JP5179023B2 - 電界効果トランジスタ - Google Patents
電界効果トランジスタ Download PDFInfo
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- JP5179023B2 JP5179023B2 JP2006151051A JP2006151051A JP5179023B2 JP 5179023 B2 JP5179023 B2 JP 5179023B2 JP 2006151051 A JP2006151051 A JP 2006151051A JP 2006151051 A JP2006151051 A JP 2006151051A JP 5179023 B2 JP5179023 B2 JP 5179023B2
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- 230000005669 field effect Effects 0.000 title claims description 48
- 229910002601 GaN Inorganic materials 0.000 claims description 47
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 45
- 239000004065 semiconductor Substances 0.000 claims description 33
- 150000004767 nitrides Chemical class 0.000 claims description 27
- 239000012535 impurity Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 31
- 238000004519 manufacturing process Methods 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 238000010438 heat treatment Methods 0.000 description 14
- 229910004298 SiO 2 Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000003071 parasitic effect Effects 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000005533 two-dimensional electron gas Effects 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 238000010406 interfacial reaction Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- YQNQTEBHHUSESQ-UHFFFAOYSA-N lithium aluminate Chemical compound [Li+].[O-][Al]=O YQNQTEBHHUSESQ-UHFFFAOYSA-N 0.000 description 1
- MNKMDLVKGZBOEW-UHFFFAOYSA-M lithium;3,4,5-trihydroxybenzoate Chemical compound [Li+].OC1=CC(C([O-])=O)=CC(O)=C1O MNKMDLVKGZBOEW-UHFFFAOYSA-M 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
- H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Description
T.Murata 他、IEEE Transactions on Electron Devices、2005年、52巻、p.1042−1047
オーミック電極とゲート電極とを同一の材料により形成できる。その結果、オーミック電極とゲート電極とを同時に形成でき、電界効果トランジスタの製造工程を簡略化することが可能となる。
本発明の第1の実施形態について図面を参照して説明する。図1は第1の実施形態に係る電界効果トランジスタ(FET)の断面構成を示している。図1に示すように本実施形態のFETは、サファイアからなる基板10の上に形成され、窒化インジウムアルミニウムガリウム(InAlGaN)からなるキャップ層を含む窒化物半導体積層体20と、窒化物半導体積層体20の上に形成されたパラジウム(Pd)からなるソース電極31、ドレイン電極32及びゲート電極33とを備えている。
以下に、本発明の第2の実施形態について図面を参照して説明する。図6は第2の実施形態に係る電界効果トランジスタ(FET)の断面構成を示している。
11 SiO2マスク
20 窒化物半導体積層体
20a ゲートリセス部
21 AlNバッファ層
22 GaNバッファ層
22A アンドープGaN膜
23 スペーサ層
24 電子供給層
25 キャップ層
26 多層膜
27 絶縁膜
31 ソース電極
32 ドレイン電極
33 ゲート電極
Claims (7)
- 基板の上に形成された電子供給層、及び前記電子供給層よりも上に形成され一般式がInxAlyGa1-yN(0<x≦1、0≦y<1、0<x+y≦1)で表される化合物からなるキャップ層を含む窒化物半導体積層体と、
前記キャップ層の上に互いに間隔をおいて形成されたソース電極及びドレイン電極と、
ゲート電極と、
絶縁膜とを備え、
前記キャップ層は、前記ソース電極と前記ドレイン電極との間の領域に形成され且つ前記電子供給層を露出する開口部を有し、
前記絶縁膜は、前記電子供給層の前記開口部から露出した部分及び前記キャップ層における前記開口部の周囲の領域を覆い、
前記ゲート電極は、前記電子供給層の前記開口部の上に前記絶縁膜を介在させて形成され、
前記ゲート電極、ソース電極及びドレイン電極は同一の材料により形成されていることを特徴とする電界効果トランジスタ。 - 前記絶縁膜の厚さは、前記電子供給層の開口部の深さ以下であることを特徴とする請求項1に記載の電界効果トランジスタ。
- 前記窒化物半導体積層体は、前記キャップ層と前記電子供給層との間に形成され、窒化ガリウムと窒化アルミニウムガリウムとが交互に積層されてなる多層膜を含むことを特徴とする請求項1又は2に記載の電界効果トランジスタ。
- 前記キャップ層におけるインジウム、アルミニウム及びガリウムの組成比は、アルミニウムの組成比をインジウムの組成比で割った値が3.6以上且つ4.7以下の範囲となる組成比であることを特徴とする請求項1から3のいずれか1項に記載の電界効果トランジスタ。
- 前記ソース電極及びドレイン電極は、アルミニウム、チタン、モリブデン、銅又はパラジウムからなることを特徴とする請求項1から4のいずれか1項に記載の電界効果トランジスタ。
- 前記ソース電極及びドレイン電極のコンタクト抵抗は、1×10-4Ωcm2以下である
ことを特徴とする請求項1から5のいずれか1項に記載の電界効果トランジスタ。 - 前記キャップ層は、1×1019cm-3以上の濃度の不純物を含んでいることを特徴とする請求項1から6のいずれか1項に記載の電界効果トランジスタ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2006151051A JP5179023B2 (ja) | 2006-05-31 | 2006-05-31 | 電界効果トランジスタ |
US11/730,615 US7705371B2 (en) | 2006-05-31 | 2007-04-03 | Field effect transistor having reduced contact resistance and method for fabricating the same |
US12/723,069 US8039329B2 (en) | 2006-05-31 | 2010-03-12 | Field effect transistor having reduced contact resistance and method for fabricating the same |
Applications Claiming Priority (1)
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JP2006151051A JP5179023B2 (ja) | 2006-05-31 | 2006-05-31 | 電界効果トランジスタ |
Publications (2)
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JP2007324263A JP2007324263A (ja) | 2007-12-13 |
JP5179023B2 true JP5179023B2 (ja) | 2013-04-10 |
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US (2) | US7705371B2 (ja) |
JP (1) | JP5179023B2 (ja) |
Families Citing this family (44)
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JP2008078613A (ja) * | 2006-08-24 | 2008-04-03 | Rohm Co Ltd | 窒化物半導体の製造方法及び窒化物半導体素子 |
JP2009152353A (ja) * | 2007-12-20 | 2009-07-09 | Mitsubishi Electric Corp | ヘテロ接合電界効果型トランジスタおよびその製造方法 |
JPWO2009104299A1 (ja) * | 2008-02-22 | 2011-06-16 | 住友電気工業株式会社 | 半導体装置および半導体装置の製造方法 |
JP2009231508A (ja) | 2008-03-21 | 2009-10-08 | Panasonic Corp | 半導体装置 |
JP2010050280A (ja) * | 2008-08-21 | 2010-03-04 | Toyota Motor Corp | 窒化物半導体装置 |
US8330167B2 (en) * | 2008-11-26 | 2012-12-11 | Furukawa Electric Co., Ltd | GaN-based field effect transistor and method of manufacturing the same |
JP5275773B2 (ja) * | 2008-12-12 | 2013-08-28 | 古河電気工業株式会社 | 電界効果トランジスタ |
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JP5562579B2 (ja) | 2009-05-12 | 2014-07-30 | 日本碍子株式会社 | 半導体素子用エピタキシャル基板の作製方法 |
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JP5595685B2 (ja) * | 2009-07-28 | 2014-09-24 | パナソニック株式会社 | 半導体装置 |
JP5530682B2 (ja) * | 2009-09-03 | 2014-06-25 | パナソニック株式会社 | 窒化物半導体装置 |
JP2011082216A (ja) * | 2009-10-02 | 2011-04-21 | Fujitsu Ltd | 化合物半導体装置及びその製造方法 |
US8258543B2 (en) * | 2009-12-07 | 2012-09-04 | Intel Corporation | Quantum-well-based semiconductor devices |
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KR20120060303A (ko) * | 2010-12-02 | 2012-06-12 | 엘지전자 주식회사 | 질화물 반도체 소자의 제조 방법 및 이에 의해 제조된 질화물 반도체 소자 |
JP5685917B2 (ja) | 2010-12-10 | 2015-03-18 | 富士通株式会社 | 半導体装置及び半導体装置の製造方法 |
JP5654884B2 (ja) * | 2011-01-26 | 2015-01-14 | 株式会社東芝 | 窒化物半導体装置の製造方法 |
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