CA2567066A1 - Methods of fabricating nitride-based transistors having regrown ohmic contact regions and nitride-based transistors having regrown ohmic contact regions - Google Patents

Methods of fabricating nitride-based transistors having regrown ohmic contact regions and nitride-based transistors having regrown ohmic contact regions Download PDF

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Publication number
CA2567066A1
CA2567066A1 CA002567066A CA2567066A CA2567066A1 CA 2567066 A1 CA2567066 A1 CA 2567066A1 CA 002567066 A CA002567066 A CA 002567066A CA 2567066 A CA2567066 A CA 2567066A CA 2567066 A1 CA2567066 A1 CA 2567066A1
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Prior art keywords
contact
layer
forming
nitride
channel layer
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Abandoned
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CA002567066A
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English (en)
French (fr)
Inventor
Adam William Saxler
Richard Peter Smith
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Wolfspeed Inc
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Individual
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/40FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • H10D30/471High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/475High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
    • H10D30/4755High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/012Manufacture or treatment of static induction transistors [SIT], e.g. permeable base transistors [PBT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/40FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having 2D charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503Nitride Group III-V materials, e.g. AlN or GaN

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  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
CA002567066A 2004-05-20 2005-02-09 Methods of fabricating nitride-based transistors having regrown ohmic contact regions and nitride-based transistors having regrown ohmic contact regions Abandoned CA2567066A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/849,617 US7432142B2 (en) 2004-05-20 2004-05-20 Methods of fabricating nitride-based transistors having regrown ohmic contact regions
US10/849,617 2004-05-20
PCT/US2005/004039 WO2005119787A1 (en) 2004-05-20 2005-02-09 Methods of fabricating nitride-based transistors having regrown ohmic contact regions and nitride-based transistors having regrown ohmic contact regions

Publications (1)

Publication Number Publication Date
CA2567066A1 true CA2567066A1 (en) 2005-12-15

Family

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Family Applications (1)

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CA002567066A Abandoned CA2567066A1 (en) 2004-05-20 2005-02-09 Methods of fabricating nitride-based transistors having regrown ohmic contact regions and nitride-based transistors having regrown ohmic contact regions

Country Status (8)

Country Link
US (1) US7432142B2 (enExample)
EP (1) EP1747589B1 (enExample)
JP (1) JP5160225B2 (enExample)
KR (1) KR20070032701A (enExample)
CN (1) CN1998085B (enExample)
CA (1) CA2567066A1 (enExample)
TW (1) TW200539264A (enExample)
WO (1) WO2005119787A1 (enExample)

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