0237095B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
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    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/02Bonding areas; Manufacturing methods related thereto
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    • H01L2224/0554External layer
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    • H01L2224/05624Aluminium [Al] as principal constituent
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

Ultra-fine wires of copper or a copper alloy of 98 to 99.9% by weight of copper and 0.1 to 2% by weight of beryllium, tin, zinc, silver, zirconium, chromium or iron, are utilised for the production of the external connectors or terminals for semiconductor components. The wires may have a diameter of 0.01 to 0.06mm.
JP57019859A 1981-02-12 1982-02-12 Extrafine wire Granted JPS57149744A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813104960 DE3104960A1 (en) 1981-02-12 1981-02-12 "FINE WIRE"

Publications (2)

Publication Number Publication Date
JPS57149744A true JPS57149744A (en) 1982-09-16
JPH0237095B2 JPH0237095B2 (en) 1990-08-22

Family

ID=6124622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57019859A Granted JPS57149744A (en) 1981-02-12 1982-02-12 Extrafine wire

Country Status (5)

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JP (1) JPS57149744A (en)
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JPH0770675A (en) * 1994-07-08 1995-03-14 Toshiba Corp Semiconductor device
JPH0770674A (en) * 1994-06-06 1995-03-14 Toshiba Corp Semiconductor device
JPH0770673A (en) * 1994-04-11 1995-03-14 Toshiba Corp Semiconductor device
KR100926932B1 (en) 2002-03-14 2009-11-17 페어차일드코리아반도체 주식회사 Semiconductor package having copper wire prevented from oxidation and manufacturing method thereof
US7820913B2 (en) 2005-01-05 2010-10-26 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor device

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JPS60223149A (en) * 1984-04-19 1985-11-07 Hitachi Ltd Semiconductor device
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
GB2175009B (en) * 1985-03-27 1990-02-07 Mitsubishi Metal Corp Wire for bonding a semiconductor device and process for producing the same
US5149917A (en) * 1990-05-10 1992-09-22 Sumitomo Electric Industries, Ltd. Wire conductor for harness
JPH05184788A (en) * 1991-12-19 1993-07-27 Daiken Trade & Ind Co Ltd Drying storage
JPH0716797U (en) * 1993-08-27 1995-03-20 武盛 豊永 High temperature clothes dryer with dehumidifier
DE19606116A1 (en) * 1996-02-20 1997-08-21 Berkenhoff Gmbh Electrical contact elements
JP3891346B2 (en) * 2002-01-07 2007-03-14 千住金属工業株式会社 Fine copper ball and method for producing fine copper ball
WO2017221434A1 (en) 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 Bonding wire for semiconductor device
DE102018122574B4 (en) * 2018-09-14 2020-11-26 Kme Special Products Gmbh Use of a copper alloy
DE102019113082A1 (en) 2019-05-17 2020-11-19 Infineon Technologies Ag SEMICONDUCTOR HOUSING AND METHOD OF FORMING A SEMICONDUCTOR HOUSING

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DE3011661C2 (en) * 1980-03-26 1982-08-26 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Semiconductor arrangement with bonding wires
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770673A (en) * 1994-04-11 1995-03-14 Toshiba Corp Semiconductor device
JPH0770674A (en) * 1994-06-06 1995-03-14 Toshiba Corp Semiconductor device
JPH0770675A (en) * 1994-07-08 1995-03-14 Toshiba Corp Semiconductor device
KR100926932B1 (en) 2002-03-14 2009-11-17 페어차일드코리아반도체 주식회사 Semiconductor package having copper wire prevented from oxidation and manufacturing method thereof
US7820913B2 (en) 2005-01-05 2010-10-26 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor device

Also Published As

Publication number Publication date
FR2499767A1 (en) 1982-08-13
JPH0237095B2 (en) 1990-08-22
GB2093064A (en) 1982-08-25
FR2499767B3 (en) 1984-01-06
CH652532A5 (en) 1985-11-15
DE3104960C2 (en) 1987-09-24
DE3104960A1 (en) 1982-08-26
GB2093064B (en) 1984-10-31

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