JPS57149744A - Extrafine wire - Google Patents

Extrafine wire

Info

Publication number
JPS57149744A
JPS57149744A JP57019859A JP1985982A JPS57149744A JP S57149744 A JPS57149744 A JP S57149744A JP 57019859 A JP57019859 A JP 57019859A JP 1985982 A JP1985982 A JP 1985982A JP S57149744 A JPS57149744 A JP S57149744A
Authority
JP
Japan
Prior art keywords
copper
weight
extrafine
wire
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57019859A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0237095B2 (enExample
Inventor
Arudeingaa Furitsutsu
Bishiyotsufu Arupuretsuhito
Poonifuaa Buorufugangu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
WC Heraus GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WC Heraus GmbH and Co KG filed Critical WC Heraus GmbH and Co KG
Publication of JPS57149744A publication Critical patent/JPS57149744A/ja
Publication of JPH0237095B2 publication Critical patent/JPH0237095B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP57019859A 1981-02-12 1982-02-12 Extrafine wire Granted JPS57149744A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813104960 DE3104960A1 (de) 1981-02-12 1981-02-12 "feinstdraht"

Publications (2)

Publication Number Publication Date
JPS57149744A true JPS57149744A (en) 1982-09-16
JPH0237095B2 JPH0237095B2 (enExample) 1990-08-22

Family

ID=6124622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57019859A Granted JPS57149744A (en) 1981-02-12 1982-02-12 Extrafine wire

Country Status (5)

Country Link
JP (1) JPS57149744A (enExample)
CH (1) CH652532A5 (enExample)
DE (1) DE3104960A1 (enExample)
FR (1) FR2499767A1 (enExample)
GB (1) GB2093064B (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770673A (ja) * 1994-04-11 1995-03-14 Toshiba Corp 半導体装置
JPH0770675A (ja) * 1994-07-08 1995-03-14 Toshiba Corp 半導体装置
JPH0770674A (ja) * 1994-06-06 1995-03-14 Toshiba Corp 半導体装置
KR100926932B1 (ko) 2002-03-14 2009-11-17 페어차일드코리아반도체 주식회사 산화가 방지되는 구리 와이어를 갖는 반도체 패키지 및 그제조 방법
US7820913B2 (en) 2005-01-05 2010-10-26 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor device
JP2019508882A (ja) * 2016-01-15 2019-03-28 ヘレウス マテリアルズ シンガポール ピーティーイー． リミテッド 被覆ワイヤ

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60223149A (ja) * 1984-04-19 1985-11-07 Hitachi Ltd 半導体装置
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
GB2175009B (en) * 1985-03-27 1990-02-07 Mitsubishi Metal Corp Wire for bonding a semiconductor device and process for producing the same
US5149917A (en) * 1990-05-10 1992-09-22 Sumitomo Electric Industries, Ltd. Wire conductor for harness
JPH05184788A (ja) * 1991-12-19 1993-07-27 Daiken Trade & Ind Co Ltd 乾燥庫
JPH0716797U (ja) * 1993-08-27 1995-03-20 武盛 豊永 除湿機付高温衣類乾燥機
DE19606116A1 (de) * 1996-02-20 1997-08-21 Berkenhoff Gmbh Elektrische Kontaktelemente
JP3891346B2 (ja) * 2002-01-07 2007-03-14 千住金属工業株式会社 微小銅ボールおよび微小銅ボールの製造方法
WO2017221434A1 (ja) 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
DE102018122574B4 (de) 2018-09-14 2020-11-26 Kme Special Products Gmbh Verwendung einer Kupferlegierung
DE102019113082A1 (de) 2019-05-17 2020-11-19 Infineon Technologies Ag Halbleiter-gehäuse und verfahren zum bilden eines halbleiter-gehäuses
US20230119577A1 (en) * 2021-10-15 2023-04-20 Lincoln Global, Inc. High alloy welding wire with copper based coating

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5678357U (enExample) * 1979-11-09 1981-06-25

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1090437B (de) * 1956-08-14 1960-10-06 Nippert Electric Products Comp Verfahren zum Verbessern der elektrischen und mechanischen Eigenschaften von Kupfer-Zirkon-Legierungen
NL219101A (enExample) * 1956-10-31 1900-01-01
DE2929623C2 (de) * 1979-07-21 1981-11-26 W.C. Heraeus Gmbh, 6450 Hanau Feinstdraht aus einer Aluminiumlegierung
DE3011661C2 (de) * 1980-03-26 1982-08-26 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiteranordnung mit Kontaktierungsdrähten
DE3023528C2 (de) 1980-06-24 1984-11-29 W.C. Heraeus Gmbh, 6450 Hanau Aluminium enthaltender Feinstdraht

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5678357U (enExample) * 1979-11-09 1981-06-25

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770673A (ja) * 1994-04-11 1995-03-14 Toshiba Corp 半導体装置
JPH0770674A (ja) * 1994-06-06 1995-03-14 Toshiba Corp 半導体装置
JPH0770675A (ja) * 1994-07-08 1995-03-14 Toshiba Corp 半導体装置
KR100926932B1 (ko) 2002-03-14 2009-11-17 페어차일드코리아반도체 주식회사 산화가 방지되는 구리 와이어를 갖는 반도체 패키지 및 그제조 방법
US7820913B2 (en) 2005-01-05 2010-10-26 Nippon Steel Materials Co., Ltd. Bonding wire for semiconductor device
JP2019508882A (ja) * 2016-01-15 2019-03-28 ヘレウス マテリアルズ シンガポール ピーティーイー． リミテッド 被覆ワイヤ

Also Published As

Publication number Publication date
JPH0237095B2 (enExample) 1990-08-22
DE3104960A1 (de) 1982-08-26
DE3104960C2 (enExample) 1987-09-24
CH652532A5 (de) 1985-11-15
FR2499767A1 (fr) 1982-08-13
GB2093064A (en) 1982-08-25
FR2499767B3 (enExample) 1984-01-06
GB2093064B (en) 1984-10-31

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