CH645927A5 - Electroplating bath and use thereof - Google Patents
Electroplating bath and use thereof Download PDFInfo
- Publication number
- CH645927A5 CH645927A5 CH785879A CH785879A CH645927A5 CH 645927 A5 CH645927 A5 CH 645927A5 CH 785879 A CH785879 A CH 785879A CH 785879 A CH785879 A CH 785879A CH 645927 A5 CH645927 A5 CH 645927A5
- Authority
- CH
- Switzerland
- Prior art keywords
- bath
- gold
- cadmium
- bath according
- alloy
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title description 8
- 229910052793 cadmium Inorganic materials 0.000 claims description 16
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 13
- 150000001412 amines Chemical class 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 7
- 150000002903 organophosphorus compounds Chemical class 0.000 claims description 7
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 7
- 229910001339 C alloy Inorganic materials 0.000 claims description 6
- LYIDMEYAHXREFY-UHFFFAOYSA-N [C].[Cd].[Au] Chemical compound [C].[Cd].[Au] LYIDMEYAHXREFY-UHFFFAOYSA-N 0.000 claims description 6
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 5
- 150000002466 imines Chemical class 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229920000768 polyamine Polymers 0.000 claims description 5
- 229960001124 trientine Drugs 0.000 claims description 5
- 239000007795 chemical reaction product Substances 0.000 claims description 4
- 229920001281 polyalkylene Polymers 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000013522 chelant Substances 0.000 claims description 3
- 239000008139 complexing agent Substances 0.000 claims description 3
- 238000004070 electrodeposition Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- 150000001340 alkali metals Chemical class 0.000 claims description 2
- IQXHAJSMTNDJGA-UHFFFAOYSA-O azanium;gold(1+);dicyanide Chemical compound [NH4+].[Au+].N#[C-].N#[C-] IQXHAJSMTNDJGA-UHFFFAOYSA-O 0.000 claims description 2
- 229940065285 cadmium compound Drugs 0.000 claims description 2
- 150000001662 cadmium compounds Chemical class 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 125000004437 phosphorous atom Chemical group 0.000 claims description 2
- 239000006258 conductive agent Substances 0.000 claims 1
- UPCIBFUJJLCOQG-UHFFFAOYSA-L ethyl-[2-[2-[ethyl(dimethyl)azaniumyl]ethyl-methylamino]ethyl]-dimethylazanium;dibromide Chemical compound [Br-].[Br-].CC[N+](C)(C)CCN(C)CC[N+](C)(C)CC UPCIBFUJJLCOQG-UHFFFAOYSA-L 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 20
- 229910052737 gold Inorganic materials 0.000 description 20
- 239000010931 gold Substances 0.000 description 20
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- WJCRZORJJRCRAW-UHFFFAOYSA-N cadmium gold Chemical compound [Cd].[Au] WJCRZORJJRCRAW-UHFFFAOYSA-N 0.000 description 10
- 229910000925 Cd alloy Inorganic materials 0.000 description 8
- 229910001020 Au alloy Inorganic materials 0.000 description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 6
- 239000003353 gold alloy Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 4
- 239000004327 boric acid Substances 0.000 description 4
- 239000012153 distilled water Substances 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 4
- 235000019796 monopotassium phosphate Nutrition 0.000 description 4
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- SFOSJWNBROHOFJ-UHFFFAOYSA-N cobalt gold Chemical compound [Co].[Au] SFOSJWNBROHOFJ-UHFFFAOYSA-N 0.000 description 3
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920002873 Polyethylenimine Polymers 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 2
- QCUOBSQYDGUHHT-UHFFFAOYSA-L cadmium sulfate Chemical compound [Cd+2].[O-]S([O-])(=O)=O QCUOBSQYDGUHHT-UHFFFAOYSA-L 0.000 description 2
- 229910000331 cadmium sulfate Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 2
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- 239000004471 Glycine Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- JKPAIQYTAZUMKI-UHFFFAOYSA-N N[P] Chemical class N[P] JKPAIQYTAZUMKI-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- FTFNHSFOQCSFFJ-UHFFFAOYSA-N [Cd].[Au](C#N)(C#N)C#N Chemical compound [Cd].[Au](C#N)(C#N)C#N FTFNHSFOQCSFFJ-UHFFFAOYSA-N 0.000 description 1
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 description 1
- KAPYVWKEUSXLKC-UHFFFAOYSA-N [Sb].[Au] Chemical compound [Sb].[Au] KAPYVWKEUSXLKC-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000002140 antimony alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- DUYCTCQXNHFCSJ-UHFFFAOYSA-N dtpmp Chemical compound OP(=O)(O)CN(CP(O)(O)=O)CCN(CP(O)(=O)O)CCN(CP(O)(O)=O)CP(O)(O)=O DUYCTCQXNHFCSJ-UHFFFAOYSA-N 0.000 description 1
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Contacts (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7835086 | 1978-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH645927A5 true CH645927A5 (en) | 1984-10-31 |
Family
ID=10499359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH785879A CH645927A5 (en) | 1978-08-31 | 1979-08-30 | Electroplating bath and use thereof |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5937354B2 (it) |
| BE (1) | BE878515A (it) |
| CH (1) | CH645927A5 (it) |
| DE (1) | DE2930035C2 (it) |
| FR (1) | FR2434873A1 (it) |
| IT (1) | IT1195735B (it) |
| NL (1) | NL7906568A (it) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3032469A1 (de) * | 1980-08-28 | 1982-04-01 | Siemens AG, 1000 Berlin und 8000 München | Cyanidische goldbaeder und verfahren zur galvanischen abscheidung von feststoffschmiermittel-haltigen gold-dispersionsueberzuegen und seine anwendung |
| JPS58199791A (ja) * | 1982-05-18 | 1983-11-21 | 大塚化学株式会社 | 耐火断熱シ−ト |
| JPS60238496A (ja) * | 1984-05-12 | 1985-11-27 | Shinko Electric Ind Co Ltd | 金めつき液 |
| JPS6239235A (ja) * | 1985-08-14 | 1987-02-20 | 松下電工株式会社 | 吸音板の製造方法 |
| JPS6239233A (ja) * | 1985-08-14 | 1987-02-20 | 松下電工株式会社 | ロツクウ−ル吸音板の製造法 |
| JPS6239234A (ja) * | 1985-08-14 | 1987-02-20 | 松下電工株式会社 | 吸音板及びその製造法 |
| JP2008133533A (ja) * | 2006-11-01 | 2008-06-12 | Ne Chemcat Corp | 金−銀合金めっき液 |
| JP5731802B2 (ja) * | 2010-11-25 | 2015-06-10 | ローム・アンド・ハース電子材料株式会社 | 金めっき液 |
| DE102011114931B4 (de) * | 2011-10-06 | 2013-09-05 | Umicore Galvanotechnik Gmbh | Verfahren zur selektiveren, elektrolytischen Abscheidung von Gold oder einer Goldlegierung |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3642589A (en) * | 1969-09-29 | 1972-02-15 | Fred I Nobel | Gold alloy electroplating baths |
-
1979
- 1979-07-24 DE DE2930035A patent/DE2930035C2/de not_active Expired
- 1979-07-25 FR FR7919190A patent/FR2434873A1/fr active Granted
- 1979-07-31 JP JP54096866A patent/JPS5937354B2/ja not_active Expired
- 1979-08-09 IT IT25034/79A patent/IT1195735B/it active
- 1979-08-30 CH CH785879A patent/CH645927A5/de not_active IP Right Cessation
- 1979-08-30 BE BE0/196950A patent/BE878515A/xx not_active IP Right Cessation
- 1979-08-31 NL NL7906568A patent/NL7906568A/nl not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| DE2930035A1 (de) | 1980-03-20 |
| FR2434873B1 (it) | 1984-07-27 |
| IT7925034A0 (it) | 1979-08-09 |
| JPS5937354B2 (ja) | 1984-09-08 |
| BE878515A (fr) | 1979-12-17 |
| JPS5534697A (en) | 1980-03-11 |
| DE2930035C2 (de) | 1983-09-08 |
| FR2434873A1 (fr) | 1980-03-28 |
| NL7906568A (nl) | 1980-03-04 |
| IT1195735B (it) | 1988-10-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE68925768T2 (de) | Platin- oder Platinlegierung-Plattierungsbad | |
| DE2255728A1 (de) | Elektrochemische zubereitungen und verfahren | |
| DE2445538C2 (de) | Cyanidfreies Bad und Verfahren zur galvanischen Abscheidung von Edelmetall - Legierungen | |
| DE3012999C2 (de) | Bad und Verfahren zur galvanischen Abscheidung von hochglänzenden und duktiler Goldlegierungsüberzügen | |
| EP0143919B1 (de) | Alkalisch-cyanidisches Bad zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen | |
| DE2930035C2 (de) | Galvanisches Bad und Verfahren zur Abscheidung einer Gold-Cadmium-Kohlenstoff-Legierung und elektrisches Verbindungselement mit einem nach diesem Verfahren hergestellten Kontaktmaterial | |
| DE3601698A1 (de) | Ein bad und ein verfahren fuer die galvanische abscheidung von palladium und palladiumlegierungen | |
| DE3628361A1 (de) | Waessriges saures bad und verfahren zur galvanischen abscheidung von zinklegierungsueberzuegen | |
| DE3505473C1 (de) | Bad zur galvanischen Abscheidung von Gold-Indium-Legierungsueberzuegen | |
| EP0416342A1 (de) | Galvanisches Goldlegierungsbad | |
| DE2506467A1 (de) | Bad zur galvanischen abscheidung von palladium-nickel-legierungen | |
| CH629259A5 (de) | Waessriges elektroplattierungsbad fuer die ablagerung von silber/gold-legierungen. | |
| DE3147823A1 (de) | "bad zur galvanischen abscheidung von palladium oder palladiumlegierungen und ein verfahren zur abscheidung von palladium oder palladiumlegierungen mit diesem bad" | |
| CH652150A5 (de) | Gold-plattierungsbad und -verfahren unter verwendung eines polymerchelates. | |
| EP0126921B1 (de) | Bad für die galvanische Abscheidung von Goldlegierungen | |
| DE2445537A1 (de) | Bad zur galvanischen abscheidung von gold | |
| US4253920A (en) | Composition and method for gold plating | |
| DE69011549T2 (de) | Elektroplattierung von Gold enthaltenden Legierungen. | |
| DE2511119A1 (de) | Zusatzmittel fuer die elektroplattierung | |
| EP0194432A1 (de) | Bad zur galvanischen Abscheidung von Gold/Zinn-Legierungsüberzügen | |
| DE3021665A1 (de) | Stark saures goldlegierungsbad | |
| US4197172A (en) | Gold plating composition and method | |
| DE2439656C2 (de) | Wäßriges saures Bad zur galvanischen Abscheidung einer Zinn-Nickel-Legierung | |
| EP4146848B1 (de) | Silberelektrolyt zur abscheidung von silberdispersionsschichten | |
| DE4040526C2 (de) | Bad zur galvanischen Abscheidung von Goldlegierungen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |