DE102006041355B4 - Aluminium-Bonddrähte mit eingebetteten Kupferfasern - Google Patents

Aluminium-Bonddrähte mit eingebetteten Kupferfasern Download PDF

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Publication number
DE102006041355B4
DE102006041355B4 DE102006041355A DE102006041355A DE102006041355B4 DE 102006041355 B4 DE102006041355 B4 DE 102006041355B4 DE 102006041355 A DE102006041355 A DE 102006041355A DE 102006041355 A DE102006041355 A DE 102006041355A DE 102006041355 B4 DE102006041355 B4 DE 102006041355B4
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Prior art keywords
aluminum
bonding
bonding wire
copper
component
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DE102006041355A
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DE102006041355A1 (de
Inventor
Albrecht Dr. 63486 Bischoff
Wolfgang 63165 Bonifer
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Heraeus Deutschland GmbH and Co KG
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WC Heraus GmbH and Co KG
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Priority to DE102006041355A priority Critical patent/DE102006041355B4/de
Priority to PCT/EP2007/007583 priority patent/WO2008025547A1/de
Publication of DE102006041355A1 publication Critical patent/DE102006041355A1/de
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    • H—ELECTRICITY
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
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Abstract

Bonddraht aus wenigstens zwei Komponenten, dessen Oberfläche aus der für Ultraschallbonden geeigneteren ersten Komponente besteht und dessen Kern die zweite Komponente mit der besseren elektrischen Leitfähigkeit und Ermüdungs- oder Warmfestigkeit aufweist, dadurch gekennzeichnet, dass der Kern mindestens drei Fasern der zweiten Komponente aufweist und der Bonddraht leichter quetschbar ist, als wenn der Kern homogen wäre.

Description

  • Die vorliegende Erfindung betrifft Bonddrähte, insbesondere Kupfer aufweisende Aluminium-Bonddrähte.
  • Bonddrähte aus Aluminium lassen sich bedeutend einfacher Ultraschall-Bonden als Kupferdrähte. Die gegenüber Kupfer schlechtere Leitfähigkeit kann gemäß DE 30 23 528 C2 mit Manteldrähten aus einem Kupferlegierungskern und einem Aluminiumlegierungsmantel behoben werden.
  • Derartigen Aluminium-Manteldrähten mit Kupferkern fehlt für spezielle Anwendungen, insbesondere bei empfindlichen Substraten, die erforderliche Nachgiebigkeit beim Bonden.
  • Um die Zuverlässigkeit mit Anhebung der Belastungskriterien Temperatur, thermischer und mechanischer Wechsel und Beanspruchung zu bewahren, sind sogenannte Al-Dickdrähte mit Dotierungen wie beispielsweise Nickel oder Kupfer, bzw. Legierungszusätzen, wie beispielsweise 0,5 Gew.-% Magnesium, 0,1 bis 1 Gew.-% Silizium bekannt. Diese Drähte zeigen jedoch eine begrenzte Ermüdungs- und Warmfestigkeit, verbunden mit einer geringen elektrischen Leitfähigkeit.
  • In der WO 03/068445 A1 wird ein Bonddraht, der zum Ultraschallbonden geeignet ist, offenbart, der der eine Kupfer- und Aluminiumlegierung aufweisen kann, um die Federelestizität des Bonddrahts zu verbessern.
  • Es besteht die Aufgabe, Aluminiummantel-Bonddraht mit erhöhten Festigkeitseigenschaften, insbesondere erhöhter Ermüdungsfestigkeit, verbesserten Loop-Abreisskräften, erhöhter elektrischer Leitfähigkeit und generell höherer Zuverlässigkeit bereit zu stellen.
  • Insbesondere ist es eine Aufgabe der vorliegenden Erfindung, Bonddrähte bereitzustellen, die von der elektrischen Leitfähigkeit nah an die Eigenschaften des Kupfers gelangen, sowie von der Bondbarkeit nah an die Eigenschaften des Aluminiums. Es besteht weiterhin die Aufgabe, dass auch die mechanischen Eigenschaften weiter verbessert werden.
  • Lösungen der Aufgabe sind in den unabhängigen Ansprüchen beschrieben. Die abhängigen Ansprüche beschreiben bevorzugte Ausführungsformen. Vorzugsweise weisen die Drähte
    • • einen Aluminiummantel oder
    • • Kupferadern oder
    • • Aluminiumadern auf oder
    • • beträgt die Anzahl längs nebeneinander geführter Fasern drei oder mindestens fünf.
  • Zur Herstellung erfindungsgemäßer Aluminiummanteldrähte mit innenliegenden Kupferadern wird ein Aluminiumrohr oder eine Aluminiumkapsel mit Aluminiumstangen oder Kupferstangen oder -drähten befüllt. Die auf diese Weise erhaltene Anordnung der Kupferadern in einer Aluminium-Matrix wird nach bekannten Verfahren zu einem Verbunddraht umgeformt. Dabei hat es sich bewährt, mit einem Vorverdichtungsprozess HIP bzw. CIP zu beginnen, wonach der hierbei erhaltene Verbund stranggepresst und abschließend auf einen Bonddraht-Durchmesser zwischen 75 und 600 μm, insbesondere 200 bis 400 μm, gezogen wird.
  • Maßgeblich für die Oberfläche oder den Mantel des Bonddrahtes ist, dass dessen Oberfläche zum Bonden, insbesondere Ultraschall-Bonden geeignet und vorzugsweise besonders geeignet ist. Für den Kern ist stattdessen maßgeblich, dass dieser eine gute elektrische Leitfähigkeit aufweist und dem Bonddraht mechanische Festigkeit verleiht, insbesondere eine gute Ermüdungs- und Warmfestigkeit. Erfindungswesentlich ist dabei, dass der Kern leicht quetschbar ist. Diesbezüglich wird gegenüber einem massiven homogenen Kern die Quetschbarkeit durch wenigstens zwei Materialphasen gegenüber einem einphasigen Kern erhöht. Dabei spielt die Anordnung der Phasen untereinander eine maßgebliche Rolle. So ist eine zunehmende Quetschbarkeit bei Anwendung von drei auf fünf, bzw. von fünf auf acht parallel innerhalb eines Mantels verlaufenden Adern feststellbar. Dagegen ist bei einer Anordnung von vier und in geringerem Umfang von sieben gleich dicken, parallel verlaufenden Adern die Quetschbarkeit richtungsabhängig. Ab acht Adern geht die Richtungsabhängigkeit merklich verloren. Zur Herstellung erfindungsgemäßer Bonddrähte eignen sich Metallstangen und Metallrohre, gegebenenfalls auch Metallspäne oder Metallpulver, die in einem Metallbehälter miteinander umgeformt werden, beispielsweise durch Ziehen bis zur Bonddraht-Dimension. Zu kleine Partikel können aber nachteilig zu intermetallischen Phasen oder Legierungen führen, die den erfindungsgemäßen Effekt nivellieren oder aufheben könnten.
  • Beim Bonden des erfindungsgemäßen Bonddrahtes dient die Aluminiumoberfläche als bewährte, besondere günstige Ultraschall-bondbare Substratoberfläche.
  • Die Kupferfasern bzw. Kupferadern werden dabei in eine neu angeordnete Raumstruktur überführt. Diesbezüglich scheint der allgemeine Zusammenhang zu bestehen, dass der Bonddraht bedeutend nachgiebiger ist und die Gefahr verringert wird, empfindliche Substrate zu beschädigen, wenn eine Faserstruktur vorliegt. Vorzugsweise liegt ein möglichst breiter, Cu-freier, nachgiebiger Al-Oberflächenbereich vor. Dies ermöglicht einen geringeren Anpressdruck beim Bonden und damit einhergehend ein schonenderes und zuverlässigeres Bondverfahren mit qualitativ verbesserten, zuverlässigeren Bondstellen mit erhöhter Festigkeit.
  • Nachfolgend wird die Erfindung mit Bezug auf die Abbildungen anhand eines Beispiels verdeutlicht. Dabei handelt es sich bei den einzelnen Abbildungen um:
  • 1 Balkendiagramm mit Darstellung der Pullkräfte in Abhängigkeit vom Bonddrahtzustand
  • 2 Metallographischer Längsschliff durch Bondloop (realistische Wiedergabe)
  • 3 Querschliffe durch Bondloop (schematisiert)
    • a) Ultraschall-unbeeinflusstes Drahtsegment
    • b) Ultraschall-Fügestelle zum Substrat
  • Ausführungsbeispiel
  • Ein Al-Rohr mit Außendurchmesser 70 mm wird mit Al-Stangen gefüllt. Die verbliebenen Hohlräume werden wiederum mit Cu-Drähten ausgefüllt. Die Reinheit der Al- bzw. Cu-Komponenten beträgt 99,99%.
  • Dieser Verbund wird auf 4,5 mm stranggepresst. Der Strang wird nach einer Zwischenglühung (250°C/1 h/Argon) an 0,3 mm gezogen. Nach erfolgter dreißigminütiger Schlussglühung bei 300°C bzw. 250°C unter Argon-Atmosphäre wird die mechanische und elektrische Prüfung durchgeführt. Zusätzlich erfolgt die anwendungsbezogene Bondprüfung nach dem sogenannten wedge/wedge-Ultraschall-Schweißvorgang gemäß G. G. Harman, „Wire Bonding in Microelectronics”, McGraw-Hill 1997, Seiten 11 ff. Dabei steht die Bezeichnung „wedge/wedge” für je eine an beiden Enden des Bonddrahtloops erfolgte Fügestelle.
  • Verglichen wurde mit einem Standard-Aluminium-Dickdraht, der umfangreich bei Leistungsbauteilen eingesetzt wird. Es handelt sich hierbei um einen massiven Al-Draht der Bezeichnung Al-H11 mit Dotierungszusätzen < 20 ppm.
  • In 1 werden die deutlich erhöhten Pulltest-Werte des auf ein Al-walzplattiertes Cu-Band gebondeten Verbunddrahtes wiedergegeben. Besonders hohe Werte zeigen die bei 250°C (2) bzw. 300°C (3) schlussgeglühten Verbunddrähte (mit 1300 bzw. 1500 cN) gegenüber jenen des Al-H11-Referenzdrahtes (1), der lediglich eine Pull Force von 700 cN aufweist.
  • 2 zeigt einen metallographischen Längsschliff durch einen solchen oben beschriebenen aufgebondeten Versuchsdraht (Bond-Loop) vor dem Pull-Test. Die gekennzeichneten Komponenten sind: Kupferfasern (4), Aluminiumfasern bzw. -mantel (5), Aluminium-walzplattiertes Kupferband bzw. -substrat (6) und Aluminiumschicht (7).
  • In 3 sind schematisierte Querschliffe durch den Bondloop wiedergegeben. 3a zeigt die gleichmäßige Anordnung der Cu-Fasern (4) in der Aluminium-Matrix (5), wie er nach dem Drahtziehvorgang vorliegt. 3b verdeutlicht die neu angeordnete Raumstruktur der Fasern (4) nach dem Ultraschall-unterstützten Fügeprozess des Drahtes mit dem Substrat (6) bzw. dessen Aluminiumschicht (7).

Claims (5)

  1. Bonddraht aus wenigstens zwei Komponenten, dessen Oberfläche aus der für Ultraschallbonden geeigneteren ersten Komponente besteht und dessen Kern die zweite Komponente mit der besseren elektrischen Leitfähigkeit und Ermüdungs- oder Warmfestigkeit aufweist, dadurch gekennzeichnet, dass der Kern mindestens drei Fasern der zweiten Komponente aufweist und der Bonddraht leichter quetschbar ist, als wenn der Kern homogen wäre.
  2. Bonddraht nach Anspruch 1, dadurch gekennzeichnet, dass die erste Komponente Aluminium oder eine Aluminiumlegierung ist.
  3. Bonddraht nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die zweite Komponente Kupfer oder eine Kupferlegierung ist.
  4. Bonddraht nach einem der Ansprüche 1–3, bestehend aus Aluminium- und Kupferkomponenten, dadurch gekennzeichnet, dass in diesem Bonddraht Kupferfasern in Aluminium eingebettet sind.
  5. Verwendung eines Bonddrahtes nach einem der Ansprüche 1–4 zum Bonden.
DE102006041355A 2006-09-01 2006-09-01 Aluminium-Bonddrähte mit eingebetteten Kupferfasern Revoked DE102006041355B4 (de)

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DE102009029339A1 (de) * 2009-09-10 2011-03-24 Lisa Dräxlmaier GmbH Leitungsverbinder zum elektrischen Verbinden wenigstens zweier elektrischer Leiter, elektrische Leitung mit einem solchen Leitungsverbinder sowie Verfahren zum elektrischen Verbinden zweier elektrischer Leiter
DE102013200308A1 (de) * 2013-01-11 2014-07-17 Infineon Technologies Ag Bonddraht und Verfahren zur Herstellung einer Bondverbindung
US9756726B2 (en) 2013-11-04 2017-09-05 Infineon Technologies Ag Electronic device and method of fabricating an electronic device
CN115732114A (zh) * 2021-08-31 2023-03-03 美垦半导体技术有限公司 一种电线和电线的加工方法

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WO2003068445A1 (de) * 2002-02-11 2003-08-21 Infineon Technologies Ag Anordnung zum drahtbonden und verfahren zur herstellung einer bondverbindung

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